1

SHSH--MobileG1: MobileG1: A SingleA Single--Chip Application and Chip Application and

DualDual--mode Baseband Processormode Baseband Processor

Masayuki Ito1, Takahiro Irita

1, Eiji Yamamoto

1,

Kunihiko Nishiyama1, Takao Koike

1, Yoshihiko Tsuchihashi

1,

Hiroyuki Asano1, Hiroshi Yagi

1, Saneaki Tamaki

1,

Ken Tatezawa1, Toshihiro Hattori

1, Shinichi Yoshioka

1,

Koji Ohno2 *

.

1 Renesas Technology2 NTT DoCoMo

*: Currently with Renesas Technology

2

OutlineOverview

SH-MobileG1 Architecture

- 3 CPU Configuration

- Communication Architecture

- Interrupt Control

- System Control

- Power Control and Leakage Current

Summary

3

3G Multi-Media Cellular Phone System

HPAHigh Power Amplifier

RFICRadio Frequency IC

BasebandProcessor

ApplicationProcessor

Multi-MediaAccelerator

HPAHigh Power Amplifier

RFICRadio Frequency IC

One ChipSH-MobileG1

PreviousSystem

New SystemUsing G1

4

Realtime OS (ITRON, etc.)

BB-CPU (ARM)

W-CDMA IPGSM/GPRS IP

Application-System domain

Baseband domain

SuperHyway Bus SuperHyway Bus

AP-RT CPU (SH) APSYS CPU(ARM)

Multi-MediaAccelalators

System Peripherals

BridgeBridge

SDRAMSDRAM SDRAMSDRAM

General Purpose OS(Symbian, Linux, etc.)

VideoVideoM/WM/W

CameraCameraM/WM/W

GSM/WCDMAGSM/WCDMAProtocol StackProtocol Stack

AudioAudioM/WM/W

File File SystemSystem

JAVAJAVADeviceDeviceDriverDriver

CameraCameraApplicationApplication

MailMailApplicationApplication

Video PhoneVideo PhoneApplicationApplication

BrowserBrowserApplicationApplication

TelephoneTelephoneApplicationApplication

APIAPI

Realtime OS (ITRON, etc.)

Application-Realtimedomain

A Sample of System Architecture using G1

5

Motivation for One Chip Integration

GSM

W-CDMA

BB-CPU

APL-RTCPU

AP-SYSCPU

BB-Misc

AP-Misc

MediaRAM

3D G MPEG

Camera

SoundCPG

LCDC

JPEG

DDR

SRAM

- Chip-set cost will be down

- Mount area will be decreased by sharing

common peripherals

- Performance will be up by wide data

throughput

- Dynamic power will be saved by low-load

inter-domain signals

- Static power will be saved by leakage

current shut-off for unused domain

6

Chip Overview

181M TRs,

13.5M Gate

20.2 Mbit mem

# of TRs, gate, memory

11.15mm x 11.15mm

Die size

1.2V(internal), 1.8/2.5/3.3V(I/O)

Supply voltage

90nm LP

8M(7Cu+1Al)

CMOS dual-Vth

Process

GSM

W-CDMA

BB-CPU

APL-RTCPU

AP-SYSCPU

BB-Misc

AP-Misc

MediaRAM

3D G MPEG

Camera

SoundCPG

LCDC

JPEG

DDR

SRAM

7

G1 Module Diagram

BSC SBSC

LCDC

VIO

MFI

DMAC3DG

INTCRT

CPGAP

Camera

LCD

Med

ia B

us

JPU

VPU

HP

Bu

s (R

T)

APBB

AH

B B

us

AP-RT Block

DMAC

MFI

INTCSYS

HP

Bu

s (S

YS

)

Peripherals(SYS)

APB Bus

MMU

I-Cache

CPU

AP-SYS Block

D-Cache

MMU

I-Cache

CPU

BB Core Block

D-Cache

BB Main Bus

CPGBB

BBSC

WCDMA Block

GSM Block

MODEMDSP

MMU

I-Cache

CPU

D-Cache

URAM

DSP

XYRAM

INTCBB

SYSC WUC

Peripherals(RT)

DMAC

ABBPeripherals

S2SSuperHyway (SYS) SuperHyway (RT)

INTRAM

MODEMDSP

Peripherals

8

AP-Realtime Domain Configuration

SHX2 runs on RT-OS - 2-way superscalar up to 312MHz

- 32KB-I$ and 32KB-D$

- 512KB onchipRAM

Media IPs - VPU encodes MPEG4 and H.264

- VIO handles up to 5M pixel

camera.

