Sandeep ChennakeshuSenior Vice President and General Manager

Wireless & Mobile Systems Group25 July 2006

The forward-looking statements in this presentation include statements regarding market growth and our potential capacity, financial position, expanded addressable market, business strategy and other plans and objectives for future operations, as well as any other statements which are not historical facts.

Although we believe that these statements are based on reasonable assumptions, they are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties are listed in our Form 10K for the year ended December 31, 2005 and other SEC filings.

RF, PA, PMIC

DSPs, CPUs

Process technology

Packaging

Software components (e.g. codecs)

Growth Through Innovation

IP Portfolio Platforms Market Position

2G, 2.5G

2.75G, 3G

iDEN

Applications processors

Connectivity

#2 GSM/GPRS basebands

#2 DSPs

#3 Wireless handset RF

MXC – Processor of the year

Business Model to Drive Market Success

CustomersCustomers

Platform thinking. Platform execution.

RF, PM, PA, BB

Platforms

DSPs & App. Processors

Support

Process & Packaging

Technologies

Ecosystem Foundry

Software Components(e.g. codecs)

MXC

Focus Areas

• iDEN• 2G-3G

Platforms

• Open OS support

• RF transceivers• PA• PMIC

• ZigBee™• WLAN• DVB-H

• Application processors

• Portable media players

• V2IP solutions

• Audio for automobiles

• DVB-H tuners• GPS front ends• LNAs• FEMs

• Mini-USB• GPS

Components Through Platform Thinking

RF TransceiverUSB

DigitalBasebandPMICApp Proc DVB-H

tuner PACodecs

Portable Media Players Cell Phones

DVB-HSiP

RF Module

Software Drivers, Application Enablers and Platforms

Time to market via ready to use components

Basis for Elektrobit/S60/Symbian reference design

MXC Cellular Platform Architecture

Differentiators• ARM11 for better multimedia (H.264 encode/decode)• DSP based modem (flexibility)• Faster integration of 3rd party apps framework (open OS)• Integration to reduce total cost of ownership• RF requires limited tuning in factory

ACCESSSOFTWARE

• Proven• Protected• Stable

MODEMCORE

APPLICATIONS SOFTWARE

• Any OS• Independent• Downloadable

APPSCORE

2, 2.5 & 2.75GTransceiver

3GTransceiver

PA

PA

Power Management and Audio

Software Platform

OperatingSystem

OperatingSystem

Service PrimitivesService Primitives

Protocol stack, IP stack, Connectivity, Codecs,

Application services, Security

Protocol stack, IP stack, Connectivity, Codecs,

Application services, Security

Hardware LayerHardware Layer

Cellular Platform Access (CPA)Cellular Platform Access (CPA)

Applications Framework & UI(S60, Windows Mobile®, Linux, Ajar, RTOS based)• Application reusability

• Stable porting layer

• Stable platform

HSDPA and HSUPA Evolution

• 1.8 Mbps available

• 3.6 Mbps multi-call capable

• Successful IOT testing with 4 global partners

• HSUPA: 1.5Mpbs – 5.8Mbps

• HSDPA: 7.2Mbps and higher

2006 2007

Download Signal

Feedback

Transmit

Multimedia Capability Enabled by ARM11 Imaging

• 4M pixel cameras• 24 million color displays

Video• H.264 encode (QCIF 15 fps) & decode (CIF 30 fps) • MPEG4 CIF 30 fps encode & decode • Real Video® and WMV

Music & Audio• AAC, AAC+, enhanced AAC,

MP3, Real Audio®, WMA, WB-AMRMemory Support

• NAND, NOR, SDRAM (DDR & SDR) and PSRAM

532MHz performance on MXC and i.MX

Volume and Cost

Margin, cost optimized derivatives from high tier

Technology driven, rich multimedia & connectivity

Market Driver

High-Tier

Entry-Tier

Mid-Tier

V2IP / OtherPMP (Flash and Hard Disk)Cellular

i.MX27

i.MX27

i.MX Applications Processors Portfolio

Smart RF – Lowers Total Cost of Ownership

• Flexible, advanced programming model

Simplifies software interface

• Simple auto calibration routines

Reduces phone calibration and test time in factory

• Delivers high board level yields

Sagem my700xRF EDGE Subsystem

• Single chip solution

• Part count reduction

• Flexibility for product segmentation

Power Management ICsFlexible buck switcher scheme;supports up to four domains (0.5A) and parallel mode for 1A capability

Completebacklight and fun lightingmanagement system

One of first to include CEA-936-Asupport

Touch screeninterface for smartphone interfacing

Dual SPI / SSI allows sharing resources between two processors

Switchers and regulators supporta complete 2G and 3G power tree

Complete high end audio system integrated on chip

Battery Charging(EMU)

MC13783

Switchers

Audio

BatteryCharging

RegulatorsBacklight

Fun Lights

Dual SSI

Dual SPI

TouchScreen

USB-OTG

RF/PA & Power Management Momentum

Motorola SLVR L6FSL BB, RF, PM & PA

Sagem my700x FSL RF EDGE Subsystem

Continuous Innovation on Size and Power

Platform Techniques (Profiling)

Subsystem Techniques (Power Domain Gating)

Circuit Techniques (DVFS)

Transistor Design (Low Power)

POWER SIZE

Packaging(RCP)

Passive Integration(IPD)

Process Nodes RFCMOS (90nm)

SMOS (130nm)CMOS (65nm)

Architecture (MXC, i.MX, Polar-lite,

Direct Launch)

Leadership & Innovation in Packaging

• 30-50% reduction in size

• Reduces cost

• Module design

Thic

knes

s POP

RCP

FoldedPkg.

1.4mm Cos

t

StackPkg.

DieStack

PCBEmbed.Die

Footprint

RCP lowers cost, footprint and thickness

Connectivity Components

ZigBee™• Over 40% market share• Single chip RFCMOS solution in 2007

DVB-H• Over 50% tuner market share• Developing single chip solution

GPS• Shipping integrated solution in iDEN

platform

WLAN• Low power signal processing engine• Multi-mode architecture design in

progress

Priorities

• Broaden 2.5G, 2.75G and 3G portfolio

• Execute on design projects for Tier 1 OEMs

• Increase momentum with i.MX, RF/PA and PMIC

• Connectivity components now; platforms next

• Platform/software delivery capability

• Smooth technology transitions