session 2 z196-z114 product update final

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© 2012 IBM Corporation z196/z114 Product Update IBM zEnterprise Hybrid Architecture James R. Fyffe Jr. IBM Hybrid Systems Technical Lead, NA IMT West; CISSP Email: [email protected] Last Update: June 15, 2012

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Page 1: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation

z196/z114 Product UpdateIBM zEnterprise Hybrid Architecture

James R. Fyffe Jr.IBM Hybrid Systems Technical Lead, NA IMT West; CISSP

Email: [email protected]

Last Update: June 15, 2012

Page 2: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation2

Session objectives

� Level set the audience on the current

zEnterprise Server Offerings.

� Review recently announced capabilities (GA2).

� Provide a forum for questions.

Page 3: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation3

State of System z – The Enterprise Server

© 2012 IBM Corporation3

Page 4: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation4

Achieved two-year, positive compound growth rate for the 6th consecutive quarter as of 1Q12.

BladeCenter Extension units

blades shipped

[ITD]

of System z clients

have IFLs installed

[1Q12]

new ISV partners

[2011]

125+

1100+

36%

100+

System z Total Installed Capacity

System z continues to grow

Page 5: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation5

new accounts since 3Q10

zEnterprise launch [as of 1Q12]

new accounts since 3Q10

zEnterprise launch [as of 1Q12]120+

35%+

49%

19% from public sector

goal of new clients in 2012100+

from the growth markets

from general business

System z new clients span the globe

Page 6: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation6

Project “Big Green” – Server virtualization

2007

Major proof point for Project Big Green

Today

• IBM will consolidate and virtualize thousands of server images onto IBM System z Mainframes

• Substantial savings: energy, software and systems support costs

• 80% less energy, 85% less floor space

• Enabled by virtualization capability

Progress

Servers consolidated over 5,000

Current migration pace2,000 servers / year

Energy savings >20,000 MegaWatt hours / year

Reduction in floor space 47,000 square feet

Sys Admin efficiency100 images/admin vs. 30 before

Consolidation RatiosIntel: X3850 - 15

Power: P5 - 65 ; P7 - 130z: z10 - 130 ; z196 - 200

6

Page 7: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation7

IBM z196 instruction set architecture

1960s 1970s 1980s 1990s 2000s

Continues line of upward-compatible Mainframe processors

• Application compatibility since 1964

• Supports all z/Architecture-compliant OSes

S/360 S/370™ 370/XA z/Architecture370/ESA ESA/390

• Binary Floating Point

• 64-bit addressing

• 31-bit addressing

• Sysplex

• Virtual addressing

• 24-bit addressing

Page 8: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation8

z196 Server Review

© 2012 IBM Corporation8

Page 9: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation9

� Machine Type– 2817

� 5 Models– M15, M32, M49, M66 and M80

� Processor Units (PUs)– 5.2 GHz, 1200 MIPS, 50 BIPS– Increased Cache

– L1 cache/PU core (64 KB I-cache + 128 KB D-cache)– L2 cache/PU core (1.5 MB)– L3 cache shared by 4 PUs per chip (24 MB)

– 110+ new instructions– Out of Order Execution– 20 (24 for M80) PU cores per book (96 max)– Up to 14 SAPs per system, 2 spares designated per system– Dependant on the H/W model - up to 15,32,49,66 or 80 PU

cores available for characterization• CPs, IFLs, ICFs, zAAPs, zIIPs, SAPs

– Sub-capacity available for up to 15 CPs• 3 sub-capacity points

� Memory (RAIM – Redundant Array of Independent Memory)– System Minimum of 32 GB– Up to 768 GB per book– Up to 3 TB for System and up to 1 TB per LPAR

• Fixed HSA, standard • 32/64/96/112/128/256 GB increments

� I/O– Up to 48 I/O Interconnects per System @ 6 GBps each– Up to 4 Logical Channel Subsystems (LCSSs)

