smart vehicle ensuring safe ride using accerolometer, laser sensor, co sensor and also with use of...

International Journal of Engineering and Science Invention

ISO 9001: 2008 Certified

ISSN (Online): 2319 – 6757, ISSN (Print): 2319 – 6727

www.ijesi.org | Volume 2 | Issue 7| July. 2013 | PP.10 – 9

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SMART VEHICLE ENSURING SAFE RIDE

Project B

Submitted in partial fulfillment of the requirements

For the degree of

BACHELOR OF ENGINEERING

By

Parth. S. Cholera

Under the guidance of

Prof. K. Y. RAJPUT

DEPARTMENT OF ELECTRONIC

AND

TELECOMMUNICATION ENGINEERING

THADOMAL SHAHANI ENGINEERING COLLEGE

UNIVERSITY OF MUMBAI

(2012-2013)





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www.ijesi.org |Smart Vehicle Ensuring Safe Ride

ACKNOWLEDGEMENT

“A master can tell what he expects from you, A teacher though awakens your own expectations” - Patricia Neal

It is my great pleasure to acknowledge the assistance and contribution for

individuals who co-operated us to complete the project successfully. First and

foremost I like to thank my Project guide Prof K.Y.Rajput and Head of

department Dr. Ashwini Kunte for enthusiastic help in successful completion of

this project. We would also like to thank our honorable Principle Dr.G.T

Thampi for providing us with their precious and valuable suggestion and time

and also for their encouragement throughout the project. It’s their patience and

guidance the project has been completed successfully.

Teamwork of many teachers and my fellow friends we have been able to

complete our project. Their contributions of time and encouragement have

helped us a lot. We would like to thank our teachers and fellow friends for their

help and sharing time and suggestions and taking interest in our work.

PARTH S CHOLERA

LUKESH N JAIN

SACHIN S JAIN

TARKESHWAR R MISHRA

I





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ABSTRACT

In this project, the design of “Smart Vehicle Ensuring Safe Ride” which

assists the driver in avoiding pot-holes on the roads, by giving prior information

about the potholes via GPS system. The entire subscribed user may be warned

in advanced regarding what road has how many potholes. Distribution of this

information is an important aspect which we study in our Pothole detection

system.

This system is divided into three subsystems.

First is to sense the potholes encountered by it, about which it did not

have the prior information. Then communication subsystem which transfers the

information between GSM interface and User. When a vehicle gets this data, it

sees if it has sensed any potholes which the database does not have information

about the potholes is transmitted to the GSM Module as a feedback. The GPS

Module updates its database with the new entries of potholes. And finally the

localization subsystem which reads the data given by GPS Module and warns

the driver regarding the occurrence of potholes.

Second is to sense the CO emission encounter by the vehicle, after some

particular value if the emission increase it warns the user via Message and the

same data is send to RTO giving all the information about the Vehicle

Third is to sense the Obstacles in front of the driving vehicle. Here Laser

sensor is used which radiates ray of light, if the light reflects back than it is

assumed that obstacle is present. If so happens Driver is warns by giving Buzz

alarm and Blinking LED.

II





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TABLE OF CONTENTS

1. INTRODUCTION……………………………………….……………..….1

1.1 Introduction………………………………………………………………………1

1.2 Motivation………………………………………………………………………..2

1.3 Objective (Need for the project) …………………………………………………3

1.4 Organization of report…………………………………………………………….4

2. PROJECT BACKGROUND………………………………………………6

2.1 Literature Survey………………………………………………………………….6

2.2 Problem faced……….…………………………………………………………….6

2.3 Solution to that Problem.....…………….…………………………………………8

2.4 System description..….……………………………………………………………9

2.5 System requirement..…………………………………………………………….10

3. PROJECT DESIGN AND ANALYSIS..…………………………………13

3.1 Introduction………………………………………………………………………13

3.2 Block diagram…………………………………………………...……………….14

3.3 Hardware require..………………………………………………………………..15

3.3.1 Component explanation...………………………………………………15

3.3.1.1 Power supply and Solar panel Module…...…………………..16

3.3.1.2 Microcontroller Module..…………………………………….18

3.3.1.3 Sensors Module…………………………………..…………..22

3.3.1.4 GSM and GPS Module………....……………………...……..23

3.3.1.5 LCD Module…………………………………...……………..25

3.3.1.6 LED and ALARM Buzz Module……………………..……...27

III





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3.3.2 PCB layouts ………………………………………………………….28

3.4 Software required ...…….………………………………………………………30

3.4.1 PIC tools kit ….………………………………………………………30

3.4.2 Eagle.…………………………………………………………………39

4. IMPLEMENTATION ……………………………….…………………..49

4.1 Introduction …………………………………………….………………………49

4.2 Hardware Implementation (PCB fabrication) ………………………….………50

4.2.1 Layouts ……………………………………………………………….50

4.2.2 PCB design ……………….…………………………….…………….51

4.2.2.1 Cleaning……………………………………………………..52

4.2.2.2 Ironing……………………………………………………….52

4.2.2.3 Patterning (etching) …………………………………………53

4.2.2.4 Cleaning……………………………………………………..54

4.2.2.5 Drilling………………………………………………………54

4.2.2.6 Soldering…………………………………………………….54

4.2.2.7 Finishing………………………………………….………….54

4.2.2.8 Testing the layouts…………………………………………...54

4.3 Software Implementation …………………………………………………..……55

4.3.1 Introduction ……………………………………………………………55

4.3.2 Creating Ports …………………………………………………………55

4.3.3 Algorithms ……………………….……………………………………56

4.3.1 PIC tool Algorithms……………………………………………56

4.3.4 Flow charts …………………………………………………………….59

4.4 Implemented PCB Circuit………………………………………………………..62

IV





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5. TESTING AND RESULT ANALYSIS…………………………………...63

5.1 Potholes Testing and its Result...………………………………………………...63

5.2 CO Testing and its Result ………………………………………………………..65

5.3 Obstacles Testing and its Result …………………………………………………66

6. CONCLUSION AND FUTURE SCOPE ………………………………...67

6.1 Conclusion ……………………………………………………………………….67

6.2 Future scope and Further Modification ……………………………..………...…68

7. REFERENCES …………………………………………………………….69

8. TECHNICAL PAPER PRESENTATION…………………………….....70

9. APPENDIX ………………………………………………………………..74

V





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www.ijesi.org |Smart Vehicle Ensuring Safe Ride Page 1

1. INTRODUCTION

1.1 Introduction

With the increase in world’s population, there has been increasing load on

the infrastructure. Roads have been flooded with the vehicular traffic. Vehicular

traffic has been rapidly growing over the recent years with more privately

owned vehicles taking to the streets each day. Today, trucks weigh significantly

more than ever before and are capable of carrying much larger payloads.

Because of many reasons like rains, oil spills, road accidents or inevitable wear

and tear make the road difficult to drive upon. Unexpected hurdles on road may

cause more accidents. Also because of the bad road conditions, fuel

consumption of the vehicle increases, causing wastage of precious fuel. Because

of these reasons it is very important to get the information of such bad road

conditions, Collect this information and distribute it to other vehicles, which in

turn can warn other driver. The other Problems are visibility and CO emissions

from the vehicles. So as to stop accident in hilly regions due to low visibility

some techniques have to be implemented. For CO emissions there should be

some steps taken so as to control Environmental pollution. But to put these into

real time application there are various challenges involved.

The entire system consists of 3 sub-systems:

• Sensing.

• Communication.

• Localization, Display and Alarm

These three subsystems work independent of each other, but have one

center point on which they revolve around, that is data. Sensing system

generates the data, Communication collects co-ordinates and distributes the

data, and lastly Localization uses the data and generates information for the

Govt. bodies and for the driver. And also it displays the location and interrupts

the driver by alarm tone and LED.





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1.2 Motivation

With the increase in world’s population, there has been increasing load on

the infrastructure. Roads have been flooded with the vehicular traffic. It has

become increasingly difficult to manage this traffic. This is the prime

motivation behind making a vehicle intelligent enough to aid driver in various

aspects. One of the increasing problems the roads are facing is worsened road

conditions. Because of many reasons like rains, oil spills, road accidents or

inevitable wear and tear make the road difficult to drive upon. Unexpected

hurdles on road may cause more accidents. Also because of the bad road

conditions, fuel consumption of the vehicle increases; causing wastage of

precious fuel. Because of these reasons it is very important to get the

information of such bad road conditions, Collect this information and distribute

it to other vehicles, which in turn can warn the driver. But there are various

challenges involved in this. First of all there are various methods to get the

information about the road conditions. Now second and most important thing is

about environment which is affecting by CO gas which emits from vehicles, so

as the traffic increases number of vehicles increases and hence the CO emission.

