sinkpad technology
DESCRIPTION
SinkPADTM is the LED Thermal Management PCB Technology reduces LED junction temperature. It’s an alternative technology to the Aluminum PCB or MCPCB providing superior thermal performance for medium to high powered LEDs. It reduces LED junction temp, increases LED life, and increases lumens per LED. SinkPAD Corporation is a manufacturing company offering a thermal management printed circuit board technology specifically manufactured for the Solid State Lighting Industry (LED’s). SinkPAD is an alternative technology to the conventional Aluminum PCB or MCPCB providing superior thermal performance for medium to high powered LEDs. SinkPAD Corporation is now part of a conglomerate of companies which have serviced the printed circuit board industry for over 30yrs. SinkPAD has leveraged the strengths of those companies in terms of finance, global logistics, and manufacturing capacity to propel its rapid growth from technology development phase to a full service volume manufacturer. Developing the SinkPADTM technology is our company’s passion, manufacturing printed circuit boards is our strength. Our patent pending SinkPADTM technology is a PCB technology that makes it possible to conduct heat out of the LED system and into the atmosphere at a much greater rate. While the primary focus of the SinkPADTM technology is to solve thermal problems of the rapidly evolving high power LED market there are other applications for which SinkPADTM can be an ideal candidate. SinkPADTM technology can have a dramatic effect on the customer’s ability to improve upon and revolutionize their high power LED products. We enable our customers to be the first to market with the most efficient thermally managed LED systems. The SinkPAD promise is to reduce LED junction temperature allowing users to increase LED life, increase reliability, increase brightness, increase lumens per LED and reduce dollar per lumens and that is a promise SinkPAD definitely delivers on.TRANSCRIPT
Patent Pending
SinkPADTM
Th ll Effi i t PCB T h l f
Patent Pending
Thermally Efficient PCB Technology for the LED Application
Sinkpad Corporation
1
R3Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.
PRESENTATION OUTLINE
Thermal Challenges In The LED Applications
How it is Addressed? Metal Back PCB Technology
Is There a Better Way? SinkPADTM Technologyy gy
What Would I Gain Using SinkPADTM?
Comparisons Of “Metal Back” & “SinkPADTM” Comparisons Of Metal Back & SinkPADTM
Potential Applications
Test Data
Conclusion
2R3
THERMAL CHALLANGES
Increasing Trend For LED Power Increasing Trend For LED Power
Increasing Trend For Higher Brightness
Primary Thermal Path: Conduction Cooling
Higher Thermal Resistance
Power Density Increasing – more LEDs in a small area
Long Life Expectation Long Life Expectation
3R3
How Heat Issues Addressed Historically?
Metal Back PCB TechnologyExample: MCPCB, Aluminum PCB etc…type products
THERMALLY CONDUCTIVE DIELECTRICS Arlon 92ML – 2.0W/m.kExample: MCPCB, Aluminum PCB etc…type products Bergquist – 2.2-3.0W/m.k Doosan – 2.0W/m.k Denka Hit Plate – 2.0-8.0 W/m.k DuPont CoolLam – Polyimide based – 0.80W/m.k ITEQ- IT859 GTA – 2.0W/m.k Laird Technology HKA 3 0W/m k
Thermally Conductive Dielectric
Laird Technology HKA – 3.0W/m.k Polytronics – 2.7W/m.k Sekisui – 2.0W/m.k Ventec - VT 4A1 – 1.6W/m.k
Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k)
Thermal Pad Z-axis HeatThermal Pad or Bond Pad
Metal Thermal Conductivity (TC)Al ~135-180W/m.k
Z-axis Heat Transfer rate:
Only 1-4 W/m.kCu ~385W/m.k
Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material4R3
Is There a Better Way to Remove Heat?
YES
SinkPADTM TechnologySinkPADTM Technology
5R3
What is SinkPAD?
SinkPADTM is a MCPCB Technology gyWhich Provides
Direct Thermal Path to Hot LEDDirect Thermal Path to Hot LED
6R3
“SinkPADTM” TECHNOLOGY
Direct Heat TransferPatent Pending
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Z-axis Heat
Metal Thermal Conductivity (TC)Al ~135-180W/m.kCu ~385W/m.k
Transfer rate: 150-385 W/m.k
Cu 385W/m.k
Z-axis heat transfer is same as the TC of the base material used7R3
What would I gain using SinkPAD?