� STP - optional (No ETR)� Water Cooling� Overhead Cabling

z196 overview

With no increase in

energy consumption

Page 10: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation10

0

1000

2000

3000

4000

5000

1997G4

1998G5

1999G6

2000z900

2003z990

2005z9 EC

2008z10 EC

2010z196

300MHz

420 MHz

550 MHz

770 MHz

1.2 GHz

1.7 GHz

4.4 GHz

5.2 GHz

� G4 – 1st full-custom CMOS S/390®

� G5 – IEEE-standard BFP; branch target prediction� G6 – Copper Technology (Cu BEOL)

� z900 – Full 64-bit z/Architecture� z990 – Superscalar CISC pipeline� z9 EC – System level scaling

� z10 EC – Architectural extensions � z196 – Additional Architectural

extensions and new cache structure

MH

zz196 continues the CMOS Mainframe heritage

Page 11: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

IBM System zBalanced System

Comparisonfor High End Servers

Balanced System

CPU, nWay, Memory,

I/O Bandwidth*

Memory

3 TB**

System I/O Bandwidth384 GB/Sec*

PCI for1-way

12021.5 TB**

64-way

920

80-wayProcessors

288 GB/sec*

600512 GB

54-way

96 GB/sec

450256

GB

32-way

24 GB/sec

30064

GB

16-way

* Servers exploit a subset of its designed I/O capability

** Up to 1 TB per LPAR

PCI – Processor Capacity Index

172.8 GB/sec*

z10 EC

z9 EC

zSeries 990

zSeries 900

z196 - 2011

11

Page 12: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation12

z114 Server Review

© 2012 IBM Corporation12

Page 13: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation13

� Machine Type– 2818

� 2 Models– M05 and M10– 3.8 Ghz, 26-3139 MIPS (UP speed 782 MIPS)– Single frame, air cooled– Non-raised floor option available– Overhead Cabling and DC Power Options

� Processor Units (PUs)– 7 PU cores per processor drawer (One for M05 and two for M10)– Up to 2 SAPs per system, standard– 2 spares designated for Model M10– Dependant on the H/W model - up to 5 or 10 PU cores available

for characterization• Central Processors (CPs), Integrated Facility for Linux (IFLs),

Internal Coupling Facility (ICFs), System z Application Assist Processors (zAAPs), System z Integrated Information Processor (zIIP), optional - additional System Assist Processors (SAPs)

• 130 capacity settings� Memory

– Up to 256 GB for System including HSA• System minimum = 8 GB (Model M05), 16 GB (Model M10)• 8 GB HSA separately managed• RAIM standard• Maximum for customer use 248 GB (Model M10)• Increments of 8 or 32 GB

� I/O– Support for non-PCIe Channel Cards– Introduction of PCIe channel subsystem

– Up to 64 PCIe Channel Cards – Up to 2 Logical Channel Subsystems (LCSSs)

� STP - optional (No ETR)

z114 overview

Page 14: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation14

z114 continues the CMOS Mainframe heritage

0

500

1000

1500

2000

2500

3000

3500

1997Multiprise®

2000

1999Multiprise

3000

2002z800

2004z890

2006z9 BC

2008z10 BC

MH

z

139MHz

413 MHz

625 MHz

1.0 GHz

1.4 GHz

� z800 - Full 64-bit z/Architecture®

� z890 - Superscalar CISC pipeline� z9 BC - System level scaling

3.5 GHz

� z10 BC - Architectural extensions �Higher frequency CPU

� z114 – Additional Architectural extensions and new cache structure

� Multiprise 2000 – 1st full-custom Mid-range CMOS S/390

� Multiprise 3000 – Internal disk, IFL introduced on midrange

2011z114

3.8 GHz

4000

14

Page 15: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation15

System comparisons System I/O Bandwidth

MemoryPCI for 1-Way

Engines

782256 GB

128 GB/Sec

5-Way

256 GB

72 GB/Sec

5-Way

67364 GB

4-Way

47434417032 GB

21.6 GB/Sec

16 GB/Sec

6 GB/Sec

z114

z10 BC

z9 BC

z890

z800

Notes:1. Capacity shown is for CPs only2. z9, z10 and z114 can have additional PUs