So various sensors are used to get the information about the CO emission. Then

this information must be collected and distributed to all the vehicles that might

need this information. Lastly the information must be conveyed in the manner

which can be understood and used by driver. We in this project try to design and

build such a system. In this system the access point collects the information

about the potholes, CO emission and Obstacle in front of vehicle using Laser

Sensor and further it vicinity of a wireless access point and distributes to other

vehicles using a wireless broadcast. Here 'vicinity' is a user defined term. Ideally

the vicinity is every rout till the next access point.





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1.3 Goals and Objectives

The goal of our project work was to develop an automated data collection

system that can be installed in any automotive vehicle to monitor road or

highway pavement conditions. In order to reach this goal, we had to meet all of

our objectives by our set deadlines. Meeting these deadlines will assure that we

are where we need to be to successfully achieve our goal. Within the context of

our overall goal, we developed the following objectives:

The first goal of our project was to research potholes, GPS,

accelerometers, and hardware and software solutions.

This involves two main steps:

• How to design a working prototype for an automated data collection

system that can monitor road conditions.

• How to process data with Geographical Information System software to

map surface roughness data from GPS coordinates on a user-viewable

city map.

The health effects of carbon monoxide (CO) on the human body are well

known, but there has recently been an increasing awareness and interest

amongst the general public. One reason has been a number of well-publicized

incidents, stimulating media interest in the subject. It has long been recognized

that incomplete combustion, for whatever reason, can create hazardous levels of

CO.

The Second goal of our project was to install a system that will identify

levels of CO emission and inform the consumers via message, which have a role

to play as a further safety assurance to consumers as well to environment.

The Third goal of our project was to install a system that will identify

conditions of low visibility and notify approaching drivers of obstacle before

they encounter it. This information is provided to Driver with alarm and

Blinking LED.





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1.4 Organization of report

Chapter I Describes the causes of pothole formation and detection. Also it

detects CO emission and obstacles in front of vehicles. The detection of

obstacles is also possible in Foggy condition.

Chapter II Presents all the relevant literature reviewed on a case study.

The literature review is divided into 3 categories,

• Sense the potholes encountered and its detection and send information

to GOVT. bodies and all subscribed users.

• CO emission encounter by the vehicle and the user is informed via

Message and the same data is send to RTO.

• Sense the Obstacles in front of the driving vehicle and the user is

informed via Buzz alarm and Blinking LED.

Chapter III Involves in detail the Designing of Project.

The Designing of Project is divided into 4 categories,

• Design Outline.

• Phases of the Project.

• Development plan.

• Testing Plan.

Chapter IV Implementation of Project.

This chapter divided into 6 categories

• Implementing Packaging Requirements.

• Reviewing Data Processing Requirements.

• PCB Fabrication.

• Hardware Implementation

• Software Implementation.

• Interfacing both of them.





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Chapter V Testing and Result Analysis of complete Project designed.

This chapter has 3 testing to be performed

1) Potholes testing and analyzing the result.

2) CO testing and analyzing the result.

3) Obstacles testing and analyzing the result.

Chapter VI Summarizes the achievements of this thesis. This chapter also

includes pros and cons of the designed project.

Chapter VII Includes Conclusion, Future Scope and Its further Modification.

Chapter VIII References taken for developing the project.

Chapter IX Contents Technical paper presentation of the project.

Chapter X Appendix.

This has two sections which are as follows:-

1. Hardware

2. Software





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2. PROJECT BACKGROUND

2.1 Literature Survey and Problem Faced

In this article we will be talking about something that Indian drivers have

come to accept as part of their suffering. As there are 3 major problem drivers

are facing Potholes, Low visibility and the maintenances of their vehicles. Now

we will look step by step each problems.

Very few Indian roads are made of concrete. Concrete roads can last up to

sixty years and only require maintenance every 5 – 10 years, but our bituminous

roads don’t last this long and require to be serviced every eight or ten months.

Despite the huge amount of money sanctioned to maintain the roads, the

assignments are often given to contractors who use poor quality material. India

has the world’s second largest road network and this network is clogged due to

India’s booming automobile industry that adds about 7 million new vehicles to

the roads every year. India is no stranger to traffic jams; indeed, during peak

hours, drivers in Bangalore can’t go over 16 kilometers per hour and in Delhi

and Mumbai they crawl at 18 kilometers per hour. There are undoubtedly many

reasons for these traffic jams, including the blatant disregard for the rules, the

inadequate number of lanes, overworked traffic police and the endless potholes

present on Indian roads. It would be impossible to expect the disappearance of

these altogether. Potholes also cause Economic losses.

According to studies that have been conducted by the World Bank, poor

road infrastructure i.e. potholes, result in a loss of 300 billion INR every year.

Despite the fact that India makes up only a small part of this figure, in the long

list of nuisances to the Indian driver, potholes feature quite prominently.

Besides causing delays in transportation, potholes require more consumption of

fuel and require an increased Vehicle Operating Cost or a VOC. Running over a

pothole can cause the tier to wear out unevenly and alter the alignment of the





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wheel and steering which is dangerous when turning corners or when driving at

high speeds.

A 2009 study conducted by IIM in collaboration with the Transport

Corporation of India stated that Indian truckers clocked only 100,000 kilometers

a year which was 300,000 less than their American counterparts.

In 2010 BMC (Brihanmumbai Municipal Corporation) of Mumbai had

sanctioned INR 40Crores to fill in the potholes before the monsoon. But it is

estimated that Mumbai has 723 major arterial and minor roads that have

potholes and it looks like the Mumbaikers are in for another post-difficult

monsoon.

As other major Losses are due to Low visibility in hilly areas due to

which there are major accident taking place. As per the review in 2010 there

were many accident cases filed in many hilly areas and it has be important to

find out some solution. The Government of INDIA have spend many Crores of

INR to implement some of the technologies, so as to figure out the obstacles in

front of vehicles

The environmental organizations have started their protest against the CO

emission from the vehicles and these have been worldwide accepted and many

technologies have been implemented to overcome these problem. The major

problem is that if a leakage path (blocked or disconnected vent) of appliance

exhaust to living space is present, then a CO exposure hazard is created.





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2.2 Solution to that Problem

The Solution is that we have to design a device that is automatic data

collection system that can be installed in any automotive vehicle to monitor

road or highway pavement conditions. In order to reach this goal, we had to

meet all of our objectives by our set deadlines. Meeting these deadlines will

assure that we are where we need to be to successfully achieve our goal. Within

the context of our overall goal, we developed the following objectives:

The first goal of our project was to research potholes, GPS,

accelerometers, and hardware and software solutions.

This involves two main steps:

• How to design a working prototype for an automated data collection

system that can monitor road conditions.

• How to process data with Geographical Information System software to

map surface roughness data from GPS coordinates on a user-viewable

city map.

The health effects of carbon monoxide (CO) on the human body are well

known, but there has recently been an increasing awareness and interest

amongst the general public. One reason has been a number of well-publicized

incidents, stimulating media interest in the subject. It has long been recognized

that incomplete combustion, for whatever reason, can create hazardous levels of

CO.

The Second goal of our project was to install a system that will identify

levels of CO emission and inform the consumers via message, which have a role

to play as a further safety assurance to consumers as well to environment.

The Third goal of our project was to install a system that will identify

conditions of low visibility and notify approaching drivers of obstacle before

they encounter it. This information is provided to Driver with alarm and

Blinking LED.





_________________________________________________________________________________________________________________________


2.3 System Descriptions

The entire system consists of 3 sub-systems:

• Sensing.

• Communication.



center point they revolve around; that is data.

Sensing system generates the data, Communication collects co-ordinates

and distributes the data, and lastly Localization uses the data and generates

information for the Govt. bodies and for the driver. And also it displays the

location and interrupts the driver by alarm tone and LED.

This subsystem is responsible for getting the data. The data in this case

would be the data about pothole e.g. location of pothole, the severity of the

pothole. There were two methods under consideration for this subsystem one is

Vision based and the other is vibration based.





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2.4 System Requirements

• Rugged Design.

• Device must be able to display if the device is correctly

working.

• Device must log the location of road conditions.

• The device must be able to operate for a week’s worth of data.