- 3D graphic accelerator

LCDC

VIO

Med

ia B

us

JPU

VPU

AP-RT Block (SHX2)

MMU

I-Cache

CPU

D-Cache

URAM

DSP

XYRAM

SBSC

MFI

DMAC3DG

INTCRT

HP

Bu

s (R

T)

Peripherals(RT)

SuperHyway (RT)S2S

S2S:SBSC:LCDC:VIO:

VPU:

JPU:3DG:INTC: MFI:

SHwy-SHwy bridgeSDR/DDR-SDRAM ControllerLCD ControllerCamera I/F with Image-

Processing EngineVideo Processing Unit

(MPEG-4 Accelerator)JPEG Codec Unit3D Graphics AcceleratorInterrupt ControllerMulti-Functional Interface

SDRAM(AP)

9

AP-System Domain Configuration

BSC

CPGAP

APBB

DMAC

MFI

INTCSYS

HP

Bu

s (S

YS

)

Peripherals(SYS)

S2SSuperHyway (SYS)

ARM926EJ-S runs on

general-purpose OS- Up to 208MHz

- 32KB-I$ and 16KB-D$

Peripherals - Sound handling

- SDcard, IIC

- Flash Control

- USB

- BB communication serial

MMU

I-Cache

CPU

AP-SYS Block

D-Cache

S2S:APBB:BSC::CPG: INTC: MFI:

SHwy-SHwy bridgeAP-BB bridgeSRAM/FLASH ControllerClock Pulse GeneratorInterrupt ControllerMulti-Functional Interface

SRAM/FLASH

10

Baseband Domain Configuration

APBB

AH

B B

us

APB Bus

MMU

I-Cache

CPU

BB Core Block

D-Cache

BB Main Bus

CPGBB

BBSCWCDMA Block

GSM Block

MODEMDSP

INTCBB

DMAC

Peripherals

ARM926EJ-S runs on RT-OS- Up to 104MHz

- 16KB-I$ and 4KB-D$ with TCM

W-CDMA and GSM/GPRS- DSP accelerates the modem

protocol handling

- One can be cut-off where only

the other is available

- Only small logic is awake for

tracing the timing of each radio

RAM MODEMDSP

Peripherals

APBB:BBSC:CPG:INTC:

AP-BB bridgeBaseband Bus ControllerClock Pulse GeneratorInterrupt Controller

SDRAM(BB)

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Communication Architecture

SH-MobileG1 (1 LSI with 3 CPUs)

AP- RTCPU

AP- SYSCPU

BasebandCPU

APBB

Serial

S2S

MFI

BSC

SerialPrevious System with 3 LSIs

- G1 keeps the communication paths (MFI and Serials)

used in the previous system for software reuse

Memory

　AP- SYS LSI　Baseband　LSI

　AP- RT LSI

Serial

BBSC BSC

MFI

MFI

Serial

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Communication Architecture (Cont’d)

AP Address MapBB Address Map

Map any region ofAP address byregister settings

Map any region ofBB address byregister settings

- AP-SYS and AP-RT share SDRAM and memory map

- AP and BB have different SDRAM and memory map

- APBB bridge supports access window scheme to access

the resource in the other memory map

AP Access WindowUsing AP-BB bridge

BB SDRAM

BB Periphral Regs

Flash

BB Access WindowUsing AP-BB bridgeRT Periphral Regs

Flash

SYS Periphral Regs

AP SDRAM

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Interrupt Control

AP- RTCPU

AP- SYSCPU

BasebandCPU

INTC(SYS)

INTC(BB)

INTC(RT)

Peripherals(SYS)

Peripherals(BB)

Peripherals(RT)

MFI MFI

- Each CPU has its INT controller

- MFI can generate inter-domain interruptions

- Some external pins generate interrupts for each CPU

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System Control

CPGAPCPGBB

S P W B S P W B S P W B

SemaphoreFree:00RT:01SYS:10BB:11

SYSC (Common)

Boot Control(Master CPU,Boot Address for each CPU)

SYSCBB SYSCSYS SYSCRT

Power Control

Boot Address

Boot Address

AP- SYSCPU

Boot Address

AP- RTCPU

PLLs PLLs

Reset Control

Reset Control

Reset Clock

Reset Clock

Reset Clock

S:SemaphoreRegister

P:Power Down Register

W:Wake-up Register

B: Boot ControlRegister Boot

Mode

RESET

WakeUp

BasebandCPU

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System Control (Cont’d)

GSM

W-CDMA

BB-CPU

APL-RTCPU

AP-SYSCPU

BB-Misc

AP-Misc

MediaRAM

MPEG

Camera

SoundCPG

LCDC

JPEG

DDR

SRAM

Boot Control- One master CPU defined by pin settings boots first and

specifies the other CPUs’ boot addresses

- Various boot modes are supported for system

configurability and debuggability(1) BB Master External Memory Boot(2) BB Master Internal ROM Boot(3) BB-Alone Mode (for Test)(4) AP-SYS Master External Memory Boot (5) AP-SYS Master Internal ROM Boot(6) AP-RT Master Boot(7) AP-Alone Mode (for Test)

