salzman - jaxa mews 22 ti presentation for 2009 101016 · reliable harsh environment electronics...
TRANSCRIPT
Texas InstrumentsReliable Harsh Environment Electronics
for the Global Market
James F. Salzman and Bruce Holcombe
22st Microelectronics Workshop
James F. Salzman
Agenda
• The Need for Reliable Space Products– Satellite Failures– Product Up-Screening issues
• Understanding Reliability for Space Products– Bathtub Reliability Curve – Extrinsic & Intrinix mechanisms
• TI HiRel Division Overview• Product Roadmaps• Extreme Temperature Operation• Summary
James F. Salzman
Newspaper Headlines
Jan 15, 2009 - Engineers are trying to determine what happened to the telecommunications satellite Astra 5A, which inexplicably failed on Jan. 15 after 12 years of operation. The satellite has since been adrift in space, moving out of its geostationary position about 22,300 miles (35,888 km) above Earth and is moving eastward along its orbital arc.
Mar 7, 2009 - The reason for the loss of the satellite, experts confirmed, was a failure of its electronic components. And the so-called electronic-component base constituted the basis of this spacecraft. The loss of the satellite reminded specialists of a two-year-old story. ... Low-quality components said to be the cause of Russian satellite failure -
Mar 20, 2009 - ... ... the in-orbit satellite failure of the Coast Guard demonstration or the quick-launch satellites, satellite launch and construction delays and cost overruns and in-orbit satellite failures or reduced performance; the failure of our system or reductions in levels of service due to faulty components ...
Satellite Failure Rate ~ 20/year
Sept 1, 2009 The Indian space agency has announced that it lost contact with its lunar orbiterChandrayaan-1 on Saturday last week. The mission, which has achieved most of its scientific objectives, carried three European instruments. Radio contact with Chandrayaan-1 was lost at 22:00 CEST on 28 August
Aug 08, 2009 NASA’s Mars Reconnaissance Orbiter is in safe mode, a precautionary standby status, and in communications with Earth after unexpectedly switching to its backup computer on Thurs. Aug. 6. This is the fourth computer shutdown on the Mar’s Reconnaissance Orbiter this year
Satellite Grim Reaper
James F. Salzman
Typical Up Screening to QMLV flow by some Suppliers
Obtain die fromvarious sources
Radiation Test &Ceramic package
Up-Screeningas Required Sell to end User
• Typically Fab less• No process information• Unknown design rules• Unknown heritage• Unknown future
• Unknown FIT Mechanisms• NBTI• TDDB• CHC• Metal Migration• Etc.
• Out sourced to 3rd Party• May use several vendors• Relies on 3rd party quality• Lack of process information• Lack of Wafer Level Reliability• Lack of package Thermal Analysis
• Typical Lack of experience• Limited product information• Limited Destructive Physical Analysis Size• Lack of full time reliability Engineer• Commercial die reliability ~ 10 years
• Questionable Product• Lack of Ownership
James F. Salzman
The Reliability Bath Tub Curve
Time
Failu
reR
ate
Time
Failu
reR
ate
Extrinsic failures - caused by some type of processing or material defects
Intrinsic failures - happen as a result of wearout
The “bathtub curve” is really the addition of two curves.
James F. Salzman
No reliability discussion can be complete without mentioning the bathtub curve.
TYPICAL TIME (log scale)
Failu
re R
ate
Infant MortalityExtrinsic Failures
Useful Lifetime
Wear outIntrinsic Failures
EFR Testing/Outlier Process Quals/WLRProduct Quals
6 months – 1 year 10 years
Burn-in 24 hrsFIT
DPPM to Customer
EFRDPPM
Random Failures
The Reliability Bath Tub Curve
James F. Salzman
KNOWN SEMICONDUCTOR FAILURE MECHANISMS
• Electromigration (leads, contacts, vias)• Stress Migration (notching, voiding)• Dielectric Leakage / Time-Dependent Dielectric Breakdown• Antenna Charging• Mobile Ions (surface inversion)• Corrosion• Channel Hot Carriers (parametric degradation, NMOS, PMOS)• NBTI (Negative Bias Temperature Instability)• Gate Oxide Integrity (GOI) Time Dependent Dielectric Breakdown TDDB• Thermo-Mechanical Stresses (shear, tensile, fillers, etc.)• Bonding (intermetallic voiding, chip-outs)• Heat Dissipation (impact on failure rate)• Radiation Effects
James F. Salzman
The total intrinsic failure curve is the sum of the failure rate of allpossible wearout mechanisms.