• Get Power from the Cigarette Lighter.

• Display if memory is almost full.

• Display if device is writing to memory.

• Have a standby button.

• Display if system is in standby mode.

• Must be portable.

• Must be easy to mount.

� Technical Specification :

• WORKING VOLTAGE - 12V DC

• OPRATING CURRENT - 250MA

• OUTPUT RATING - 230V AC / 500W

• IR FREQUENCY - 38KHZ

• OPRATING RANGE - 10 METERS

� Component List :

1. Micro controller: PIC 16F877A

• At least 4 Serial Ports

• At least 8 8-bit Analog to Digital Converters

• At least 18 Digital I/O ports

• External Flash memory

• Ports are designated for the LCD display, one for GPS, one

for programming, and a final one for debugging.

2. Accelerometer: ADXL203

• Single axis accelerometer

• Respond to frequencies below 20 Hz





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3. Co sensor: MQ 7

• High reliability sensor

• Operating temp range: -4 to +122 °F (-20 to +50 °C)

• Available for Natural gas, LPG, CO

• High sensitivity to Carbon Monoxide (CO)

• Stable and long life

• Malfunction auto-check indicator and Auto-reset after alarm

4. Laser sensor

• Non-contact detection

• Highly accurate detection

• Detection of targets of virtually any material

5. GSM and GPS INTERFACE : MAX 232

6. Power supply: 12 V

7. Solar panel: 12V 500m AMP

8. LED and ALARM

9. LCD (16 x 2)





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10. Transmitter Board

• R1, 6 - 47K [yellow, violet, orange]

• R2 - 22E [red, red, black]

• R3 - 1K [brown, black, red]

• R4 - 6K8 [blue, gray, red]

• R5 - 1K8 [brown, gray, red]

• C1 - 47UF / 25V ELECTROLYTIC

• C2 - 0.1UF DISC (100nf / 104)

• C3 - 0.001UF DISC (1nf / 102)

• D1 - 5.1V / ½ W ZENER DIODE

• D2 - IN4007 DIODE

• D3 - 5mm IR LED

• U1 - CD4093 CMOS IC

• Q1 - BC557 PNP TRANSISTOR

• J2 - PCB MOUNT DC JACK

• 1nos - 14 PIN IC SOCKET

11. Receiver Board

• R1, 4, 5 - 470E [yellow, violet, brown]

• R2, 3 - 6K8 [blue, gray, red]

• R6 - 47K [yellow, violet, orange]

• C1 - 47UF / 16V ELECTROLYTIC

• C2 - 100UF / 16V

• C3, 4 - 10UF / 16V

• C5 - 1UF / 16V

• D1, 2 - IN4007 DIODE

• D3 - 5.1V ZENER DIODE

• D4 - 5 mm RED LED

• D5, 6 - IN4148 DIODE

• U1 - IR RECEIVER MODULE

• Q1 - BC557 - PNP TRANSISTOR

• Q2 - BC547 – NPN TRANSISTOR

• RL1 - 12V / 1CO PCB MOUNT RELAY

• J1 - PCB MOUNT DC JACK

• J2 - PCB MOUNT POWER CONNECTOR





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3. PROJECT DESIGN AND ANALYSIS

3.1 Introduction

In the following sections, the overall system design of the project will be

presented. The entire system consists of 3 sub-systems:

• Sensing.

• Communication.



center point they revolve around; that is data.

Sensing system generates the data, Communication collects co-ordinates

and distributes the data, and lastly Localization uses the data and generates

information for the Govt. bodies and for the driver. And also it displays the

location and interrupts the driver by alarm tone and LED.

This subsystem is responsible for getting the data. The data in this case

would be the data about pothole e.g. location of pothole, the severity of the

pothole. There were two methods under consideration for this subsystem one is

Vision based and the other is vibration based.

The overall design can be broken down into 8 sub-to-sub systems which include

the

• Accelerometer module.

• Co module.

• Laser Module.

• GSM and GPS module.

• LCD module.

• LED and Alarm module.

• Microcontroller module.

• Power supply with Solar panel module.



ISSN (Online): 2319 – 6757, ISSN (Print): 2319

www.ijesi.org | Volume 2 | Issue 7| July. 2013

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3.2 Block diagram

ngineering and Science Invention

6757, ISSN (Print): 2319 – 6727

July. 2013 | PP.10 – 9

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3.3 Hardware Required

For enhancing any project there are two types of requirement hardware

and software. In hardware there are many types of component. These are listed

below as follows:-

3.3.1 Component Explanation

3.3.1.1 Microcontroller Module:

Microcontroller: PIC 16F877A

PIC stands for Peripheral Interface Controller .Microcontroller

16F877 is the heart of the project. It is an 8-bit microcontroller. It has

3KB of data memory, 8KB of flash memory, and 2KB of EEPROM.

Now we are using PIC 16F877A for these project.

Features of PIC 16F877A:

• Small instruction set to learn

• High-Performance RISC architecture

• Built in oscillator with selectable speeds

• Operating speed: 20 MHz, 200 ns instruction cycle

• Operating voltage: 4.0-5.5V

• Industrial temperature range (-40° to +85°C)

• 15 Interrupt Sources

• 35 single-word instructions

• All single-cycle instructions except for program branches (two-

cycle)

• Flash Memory: 14.3 Kbytes (8192 words)

• Data SRAM: 368 bytes

• Data EEPROM: 256 bytes





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• Watchdog Timer with on-chip RC oscillator

• Programmable code protection

• Power-saving Sleep mode

Analog Features of PIC 16F877A:

• 10-bit, 8-channel A/D Converter

• Brown-Out Reset

• Analog Comparator module

� 2 analog comparators

� Programmable on-chip voltage reference module

� Programmable input multiplexing from device inputs and internal

VREF

� Comparator outputs are externally accessible.

3.3.1.2 Accelerometer Module:

Accelerometer:

This is a device that measures total specific external force on the

sensor. For example if the device is stationary, it will show some reading

corresponding to earth's gravitational force. An accelerometer falling

freely in the vacuum will show zero reading. The design of the

accelerometer is often very simple. The simplest design can be a mass

hanging by a thread and some sensor to measure its deflection for

original. The device is popularly used to measure vibration or inclination.

It is popularly used in iTouch and some cameras to detect inclination and

change the view of the display.





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But we are using ADXL203. It is a high precision, low power, dual-

axis accelerometers with signal conditioned voltage outputs on a single

IC. The output signals are analog voltages proportional to acceleration.

ADXL203 can measure acceleration, both static and dynamic, with a full-

scale range of 1.7 g.

Features of ADXL203:

• High performance, dual-axis accelerometer on a single IC chip.

• Low power: 700 µA at VS = 5 V (typical).

• High zero g bias stability and sensitivity accuracy.

• −40°C to +125°C temperature range.

• X and Y axes aligned to within 0.1° (typical).

• Bandwidth adjustment with a single capacitor.

• Single-supply operation.

• 3500 g shock survival.

• Qualified for automotive applications.

3.3.1.3 Laser sensor Module:

Laser sensor:

A laser sensor emits a beam of light from its transmitter. A

reflective type photoelectric sensor is used to detect the light beam

reflected from the target and the thru beam type is used to measure the

change in light quantity caused by the target crossing the beam.





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Features Laser sensor:

• Non-contact detection.

• Detection of targets of virtually any material.

• Long-detecting distance.

• High response speed.

• Highly accurate detection.

3.3.1.4 CO Sensor Module:

CO (Carbon Monoxide) Gas Sensor:

The CO (Carbon Monoxide) Gas Sensor is used in gas detection

equipment for detecting Carbon Monoxide in home, automotive or

industrial settings. This line of sensors can be interfaced with any of the

Parallax microcontrollers, and would be a good addition to any projects

needing to sense the presence of carbon monoxide. Here we are using

model MQ-7

Feature of MQ-7:

• High reliability sensor, excellent stability

• Auto-reset after alarm

• MCU processing adopted

• Malfunction auto-check indicator

• Alarm output N. C. / N. O. Optional





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• Available for Natural gas, LPG, CO

• High sensitivity to Carbon Monoxide (CO)

• Stable and long life

• Simple drive circuit

Key Specifications:

• Power requirements: 5 VDC @ ~160mA

• Interface Type: Resistive

• Operating temp range: -4 to +122 °F (-20 to +50 °C)

3.3.1.5 LCD Module:

LCD (Liquid Crystal Display) screen is an electronic display module and

find a wide range of applications. A 16x2 LCD display is very basic module and

is very commonly used in various devices and circuits. These modules are

preferred over seven segments and other multi segment LEDs. The reasons

being: LCDs are economical; easily programmable; have no limitation of

displaying special & even custom characters(unlike in seven segments),

animations and so on.

