silicon systems group applied materials confidential
TRANSCRIPT
Time Title Presenter
9:30 – 9:35 AM Welcome Mike Splinter, Applied Materials
9:35 – 9:40 AM Opening Toru Watanabe, Applied Materials
9:40 – 10:10 AM Sony Image Sensor Business and its Latest Technologies
Hideo Nomura, Sony
10:10 – 10:40 AM Light Control & Packaging Challenges and Solutions
Russ Perry, Applied Materials
10:40 – 11:10 AM CMOS Image Sensors and 3D Integration
Derek Hinkle, Aptina Imaging
11:10 – 11:20 AM Break
11:20 – 11:50 AM New Solutions of Ion Implantation for Advanced Image Sensor Devices
Hiro Ito, Applied Materials
11:50 – 12:20 PM The Flip Side of Front End Applications
John Boland, Applied Materials
12:20 – 12:50 PM Ultra-Smooth Deep Silicon Etching Brad Eaton, Applied Materials
12:50 – 1:00 PM Closing Toru Watanabe, Applied Materials
1:00 – 2:00 PM Lunch
Applied Materials Confidential
Image Sensors Inside Smartphone Revolution
4
300mm wafer size migration to meet growing demandb
Backside illuminated sensors to be inside ~ 75% of smartphones by 2014a
1080p high definition video capture at 30 frames/secondc
a. From 33.4 million units at 14% share (2010) to over 300 million units at 75% share (2014) in smartphones - iSuppli Corp., Sept. 2010 b. “… nearly all of the small pixel leaders have moved to advanced technology generation production using 300 mm wafers” - Ray Fontaine, Chipworks c. Apple iPhone 4s product performance spec sheet
Applied Materials Confidential
CMOS Image Sensor End Market
5
Mobility Total: 1,951M units
Notebooks 227M
Medical Systems 1.2M
Mobile Audio TV & Gaming
177M
DSC & SLR Cameras 46M
Security & Surveillance 19M
Video & Camcorders 78M
Automotive & Transport 14M
Machine Vision, Science & Space Sensors Defense <1M
Cell Phones 1,822M
Tablets 129M 2 BSI sensors per device
*2012 Unit Shipments, does not include Computer Mice. Yole Developpment, Oct 2012
Mobility Accounts ~ 70% of Total CMOS Image Sensor Shipments in 2012*
Applied Materials Confidential
Compelling Opportunity Shift to BSI
6
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2011 '12e '13f '14f '15f '16f '17f
ACCELERATED BSI ADOPTION
'11 '12e '13f '14f '15f '16f '17f
94 107
120 134
151
168 188
SMARTPHONES
TABLETS
DIGITAL STILL CAMERAS
OTHERS
(300MM KWSPM PRODUCTION)
DEMAND DRIVING PRODUCTION GROWTH
CAGR ≈ 12%
Growing demand driven by mobility and DSCs; BSI to become the de-facto architecture in production
BSI
FSI
Source: Yole Developpment (Oct’12)
Applied Materials Confidential
CMOS Image Technology Roadmap
7
FRONT SIDE ILLUMINATED
MONOLITHIC BACKSIDE ILLUMINATED
HYBRID BACKSIDE ILLUMINATED
3D INTEGRATED
PERIPHERAL 3D INTEGRATED
Com
plex
ity/p
erfo
rman
ce
2000 2009 2012 2016
Source: IMEC, Yole Developpment (Oct’12)
BSI CIS
DSP
BSI CIS
DSP
MEMORY
Applied Materials Confidential
Applied Materials Tool Box for BSI
8
Front End Optical Back End
Packaging
Wafer
Pixel & photo-diode process
Bond to Final Carrier
Flip Wafer
Grinding/Thinning
AR Coating(s)
Light Shielding and Reflecting
Microlens ARC
Glass Wafer Bonding Grinding/Thinning
3D TSV / WLP
Reflexion LK™ CMP InVia™ CVD Raider S™ ECD Avila™ CVD Silvia™ Etch
Optiva™ CVD
Endura™ PVD
VIISta™ 900XPT
Centura® Gate Stack
Astra™ DSA
Oxidation Anneal Implant
Endura™ PVD
Shields/Reflectors