s.gnyana sundar program director - offsets strategic ... director - offsets strategic electronics...
TRANSCRIPT
….long-term partners to Indian Defence
STRATEGIC ELECTRONICS DIVISION
Offset opportunities
26th
July 2012
S.Gnyana Sundar
Program Director - Offsets
Strategic Electronics Division
THE TATA POWER COMPANY LIMITED
STRATEGIC ELECTRONICS DIVISION
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Contents
• Strategic Electronics
• Origin for Offset Opportunities: India’s Defence Budget
• Requirements of Defence Services
• Offset Opportunities
• Challenges and Responsibilities
• Way Forward
• Conclusion
STRATEGIC ELECTRONICS DIVISION
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Definition of Strategic Electronics
• Strategic Electronics
− Application of the state-of-the-art
technology for designing,
developing and upgrading
mission critical systems
− In Defence,
− Strategic Electronics is
Embedded Intelligence in
Weapon Systems and
associated Support Systems
for all tactical / strategic
applications
Modern Warfare
Strategic Electronics is not about Hardware;
It is Capability & Process
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Defence Standards
• Military System Engineering Standard Mil-Std-499B and a plethora of
Military Standards covering everything from Earthing Standards Mil-Hdbk-
419A to EMP Hardening Mil-Std-188-125-2
• Environmental Specifications – JSS 55555
– Mil-Std-810F
• EMI/EMC – Mil-Std-461 C/D/E/F
• EMP Hardening – Mil-Std-188-125-2
• Documentation Standard JSS-0251-01
• Systems Engineering ISO 15288 encompassing Software lifecycle standard
IEEE12207
• CMMI Development v1.3
– US DoD Standard with Carnegie Mellon University – Software Engineering
Institute (SEI)
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Imperatives to meet Defence Needs
• Ruggedisation for Operation in Harsh Environments
• Appropriate facilities for realisation of Rugged Systems
– PCB Assembly, Testing, Rework, etc
– Sub-System Assembly, Testing and Repair
– Large System Integration
• Processes & Quality Systems for
– Integrated Design to Manufacturing
– Product Lifecycle Management
• Configuration Management
– Traceability of Hardware and Software Components through the entire lifecycle
• Supply Chain Management & storing of components for Lifecycle Support
• Repairs & Maintenance
– Obsolescence Management
• Security & Trust
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Ruggedisation for Operations in Harsh Environments
Sr
No.
Parameter Mitigation Techniques
1 Corrosion, mould
growth, contamination
protection,
Humidity protection
i. Proper selection of various materials/processes in the
individual components/assemblies
ii. Coating and encapsulation techniques can also be
employed for components/assemblies.
2 Temperature and
altitude withstanding
capability
i. Proper thermal management techniques. Usage of suitably
designed heat sinks with proper connectivity, force cooling
with fans, and thermo-electric devices. Peltier devices.
3 Drip / Dust proofing
capacity
i. Sealed construction to IP-54 or higher level grade, Gaskets
of various sizes and shapes at the joints, to prevent any
ingress of dust or water into the system
4 Vibration, Shock
Handling i.e., toppling,
dropping and bumping
Acceleration
i. Avoiding cantilevers
ii. Using stiff brackets and damped structure
iii. Using materials with high stiffness to mass ratio
iv. Providing firm anchorage for large masses
v. Providing additional supports for long/flexible members, for
e.g., PCBs to prevent warping and damage due to vibration
vi. Anchoring electrical cable looms and connectors
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Ruggedisation for Operations in Harsh Environments
Sr
No.
Parameter Mitigation Techniques
1 CE, RE, CS, RS,
Electro Static
Discharge (ESD)
i. Shielding gaskets, special materials such as mu-metal metal
mesh/conducting film embedded in acrylic sheets, filters,
specifically designed to comply with individual system and
subsystem requirements.
EMI/EMC Techniques
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Electro Magnetic Pulse (EMP) Hardening
• Why EMP Protection?
– Manmade (EMP Bombs), Natural (Solar Flares)
– 50,000 volts / meter field strength
– Can permanently disable civil/military installations
– Command, Control & Communication failure
• How to protect against EMP?
– Double Skinned Sandwich Enclosures (Faraday cage)
– EMP Filters, Wave guide feed-through
– Improved Shielding, Reinforced paths to GND to steer pulse away from equipment.
– Honeycomb air vents
– EMP Hardened Circuits and Equipment
– Migration to Fiber Optic media
• Trade off
– Increase in Equipment Weight
– Higher Equipment costs
– Higher installation and maintenance Costs
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Feature Distinction & Reliability
• SWAP (Size, Weight and Power)
– Size & Weight
• Optimisation of Unit size can be achieved the mechanical 3D modeling tools and the
PCB design tools were integrated tightly, such that designs could be moved between
these two diverse environments
• Use of special light-weight, high-strength composites
– Power
• Use of Intelligent Power Management Techniques - Optimise energy consumption
from batteries depending upon the “computing speed” demands (computing speed is
directly proportional to energy consumption) of various applications thus extending
the uninterrupted operational time without a battery re-charge
• Use of Dual hot-swappable Power Modules
• Modular & Scalable Power Systems
• Alternative sources of Power Supplies such as Fuel Cells
• Reliability
– No single point failure
– Graceful degradation
– Structural, Thermal & Circuit Analysis & Validation
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Security & Trust
• Secure & Trusted Platform for Information Assurance to handle Military
Intelligence
– Presence of a “Kill Switch” (electronic trapdoors) in key military hardware that
can be accessed remotely for destructive purposes is a world-wide fear among
Defence personnel
– EM emissions are “signatures” of equipment and in the case of imported
hardware these EM signatures will be known by enemy forces as the use of
these Hardware platforms will be detected with their unique signatures.
