Ruggedized Protection For NavyFleet Services

PRS Proprietary

Environmental Protection- An Engineered Solution for Electronic and Mechanical

Assemblies

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Situational Awareness and Threat Environments

Todays “in-theatre” shipboard needs demand C5ISR Systems to be fully operational 100% of the time.

Complicating these needs are: Asymmetrical threats, High demand mission cycle times with limited intervals for maintenance and support activities, evolving environmental conditions and COTS/RoHS products in use for Military applications.

Reality is that C5ISR systems are expected to operate in real time “come as you are” status with 100% reliability regardless of threat or environmental conditions.

Given the varying and dynamic nature of Mission requirements, growing complexity of electronic systems and the need to operate in smaller packages in increasingly hostile environments, electronics must be ruggedized at the component and PCB level.

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Response/Engineering Solutions

The Security services of the U.S. have been mandated to use COTS componentry in all electronic (including C5ISR) systems.

The reliability and certainty of mission success may be put in jeopardy as COTS products were never intended for military application or environments.

Couple this with RoHS/lead free material and reliability of system performance (and thus Mission effectivity) may be subject to further degradation.

To better insure survivability and performance any PCB’s (and probably some mechanical product) associated with Communications, EW, Fire Control and any other Mission critical electronics must be coated or encapsulated with mil-rated materials.

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Forward Looking Proactive Action To insure mission success from the outset it is necessary to spec into any RFQ or

RFI an environmental requirement so that the design integrates an environmental solution with the overall system.

Too many times a design passes a well thought out Qualification testing process only to find out in the LRIP or Preproduction phase that tin whiskers or corrosion or an EMI/RFI issue has arisen that was unaccounted for.

Plasma Ruggedized Solutions has worked with various A&D Tier 1 and Tier 2

firms for more than 23 years creating lifecycle cost-savings applications to insure high MTBF mission critical performance.

Featuring more than 2.5K types of coatings and encapsulates PRS engineering designs and creates custom ruggedized solutions for specific threat environments.

In the following set of charts we will discuss engineered approaches for dealing with various threat environments that electronic and mechanical systems face in theater. PRS

Proprietary

Cleaning and Unit Preparation DI Water Wash

Some Hardware; Water Soluble Fluxes

Aqueous Cleaning (water + chemicals) Optimal for Hardware; Most Fluxes

including No Clean

Solvent Cleaning Optimal for Hardware; RMA, Rosin, No Clean Fluxes,

Oils

Ultrasonic Increase Effectiveness of Standard Methods

Mechanical – brushing & wiping PRS

Proprietary

Plasma Treatment and Surface Activation Dry Process Environmentally Friendly

High Efficiency Reduced Waste Stream

Removal of Contaminants Modify Surface Energy

Increased Material Substrate Options Teflon, Plastics

Increased Adhesion and Wettability

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Application Methodology CVD-Chemical Vapor Deposition

Truly Conformal

Dip coating Spray Multi faceted approach

Increased Efficiency

Layered approach Optimized Material Performance

Example: Parylene with Urethane Overcoat

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Preferred MaterialsConformal Coating for Enhanced Corrosion

Resistance

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Parylene Excellent Chemical Resistance Excellent Electrical and Mechanical Properties Protection from Corrosion Low Stress Thin Film

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Epoxy and Polyurethane

Great Material CompatibilityGood to Excellent Chemical

Resistance Ideal for harsh environments Moisture, Fluids, Corrosive Gases

Good to Excellent Abrasion Resistance

Thermo-mechanical StabilityTunable

Mix Ratios, Additives/Fillers Greater Control of Physical and Electrical

Properties PRS Proprietary

Acrylics & Silicones Low Stress Good RF compatibility (Low Dielectric K)

Ideal material for antenna

Reduced Process Complexity Easily Reworked /repairable

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Nano Technology Inorganic Coatings (ASG)

High Operating Temperature Limits

Thin Film

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Potting & Encapsulation

Potting / Encapsulation is the process used to protect “ruggedize” electronics. Potting provides protection from extreme environments, against shock and vibration, ensures security of sensitive designs, as well as creates a barrier against moisture, fungus, dust, and corrosion.

Potting can also enhance circuit reliability by reducing leakage from high voltage circuits, protecting against voltage arcs and short circuits and by preventing the formation of “tin whiskers.”

Potting or Encapsulating a circuit can make it Federal Information Processing Standards (FIPS) compliant. Because Potting and Encapsulating encloses the entire assembly, the assembly is protected from unauthorized entry, modification and reverse engineering.

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Security Programs FIPS Compliant

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Material Development - KryptosPlasma Ruggedized Solutions recently began developing new materials in-house for our conformal coating, potting, encapsulating, and other processes. Certain applications can be carried out perfectly with standard materials, but others require something more specialized. Our materials development processes give us a unique ability to create the perfect/tailored material to match your project's exact specifications.