A 16x2 LCD means it can display 16 characters per line and there are 2

such lines. In this LCD each character is displayed in 5x7 pixel matrix. This

LCD has two registers, namely, Command and Data. The command register

stores the command instructions given to the LCD. A command is an instruction

given to LCD to do a predefined task like initializing it, clearing its screen,

setting the cursor position, controlling display etc. The data register stores the

data to be displayed on the LCD. The data is the ASCII value of the character to

be displayed on the LCD.





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Features of LCD:

• 5 x 8 dots with cursor

• Built-in controller (KS 066 or Equivalent)

• + 5V power supply (Also available for + 3V)

• 1/16 duty cycle

• B/L to be driven by pin 1, pin 2 or pin 15, pin 16 or A.K (LED)

• N.V. optional for + 3V power supply

3.3.1.6 LED and ALARM Buzz Module:

LED

A light-emitting diode (LED) is a semiconductor light source.

LEDs are used as indicator lamps in many devices, and are increasingly

used for lighting. LEDs emitted low-intensity red light, but modern

versions are available across the visible, ultraviolet and infrared

wavelengths, with very high brightness.





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When a diode is forward biased (switched on), electrons are able to

recombine with holes within the device, releasing energy in the form of

photons. This effect is called electroluminescence and the color of the

light (corresponding to the energy of the photon) is determined by the

energy gap of the semiconductor..LEDs present many advantages over

incandescent light sources including lower energy consumption, longer

lifetime, improved robustness, smaller size, faster switching, and greater

durability and reliability. Current LED products for general lighting are

more expensive to buy than fluorescent lamp sources of comparable

output. They also enjoy use in applications as diverse as replacements for

traditional light sources in automotive lighting (particularly indicators)

and in traffic signals. The compact size of LEDs has allowed new text

and video displays and sensors to be developed, while their high

switching rates are useful in advanced communications technology.

ALARM Buzz :

A device for the purpose of detecting obstacle that produces a

distinct audible alarm.

A device for the purpose of detecting obstacle that produces a

distinct audible alarm, and is listed or labeled with the appropriate

standard, either ANSI/UL 2034 - 96, Standard for Single and Multiple

Station CO Alarms, or UL 2075 – 04.





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3.3.1.7 GSM and GPS Module:

GSM and GPS INTERFACE: MAX 232

� GSM- GSM stands for Global System for Mobile Communications.GSM

is a system that involves telecommunications such as mobile

phones.GSM modem using RS232 communication, by the GSM modem

connection to the PIC through the MAX232. PIC UART to send and

receive UART according to her protocol.GSM Modem AT Command set

to operate through. The interfacing of a GSM Module with a PIC

microcontroller. It also covers a way to dial a particular GSM mobile

number as well as send a message to it using AT Commands with the

help of PIC16F877A:

Examples of AT Command are listed below.

AT+CGMI Manufacturer identification

AT+CGMM Request model identification

AT+CGMR Request revision identification

AT+CGSN Product Serial Number

ATD Dial command

ATH Hang-Up command

AT+CMGF Preferred Message Format

AT+CMGS Send message





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� MAX232-

The MAX232 was the first IC which in one package contains the

necessary drivers (two) and receivers (also two), to adapt the RS-232

signal voltage levels to TTL logic. It became popular, because it just

needs one voltage (+5V) and generates the necessary RS-232 voltage

levels (approx. -10V and +10V) internally. This greatly simplified the

design of circuitry. The MAX232 has a successor, the MAX232A. It

should be noted that the MAX232 (A) is just a driver/receiver. It does not

generate the necessary RS-232 sequence of marks and spaces with the

right timing, it does not decode the RS-232 signal, it does not provide a

serial/parallel conversion. All it does is to convert signal voltage levels.

Generating serial data with the right timing and decoding serial data has

to be done by additional circuitry.

The original manufacturer offers a large series of similar ICs, with different

numbers of receivers and drivers, voltages, built-in or external capacitors, etc.

E.g. The MAX232 and MAX232A need external capacitors for the internal

voltage pump, while theMAX233 has these capacitors built-in.





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3.3.1.8 Power Supply and Solar panel Module:

Power Supply:

The performance of the master box depends on the proper functioning of

the power supply unit. The power supply converts not only A.C into D.C, but

also provides output voltage of 5V, 1 amp. The essential components of the

power supply are Transformer, four diodes which forms bridge rectifier,

capacitor which work as a filter and positive voltage regulator IC 7805. It

provides 5v to each block of the transmitter.

Solar panel: 12V 500m AMP

They are the preferred method of power sourcing for remote areas that

lack access to the main power grid, or can be used in any home emergency

situation during a power loss. A solar generator literally can supply power for

free and as needed. They are typically highly efficient and powerful, easy to

use, and compact, making storage and usage convenient.

Best of all, solar generators emit no fumes into the air, so they represent

the very best in green power. You will find a huge selection of solar generators

using our store links below, at a variety of price points sure to fit any budget.

3.3.1.9 PCB Module:





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3.3.1.9.1 Design of Microcontroller PCB:

After having successful simulations, the circuit was constructed on a

bread board, tested, and was then put onto PCB board. The module was then

coated in an epoxy to protect it from environmental hazards such as water and

sand. Using this coated module, field testing was able to be done.

3.3.1.9.2 Design of Accelerometer PCB:



ISSN (Online): 2319 – 6757, ISSN (Print): 2319

www.ijesi.org | Volume 2 | Issue 7| July. 2013

_________________________________________________________________________________________________________________________

After having successful simulations, the circuit was constructed

on a bread board, tested, and was then put onto PCB board. The module was

then coated in an epoxy to protect it from

and sand. Using this coated module, field testing was able to be done.

3.3.1.9.3 Design of CO sensor

In one version, an adjustable voltage regulator is used to get a 1.4v

power line. A really tiny relay toggles between that voltage and the 5v from the

Adriano circuit. The other version uses 4 diodes, in series, to drop the voltage

down (it went about 1.2v each time).

These are 4148 300mv diodes.

used to toggle between the voltages

send it HIGH, and 5v is pumped to the sensor.

sketches with the board so that you can be doing whatever you’d like in the

sketch, and don’t need to worry about the toggling

background. 3.3.1.9.4 Design of LASER sensor

ngineering and Science Invention

6757, ISSN (Print): 2319 – 6727

July. 2013 | PP.10 – 9

_________________________________________________________________________________________________________________________


and was then put onto PCB board. The module was

then coated in an epoxy to protect it from environmental hazards such as water


Design of CO sensor PCB:


A really tiny relay toggles between that voltage and the 5v from the

circuit. The other version uses 4 diodes, in series, to drop the voltage

2v each time).

These are 4148 300mv diodes. In both boards, a single digital pin can be

used to toggle between the voltages – just send the pin LOW, and you get 1.4v,

send it HIGH, and 5v is pumped to the sensor. I will be releasing timer

hes with the board so that you can be doing whatever you’d like in the

sketch, and don’t need to worry about the toggling – it will happen in the

Design of LASER sensor PCB:

_________________________________________________________________________________________________________________________


and was then put onto PCB board. The module was

environmental hazards such as water



A really tiny relay toggles between that voltage and the 5v from the

circuit. The other version uses 4 diodes, in series, to drop the voltage

In both boards, a single digital pin can be

just send the pin LOW, and you get 1.4v,

I will be releasing timer-based

hes with the board so that you can be doing whatever you’d like in the

it will happen in the





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I used SMD components to fit the circuit on the bottom side of the sensor's

PCB. I used resistors with 0805 form-factor. The PCB size was 39.25 x 16.7

mm. I used a laser printer to print PCB layout and a hot iron to transfer the

printed image to the bottom copper layer of the interface board. Then I used

Ferric Chloride (FeCl3) to remove uncovered parts of the copper layer. After

mounting electronic components on the PCB I formed contacts of the S6986 to

place it into the lens focus. I measured the lens focus distance and found that it

was about 10 mm.