Time
Failu
re R
ate
Total
Gate OxideTDDB
Electromigration
Channel Hot Carriers
A Closer Look at Intrinsic Failures
RadiationNBTI
Radiation is just one of many FIT mechanisms, and often is not the Major mechanism !!!
SmallRandom
FIT’s
Useful Life
James F. Salzman
TECHNOLOGY RELIABILITY ASSESSMENT
Diodes • Leakage• Kinetics• Defect Density• Stability
Gate Oxide Integrity• VLF• VBD• TDDB• Antenna Effects
Channel Hot Carriers• RelXpert Models• N Channel Transistors• P Channel Transistors• Degradation Lifetime:
Idlin, Idsat• Hot Carrier Degradationduring Wafer Stress/Burn-In
NBTI / PBTI• RelXpert Models• N Channel Transistors• P Channel Transistors•Degradation Lifetime:
Idsat, Vtlin•NBTI Degradationduring Wafer Stress/Burn-In
Contacts/Vias• Contact EM Performance• Via EM Performance
ILO Integrity (Interlevel/Intralevel) • Leakage• Breakdown• TDDB• Microtrenching/Hillocks• LER/HER (Line Edge Roughness; Hole Edge Roughness)
Metal / Vias• Electromigration• Stress Migration• Corrosion• Bonding• Side Hillocks
SER• ASER Data
ESD• HBM• CDM• It2
LatchupMobile Ions• Temp/Bias Stress• Thick Fields• Poly Field I66
• Click to add text
P+ Substrate
N TankP TankP- EPI
n+ n+ p+p+
Metal 5
Metal 3
Metal 2
Metal 1
Metal 4
James F. Salzman
Packaging ReliabilitySpace Level Reliability – Organic packages reliability concerns remain:
PB Free - Tin Whiskers
17 April, 2005 — Millstone Nuclear Generating Station — A single tin whisker created a bridge (short circuit) between a diode and the output trace on a circuit card, causing a partial reactor shutdown. P. Daddona, “New London, CT, July 4, 2005
Tin Whiskers growing on a MATTE tin-plated copper lead frame commonly used in the manufacture of 28 pin small outline integrated circuit (SOIC) lead frame after 3 years of ambient storage. From Wikipedia
Tin whiskers caused the failure of the Galaxy IV Satellite in 1998. Wireless Week, 1999-05-17.
-Residual stresses caused by electroplating-mechanically induced stresses-bimetallic stress induced by diffusion -thermal stresses.
Oh My !!
James F. Salzman
JC-13 Government Liaison – TI ChairmanJC-13.4 Rad Hard – TI Participation• JC-13.1 Discrete Devices• JC-13.2 Microelectronics• JC-13.4 Rad Hard - TI Active• JC-13.5 Hybrids, RF/Microwave, MCM
JC-14 Quality & Reliability – TI Active
US Government Liaisons• US Army• US Navy• US Air Force • NASA• DSCC• DMEA• GIDEP
Teaming
Europe/Japan/Asia
• JAXA - Japan AerospaceExploration Agency
• ESA - European Space Agency
• CNES – French Space Agency
• DLR - Deutsches Zentrum fürLuft- und Raumfahrt e.V
• BSNC - British National Space Centre
• DSO – Singapore Defense Science Org
• DOS/ISRO – India Department of Space & Research
Collaborative Relationships
James F. Salzman
TI in the High Reliability industry• 30+ years of experience working with HiRel customers• Largest dedicated organization in the industry • Worldwide sales and support infrastructure
HiRel Products Life Cycle
Intro Phase OutDeclineMaturityGrowth
ConsumerLife Cycle
As short as 9 months
As long as 30 years
ProductLongevityAssured
ProductLongevityAssured
Extended product life cycles• Obsolescence mitigation • Supply beyond commercial availability• Product resurrection
Leading-edge technology and manufacturing• HiRel approved fabs (certified by Defense &
Aerospace standards)• Access to latest process technologies (HPA07, BiCom, etc.)• Broad packaging capabilities
Market expertise• Baseline control and qualification per unique market
requirements: TID, SEU, high-temp, ceramic, QML –Q/V, EP, die solutions, etc.