which can be used as Speciality Engines

Page 16: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation16

zEnterprise GA2 Updates

© 2012 IBM Corporation16

Page 17: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation17

I/O infrastructure

� New PCIe-based I/O infrastructure

� New PCIe I/O drawer

� Increased port granularity

� Designed for improved power and bandwidth compared to I/O cage and I/O drawer

Storage

� New PCIe-based FICON Express8S features

� ESCON Statement of Direction

Networking

� New PCIe-based OSA-Express4S features

Coupling

� New 12x InfiniBand and 1x InfiniBand features (HCA3-O fanouts)

� 12x InfiniBand - increased service times when using 12x IFB3 protocol

� 1x InfiniBand – increased port count

zEnterprise 114 and zEnterprise 196 GA2

Page 18: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

z196 GA2 I/O Features supported

� Features – PCIe I/O drawer– FICON Express8S

• SX and LX– OSA-Express4S

• 10 GbE LR and SR• GbE SX and LX

� Features – I/O cage and I/O drawer– Crypto Express3– ESCON (240 or fewer)– FICON Express8 (Carry forward or RPQ 8P2534 to fill empty slots)– FICON Express4 (Carry forward only)– ISC-3– OSA-Express3 1000BASE-T– OSA-Express3 (Carry forward or RPQ 8P2534 to fill empty slots)

• 10 GbE, GbE– OSA-Express2 (Carry forward only)

• GbE, 1000BASE-T– PSC (Carry forward or new build, no MES add)

28 slot I/O cage

8 slot I/O drawer

PCIe I/O drawer

32 I/O slots

Supported features

18

Page 19: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation19

z114 I/O Features supported

� Features - PCIe I/O drawer

• FICON Express8S

SX and 10 km LX

• OSA-Express4S

10 GbE LR and SR

GbE SX and LX

� Features - I/O drawer

• Crypto Express3, Crypto Express3 1P

• ESCON (240 or fewer)

• FICON Express8 (Carry forward or RPQ 8P2534 to fill empty slots)

• FICON Express4 (Carry forward only for 4 port cards)

• FICON Express4-2C (Carry forward or RPQ 8P2534 to fill empty slots)

• ISC-3

• OSA-Express3 1000BASE-T (Includes -2P)

• OSA-Express3 (Carry forward or RPQ 8P2534 to fill empty slots)10 GbE, GbE

• OSA-Express2 (Carry forward only)GbE, 1000BASE-T

• PSC (Carry forward or new build, no MES add)

8 slot I/O drawer

32 slot PCIe I/O drawer

Supported features

Page 20: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

� For FICON, zHPF, and FCP environments

- CHPID types: FC and FCP

- 2 PCHIDs/CHPIDs

• Auto-negotiates to 2, 4, or 8 Gbps

• Increased performance

compared to FICON Express8

� 10KM LX - 9 micron single mode fiber

- Unrepeated distance - 10 kilometers (6.2 miles

- Receiving device must also be LX

� SX - 50 or 62.5 micron multimode fiber

- Distance variable with link data rate and fiber type

- Receiving device must also be SX

• 2 channels of LX or SX (no mix)