3.3.1.9.4 Design of GPS:

GPS accuracy in our deployment is important if potholes are to be

properly located and multiple detections combined to report a single pothole. To

measure accuracy, we placed a thick metal bar across a road, and repeatedly

drove over it. For each drive, we first identify the peak accelerometer reading r

in the drive, and then find the estimated location of the car when r occurred,

using linear interpolation between GPS readings. We found the standard

deviation of the positions reported for the bar to be 3.3 meters, which is

consistent with typical measurement errors from modern GPS receivers

outdoors.

3.3.1.9.6 Design of LCD and LED PCB:





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Looking at the schematic it can be seen that this circuit is not challenging to understand but provides all the necessary components to let the LCD work easily with minimal wiring mess. In the upper left hand corner .The standard pin out for the Hitachi can be seen even though pins seven through ten aren’t used by the 16-pin LCD header due to this board being specifically built for four-bit mode.

Input Port: The input port from the microcontroller is the first place to

start. A standard eight-pin header is used here because most 8-bit

microcontrollers use eight pin ports and on development boards that is generally

how the pins are pulled out.

5V Step Down Regulator: LCD model (S) runs on 5V DC so attaching

the output of the 7805 directly to pin two of the LCD header takes care of my

input voltage requirements. Second, if I were using the U-model LCD and had

an low-power input voltage of 3.3V it would be necessary to create a negative

voltage between -0.7 and -1.4V so that the potential voltage differential between

Vcc and Vo is greater than about 4.0V in order for the contrast to work. This

circuitry, depending on how it is implemented, can cost more PCB real estate

and can actually cost more in components than putting in a 5.0V regulator.

Note: When the input voltage is large (greater than 12 or 15V) or when the

voltage regulator is sourcing a good amount of current the chip will get very

hot to the touch. If the chip gets extremely hot with no load then there’s a good

chance there is a power and ground short somewhere on the board.

3.3.1.9.7 Design of GSM/GPRS along with MAX232:





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This can be said as the backbone of the system. This subsystem collects

the data from different vehicles; Co-ordinates the data and broadcasts it to other

vehicles. This system uses GPS infrastructure for communication between

Access point and Mobile nodes. There are multiple approaches in which this

subsystem can be implemented some of which are as explained below.

MAX 232:

3.4 Software required





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3.4.1 PIC tools kit

The PICBASIC PRO™ Compiler (or PBP) makes it even quicker and

easier for you to program Microchip Technology’s powerful PIC®

microcontrollers (MCUs). The English-like BASIC language is much easier to

read and write than assembly language. The PICBASIC PRO Compiler is

“BASIC Stamp II like” and has most of the libraries and functions of both the

BASIC Stamp I and II. Being a true compiler, programs execute much faster

and may be longer than their Stamp equivalents. PBP is not quite as compatible

with the BASIC Stamps as our original PICBASIC™ Compiler is with the BS1.

Decisions were made that we hope improve the language overall. One of these

was to add a real IF..THEN..ELSE..ENDIF instead of the IF..THEN(GOTO) of

the Stamps. These differences are spelled out later in this manual. PBP defaults

to create files that run on a PIC16F84 clocked at 4MHz. Only a minimum of

other parts are necessary: 2 22pf capacitors for the 4MHz crystal, a 4.7K pull-up

resistor tied to the MCLR pin and a suitable 5- volt power supply. PIC MCUs

other than the 16F84, as well as oscillators of frequencies other than 4MHz,

may be used with the PICBASIC PRO Compiler.

PICBASIC PRO Compiler (PBP) is intended to be used within a system

comprised of several tools. Below is a brief list of commonly used components,

listed in the order in which you are likely to encounter them. Your PBP

installation typically includes PICBASIC PRO Compiler, Mecanique's

MicroCode Studio IDE, Microchip's MPLAB IDE, and Microchip's MPASM

assembler. If you obtained PBP as a reduced file size download, the installation

does not include MPLAB and MPASM, but the installation process will offer

you the chance to download and install MPLAB. MPLAB includes MPASM.

The latest version of MPLAB can always be downloaded from Microchip's

website (www.microchip.com)

� Integrated Development Environment (IDE)

The IDE is the user interface, in which you create and edit your program.

A good IDE will also manage the following tools, invoking them when needed.

Examples of IDEs include MicroCode Studio from Mecanique and MPLAB

from Microchip

� Compiler





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The compiler is the tool that converts your BASIC program into

Assembly Language. PBP is a compiler. PBP depends on an IDE for user

interface, and an assembler to finish the conversion to machine language

� Assembler

The assembler is the tool that converts the Assembly Language into

machine language. The assembler runs after the compiler, and is normally

invoked automatically. PBP is designed to use Microchip's MPASM assembler,

which is included with MPLAB.

� Device Programmer

The device programmer takes the machine language code and "burns" it

into the microcontroller. Examples of device programmers are the U2

Programmer from melabs and the PICkit 3 from Microchip. The melabs U2

Programmer is recommended for ease of use and availability of technical

support.

� Debugger

A debugger is used to "see" what is happening inside the microcontroller

when it runs. The simplest method of debugging is to write bits of code into

your program that display information like variable and register values. The

term In Circuit Debugger (ICD) refers to a device or method that gives you

steps – by - step control of program execution via a connection to the

microcontroller.

Examples of debuggers are the ICD3 from Microchip and the software -

based ICD system offered in MicroCode Studio PLUS from Mecanique.

� Special Terminology and Acronyms

Some acronyms and terms that will be used extensively in this manual

are:

� Ports and Other Registers

PBP PICBASIC PRO™ Compiler

PBPW PBP in WORD mode

PBPL PBP in LONG mode

Melabs micro Engineering Labs, Inc





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All of the PIC MCU registers, including the ports, can be accessed

just like any other byte-sized variable in PICBASIC PRO. This means

that they can be read from, written to or used in equations directly:

PORTA = %01010101 ‘Write value to PORTA

anyvar = PORTB & $0f ‘ Isolate lower 4 bits of PORTB and place result

into anyvar

� Pins

Pins may be accessed in a number of different ways. The simplest

way to specify a pin for an operation is to simply use its PORT name and

bit number:

PORTB.1 = 1 ‘ Set PORTB, bit 1 to a 1

To make it easier to remember what a pin is used for, it may be assigned

a name using the VAR command. In this manner, the name may then be

used in any operation:

led Var PORTA.0 ‘ Rename PORTA.0 as led

High led ‘ Set led (PORTA.0) high

For compatibility with the BASIC Stamp, pins used In PICBASIC PRO

Compiler commands may also be referred to by a number, 0 - 15. This

number references different physical pins on the PIC MCU hardware

ports dependent on how many pins the microcontroller has.

PICBASIC PRO Compiler 28 No.

PIC MCU Pins 0-7

8 - 158-pin GPIO GPIO1

And

20-pin PORTA PORTC

18-pin PORTB PORTA

28-pin (except 14000) PORTB PORTC

14000 PORTC PORTD





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40-pin and up PORTB PORTC

If a port does not have 8 pins, such as PORTA, only the pin numbers that

exist may be used, i.e. 8 - 12. Using pin numbers 13 - 15 will have no

discernible effect. This pin number, 0 - 15, has nothing to do with the

physical pin number of a PIC MCU. Depending on the particular PIC

MCU, pin number 0 could be physical pin 6, 21 or 33, but in each case it

maps to PORTB.0

(or GPIO.0 for 8-pin devices, or PORTA.0 for 14 and 20-pin devices, or

PORTC.0 for a PIC14000).

High 0 ‘ Set PORTB.0 (or GPIO.0)

High B0 = 9 ‘ Select PORTC.1 (or PORTA.1)

Toggle B0 ‘ Toggle PORTC.1 (or PORTA.1)

Pins may be referenced by number (0 - 15), name

(e.g. Pin0, if BS1DEFS.BAS or BS2DEFS.BAS is included or you have

defined them yourself), or full bit name (e.g. PORTA.1). Any pin or bit of

the microcontroller can be accessed using the latter method. The pin

names (i.e.Pin0) are not automatically included in your program. In most

cases, you would define pin names as you see fit using the

VAR command:

led Var PORTB.3

However, two definition files have been provided to enhance BASIC

Stamp compatibility. The files BS1DEFS.BAS Or BS2DEFS.BAS may

be included in the PICBASIC PRO program to provide pin and bit names

that match the BASIC Stamp names. Include “bs1defs.bas”

or PICBASIC PRO Compiler 29

Include “bs2defs.bas”

BS1DEFS.BAS





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Defines Pins, B0-B13, W0-W6 and most of the other BS1 pin and

variable names. BS2DEFS.BAS defines Ins ,Outs ,InL, Inh, OutL, Outh,

B0-B25,W0-W12 and most of the other BS2 pin and variable names.

