Skylight Glass

Group 13

Ben Farris – CpEPaul Fedi – EE

Blake Loeb – CpEWilliam Tyback - CpE

Goals/Objectives

Problems: Blind Automation• Heating/Cooling is very expensive• Sunlight (not) entering the house makes things worse.• Traditional blinds don’t work with your AC system and still absorb heat• Traditional blinds don’t compensate for the light lost when they’re shut• Traditional lighting doesn’t replicate the sun’s color temperature

• Very important for circadian rhythm

Specifications / Requirements

Component Parameter Design Specification

Smart Film Light Blocked 70%

Bluetooth Module Minimum Range 10 feet

LEDs Full Duty Cycle Brightness 1000 Lumens

LEDs Color Temperature 3000K-5000K

Temperature Sensor Accuracy 1 degree

Light Sensor Accuracy 10 Lumens

Time (software) Accuracy 10 seconds

Features

• Or none if you prefer

• Tint, when you want it

Privacy

• Temperature control of household

• Less power used by A/C unit

Savings

• I/O

• Alarm Mode

• Seasonal Setting

• LED Control

App control

• Temperature Sensor helps with auto tinting

• Tinting control without having to manually do it

Smart Control

Block Diagram

Work Distribution

Task Primary Secondary

LED Subsystem Blake Paul

Power Subsystem Blake Paul

Smart Film Subsystem Paul Blake

Feedback Subsystem William Ben

Control Subsystem Ben William

MCU programming William Ben

System Integration (PCB)

Paul Blake

Design and Hardware Implementation

● Decentralized design approachWe designed individual subsystems and then designed the architecture that integrated the subsystems into a coherent system.For implementation, the team then created a breadboard prototype for each subsystem and tested its functionality individually. After we tested each subsystem, we integrated the overall system as a breadboard prototype to verify complete system functionality. This was used as a basis for the PCB design.

Smart Film Subsystem

Smart Film Market Research

Requirement: Visible light transmission < 30% when opaqueSmart Film Technologies:

1. Electrochromic - slow transition time2. Polymer Disperse Liquid Crystal (PDLC) - fast transition, industry

standard3. Suspended Particle Device (SPD) - few vendors sell film variant4. Micro-blinds - patented and not on the market currently

Smart Film Subsystem Components

Smart Film selectedProduct Attributes Smart Tint®

Light Transmittance (opaque

state)4% ± 2%

Switching Speed 50-100 ms

Operational Temperature Range -10° to 60° C

Coefficient of Haze (transparent) 0.03 ± 0.01

UV Absorption Index (opaque) 99%

IR Absorption Index (opaque) 20% (regular)

90% (LV-NF)

Solar Heat Gain Coefficient 0.71

Energy Consumption (W/ft2) 0.3-0.49

Example of Smart Film states

Window 1 2 3 4 5

RoomLiving

Area

Master

BedKitchen Room 1 Room 2

Morning Off Off On On On

Midday Off Off Off Off Off

Afternoon On On Off On On

Evening On Off On Off Off

Night Off Off Off Off Off

Morning: 7 AM - 11 AM

Midday: 11 AM - 2 PM

Afternoon: 2 PM - 6 PM

Evening: 6 PM - 11 PM

Night: 11PM - 7AM

LED Subsystem

LED Requirements

Requirements: 1) Illuminates a 10ft x 10ft room.2) LED color temperature can vary between 3000K-5000K

LED Products:1. LED bulbs - meets the requirements but bulky and costly2. Surface Mounted Device - LED strip, meets both requirements3. Chips on Board - Maglite, will light the room but blind everyone

LED Color Temperature

3528 SMD LED strip (3.5 mm by 2.8 mm) demonstrating varying color temperature.

LED Challenges

• Too Bright

• Unequal Duty Cycle causes flickering

• Limited BJT current gain requires a base resistor that limited brightness

• Coupling capacitors needed to reduce MCU strain

Feedback System

• Incorporate System AutomationSmart

• Help Improve EfficiencyEnergy

• Light Intensity

• TemperatureSensors

Light Sensor

Outdoor

• Determine outside light intensity

Indoors

• Control indoor light accordingly

Light Sensor

Resolution

• Can be varied by changing resistance

Easy of Use

• Output is easily accessible

Cost Effective

Temperature

Seasonal

• Adapt to conditions automatically

Efficiency

• Help improve energy consumption

Temperature

Accuracy

• Precise for our needs ± 1°C (+25°C)

Integration

• 3 pins allows simple integration.

Cost Effective

PowerSystem Part Requirement

Output Smart Film 60v AC

Output LEDs 24V DC

Main MCU 5v

Application (Android Studio)

Software Logic

ATmega328P

Analog

• Feedback System (6 A/D Pins)

Digital

• Controlling LEDs (6 PWM Pins)

Digital

• Communication (TX/RX)

ATmega328P

Initial Testing

Bluetooth Communication

• Bluetooth module makes use of Serial Communication• Communication happens via PCB• Controls all major components

• Major Features (I/O, LEDs, Alarm and Seasonal Modes, Manual/Auto)

• Coincide with Application from Android Studio• Range at 10 meters is fine for this project• Will be embedded within the frame along with the rest of the

components• Difficulty with first Bluetooth module, possible shorted or burnt AGND• For future applications a stronger Bluetooth module could be used for

larger families moving from room to room.• PCB design plan to implement HC-05

• Through hole header for module• Cleaner• Ability to de-solder and toss burned out components

Description Spec

Baud Rate 9600

Range 10 meters

Frequency 2.4GHz

Voltage 3.3V

Bluetooth Integrated Prototype

Overall System Schematic

Prototype System

Administrative Content

BudgetItem Quantity Price/Unit Projected Cost Actual Cost

Window Film 2 $145.07 $100.00 $145.07

Color Temp LED Strip 1 $24.95 $50.00 $24.95

Microcontroller Chip 3 $5.05 $1.00 $15.14

Voltage Regulators 5 $1.19 $1.50 $5.95

Relay for film control 2 $3.39 $30.00 $6.79

Power Supply (60 VAC) 1 $0.00 $0.00 $0.00

Power Supply (24VDC) 1 $19.95 $20.00 $19.95

Lux Sensor 3 $0.43 $6.00 $1.49

Bluetooth Module 1 $7.99 $10.00 $7.99

Polycarbonate Window 1 $0.00 $0.00 $0.00

Wood for Frame 1 $29.17 $35.00 $29.17

PCB Costs 3 $23.35 $150.00 $70.05

Temp Sensor 3 $1.48 $5.00 $4.44

Potentiometer 1 $3.25 $0.95 $6.50

Mosfets 10 $1.60 $10.00 $16.00

Total 36 $365.95 $353.49

Current Progress

87%

72%

65%

75%

20%

50%

63%

62%

0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%

Research

Parts Acquisition

Hardware Testing

PCB Development

Software Testing

Prototyping

Fabrication

Overall

Percentage

**Receive PCB

Work on design improvements and

App design

Testing and Integration of components

manually with PCB

Write App

Test/Integrate components with

App and begin frame assembly

Add glass and mount components inside

frame

Integrate full Prototype

Finalize Assembly

Present to Faculty

Jun.21

Schedule Towards Completion

Jun.21 – 23

Jun.26 – 29

Jun -July30 –6

July7-16

July17-18

July19-20

July21

July24-26

• **Ideal Schedule, approximate date for PCB shown• Some padding added to dates for any extensive troubleshooting that may occur

Questions/Comments?