sensible solutions fast! - aries electronics · as a leading manufacturer of a broad range of...
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Sensible Solutions...Fast!
Burn-in/Test & RF SocketsFor QFPs, TSSOPs, CSPs, BGAs, QFNs, MLFs
Correct-A-Chip™ AdaptersFor SOICs, SSOPs, TSSPOs, QFNs
Vertisockets™
For DIPs, LEDs, DIP Switches, Test Points, Board-to-Board Jumpers
•Unique,patented2-pieceSpring-ProbeSystem•ForICson0.2mmpitchandgreater• Fivestandardmoldedsizesfordevicesupto55mm²•CustommachinedsocketsavailableforANYdevice•Elastomercontactsystemsfordevicetestingbeyond
45GHz
•Convertsand/orre-routesanyICdevicepackagetoanyotherICdevicepackage
•Eliminatestheneedtore-spinPCBsforICend-of-lifeorICpackagechange
•SMTorthru-holedesigns.RoHSorleaded(Pb)versionsavailable
•AvailableturnkeyoperationwithnewICassembledontoadapter
•Standardandcustomdesignscanbedeliveredin15workdaysorless
•Horizontalorverticaldisplay•Variousmountingpositionsandpinconfiguration•Exceptionaldesignfreedom•Restrictedentryforcontactprotection•Elevatedevicestodesiredlevelfrom0.260"to1.250"
heightextensions•Mountcomponentsatrightangletoprintedcircuit
board
ZIF SocketsFor DIPs, SOICs, PGAs, PLCCs
High-Temperature (200-300°C) ZIF SocketsFor DIPs, PGAs, CSPs, BGAs, LGAs, QFNs, MLCCs, More
DIP/SIP Sockets & HeadersFor DIPs, LCDs, Odd-shaped Devices
•Varietyofrowspacings,pincountsandgridfootprints•Contactsnormallyclosed,eliminatingdependenceon
plastictosustaincontact•Handlesconfiguredineitherupordownpositionand
mountedonrightorleftside•Socketscanbesolderedintoprintedcircuitboardsor
pluggedintoothersocketsortestreceptacles•Customdesignsuponrequest
• Forburn-inandtestapplications•Acceptsvariousrowspacings,pincountsandgridfoot-
printsonstandard8x8to21x21grids•High-frequencybandwidth(-1dBat>40GHz),low
inductance(0.02nH)andhigh-current(4ampsat14°Cheatrise)applications
•EnablesreliableATEtestingandburn-in
•Withsolderpintail,wirewrap,bifurcated,colletcontacts• Singleanddualrow•Side-to-sideandend-to-endstackable•Openframeforbetterairflow•Compatiblewithautomaticinsertionequipment
Cable AssembliesWith DIP and SIP Jumpers
Custom CapabilitiesFor New or Specialized Components
• Flexible,fusion-bonded,color-coded•SolidCopperconductorsembeddedbetweenlayersof
tough,flexible,flame-retardantinsulation•AwidearrayofDIPjumperconfigurationsandwiring
possibilities•Reliable,electronicallytestedsolderconnections
AriesElectronicsspecializesincustomdesignandproduction.Specialmaterials,platings,sizes,andconfigurationscanbefurnished,dependingonquantity.
Asaleadingmanufacturerofabroadrangeofinterconnectproducts,ourCorrect-A-Chip®technologyprovidesuniversalaccesswithexistingpackageswithoutredesign.
Someofourexpertiseliesin...•PinInstallationintoPlastic•MoldingEngineeredPlasticswithTightTolerances•CrimpingConnectorsonFlatCable•FlatCableWireStrippingandSeparation•CustomHigh-Frequency(RF)SocketDesign•Surface-mountingofElectronicComponents•BendingPins(Vertisocket™Line)•PatentedLimited-depthPinAssemblyforAdapterFlexibility
Ariesreservestherighttochangeproductgeneralspecificationswithoutnotice.
Aries Electronics, Inc.2609 Bartram Road • Bristol, PA 19007-6810 USA
Tel: 215-781-9956 • Fax: 215-781-9845 • Email: [email protected]