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System Control (Cont’d)

GSM

W-CDMA

BB-CPU

APL-RTCPU

AP-SYSCPU

BB-Misc

AP-Misc

MediaRAM

3D G MPEG

Camera

SoundCPG

LCDC

JPEG

DDR

SRAM

Power Control- Each CPU can read and write SYSC registers from each

domain, which are reflected into the common SYSC

- Power up/down can be controlled by each CPU that gets

the semaphore

Clock Control- AP and BB have separate Clock Pulse Generator

- Many variations of clock configuration and gear changes

are supported for dynamic power reduction

- Clock for some IPs remains the fixed frequency

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Power Domain

20 hierarchical domains for partial power-off

C4 (Repeaters, CK buffers, BKUP FFs)

C5 (System controller, PAD controller)

LCDC Reg Mem Control. RAM, DMAVRAM

Application part Baseband part

PLL for Application part PLL for Baseband part

Mobile Video Interface

Mem control. Serial I/Os

SYS-CPU RT-CPU

BB-CPU WCDMA GSM

DFT WCDMA GSM

WCDMA GSM

A4U1 A4U2 A4

AC

A3

A2

A1RA1A

BA4

BC

BG3

BG2

BG1

BW3

BW2

BW1

BA3

BA2

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Power Domain (Cont’d)

GSM

APL-RTCPU SRAM

C4

Chip Floorplan Power Domains

C5

GSM

W-CDMA

BB-

CPUAPL-RT

CPU

AP-SYS

CPU

BB-

Misc

AP-Misc

Media

RAM

3DGMPEG

Camera

Sound

JPEG

A2

A1A

A4

ACBC

BA2

BW2

BW

3B

W1

BA4

BA3

BG1 BG2BG3

A3

A4U1

A4U

2A1R

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Implementation Results of Power Domains

# of Power domains

# of Islands for C4(Repeaters,CK buffers, BKUP FFs)

# of Repeaters in C4 domain

# of Clock buffers in C4 domain

# of Backup FFs in C4 domain

# of mIOs (isolation cell)

Total area of power switch

20 domains

19 islands

3100 cells

1600 cells

2300 cells

20000 cells

4.2 mm2

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Leakage Current in Usage Scenes

A1R

A4U2A3

A4U1

A1A

A2A4

C5AC

BW2

BA3

BW1

BG1 BG2BG3

BC

BA4BW3

C4

BA2

(1) Video telephony

Measured Leakage Current

(@ Room Temp, 1.2V)

Control

W-CDMA

GSM

System-domain

Realtime-domain

Baseband

part

Application

part

Power on

Power off

ON

ON

ON / OFF

ON

ON

849 µA

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Leakage Current in Usage Scenes

(2)Telephony (W-CDMA)

Measured Leakage Current

(@ Room Temp, 1.2V)

Control

W-CDMA

GSM

System-domain

Realtime-domain

Baseband

part

Application

part

Power on

Power off

ON

ON

ON / OFF

ON

OFF

407 µA

A1R

A4U2A3

A4U1

A1A

A2A4

C5AC

BW2

BA3

BW1

BG1 BG2BG3

BC

BA4BW3

C4

BA2

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Leakage Current in Usage Scenes

(3)Waiting for Calling

Measured Leakage Current

(@ Room Temp, 1.2V)

Control

W-CDMA

GSM

System-domain

Realtime-domain

Baseband

part

Application

part

Power on

Power off

ON

OFF *

OFF

OFF

OFF

299 µA

A1R

A4U2A3

A4U1

A1A

A2A4

C5AC

BW2

BA3

BW1

BG1 BG2BG3

BC

BA4BW3

C4

BA2

*: Intermittent Operation

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Leakage Current in Usage Scenes

(4) Power off ( I/O fixed)

Measured Leakage Current

(@ Room Temp, 1.2V)

Control

W-CDMA

GSM

System-domain

Realtime-domain

Baseband

part

Application

part

Power on

Power off

OFF

OFF

OFF

OFF

OFF

7 µA

A1R

A4U2A3

A4U1

A1A

A2A4

C5AC

BW2

BA3

BW1

BG1 BG2BG3

BC

BA4BW3

C4

BA2

24

Summary

We have developed SH-MobileG1

- Application and dual-baseband single-chip

processor for 3G multimedia cellular phone

system

- Key features of its architecture have been

presented

- One chip integration contributes not only to

dynamic but also to leakage current reduction

by careful partial power-off control