• Small form factor pluggable (SFP) optics

- Concurrent repair/replace action for each SFP LX SX

FICON Express8S – PCIe I/O drawer

# 0409 – 10KM LX, # 0410 –SX

OR

2, 4, 8 Gbps

2, 4, 8 Gbps

FLASH

SFP+

SFP+IBM

ASIC

IBM

ASICPCIe

SwitchHBA

ASIC

HBA

ASIC

FLASH

20

Page 21: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

1200

14000

31000

20000

52000

20000

92000

0

10000

20000

30000

40000

50000

60000

70000

80000

90000

100000

I/O driver benchmark I/Os per second4k block sizeChannel 100% utilized

FICONExpress4

andFICON

Express2

zHPF

FICON Express

8

zHPF

FICON Express8FICON

Express4and

FICONExpress2

ESCON

zHPF

FICON Express8

S

FICON Express8

S

z10 z10z196z10

z196z10

z196z114

z196z114

FICON performance on System z

350

520

620

770

620

1600

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

FICON Express44 Gbps

I/O driver benchmarkMegaBytes per secondFull-duplexLarge sequentialread/write mix

FICONExpress44 Gbps

FICON Express

88 Gbps

FICON Express

88 Gbps

FICON Express8

S8 Gbps

FICON Express8

S8 Gbps

z10z9 z10

z196

z10

z196

z10z196z114

z196z114

zHPF

zHPF

zHPF

77% increase

108% increase

21

Page 22: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

• 10 Gigabit Ethernet (10 GbE)

- CHPID types: OSD, OSX

- Single mode (LR) or multimode (SR) fiber

- One port of LR or one port of SR

- 1 PCHID/CHPID

• Gigabit Ethernet (GbE)

- CHPID types: OSD (OSN not supported)

- Single mode (LX) or multimode (SX) fiber

- Two ports of LX or two ports of SX

- 1 PCHID/CHPID

• Small form factor optics – LC Duplex

OSA-Express4S fiber optic – PCIe I/O drawer

# 0406 – 10 GbE LR, # 0407 – 10 GbE SR

PCIeIBM

ASIC

FPGA

PCIeIBM

ASIC

FPGA

# 0404 – GbE LX, # 0405 – GbE SX

22

Page 23: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

System z OSA-Express3 and OSA-Express4S

� Double density of ports compared to OSA-Express2

– Reduced CHPIDs to manage

– Reduced I/O slots

– Reduced I/O cages or I/O drawers

– Up to 96 LAN ports versus 48

� New microprocessor and hardware data router – compared to OSA-Express2– Large send for IPv4 and IPv6 traffic– Checksum offload– Large send packet construction, inspection and routing performed in hardware

� Designed to reduce the minimum round-trip networking time between z196/z114

systems (reduced latency)

– Designed to improve round trip at the TCP/IP application layer• OSA-Express3 and 4S10 GbE

45% improvement compared to the OSA-Express2 10 GbE

• OSA-Express3 and 4S GbE

45% improvement compared to the OSA-Express2 GbE

– Designed to improve throughput (mixed inbound/outbound)

• OSA-Express3 and 4S 10 GbE• 1.0 GBytes/ps @ 1492 MTU• 1.1 GBytes/ps @ 8992 MTU• 3-4 times the throughput of OSA-Express2 10 GbE• 0.90 of Ethernet line speed sending outbound 1506-byte frames• 1.25 of Ethernet line speed sending outbound 4048-byte frames

23

Page 24: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

OSA-Express4S 10 GbE performance (laboratory)Mixed Streams – 1492 Byte MTUs

1240

2080

0

500

1000

1500

2000

2500

MB

ps

680

1180

0

200

400

600

800

1000

1200

1400

MB

ps

615

1120

0

200

400

600

800

1000

1200

1400

MB

ps

11801680

0

500

1000

1500

2000

2500

MB

ps

Inbound Streams – 1492 Byte MTUs

OSA-E3 OSA-E4S

80% increase

70% increase 70% increase

40% increase

Mixed Streams – 8000 Byte MTUsInbound Streams – 8000 Byte MTUsOSA-E3 OSA-E4S

OSA-E3 OSA-E4S OSA-E3 OSA-E4S

Notes:

� AWM on z/OS

� z/OS is doing checksum

� 1 megabyte per second

(MBps) is 1,048,576

bytes per second

MBps represents payload

throughput (does

not count packet

and frame headers)

Maximum transmission units (MTUs)24

Page 25: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

Up to 16 CHPIDs – across 2 ports*

z114 and z196 GA2 InfiniBand HCA3 Fanouts

Up to 16 CHPIDs – across 4 ports*

IFB IFB

HCA3-O for 12x IFB & 12x IFB3

IFB

HCA3-O LR for 1x IFB

IFB IFB IFB

* Performance considerations may reduce the number of CHPIDs per port.

