semiconductors
TRANSCRIPT
(4.1)Semiconductor Devices Atoms and electricity Semiconductor structure Conduction in semiconductors Doping
–epitaxy–diffusion– ion implantation
Transistors–MOS–CMOS
Implementing logic functions
(4.2)Electricity Electricity is the flow of electrons Good conductors (copper) have easily released
electrons that drift within the metal Under influence of electric field, electrons flow
in a current–magnitude of current depends on magnitude of voltage applied to circuit, and the resistance in the path of the circuit
Current flow governed by Ohm’s Law
electron flow direction
V = IR
+
-
(4.3)Electron Bands Electrons circle nucleus
in defined shells– K 2 electrons– L 8 electrons– M 18 electrons– N 32 electrons
Within each shell, electrons are further grouped into subshells– s 2 electrons– p 6 electrons– d 10 electrons– f 14 electrons
electrons are assigned to shells and subshells from inside out– Si has 14 electrons: 2 K,
8 L, 4 M2
610
M shell
K
L
dps
(4.4)Semiconductor Crystalline Structure Semiconductors have a
regular crystalline structure– for monocrystal,
extends through entire structure
– for polycrystal, structure is interrupted at irregular boundaries
Monocrystal has uniform 3-dimensional structure
Atoms occupy fixed positions relative to one another, but are in constant vibration about equilibrium
(4.5)Semiconductor Crystalline Structure Silicon atoms have 4
electrons in outer shell– inner electrons are
very closely bound to atom
These electrons are shared with neighbor atoms on both sides to “fill” the shell– resulting structure is
very stable– electrons are fairly
tightly bound» no “loose” electrons
– at room temperature, if battery applied, very little electric current flows
(4.6)Conduction in Crystal Lattices Semiconductors (Si and Ge) have 4
electrons in their outer shell–2 in the s subshell–2 in the p subshell
As the distance between atoms decreases the discrete subshells spread out into bands
As the distance decreases further, the bands overlap and then separate– the subshell model doesn’t hold anymore,
and the electrons can be thought of as being part of the crystal, not part of the atom
–4 possible electrons in the lower band (valence band)
–4 possible electrons in the upper band (conduction band)
(4.7)Energy Bands in Semiconductors
The space between the bands is the energy gap, or forbidden band
(4.8)Insulators, Semiconductors, and Metals This separation of the valence and conduction bands determines the electrical properties of the material Insulators have a large energy gap
–electrons can’t jump from valence to conduction bands–no current flows
Conductors (metals) have a very small (or nonexistent) energy gap–electrons easily jump to conduction bands due to thermal excitation– current flows easily
Semiconductors have a moderate energy gap–only a few electrons can jump to the conduction band
» leaving “holes”–only a little current can flow
(4.9)Insulators, Semiconductors, and Metals (continued)
Conduction Band
Valence Band
Conductor Semiconductor Insulator
(4.10)Hole - Electron Pairs Sometimes thermal energy is enough to
cause an electron to jump from the valence band to the conduction band–produces a hole - electron pair
Electrons also “fall” back out of the conduction band into the valence band, combining with a hole
pair elimination
hole electron
pair creation
(4.11)Improving Conduction by Doping To make semiconductors better
conductors, add impurities (dopants) to contribute extra electrons or extra holes–elements with 5 outer electrons contribute an extra electron to the lattice (donor dopant)
–elements with 3 outer electrons accept an electron from the silicon (acceptor dopant)
(4.12)Improving Conduction by Doping (cont.) Phosphorus and arsenic are donor dopants
– if phosphorus is introduced into the silicon lattice, there is an extra electron “free” to move around and contribute to electric current» very loosely bound to
atom and can easily jump to conduction band
– produces n type silicon» sometimes use +
symbol to indicate heavier doping, so n+ silicon
– phosphorus becomes positive ion after giving up electron
(4.13)Improving Conduction by Doping (cont.)
Boron has 3 electrons in its outer shell, so it contributes a hole if it displaces a silicon atom–boron is an acceptor dopant
–yields p type silicon
–boron becomes negative ion after accepting an electron
(4.14)Epitaxial Growth of Silicon Epitaxy grows silicon
on top of existing silicon– uses chemical vapor
deposition– new silicon has same
crystal structure as original
Silicon is placed in chamber at high temperature– 1200 o C (2150 o F)
Appropriate gases are fed into the chamber– other gases add
impurities to the mix Can grow n type, then
switch to p type very quickly
(4.15)Diffusion of Dopants It is also possible to
introduce dopants into silicon by heating them so they diffuse into the silicon– no new silicon is added– high heat causes
diffusion Can be done with
constant concentration in atmosphere– close to straight line
concentration gradient Or with constant number
of atoms per unit area– predeposition– bell-shaped gradient
Diffusion causes spreading of doped areas
top
side
(4.16)Diffusion of Dopants (continued)
Concentration of dopant in surrounding atmosphere kept constant per unit volume
Dopant deposited on surface - constant amount per unit area
(4.17)Ion Implantation of Dopants One way to reduce the spreading found
with diffusion is to use ion implantation–also gives better uniformity of dopant–yields faster devices– lower temperature process
Ions are accelerated from 5 Kev to 10 Mev and directed at silicon–higher energy gives greater depth penetration
– total dose is measured by flux»number of ions per cm2
»typically 1012 per cm2 - 1016 per cm2
Flux is over entire surface of silicon–use masks to cover areas where implantation is not wanted
Heat afterward to work into crystal lattice
(4.18)Hole and Electron Concentrations To produce reasonable levels of
conduction doesn’t require much doping– silicon has about 5 x 1022 atoms/cm3
– typical dopant levels are about 1015 atoms/cm3
In undoped (intrinsic) silicon, the number of holes and number of free electrons is equal, and their product equals a constant–actually, ni increases with increasing temperature
This equation holds true for doped silicon as well, so increasing the number of free electrons decreases the number of holes
np = ni2
(4.19)Metal-Oxide-Semiconductor Transistors Most modern digital devices use MOS transistors,
which have two advantages over other types– greater density– simpler geometry, hence easier to make
MOS transistors switch on/off more slowly MOS transistors consist of source and drain
diffusions, with a gate that controls whether the transistor is on
p
n+ n+
S DGate
metal
silicon dioxidemonosilicon
(4.20)MOS Transistors (continued) Making gate positive (for n channel device)
causes current to flow from source to drain– attracts electrons to gate area, creates
conductive path For given gate voltage, increasing voltage
difference between source and drain increases current from source to drain
p
n+ n+
S D+
+
-
(4.21)Complementary MOS Transistors A variant of MOS transistor uses both n-channel and
p-channel devices to make the fundamental building block (an inverter, or not gate)– lower power consumption– symmetry of design
If in = +, n-channel device is on, p-channel is off, out is connected to -
If in = -, n-channel is off, p-channel is on, out is connected to +
No current flows through battery in either case!!
P
N
outin
(4.22)CMOS (continued) CMOS geometry (and manufacturing
process) is more complicated Lower power consumption offsets that Bi-CMOS combines CMOS and bipolar
(another transistor type) on one chip–CMOS for logic circuits–Bi-polar to drive larger electrical circuits off the chip
p
n+ n+
S D
p+ p+
S D
n
(4.23)Logic Functions Using CMOS
A
B
p
p
n
n
out
input 0 input 1
two input NAND - if both inputs 1, both p-channel are off, both n-channel are on, out is negative; otherwise at least one p-channel is on and one n-channel off, and out is positive