PORTL and PORTH are also defined in PBP.

PORTL encompasses Pin0 - Pin7

And

PORTH encompasses Pin8 - Pin15.

When a PIC MCU powers-up, all of the pins are set to input. To

use pin as an output, the pin or port must be set to an output or a

command must be used that automatically sets a pin to an output. To set a

pin or port to an output (or input), set Its TRIS register. Setting a TRIS bit

to 0 makes its corresponding port pin an output. Setting a TRIS bit to 1

makes its corresponding port pin an input.

For example:

TRISA = %00000000 ‘Or TRISA = 0sets all the PORTA pins to outputs.

TRISB = %11111111 ‘Or TRISB = 255 sets all the PORTB pins to

inputs.

TRISC = %10101010 Sets all the even pins on PORTC to outputs, and

the odd pins to inputs.

Individual bit directions may be set in the same manner.

TRISA.0 = 0 sets PORTA, pin 0 to an output.

All of the other pin directions on PORTA are unchanged.

The BASIC Stamp variable names Dirs , Dirh , Dirl and Dir0 - Dir15 are

not defined and must not be used with the PICBASIC PRO Compiler.

TRIS must be used instead, but has the opposite state of Dirs.

PICBASIC PRO Compiler 30. This does not work in PICBASIC PRO:

Dir0 = 1 ‘Doesn’t set pin PORTB.0 to output Do this instead: TRISB.0





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� Features

� Familiar BASIC syntax o IF (condition) THEN / ELSE / ELSEIF /ENDIF o SELECT CASE o FOR… NEXT o DO WHILE/UNTIL

� Direct Register Access o All Special Function Registers are pre-mapped by

PBP and accessible by name � Built-In Commands for operations common to embedded

development o Accurate Delays in uS and mS resolutions o Analog to Digital Conversion o Asynchronous Serial Communications (RS-232,

RS-485, etc) o Synchronous Serial including I2C and SPI o Character LCD o PWM o USB o Parsing and Formatting of ASCII Strings o Sinusoidal Frequency Generation and DTMF

(requires hardware filtering) o Pulse-Width Measurement o Low-Power Mode

� Conditional Compilation with Command-Line Constants � In-Line Assembly Language � Easy Device Configuration

o Configuration settings listed for each supported device

o New #CONFIG directive eliminates the need to edit header files

� Interrupts in BASIC or Assembly Language � Newly revised and expanded, 300+ page reference

manual. � MPLAB/MPLABX compatible. � Micro Engineering Labs technical support via telephone,

email, and community forum (phone and email support not available for Experimenter Edition.)





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3.4.2 Eagle

� The PCB View

So your circuit works and also looks great in Fritzing's Breadboard

View. Let's now have a look at the PCB View. To switch to the PCB View

use the Navigator or the View Switcher. While it is very easy to recognize

parts in the Breadboard View, the PCB View might look a bit confusing at

first glance. The reason for this is that the PCB View only shows the

necessary information needed for the PCB design. This information is shown

in different layers. To view or hide layers, use the View options in the menu

bar. Learn more about the PCB View layers.

As an example, lets have a look first at the following circuit which was created in Breadboard View:





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Selecting PCB View in the Navigator will show a completely different

illustration of the same circuit. The green rectangle is the board itself, on which

parts will be arranged. It is automatically placed as you open a new sketch.

Parts are shown as footprints, including the Arduino footprint, and you can

identify them by selecting or placing the cursor on them to see their labels.

The thin connecting lines are the Rat's Nest (more about the Rat's Nest below).

You might want to resize the board, or use an Arduino shield or a board with a custom shape. Select the board and choose/edit your prefered shape in the Inspector.





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� Arranging parts on the board

The first step in designing a PCB layout is arranging the parts on the

board. There are some very important issues to consider here, because the

location of parts on the board will have a great effect on how successful the

routing process will be.

Follow these guidelines:

1. Place the parts with the most connections in the middle of the

board.

2. Notice that Arduino's footprint should also be positioned on the

board, just like other parts (new in version 3.0).

3. Rotate and position parts, leaving enough space between them

(don't forget their actual size!).





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4. If the board is too small, redefine its width and height in the

Inspector or alternatively resize the board by dragging its corners.

Learn how to design a PCB with a custom shape.

5. Don't place parts too close to the edges of the board.

6. To avoid short circuits, don't place parts too close to the USB

connector outline on the Arduino Shield.

7. When designing stack shields, parts' heights should also be

considered.

The following screenshot shows one out of many possible part arrangements for

the given circuit:





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� Auto-routing

After positioning all parts on the board, be aware that parts are not really connected to each other yet. The thin connecting lines that you see (Rat's Nest Layer) only act as a guideline. We would now want Fritzing to automatically generate the connection traces between parts. Click the Auto-route function from the bottom menu bar. If you notice that Fritzing is struggling trying to generate a connection, you can press the "Skip this Trace" button or "Cancel Auto-routing" in the bottom menu while in process.

Such a problem might happen because parts were not arranged properly on the board or when there is just no possible route. You will then need to Hand-route the trace (more about hand-route below) or create a jumper. Jumpers are connections that need to be soldered with external wires. These are shown as blue connections while traces are shown as orange ones. In the screenshot





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below, two jumper wires were created after the routing between connectors failed.

If you are happy with some of the traces and want to keep them untouched, or you know in advance that some connections need jumpers, you might want to tell Frizzing to exclude some connections in the auto-routing process. To do so, select the connections you want to exclude, choose "Don't Auto route this trace" in the right-click menu or in the Trace menu. Only then press Auto-route. The selected traces will be left untouched while all other connections will be auto-routed. Any traces that were hand routed are automatically marked as "Don't Auto route."





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Be aware that if you moved a part after auto-routing or hand-routing, the routing traces are not corrected automatically. You will need to be cautious when moving parts and make sure you don't create any short circuits.

� Hand-routing

Use any of the following methods to hand-route traces and

jumpers:

1. The safest way is to right-click a Rat’s nest wire and chooses "Create

Trace from Selected Wire(s)" or "Create Jumper from Selected Wire(s)".

This will avoid making any changes in the circuit that you built in

Breadboard View.

2. Another way is to simply click a part's connector, and drag to make a

connection. A trace will be created. To create a jumper, just right-click on





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the trace and choose "Create Jumper from Selected Wire(s)". To avoid

incorrect wiring, we strongly recommend you follow the Rat's nest wire

connections while using this method.

Note that while clicking and holding on a connector, all equipotential

connectors are highlighted (in yellow). This shows the whole set of connections

attached to this particular connection, and can really help to make hand-

routing decisions. Once again, take good care not to cross wires!

� Guidelines for better routing

For both auto- and hand-routing, follow these guidelines:

1. Place the parts with the most connections in the middle of the board. 2. Try to get short connections by moving and rotating parts. 3. Use the highlighting of equipotential connectors feature.





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4. Add bend points for tidy routing and so that lines do not cross. 5. Don't forget the traces can go under parts like resistors. 6. Use jumper wires instead of watching the auto-route go crazy.

� Editing Traces

To achieve a better and nicer design, you would need to edit traces by moving, adjusting width and adding bend points. Width adjustment can be done in the Inspector. Please note that thin traces might ruin in a DIY PCB production, so keeping traces in medium thickness is safer. To create a bend points drag it simply out of a trace. Sometimes, it would be possible to edit traces in a way that will reduce the number of jumpers. The routing in the screenshot above was edited and a better design was achieved:





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� Export Options

Frizzing features a variety of export options. When you are happy with your PCB design, you can choose to export JPG, PNG, etch able PDF and even Gerber files (for sending a professional PCB manufacturing service). The Bill of Materials option generates a list of all parts in the circuit. From the menu bar choose File > Export > and the desired format.

• For DIY PCB production, use the Etch able PDF option which exports only the necessary design for etching.

• When exporting Gerber files, create a folder for the gerberas, and zip. it before sending to a manufacturer.