SinkPAD PCB will Lower LED Junction Temperature
Which means :
1) O ti t LED t l j ti t t1) Option to run LED at lower junction temperature i.e Increase Life of the LED Fixture
2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED
3) R d b f LED li h3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost
4) Hi h D i C t B i ht Li ht F C t
8R3
4) Higher Drive Currents, Brighter Light, Fewer Components
“SinkPADTM” TECHNOLOGY
Top View of a SinkPADTM PCBPatent Pending
SinkPAD
Circuit padCircuit traces
9R2
SinkPADTM Product FamilyPatent Pending
SinkPAD P/N Base Metal Base Metal thickness
SP-A530 ALUMINUM 5052 ~0.032” (~0.80mm)
SP-A540* ALUMINUM 5052 ~0.040” (~1.0mm)
SP-A560* ALUMINUM 5052 ~0.063” (~1.60mm)
SP-A630 ALUMINUM 6061 ~0.032” (~0.80mm)
SP-A640 ALUMINUM 6061 ~0.040” (~1.0mm)SP A640 ALUMINUM 6061 0.040 ( 1.0mm)
SP-A660 ALUMINUM 6061 ~0.059” (~1.50mm)
SP-C40 COPPER ~0.040” (~1.0mm)
SP-C60 COPPER ~0.059” (~1.50mm)
* Most running product
10R3
COMPARISION OF “METAL BACK” & “SinkPAD”
“Metal Back PCB” “SinkPADTM PCB”Patent Pending
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Higher Thermal Resistance Slow Heat Transfer Rate
Special Dielectric Required
Thick Base Metal Required
Direct Thermal Path Fast Heat Transfer Rate
Standard Dielectric Used
Thinner Base Metal Optionsq
Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component
p
Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component
“No” PCB Design Change Required No PCB Design Change Required
9R5
“SinkPADTM” TECHNOLOGY
Multilayer Examples
“ l k C ” “SinkPADTM PCB”
Patent Pending
Does not increase thermal resistanceSubstantial increase in thermal resistance
“Metal Back PCB” SinkPADTM PCB
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Limitation: Components can be assembled only on one side of the PCB12R3
REQUIREMENT TO USE SinkPADTM
T i & d l d thi i fTo view & download this info “Register” below.
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Or send an email request at [email protected]
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POTENTIAL APPLICATIONS
Commercial / Industrial lights
14R3
POTENTIAL APPLICATIONS
Street lights
15R3
POTENTIAL APPLICATIONS
Back lights
16R3
POTENTIAL APPLICATIONS
PAR38 bulbs
17R3
POTENTIAL APPLICATIONS
Residential down lights
18R3
POTENTIAL APPLICATIONS
LED Packaging Substrate
19R3
TEST DATA
SinkPAD v/s MCPCB thermal data
thSinkPAD Rth: 0.45 0C/W
th MCPCB Rth : 1.75 0C/W
deg
C)
deg
C)
Power (W)Power (W)
dT*
dT*
20R5
SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp
TEST DATA, Cree 1-XPG
SinkPAD v/s Typical Aluminum back PCB thermal data
21R5
TEST DATA, Cree XP-G
SinkPAD v/s Conventional MCPCB thermal data (IR Camera)
MCPCB SinkPAD PCB- Cree XPG 9 LEDs- Current: 1 Amp.- Power: 3W each- PCB ~ 1”x1” To view & download this infoTo view & download this info
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1410 C 1190 C
Or send an email request at [email protected]
22R3
SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB
TEST DATA, Luxeon Rebel at 700mA
SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 700mALuxeon Rebel at 700mA
MCPCB Type-1MCPCB Type 1MCPCB Type-24
MCPCB-1MCPCB 1
MCPCB-2
Test was conducted by Quadica Developments Inc
23R5
LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2
TEST DATA, Luxeon Rebel at 1A
SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 1000mALuxeon Rebel at 1000mA
MCPCB Type-1MCPCB Type-1
MCPCB Type-24
MCPCB-1
MCPCB-2
Test was conducted by Quadica Developments Inc
24R5
LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2
Other Available Test Data
Nichia N219
Luxeon RebelLuxeon Rebel
Cree MTG
Osram Oslon SSLOsram Oslon SSL
Cree XML
Customize Your TestCustomize Your Test
25R5
Highlights and Q&A
Magnitude Higher Thermal Transfer Rate Direct Thermal Path
Patent Pending
Direct Thermal Path 135 to 385W/m.k vs. 1 to 4 W/m.k LOWER JUNCTION TEMPERATURE
High Tg (Up to 225oC)
Multilayer Possible Without Increase In Thermal Resistance
Weight Saving Possibly thinner profile
Di t R l t f MCPCB M t l B k PCB & Al i PCB Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB
Most Economical Direct Thermal Path Solution Any Questions….. Contact usy Q
26R5
THANK YOUTHANK YOUFor more information contact
[email protected] us at www.sinkpad.com
714-660-2944
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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.