Commitment
Overview of TI HiRel Division
James F. Salzman
DMOS 5
• 200mm wafers• Production CMOS• Dallas, Texas• 180, 130 nm
DMOS 6
• 300mm wafers Production CMOS
• Dallas, Texas• 90, 65 & 45nm
MIHO5/6
• 200mm wafers• Production CMOS• Miho, Japan
• 200mm wafers• Production CMOS• Buchon, Korea
ANAM
Advanced, Reliable, Worldwide Supply
FFAB
• 200mm wafers• Production CMOS and BiCMOS
• Freising, Germany
• 200mm wafers• Production CMOS & BiCMOS
• Military HiRel• Sherman, Texas
TI Sherman
• MS, RF, DSP development
• 200mm CMOS• DSP Headquarters• Houston, Texas
TI Stafford, Houston
DMOS 4
• 200mm wafers• Production CMOS• Dallas, Texas• 250, 180 & 130nm
James F. Salzman
HiRel SPACE Products & Technology
Space is a Global territory for SemiconductorsOver 100 Launches each year :
• Imaging, Weather, Communications • Increase system complexity & Data rates• Defense related Satellites drive more opportunities
Texas Instruments offers a complete “ signal chain” QML-V products line for Space
James F. Salzman
• Strong technology/product portfolio for HiRel applications – New devices being qualified– Customer driven roadmaps
• TI-owned Wafer Fabs, Processes and Designs– Third party designs validated against TI design rules and processes
• Established QML-V qualification and production flows– Fully support New Technology requirements of MIL-PRF-38535– All optimizations approved through DSCC, Aerospace, and NASA
• Investments being made to enhance radiation tolerance and reliability– Addresses the needs of multiple market segments, DHD, Medical, Space -– Based on commercial high volume processes– 3rd party IP partnerships for radiation improvements– Market & Customer defined roadmaps– Specific devices may be ported to commercial rad-tolerant processes– Total dose radiation testing is performed at qualification on all new QML-V
product releases– Custom radiation test options are available for SEE & ELDRS
characterization-
TI Space Products and QML-V Strategies
James F. Salzman
SubstrateP-Well
NSD
PSDThermal OxideBPSG
AlCu
PhotoresistNitride
NSD DepPSD Dep
LDD N-
CD4000 Logic Family TID Improvement
• Process hardening study underway • Metal Gate Process, no LOCOS Isolation – no FOX birds beak issue• Key is to harden the thick Gate Oxide• Change Gate from thermal Oxide to ONO – readjust transistor Vt’s• Use EPI substrate for Latchup prevention• Taking customer inputs for device part numbers• Potential hardened product release 4Q10
Gate OxideP-Well
James F. Salzman
Unitrode & Bipolar Product Improvement• Legacy Unitrode & Bipolar ELDRS performance from SFAB/MFAB ~ 8KRad
• SFAB process adjustment made: Improved Reliability and Hardness
• SFAB Bipolar process now passes 40KRAD @ 10mRad/sec(si) on following devices:– UC1825– UC1825A– UC1846– UC1843A– UC1525B
– UC1637W– UC19432JG
UC1843AJG-SP5962-8670409VPAUC1843AJQMLV5962-8670406VPAJG (8-CDIP)UC1843A
UC1846J-SPUC1846FK-SP
5962-8680603VEA5962-8680603V2A
UC1846JQMLVUC1846LQMLV
5962-8680601VEA5962-8680601V2A
J (16-CDIP)FK (20-LCCC)
UC1846
UC1525BFK-SP5962-8951106V2AUC1525BLQMLV5962-8951105V2AFK (20-LCCC)UC1525B
UC1825AJ-SP5962-8768105VEAUC1825AJQMLV5962-8768102VEAJ (16-CDIP)UC1825A
UC1825J-SPUC1825FK-SP
5962-8768104VEA5962-8768104V2A
UC1825JQMLVUC1825LQMLV
5962-8768101VEA5962-8768101V2A
J (16-CDIP)FK (20-LCCC)
UC1825
New TI Part#New SMD #Old TI Part#Old SMD #PackageDevice Function
More devices to follow in 2010 & Customers can always drive new releases
In Qualification
Available Now !! –See new Standard Microcircuit Drawing numbers below.