– Mitigation Technique - Minimise the effect of Kill Switch and vary the EM
signatures (akin to Frequency Hopping), thus enhancing the trustworthiness
and security of the platform
– Need for Secure Operating System to control access to hardware and
peripherals
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Indian Defence budget
– FY 2012-13: INR 1,934 billion
– Increase : 17.6% over previous year
– Capital expenditure: INR 795.79 billion
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Increasing opportunities
– Request for information floated during Jan 2012 to 15 April 2012
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Increasing opportunities
– Request for proposals floated during Jan 2012 to 15 April 2012
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• High Accuracy and Fast Acting Weapon Systems
• Rugged and Reliable Communication System
• Battle Field Management System
• Network Centric Warfare
• Electronic Warfare
• Sensors
• Training
• Futuristic Infantry Combat Vehicle
• FINSAS : Future Infantry Soldier As a System
INDIAN ARMY
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• Gun Upgrades
• Manufacture of guns
• Multi Barrel Rocket Launchers
• Missile launchers
• Anti Missile Missile launchers
• Battle Tank Upgrades
• Command and Control Systems
High Accuracy Fast Acting Weapon Systems
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• Network Centric Warfare: Communication Network on the move
• Software Defined Radio
– Ground based
– Airborne
• Intra Tank and Inter Tank Communication system
• Tactical Communication System
Rugged and Reliable Communication System
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• Futuristic Infantry Combat Vehicle
– Turret Control
– Sighting System
– Fire control System
– Self Protection suite
– Protection against NBC
– Communication
– GPS and Navigation
• FINSAS : Future Infantry Soldier As a System
– Communication
– Thermal Imaging
– GPS
• Actjve Protection System for tanks
Futuristic Programs
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• Hardware
– Rugged Work Stations
– Communication receivers
– GPS
– Jamming Transmitters
– Antenna Hoisting and Retraction Systems
– Power conditioning and UPS
• SOFT WARE – COM Segment
– Non Com Segment
– Control Centre
– GIS
Electronic Warfare
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• Hard ware
– Radars
– Thermal Imagers
– Gun Sights
– Laser Range Finder
– Night Vision Goggles
– Gimbal
• SOFT WARE
– Image Processing
– Image Identification
– Video Tracking
Sensors
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• Training Simulators
– Weapons
– Battle Tanks
• Driving
• Firing
– Missile Launchers
– Electronic Warfare
– UAVs
– Ships
• Platform control
• Machine room
TRAINING
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• Intra Ship and Inter ship Communication system
• Electronic Warfare
– Dual Redundant Work Stations
– Dual Multi Function Consoles
– Software
• Communication Systems
– SDR
– VLF Receivers and Transmitter
• Weapon Systems
• Sensors
– SONARS
– Sonobuoys
• Unmanned Under Water Vehicles
• Coastal Surveillance
Navy
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• Naval Combat Systems
• Submarines
• Aircraft carrier
• Port Security
• AEW&C
• Training – Platform control
– Weapon System
– Machine Room
Navy - Contd
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• Fighter Aircrafts
• Trainer Aircrafts
• Transport Aircrafts
• Helicopters
• Aircraft Upgrades
• AEW&C
• Training Simulators
Air Force
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Any program of value exceeding Rs.300 crores
Some examples • Indian Airforce
– New Aircrafts • MMRCA
• C 130
• C 17
• P8
– Attack Helicopters
– UAVs – UPGRADES
• KA 28 Helicopters
• MIRAGE 2000
– Training simulators
• Indian Army – Missile launchers: MRSAM, SRSAM, LRSAM
– Guns and Gun upgrades
– Training Simulators
– ADS
• Indian Navy
– Sub marines
– Port security: PDDS, Decoys, Torpedo defence systems
Programs eligible for Offsets
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• IAI Israel
• ELTA Israel
• Boeing USA
• Lockheed Martin USA
• HDW Germany
• ADS, Germany
• Dassault, France
• Thales, France
• Kangnam Korea
• Kongsberg, Norway
• Selex Italy
• Kamov Russia
• Indra, Spain
• Terma Denmark
“A REPRESENTATIVE LIST”
Foreign OEMs looking for Offset partners
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• Cutting Edge Technology
– Indigenous development
– Foreign Technology on selective basis
• High Quality of Design and Manufacture
– ISO 9001
– AS 9100
– ISO 27001
– CMMI Level 5
• Timely Delivery
• Reliability
– High MTBF
– Low MTTR
• Maintenance
– Low turn around time
– Fast repair
– Spares stocking
• Long Term Product Support
Challenges and Responsibilities
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• Obsolescence Management
• Upgrades
– Mid Life – Due to obsolescence
– End Of Life
– Customer driven
• Training and Documentation
– Interactive Training manuals
– CBT
– Training Simulators
• Product Liability
– Insurance against loss to third party
Challenges and Responsibilities - Contd
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Influence Categorization : SCAPP CC
• BUY INDIAN
• BUY & MAKE
• BUY AND MAKE INDIAN
• BUY GLOBAL
Contest Nomination
Way forward
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• Form Joint ventures Large Industries
• Program specific partnership agreements
• Tier 2 suppliers for major industries
• Offer specialized services directly or through tier 1 suppliers
– EMS
– Wiring harnesses
– Shelters
– Design engineering services
– High precision manufacturing
– Sourcing and Logistics
– Field support
– Maintenance support
Way forward – Contd.
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• Opportunities under OFFSETS are many
• Opportunities are growing
• Opportunities are challenging
• Catalyst for growth of Indian Companies in terms of – Technology
– Revenues
– Profitability
– Growth
– Global foot print
Conclusion