� New 12x InfiniBand and 1x InfiniBand fanout cards

� Exclusive to zEnterprise 196 and zEnterprise 114

– HCA3-O fanout for 12x InfiniBand coupling links

• CHPID type – CIB

– Improved service times with 12x IFB3 protocol

– Two ports per feature

– Fiber optic cabling – 150 meters

– Supports connectivity to HCA2-O

(No connectivity to System z9 HCA1-O)

– Link data rate of 6 GBps

– HCA3-O LR fanout for 1x InfiniBand coupling links

• CHPID type – CIB

– Four ports per feature

– Fiber optic cabling

– 10 km unrepeated, 100 km repeated

– Supports connectivity to HCA2-O LR

– Link data rate server-to-server 5 Gbps

– Link data rate with WDM; 2.5 or 5 Gbps

Note: The InfiniBand link data rates do not represent the performance of the link. The actual performance is dependent upon many factors including latency through the adapters, cable lengths, and the type of workload.

25

Page 26: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

12x InfiniBand Coupling IFB3 Protocol (HCA3-O fanout)

� Two protocols

1. 12x IFB – HCA3-O to HCA3-O or HCA2-O

2. 12x IFB3 - improved service times for HCA3-O to HCA3-O

– 12x IFB3 service times are designed to be 40% faster than 12x IFB

� 12x IFB3 protocol activation requirements

– Four or fewer CHPIDs per HCA3-O port

• If more than four CHPIDs are defined per port, CHPIDs will use IFB protocol and run at 12x IFB service times

Up to 16 CHPIDs – across 2 ports*

IFB IFB

HCA3-O for 12x IFB & 12x IFB3

* Performance considerations may reduce the number of CHPIDs per port.

Note: The InfiniBand link data rates do not represent the performance of the link. The actual performance is dependent upon many factors including latency through the adapters, cable lengths, and the type of workload.

26

Page 27: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation27

Operating System Update

© 2012 IBM Corporation27

Page 28: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation28

z/OS Version 1 Release 13 z/VM and Linux on System z z/VSE Version 5.1

� z/OS Predictive Failure Analysis and Runtime Diagnostics - help provide early

warning of certain system issues before

they become obvious

� Updates to shorten batch window, simplify batch programming, and give you more

flexibility in deploying batch applications.

� Enhancements to improve I/O performance for z/OS UNIX workloads in a

Parallel Sysplex

� Improved backup capability and system

responsiveness with less-disruptive backups.

� XML Performance improvements for

complex docs

� Continued investment in simplification with

z/OS Management Facility

� Support of new encryption and compliance

standards and keys

� Server and application consolidation on System z using Linux on System z and

z/VM is the industry leader in large-scale, cost-efficient virtual server hosting

� zEnterprise extends the choice of

integrated workloads through blades on zBX

� The z114 lowers the entry cost to get started with the Enterprise Linux Server

� Faster cores and a bigger system cache on the z196 let you do even more with less when running Linux on System z and z/VM

� Integrated blades on zBX will offer added dimension for workload optimization including applications on Windows

� Introduces 64-bit virtual addressing to

z/VSE

• Reduces memory constraints

• Allows to exploit more ‘data in memory’

� Continues the z/VSE strategy of protect,

integrate, and extend (in short “PIE”)

• Protect existing customer investments in applications and data on z/VSE

• Integrate z/VSE with the rest of IT

• Extend with Linux on System z to build modern integrated solutions

� Exploitation of selected zEnterprise

functions and features as well as IBM System Storage options

� Includes a SoD on CICS Explorer

capabilities for CICS TS for VSE/ESA

Leverage the latest operating systems to exploit the full value

of the z114and z196

Page 29: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation29

Superior virtualization for today and the future: z/VM 6.2

� Increased flexibility with Live Guest Relocation (LGR) to move virtual servers without disruption.