• The KRYPTOS™ product line is highly adaptable, of which KRYPTOS-17™ is a filled, RoHS compliant, medium viscosity, self-extinguishing flame retardant, low stress, thermally conductive epoxy casting resin system.

• This material is UL 94V0 rated and was designed to meet the physical security

requirements of FIPS 140-2, and FIPS140-3 for an encapsulating material.

• The materials inherent nature offers excellent Tin-whisker mitigation properties. It provides very good resistance to water, salt spray, inorganic acids, bases and most organic solvents.

• The material is intended for use in both indoor and outdoor environments.PRS Proprietary

Rating Scale 1 (Highest) to 4

Acrylic Polyurethane Epoxy Silicone Parylene (XY)

(AR) (UR) (ER) (SR) C D N

Humidity Resistance 2 1 2 1 2 2 1

Humidity Resistance (Extended Periods) 2 1 3 2 2 2 1

Abrasion Resistance 3 2 1 4 1 1 1

Mechanical Strength 3 1 1 2 1 1 1

Temperature Resistance 2 3 3 1 2 2 1

Acid Resistance 3 1 1 2 1 1 1

Alkali Resistance 3 1 1 2 1 1 1

Organic Solvent Resistance 4 1 1 2 1 1 1

Dielectric Constant (1MHz @ 23°C) 2.2 - 3.2 4.2- 5.2 3.3 - 4.0 2.6 - 3.0 3.15 2.84 2.65

Outgassing 3 2 3 4 1 1 1

Electrical Impedance 2 4 3 2 - - -

Optical Clarity 4 3 1 2 2 2 2

Electrical Insulation 1-2 1-2 1-2 2 2 2 1

Reworkability 1 3 3 2 4 4 4

VOC’s 1-3 2-3 2-3 1-2 1 1 1

Thermal Stability 1-2 2 2 1-2 1 1 1

Thermal Conductivity 2-3 1-3 1-3 2-3 3 3 3

Adhesion 2-3 1-2 1-2 1-3 2 2 2

Material Selection Table

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EMI RFI Shielding

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Conductive Coatings

Coatings are typically applied to hardware or electronics through spray application or CNC dispensing.

Excellent EMI RFI shielding

High Attenuation Adaptable material

properties

PRS Proprietary

EMI RFI Shielding Other solutions apply a conductive coating over the CCA itself

effectively creating a Faraday Cage around the CCA eliminating the need for an enclosure. (This requires a pre-coating to seal the assembly and prevent shorts.)

Wrapping an assembly in a conductive material and then potting around it also creates the RF barrier and provides structural support as well.

PRS Proprietary

FORM-IN-PLACE conductive gaskets offer effective EMI RFI shielding, ESD control and environmental seal. Multi-Axis CNC dispensing for precise,

repeatable, high reliability sealing. Capable of mitigating Internally or

Externally radiated interference. Can be applied to nearly all conductive

surfaces where a seal is required including conductive coated or metallized composites.

FIPG (Form-In-Place Gasket)

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Nano Technology Optically Clear Material Solutions Available

Ideal for Lighting Solutions (LED) Can Replace ITO (Indium Tin Oxide)

Applied Easily Using Conventional Methodologies Spray Dip

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QUALITY CERTIFICATIONS

Locations

Plasma Ruggedized Solutions - Northern CA Plasma Ruggedized Solutions - Southern CA2284 Ringwood Ave Suite A 5452 Business Drive San Jose, CA 95131 Huntington Beach, CA 92649

AS9100 ITAR IPC RoHS COMSEC NASA ISO 9001:2008 Registered Registered Complaint Registered 8739.1A Certified

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COMPANY OVERVIEWPlasma Ruggedized Solutions, Inc. (‘Plasma’ or the ‘Company’) is an engineering services partner to OEM’s that designs, tests, and applies chemical and mechanical agents/devices to ruggedize and encrypt (mechanically) odd geometry/asymmetric PCB’s and electronic assemblies.

Summary Founded in 1990. California subchapter ‘S’ Corporation. Shareholders are Institutional Capital and Management. Headquartered in San Jose California with a 2nd facility in Huntington Beach

comprising a total of approximately 55,000 sq. ft. 120 employees. Over 2,000 customers in current operating base covering 14 industries with 400-

600 active during any particular month. The largest representing less than 12% of sales.

Rapid historical growth facilitated by compliance with newly implemented environmental regulations (RoHS) and industry trend toward ruggedization.

Multi-industry orientation with primary applications in A&D, Medical, Automotive, Robotics and Communications sectors.

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