In Qualification– SE555– AM26LS33
James F. Salzman
Radiation Hardened 16 M SRAM
The C05HA512K32 is a high performance CMOS SRAM organized as 524,288 words by 32 bits.20ns read, 10ns write maximum access timeAsynchronous functionally compatible with commercial 512Kx32 SRAM’sBuilt-in EDAC (Error Detection and Correction) to mitigate soft errorsBuilt-in Scrub Engine for autonomous correction (scrub frequency and delay is user defined user)CMOS compatible input and output level, three state bidirectional data bus3.3 +/- 0.3V I/O, 1.8 +/- 0.15V CORE68 Lead Ceramic Quad Flat PackQualified Product Release 4Q 2010
James F. Salzman
TI Rad Hard Memory & DSP Product Roadmap
Time
Silicon Space
Licensed
Products
16M SRAM 8M DPSRAM 32M SRAM 64M SRAM SDRAM
180nm 130nm 130nm 90 nm 130nm
Texas
Instruments
Reuse Products
1394B
PHY
1394B
Link
VC33
DSP
C6701
DSP
C6727
DSP
NV
FRAM
2009 - 2010 - 2011 - 2012
= Radiation Tested
= Work in progress
= Planned beyond 2010
Products are based on BGR implant IP
James F. Salzman
Data Converter Space Roadmap
ADS546312b/500M
ADS5400in-dev
MSPS170135105
12b
Res
olut
ion
200 250 500 1000
14b
400300
ADS547414b/400M
ADS542414b/105M
2008
ADS544912b/300M
ADS544413b/250M
DAC5675A14b/400M
In Production In road map In the future
James F. Salzman
Down Hole Drilling Harsh Environments
• Environmental Operating Issues– Shock and vibration– Temperature and pressure– High reliability over target lifetime
Seismic applications -40°C to +125°C 1 year
Logging while drilling -40°C to +150°C 1000 hours-40°C to +175°C 200 hours
Wireline -40°C to +175°C 400 hours
Reservoir monitoring +150°C to +225°C 6 months
Permanent applications +150°C 5 years
NBTI, hot carrier, device leakage and latchup are main issues
The same techniques used to harden against radiation effects, improve NBTI, device leakage, and latchup in high temperature applications !!
James F. Salzman
Strategy for HiRel Harsh Environment Products
MEDICAL HIMEDICAL HI--RELRELNeutron SEL & SEU, TIDNeutron SEL & SEU, TID
Neutron and SEL improvement
BGR & EPI substrates
Hardened BGR Hardened BGR MEMORIES MEMORIES
Hardened PowerHardened Power& Bipolar& Bipolar
Hardened Digital Hardened Digital Signal ProcessorsSignal Processors
Hardened Standard Hardened Standard LOGIC LOGIC
AVIONICS HIAVIONICS HI--RELRELNeutron SEL & SEUNeutron SEL & SEU
Commercial ICProcess
Reliability & HardeningInsertionBiCom, ADSXXXX,
DACXXXX
Improved reliability of standard components
for High TempBGR added to
standard DSP products
SRAM, SDRAM, NVRAM
100K Rad 54ACXX, CD4K Family
ELDERS free @ 40K Rad Unitrode & Bipolar
Hardened Data Hardened Data ConvertersConverters
Down Hole Drilling Down Hole Drilling Characterization + BGRCharacterization + BGR
James F. Salzman
• Many Satellite failures are the result of faulty components• Up-Screening product may not be a reliable solution• TI has full ownership of all phases of it’s QML products• TI addresses Global markets, i.e. Medical, Avionics, Down Hole,
Space based systems. These are all faced with the same reliability issues: NBTI, CHC, TDDB, Radiation, Temperature, etc.
• TI’s HiRel strategy is to apply global process analysis and improvements to address multiple market uses for it’s products.
• TI HiRel has a strong, expanding portfolio of space qualified products
• By leveraging the Global Market, we can offer these products at more effective cost
The Importance of Reliable Space Products Summary
James F. Salzman
For More Information
• The TI HiRel, Defense & Aerospace Internet Site
• http://www.ti.com/hirel• The TI Product Information Center
• 1-800-477-8924• support.ti.com/sc/pic/americas.htm
James F. Salzman
Thank You