� Increased management of resources with multi-system virtualization to allow up to four z/VM instances to be clustered as a single system image.

� Increased scalability with up to four systems horizontally, even on mixed hardware generations.

� Increased availability through non-disruptively moving work to available system resources and non-disruptively moving system resources to work.

“LGR is the very

best z/VM software

enhancement since

64-bit support

became available.”– Mark Shackelford, Vice President,

Information Services, Baldor

“CSL-WAVE 3.0 will provide day-one support for z/VM 6.2 …

allowing users to harness its powerful new features in an easy,

graphical and very intuitive manner.”– Sharon Chen, Founder and CEO, CSL International Ltd

Relief from the challenges associated with virtual machine sprawl on

competitive systems

Page 30: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation30

Page 31: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation31

Trademarks

Notes:

Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.

IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.

All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.

This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area.

All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.

Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.

* Registered trademarks of IBM Corporation

The following are trademarks or registered trademarks of other companies.

* Other product and service names might be trademarks of IBM or other companies.

Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries.

IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency which is now part of the Office of Government Commerce.

Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel

Corporation or its subsidiaries in the United States and other countries.

Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both.

Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both.

Windows Server and the Windows logo are trademarks of the Microsoft group of countries.

ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office.

UNIX is a registered trademark of The Open Group in the United States and other countries.

Java and all Java based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates.

Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom.

Linear Tape-Open, LTO, the LTO Logo, Ultrium, and the Ultrium logo are trademarks of HP, IBM Corp. and Quantum in the U.S. and other countries.

The following are trademarks of the International Business Machines Corporation in the United States and/or other countries.

BladeCenter*

CloudBurst

DataPower*

DB2*

DS8000*

FlashCopy*

IBM*

IBM (logo)*

InfoSphere

POWER7*

Power Systems

ProtecTIER*

Rational*

Storwize*

System x*

VMControl

WebSphere*

XIV*

zEnterprise

Page 32: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation32

Back-up Slides

© 2012 IBM Corporation32

Page 33: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation33

zEnterprise 196 functions and features

(GA Driver 93 – September, 2011)

Additional Cryptographic enhancements

8 GBps PCIe interconnects

Additional STP enhancements

Doubled Coupling CHPIDs to 128

Improved PSIFB Coupling Link

Physical Coupling Links increased to 104

New 32 slot PCIe Based I/O Drawer

Increased granularity of I/O adapters

New form factor I/O adapters i.e. FICON Express8S and OSA-Expres4S

Page 34: Session 2 z196-z114 Product Update FINAL

© 2012 IBM Corporation34

zEnterprise 114 functions and features

(GA Driver 93 – September, 2011)

Two hardware models

Up to 10 processors configurable as CPs, zAAPs, zIIPs, IFLs, ICFs, or optional SAPs

Up to 130 subcapacity settings across a maximum of 5 CPs

Up to 256 GB of Redundant Array of Independent Memory (RAIM) for System

Dedicated Spares on the Model M10

Increased capacity processors

Out of order instruction execution

Improved processor cache design

New and additional instructions

On Demand enhancements

CFCC Level 17 enhancements

Cryptographic enhancements

6 and 8 GBps interconnects

2 New OSA CHPIDs – OSX and OSM

Doubled HiperSockets to 32

Additional STP enhancements

Doubled Coupling CHPIDs to 128

Improved PSIFB Coupling Link

Physical Coupling Links increased to 72 (Model M10)

New 32 slot PCIe Based I/O Drawer

Increased granularity of I/O adapters

New form factor I/O adapters i.e. FICON Express8S and OSA-Expres4S

Humidity and altimeter smart sensors

Optional High Voltage DC power

Optional overhead I/O cable exit

zBX-002 with POWER7, DataPower XI50z and IBM System x Blades*

NRF Support with either top exit or bottom exit I/O and power

Reclassification from “general business”environment to “data center”

*All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represents goals and objectives only.