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4. IMPLEMENTATION

4.1 Introduction

This chapter outlines the methods used by our project team to accomplish

our project goals. Briefly, we had to determine our system requirements when

choosing a microcontroller to fit our needs. The team also had to research

different means of measuring road conditions. As a result, the approach used to

develop our system was as follows:

1. Reviewed different methods to collect potholes and road conditions

2. Reviewed System Requirements

3. Implemented the design from system requirements

4. Implemented packing requirements (Size of case, user interface)

5. Reviewed data processing requirements

(How data from unit was going to be used to produce maps)

Our system depends on the accelerometer producing consistent results for

a given pothole, and on having accurate localization of events from the on-board GPS. In this section, we describe a few experiments we performed to validate the functioning of our sensors. We also discuss how our training data was gathered. The signals from the dashboard and windshield appear to be quite similar, while the accelerometer attached to the computer produced unpredictable results. Consequently, we firmly attached the accelerometer to the dashboard inside the car’s glove box, which is a relatively easy location to install sensors on, and which keeps the sensors out of the way of passengers in the cabin.





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4.2 Hardware Implementation (PCB fabrication)

4.2.1 Circuit Diagram





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� 4.2.2 PCB design

Designing of a pcb is a major slip in the production of pcbs. It forms

adistinct factor n electronic perfomance and reliability.The productivity of a

pcb with assembly and servicability also depends on design. The lay out should

include all the relevant aspects and details of the pcb design while the network

might be produced at 1:1 or 2:1 or even 4:1 scale.it is best prepared ona 1:1

scale

� Steps Involved

1. Prepare the required circuit diagram 2. List out the components, their sizes etc. 3. Draft it onto a graph sheet 4. Place all pads and finish thin tracks 5. Put it on the mylor sheet and then on the graph sheet 6. Place parts including screw holes with the help of knife. 7. Fix all the tracks and Keep one component as the key.

� Conversion of circuit diagram

1. Cutting lines , Mounting lines are done 2. List all the components their length diameter thickness code names 3. Keep one component as key component 4. Keep key component first and their supporting tools 5. All tracks are straight lines 6. In between ICs no signal lines should be passed 7. Mark the pin number of IC on the lay out for avoiding dislocations 8. The length of the conductor should be as low as possible 9. Place all the components, resistors ,diodes etc. parallel to each

other





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� PCB layout

Lay out approaches

First the board outlines and the connectors are marked on a sheet of paper

followed by sketching of the component outlines with connecting point and

conductor patterns. Prepare

The layout as viewed from the component side first, so as to avoid any

confusion. The layout is developed in the direction of signal flow as far as

possible

Among the components the larger ones are filled first and the space

between is filled with smaller ones. Components, rewiring input, output

connections came near the connectors.

All the components are placed in such a manner that desoldering of the

component is not is not necessary, if they have to be re placed. While designing

the conductors, the minimum spacing requirement for the final network should

be known.

Transforming the lay out to copper

The lay out made on the graph sheet should be redrawn on the copper

clad using paint or nail polish.





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Etching

The final copper pattern is formed by selective removal of the unwanted

copper which is not protected by an electric rebist . FeCl3 solution is popularly

used etching solution. FeCl3 powder is made into a solution using water and

kept in a plastic tray. Immerse the marked copper clad in this solution for two or

three hours. Due to the reaction solution will became weak and it is not

recommended for further etching process. Take out the etched sheet from the

tray and dry out for in sunlight for an hour.

Etchants

Many factors have to be considered to choose the most suitable etchant

system for a PCB process. Some commonly used etchants are FeCl3, Cupric

chloride, Chromic acid etc. After etching FeCl3 is washed from the board and

cleaned dry. Paint is removed using suitable from the component insertion.

Holes are drilled into appropriate position and the components are soldered into

PCB carefully Etching using FeCl3





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� Practical implementation

Take a copper clad of the required dimensions. Transfer the circuit layout

to the copper clad using cotton paper. The layout area should be marked with

nail polish. Put the copper clad into FeCl3 solution and warm it. Stage by stage

transformation of the copper clad occurs. Warm the solution Intermittently

according to the requirement. After about 4 hours etching will be completed.

Wash the board using soap solution to remove the remaining of FeCl3 solution.

Scrap off the nail polish and drill holes wherever required using appropriate

drill bits. PCB is fabricated.

� Fabrication

Route the perimeter of the board using NC equipment.





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4.3 Software Implementation

4.3.1 Introduction

This section presents the results, from a software standpoint, when the

microcontroller was programmed to bring functionality to the entire system. In

addition, this section describes the functions of our program by means of a

software flow chart. A complete version of our C++ program source code is

included in Appendix C: C++ Embedded Program Source Code. The software

flow chart of our embedded program. The basic operation of our code, from

looking at this software flow chart, can be followed from the initialization of

variables down to the Main Loop. Our functions check to see which GPS string

type (From the GPS receiver) was received from the SER1 serial port. The

program executes different procedures depending on the GPS String.

If the GPS string is type GPGGA the program first parses for time and stores the most recent time. It also parses for the number of satellites “in view” from the GPGGA string. If the GPS string is type GPRMC the program stores it as the most recent GPS coordinates on onboard memory. If the GPS string is type GPVTG the program parses and stores the most recent velocity.

4.3.2 Creating Ports

The input/output ports on the PIC are addressed in PB Pro using their port name followed by the pin you want the states of these pins are stored in special memory registers, so when you ask for PORTB.0, for example, you're actually reading the first bit of that byte of memory.

There two important memory registers for addressing the pins: The data direction register, or TRIS, which tells you what the state of the pin is (input or output). The PORT register then tells what the state of the pin is. So, for example, to set pin 0 of port B (RB0) to an output and set it high.





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4.3.3 Algorithms

DEFINE OSC 20

CLEAR

;76543210

TRISA=%00001111 '0=output

TRISB=%11110000 '1 = input

TRISC=%10000000

TRISD=%00000000

TRISE=%00000000

;-------------------- [LCD definitions]------------------------------------------

DEFINE LCD_DREG PORTD

DEFINE LCD_DBIT 0

DEFINE LCD_EREG PORTD

DEFINE LCD_EBIT 5

DEFINE LCD_RSREG PORTD

DEFINE LCD_RSBIT 4

DEFINE LCD_BITS 4

DEFINE LCD_LINES 2

DEFINE HSER_RCSTA 90h

DEFINE HSER_TXSTA 24h

GPSin VAR PORTA.0

SMS_SENT VAR BIT

ADC1 VAR BYTE

ADC2 VAR BYTE

ADC3 VAR BYTE

' TEMP VAR WORD

TIME VAR BYTE

DIR1 VAR PORTB.0

DIR2 VAR PORTB.1

PWM1 VAR PORTB.2

PWM2 VAR PORTB.3

BUZ VAR PORTE.0 ' BUZZER

SMS_DATA VAR BYT

GOTO MAIN





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SEND_SMS1:

high buz

HSEROUT ["AT+CMGS=", 34, "08976669322",34, 13]

PAUSE 500

HSEROUT ["POTHOLES DETECTED ",13]

PAUSE 3000

low buz

RETURN

SEND_SMS2:

HSEROUT ["AT+CMGS=", 34, "08976669322",]

PAUSE 500

HSEROUT ["OBSTACLE AHEAD",13]

LOW BUZ

DIR1 = 0 :DIR2 = 0:PWM1=0: PWM2=0

RETURN

SEND_SMS3:

HSEROUT ["AT+CMGS=", 34, "08976669322",34, 13]

PAUSE 500

HSEROUT ["CO LEVEL HIGH VEHICLE NO MH-3454/LIC NO-8978SD",13]

LOW BUZ

RETURN

readgps:

SerIn2 GPSin,84,Timeout,readgps,[wait("$GPRMC"),wait(","),DEC2 hh,DEC2

mm,wait(","),fix,wait(","),DEC2 latdeg,DEC2 latmin,wait(","),NS,wait(","),DEC3 londeg,DEC2

lonmin,wait(","),EO,wait(","),knots,wait("."),DEC2 knotsten,wait(","),DEC3 lcdout $fe,1,"SENDING

SMS"

LCDOut $fe,$c0,DEC2 latdeg,223,DEC2 latmin,39,NS," ",DEC2 londeg,223,DEC2 lonmin,39,EO

'----------------------------------------------------------

HSEROUT ["AT+CMGS=", 34, "08976669322",34, 13]

PAUSE 500

HSEROUT ["POTHOLES DETECTED",13]

HSEROUT ["LAT:",DEC2 latdeg,"-",DEC2 latmin,39,NS," LON:",DEC2 londeg,"-"lonmin,]

PAUSE 3000

RETURN

MAIN:





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low buz

CLEAR

SMS_SENT = 0

lcdout $fe,1,"SMART VEHICLE"

lcdout $fe,$c0,"ENSURING"

PAUSE 3000

lcdout $fe,1,"SAFE RIDE"

lcdout $fe,$c0,"2012-13"

pause 3000

DIR1 = 1 :DIR2 = 0:PWM1=1: PWM2=1

PAUSE 3000

DIR1 = 0 :DIR2 = 0:PWM1=1: PWM2=1

PAUSE 3000

WHILE 1 = 1

ADCIN 0, ADC1 ' Read channel 0 to TEMP

ADCIN 1, ADC2 ' Read channel 1 to HUM

ADCIN 2, ADC3

lcdout $fe,1,"ANGLE:", DEC3 ADC1,"OB:", DEC3 ADC2

lcdout $fe,$c0,"Gas:" , DEC3 ADC3

IF ADC1 > 110 THEN

HIGH BUZ

lcdout $fe,1,"POTHHOLE"

lcdout $fe,$c0,"DETECTED."

