1

SIS 300 Dipole Low Loss Wire and Cable

J Kaugerts GSI

TAC Subcommittee on

Superconducting Magnets

Nov15-16 2005

2

Collider vs Fast-Ramped Synchrotron Operation

bull For beam colliders such as RHIC magnet AC losses were not an important consideration given low magnet ramp rate (0042 Ts) and infrequent ramps

bull For fixed target fast-ramping synchrotrons such as GSIlsquos SIS 200 at 4 T ( and now SIS 300 at 6T) the ramp rate is high (1Ts) and ramps are frequent so AC loss reduction is an important consideration

3

Conductor Losses

bull Wire losses1) Filament hysteresis

Pf = (4df3 ) int dB Jc(T B )

bull Coupling (eddy) current lossvolume Pw

Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc

2) Adjacent strand resistance Ra

bull

4

Dipole GSI 001

bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300

5

GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)

ramping mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crsover 161048 32206 920

transvse adjacent 1069 214 06

parallel adjacent 016 03 00

filament coupling 11194 2239 64

hysteresis 1555 311 09

delta hysteresis 134 27 01

total hysteresis 1689 338 10

total magnet 175016 34999 1000

Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

2

Collider vs Fast-Ramped Synchrotron Operation

bull For beam colliders such as RHIC magnet AC losses were not an important consideration given low magnet ramp rate (0042 Ts) and infrequent ramps

bull For fixed target fast-ramping synchrotrons such as GSIlsquos SIS 200 at 4 T ( and now SIS 300 at 6T) the ramp rate is high (1Ts) and ramps are frequent so AC loss reduction is an important consideration

3

Conductor Losses

bull Wire losses1) Filament hysteresis

Pf = (4df3 ) int dB Jc(T B )

bull Coupling (eddy) current lossvolume Pw

Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc

2) Adjacent strand resistance Ra

bull

4

Dipole GSI 001

bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300

5

GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)

ramping mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crsover 161048 32206 920

transvse adjacent 1069 214 06

parallel adjacent 016 03 00

filament coupling 11194 2239 64

hysteresis 1555 311 09

delta hysteresis 134 27 01

total hysteresis 1689 338 10

total magnet 175016 34999 1000

Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

3

Conductor Losses

bull Wire losses1) Filament hysteresis

Pf = (4df3 ) int dB Jc(T B )

bull Coupling (eddy) current lossvolume Pw

Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc

2) Adjacent strand resistance Ra

bull

4

Dipole GSI 001

bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300

5

GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)

ramping mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crsover 161048 32206 920

transvse adjacent 1069 214 06

parallel adjacent 016 03 00

filament coupling 11194 2239 64

hysteresis 1555 311 09

delta hysteresis 134 27 01

total hysteresis 1689 338 10

total magnet 175016 34999 1000

Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

4

Dipole GSI 001

bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300

5

GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)

ramping mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crsover 161048 32206 920

transvse adjacent 1069 214 06

parallel adjacent 016 03 00

filament coupling 11194 2239 64

hysteresis 1555 311 09

delta hysteresis 134 27 01

total hysteresis 1689 338 10

total magnet 175016 34999 1000

Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

5

GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)

ramping mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crsover 161048 32206 920

transvse adjacent 1069 214 06

parallel adjacent 016 03 00

filament coupling 11194 2239 64

hysteresis 1555 311 09

delta hysteresis 134 27 01

total hysteresis 1689 338 10

total magnet 175016 34999 1000

Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

6

GSI 001 Dipole Calculated Conductor Loss (as built)

ramping mean loss fraction

power power cyclem of total

Watts Watts Joules

transvse crsover 021 04 05

transvse adjacent 1069 214 277

parallel adjacent 016 03 04

filament coupling 1060 212 275

hysteresis 1555 311 403

delta hysteresis 134 27 35

total hysteresis 1689 338 438

total magnet 3854 771 1000

SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

7

SIS 300 Dipole Loss Reduction

bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor

bull Loss reduction

bull 1) increase Ra

bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

8

Ra Loss Reduction

bull Ra can be increased by heating cable in air

bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

9

Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos

production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again

bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire

bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

10

Small filament wire

bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia

bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

11

SIS 300 Dipole Wire Parameters(with Cu matrix wire)

bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio

has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

12

SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire

bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)

Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

13

Another Possible CuMn Interfilamentary Matrix Wire for SIS 300

IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use

Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm

Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in

diameter for application in the SIS 300 dipole

Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist

pitch

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

14

SIS 300 dipole Losscycle-m with Cu matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 40

transvse adjnt 121 107 132

parallel adjacent 001 01 01

filnt coupling 236 208 257

hysteresis 512 450 557

delta hysteresis 012 10 13

total hysteresis 524 461 570

total magnet 930 808 1000

Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

15

SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix

rampg mean loss fraction

power power cycle of total

Watts Watts Joules

transvse crosr 036 32 57

transvse adjnt 121 107 190

parallel adjacent 001 01 02

filnt coupling 105 93 165

hysteresis 366 322 573

delta hysteresis 008 07 13

total hysteresis 374 329 586

total magnet 638 562 1000

Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

16

Loss Reduction with CuMn interfilamentary matrix

Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

17

Tested Wires

140 094 092 115 110 123

2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn

Ratio JcmJt

double stacked

single stacked

single stacked

double stacked

doublestacked

tripleextrudeddouble stackedWire ID

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

18

Single stacked wire

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

19

Filament Distortion Effects

Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

20

Other Interfilamentary Matrix Materials

bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

21

Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers

Case No

Interfil

Matrix mat

Barrier

Mat

Filament

Diam df

(m)

(msec)

et

-10

m)

Notes

1 Cu none 35 278 143 RRRCu =278

RRRCuint=25

2 Cu-05wtMn

none 25 134 297 CuMn=250

3 Cu-

05wtMnnone 25 107 372 RRRCu=220

(this case only)

4 Cu-

05wtMn

Cu-

10wtNi25 048 837 CuNi

=1400

5 Cu-10wtNi

Cu-10wtNi

25 044 900

6 Cu-10wtNi

none 25 1309 304

7 Cu-30wtNi

none 25 1304 305 cuNi =

3640

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

22

CuMn versus CuNi Interfilamentary matrix

bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn

bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss

bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss

bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

23

Jc (Amm2 vs B (T) for pure CuNi matrix switch wire

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

24

Switch wire performance conclusions

Short samples instabilitiesbull Inception of instabilities at low field

depending on wire diameter dbull Self field instabilitybull Virtually independent of

Filament size

CuNi composition (between CuNi 30 and CuNi10)

Stability limit Jc bulld ~ 2000 Amm

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

25

Low Loss Wire Conclusion

bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss

bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

26

Present Wire Status

bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2

bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of

wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire

bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

27

Problem

bull We need to order more wire to build SIS 300 model or prototype dipoles

bull Lead time between wire RFQ and wire receipt is 9-12 months

Solutionbull Make two 200 kg billets First one with 25

micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc

28

Cable Ra amp Rc

bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)

bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC

amp 15-70 MPa (BNL tests) Need more statistics

• SIS 300 Dipole Low Loss Wire and Cable
• Collider vs Fast-Ramped Synchrotron Operation
• Conductor Losses
• Dipole GSI 001
• GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
• GSI 001 Dipole Calculated Conductor Loss (as built)
• SIS 300 Dipole Loss Reduction
• Ra Loss Reduction
• Higher resistance wire matrix
• Small filament wire
• SIS 300 Dipole Wire Parameters (with Cu matrix wire)
• SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
• Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
• SIS 300 dipole Losscycle-m with Cu matrix
• SIS 300 Dipole Losscycle-m with CuMn interfilamentary Matrix
• Loss Reduction with CuMn interfilamentary matrix
• Tested Wires
• Single stacked wire
• Filament Distortion Effects
• Other Interfilamentary Matrix Materials
• Wire Coupling Current t for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
• CuMn versus CuNi Interfilamentary matrix
• Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
• Switch wire performance conclusions
• Low Loss Wire Conclusion
• Present Wire Status
• Problem
• Cable Ra amp Rc