Page 35: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

z196 GA2 I/O Infrastructure (PCIe Based) with PCIe I/O drawerBook 3Book 1

Memory

x16 PCIeGen2 8 GBps

Memory Memory Memory

Book 0 Book 2

PCIe

switch

OSA-Express4S

PCIe (8x) PCIe (8x) HCA2 (8x)

PCIe

switchPCIe

switch

FICON Express8S

PCIe

switch

4 GB/s PCIe

Gen2 x8

SC1, SC0 (FBC)

PU PU

PU PU PU

PU

SC1, SC0 (FBC)

PU PU

PU PU PU

PU

SC1, SC0 (FBC)

PU PU

PU PU PU

PU

SC1, SC0 (FBC)

PU PU

PU PU PU

PU

PCIe I/O drawerPCIe I/O drawer

FanoutsFanoutsFanoutsFanouts

6 GBps

HCA2 (8x)

IFB-MPRII

IFB-MP

FICON Express8

2 GBps mSTI

Channels

1 GBpsmSTI

2 GBps mSTI

Ports

2GBpsmSTI

FP

GA

FP

GA

FP

GA

FP

GA

RIIIFB-MPIFB-MP

OSA-Express3

I/O Cage & I/O drawerI/O Cage & I/O drawer

RIIRII

35

Page 36: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

HCA2-C IFB IFB

z196 Connectivity for I/O and Coupling

� Up to 8 fanout cards per z196 book– M15 (1 book) – up to 8 – M32 (2 books) – up to 16– M49 (3 books) – up to 20– M66 and M80 (four books) – up to 24

� I/O fanouts compete for fanout slots with the the InfiniBand HCA fanouts that support coupling:

– HCA2-O 12x two InfiniBand DDR links– HCA2-O LR two 1x InfiniBand DDR links– HCA3-O two 12x InfiniBand DDR links– HCA3-O LR four 1x InfiniBand DDR links

� PCIe fanout – PCIe I/O Interconnect linksSupports two copper cable PCIe 8 GBps interconnects to two 8-card PCIe I/O domain multiplexers. Always plugged in pairs for redundancy.

� HCA2-C fanout – InfiniBand I/O Interconnect Supports two copper cable 12x InfiniBand DDR 6 GBps interconnects to two 4-card I/O domain multiplexers. Always plugged in pairs for redundancy.

Fanout slots

PCIe PCIe PCIe

36

Page 37: Session 2 z196-z114 Product Update FINAL

© Copyright IBM Corporation 2012

IBM System z

HCA2-C IFB IFB

PCIe PCIe PCIe

z114 Connectivity for I/O and Coupling

� Up to 4 fanouts per z114 CEC drawer– M05 (one CEC drawer) – up to 4 fanouts– M10 (two CEC drawers) – up to 8 fanouts

� I/O fanouts compete for fanout slots with the InfiniBand HCA fanouts that support coupling:

– HCA2-O 12x two InfiniBand DDR links– HCA2-O LR two 1x InfiniBand DDR links– HCA3-O two 12x InfiniBand DDR links– HCA3-O LR four 1x InfiniBand DDR links

� PCIe fanout – PCIe I/O Interconnect linksSupports two PCIe 8 GBps interconnects on copper cables to two 8-card PCIe I/O domain switches. Always plugged in pairs for redundancy.

� HCA2-C fanout – InfiniBand I/O Interconnect Supports two 12x InfiniBand DDR 6 GBps interconnects on copper cables to two 4-card I/O domain multiplexers. Always plugged in pairs for redundancy.

Drawer 2M10 only

Drawer 1M05 and M10F

ANOUT

FANOUT

FANOUT

FANOUT

FANOUT

FANOUT

FANOUT

FANOUT

37