GOSUB SEND_SMS1

' HIGH RLY1 : LOW RLY2 : LOW RLY3 : LOW RLY4

ENDIF

IF ADC2 < 35 THEN

HIGH BUZ

lcdout $fe,1,"OBSTACLE"

lcdout $fe,$c0,"AHEAD"

GOSUB SEND_SMS2


ENDIF

IF ADC3 > 120 THEN

HIGH BUZ

lcdout $fe,1,"CO2 LEVEL HIGH"

lcdout $fe,$c0,"DETECTED."

GOSUB SEND_SMS3


ENDIF

PAUSE 300

WEND





_________________________________________________________________________________________________________________________

4.3.4 Flow charts





_________________________________________________________________________________________________________________________





_________________________________________________________________________________________________________________________

4.4 Implemented PCB Circuit





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5. TESTING AND RESULT ANALYSIS

These section deals with the practical working of the thesis and it has 3

main Phase of Project:

� Potholes Testing and its Result

� CO Testing and its Result

� Obstacles Testing and its Result

5.1 Potholes Testing and its Result

We shall be following a testing program that will involve unit testing,

integration testing, and validation testing. More information will be known after

further discussion.

Fig: A testing plane with Accelerometer reading

A program implementing the algorithm explained in Section 5.3.3 was

written to test the pothole-detection module. A wooden platform, shown in

Figure 6.3, was constructed for the experiment. Two potholes with the same

maximum depth of 4 cm were used. One pothole had a gradual decline to the

maximum depth while the other had a sharp fall.





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Multiple runs were conducted. This is because in the latter case the available

sampling time of 2.5–3 ms was not fast enough to record all the encoder counts.

However, so long as the maximum count recorded. Exceeds the minimum

threshold, the primary function of pothole detection remains. Unaffected

because an infrared distance sensor is used for end-point detection. Also, due to

the very nature of pothole formation described in pervious section, potholes

tend to have gradually sloping edges and are usually bowl shaped.

Fig B: LCD display showing detection of Pothole

Fig C: LCD display showing sending of SMS to subscribed user





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5.2 CO Testing and its Result

Here we are implementing the MQ-7 under the test purpose. The entire

circuitry is connected to the LED for Alerting the user regarding the emission of

CO gas. If there is emission of CO gas LED will glow and hence the testing is

done.

Fig A: LED has glow and it indicates emission of CO gas

Fig B: LCD display showing detection of CO emission from vehicle





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5.3 Obstacles Testing and its Result

Consider, Laser sensor which is used to detect the object in front of the

vehicle which is also helpful during fog. Now in the below dig.

The rays are passed from the transmitter which hits the target. The light

beam is interrupted so it considers that there is no obstacle in front of the

vehicle. Now in other case if the rays are not interrupt but is reflected back then,

it is assume that there is an object in front of vehicle. So, the Diver will get an

alert regarding that object.

Fig A: Real time representation of LASER sensor

Fig B: LCD display showing Obstacle ahead

These how it works when laser sensor is put in front side of vehicle. The

green ray indicates the transmission of signal and Red rays indicates Receiving

of signal from the obstacles.





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6. CONCLUSION AND FUTURE SCOPE

6.1 Conclusion

Our project group was able to successfully implement a GPS-GIS pothole

mapping system along with CO emission and Fog and vehicles detector across

10m which can be used in any vehicle. Our system can be easily redesigned to

fit smaller enclosures, and also, the user interface can be easily updated for

other functions and applications, making our system very useful for other

projects. There are some improvements that could be looked into such as

wireless accelerometers and the use of multiple accelerometers (1 per each

wheel).The next generation system should also use constant logging to

determine road smoothness, and use algorithms that would help map these road

conditions. Overall, our current system could potentially lower the percentage

of damaged roads by properly allocating road repair resources and also has the

potential to lower the CO emission by detecting it in the environment. Also our

current system has some extra features like Fog and obstacle detector, LCD,

Alarm and LED for the user to see, judge and analyze the location. We also

evaluated our system on data from thousands of kilometers of “uncontrolled”

taxi drives, and found that out of reported detections, 90% contain road

anomalies in need of repair and 25% of vehicles on the road emit CO in the air.

So Consumers can be protected before CO enters the living space.





_________________________________________________________________________________________________________________________


6.2 Future scope and Further Modification

� Vision-based method for any potholes detection :

• Camera Based: This method uses 'Camera' as sensor to scan the road for any potholes. The camera captures the images in real time. These images are applied to image processing algorithms like edge detection. This requires lot of processing time and power. There many design approaches possible. Hardware based methods like use of special Digital Signal Processors or Application Specific Integrated Circuits improve the performance over software based method. But still the response time of the operations required like windowing convolution for the image processing algorithm is still large. This method has one advantage over the other is, it can sense a pothole without experiencing it i.e. Vehicle does not actually has to pass through the pot hole to sense it. Characterization of pothole can be done on the basis of size of the pothole.

• RADAR Based: Other vision based methods for obstacle detection are RADAR but they have little use in pothole detection. So it is avoided.

• Automated Image Analysis Systems (AIAS) Based: The cameras used by most of the (AIAS) are based on Charge-Coupled Device (CCD) image sensors where a visible ray is projected. However, the quality of the images captured by the CCD cameras was limited by the inconsistent illumination and shadows caused by sunlight. To enhance the CCD image quality, a high-power artificial lighting system has been used, which requires a complicated lighting system and a significant power source. In this paper, we can introduce an efficient and more economical approach for pavement distress inspection by using laser imaging. After the pavement images are captured, regions corresponding to potholes are represented by a matrix of square tiles and the estimated shape of the pothole is determined. The vertical, horizontal distress measures, the total number of distress tiles and the depth index information are calculated providing input to a three-layer feed-forward neural network for pothole severity and crack type classification. The proposed analysis algorithm is capable of enhancing the pavement image, extracting the pothole from background and analyzing its severity.





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7. REFERENCES

1. R Gass, J Scott, C Diot, “Measurements of In-Motion 02.11Networking”,

IEEE Workshop on Mobile Computing System and Applications, 2006.

2. X Zhang, JK Kurose, BN Levine, D Towsley, H Zhang, “Study of a bus-

based disruption-tolerant network: mobility modeling and impact on

routing”, 13th annual ACM international conference, 2007.

3. “http://www.its.dot.gov/vii”, RITA | ITS | Vehicle Infrastructure

Integration, JAN 2007.

4. “http://dev.emcelettronica.com/datasheet/st/LIS3L06AL”, Datasheet of

STLIS3L06AL accelerometer, JAN 2008.

5. “http://www.gps.gov/”, Global Positioning System, JAN 2007.

6. JW Byers, M Lubyt, M Mitzenmachert, “A Digital Fountain Approach to

Reliable Distribution of Bulk Data”, SIGCOMM, 1998.

7. .M Mitzenmacher, “Digital fountains: a survey and look forward”,

Information Theory Workshop, 2004. IEEE, 2004.

8. “Pothole detection System using Wi-Fi”, Mtech project Report submitted

by Shonil Vijay, JUL 2007.

9. “FireBird Reference manual”, Embedded and real Time Systems Lab,

Computer science and Engineering Department, IITB.

10. Manufacturers of Emission Controls Association (MECA).

11. Emission Control Systems on FamilyCar.com.

12. National Vehicle and Fuel Emissions Laboratory of the United States Environmental Protection Agency.

13. K. De Soya, C. Keppitiyagama, G. Seneviratne, and W. Shihan, “A public transport system based sensor network for road surface condition monitoring,” in Proc. NSDR’07, 2007, pp.

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