CONTACT US:c/ Tomás A. Edison, 4 - 41092 Sevilla -Tel. +34 95 446 70 50www.altertechnology-group.com

SCANNING ACOUSTIC TOMOGRAPHYNon-destructive internal inspection and detection of hidden defects.

Main Activities • Reliability tests • Quality control & screening. • Failure analysis

Main Characteristics • Detection of ultra-thin (submicrometric) delaminations

in multilayer systems. • Micrometric lateral resolution and detection of

submicrometric features. • 3D Tomographic reconstruction. • Relabelling detection in counterfeit systems. • High sensitivity to voids in/on low density materials

(e.g. plastic encapsulation, PCBs,organic underfills, low-k inter-layer dielectrics

(ILD)…) and transparent to x-ray materials. • Compatibility with x-ray opaque (thick metal)

substrates and coatings.

Target FailuresVoids, cracks, delaminations, inclusions, attach and bound failures in:

• Plastic encapsulated IC

• Flip Chip systems (CGA, FCBGA, PBGA, FPBGA…)

• Bonded Wafers

• Printed Circuit Boards

• Capacitors

• Ceramics

• Metallic

Available stress tests Capabilities • Thermal test • Thermomechanical stress • Mechanical stress • Vibration test (sine, random,

shock) Complementary techniques • X-Ray inspection & 3D

tomography capabilities

Microsection Verification • Field Emission SEM. • Focused ion beam milling • Fluorescence microscopy and

dye penetrant test

Delamination at metals(lead frame and fingers)

Voids / crask inunderfill / attach

Solder bump white failures