smd reflector - everlight americas

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Release Date:2014-08-06 17:04:13.01Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : Jul.03.2013. Issue No:DSE-0011909 Rev.1 www.everlightamericas.com

SMD REFLECTOREAPL3232RGBA0

Features

․ Package in 12mm tape on 7〞diameter reel․ Compatible with automatic placement equipment․ Various Compatible with infrared and vapor phase reflow solder process․ 6 Pins for separate control of each chip and better thermal management․ Good color fidelity and brightness uniformity across the viewing angle․ Pb-free․ RoHS compliant

Description

․ The SMD LED package provides a perfect solution when users need a clear view of signage display with any size board with 3 in 1 full color SMD LEDs which offer smaller pixel pitch between two LEDs to create a high resolution and better contrast with its black surface design.

Applications

․ Indoor signage display applications․ Indicator and backlighting for all consumer electronics.․ Gaming equipment.․ General use.

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DATASHEETSMD REFLECTOREAPL3232RGBA0

2Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : Jul.03.2013. Issue No: DSE-0011909 Rev.1 www.everlightamericas.com

Device Selection Guide

Chip Materials Emitted Color Resin Color

AlGaInP Brilliant Red

Water DiffuseInGaN Brilliant Green

InGaN Brilliant Blue

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR 5 V

Forward Current IFR:50G:30B:30

mA

Peak Forward Current

(Duty 1/10 @1KHz)IFP

R:100G:100B:100

mA

Power Dissipation PdR:130G:110B:110

mW

Junction Temperature Tj 100 ℃

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40 ~ +90 ℃

ESD

(Classification acc. AEC Q101)ESDHBM

R:2000G:1000B:1000

V

Soldering Temperature TsolReflow Soldering : 260 fo℃ r 30 sec.

Hand Soldering : 350 for 3 sec.℃

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Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Intensity Iv

R 435 ----- 900mcd IF=20mAG 1045 ----- 2210

B 280 ----- 485

Viewing Angle 2θ1/2 ----- 120 ----- deg IF=20mA

Peak Wavelength Λp

R

-----

632

----- nm IF=20mAG 518

B 468

Dominant Wavelength Λd

R 620.0

-----

629.0

nm IF=20mAG 522.0 534.0

B 462.0 474.0

Spectrum Radiation Bandwidth Δλ

R

-----

20

----- nm IF=20mAG 25B 25

Forward Voltage VF

R 1.75

-----

2.55

V IF=20mAG 2.75 3.35

B 2.75 3.35

Reverse Current IR ----- ----- 10 μA VR=5V

Note: 1. Tolerance of Luminous Intensity: ±10%2. Tolerance of Dominant Wavelength: ±1nm3. Tolerance of Forward Voltage: ±0.1V

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Bin Range of Luminous Intensity(Red)

Bin Code Min. Max. Unit Condition

RA 435 520

mcd IF =20mARB 520 625RC 625 750RD 750 900

Bin Range of Dominant Wavelength


R1 620.0 623.0nm IF =20mAR2 623.0 626.0

R3 626.0 629.0

Bin Range of Luminous Intensity(Green)


GA 1045 1275

mcd IF =20mAGB 1275 1530GC 1530 1840GD 1840 2210



G1 522.0 525.0

nm IF =20mAG2 525.0 528.0G3 528.0 531.0G4 531.0 534.0

Note: 1.Tolerance of Luminous Intensity: ±10%2.Tolerance of Dominant Wavelength: ±1nm

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Bin Range of Luminous Intensity(Blue)


BA 280 335mcd IF =20mABB 335 400

BC 400 485



B1 462.0 465.0

nm IF =20mAB2 465.0 468.0B3 468.0 471.0B4 471.0 474.0

Note: 1. Tolerance of Luminous Intensity: ±10%2. Tolerance of Dominant Wavelength: ±1nm

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Typical Electro-Optical Characteristics Curves

Forward Voltage V (V)

For

war

d C

urre

nt

I (

mA

)F

Forward Voltage

F

Ta=25°C

Forward Current vs.

0

10

20

25

30

40

50

2.82.01.6 2.4 4.23.43.0 3.8

RED GREENBLUE

25

0

50

75

100Ta=25°C

Rel

ativ

e lu

min

ous

inte

nsi

ty (

%)

Wavelength λ (nm)

Spectrum Distribution

400 550450 500 600 650 700

REDGREENBLUE

Forward Current Derating Curve

Forward Current I (mA) FP

0

1

0

2

3

4

5

4020 60 10080

Rel

ativ

e lu

min

ous

inte

nsit

y

RED

GREEN

BLUE

Ta=25°CRadiation Diagram

70°0.7

0.5 0.40.10.3 0.290°80°

0.6

1.0

0.9

0.8

0° 10°

40°

60°

50°

30°20°

30°20°Ta=25°C

10°0°Radiation Diagram

40°

60°

50°

90°80°

0.6

70°

0.20.10.5 0.3 0.4

1.0

0.8

0.9

0.7

30°20°Ta=25°C


40°

60°

50°

90°80°

0.6

70°

0.20.10.5 0.3 0.4

1.0

0.8

0.9

0.7

30°20°Ta=25°C


40°

60°

50°

90°80°

0.6

70°

0.20.10.5 0.3 0.4

1.0

0.8

0.9

0.7

REDGREEN

BLUE

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Typical Electro-Optical Characteristics Curves

Ambient Temperature vs.

Ambient Temperature Ta (°C)

0

Tot

al P

ow

er

Dis

sipa

tion

50

0

100

150

(mW

)

200

250

4020 60 10085

Total Power Dissipation

Ambient Temperature Ta (°C)

0

Tot

al P

ower

Dis

sipa

tion

50

0

100

150

(m

W)

200

250

4020 60 10085

RED

GREEN

BLUE

Ambient Temperature vs. Power Dissipation

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Package Dimension

Note: Tolerances unless mentioned ±0.1mm. Unit = mm

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Moisture Resistant Packing Materials

Label Explanation

‧CPN: Customer’s Product NumberP/N: Product Number‧QTY: Packing Quantity‧CAT: Luminous Intensit‧ y RankHUE: Dom. Wavelength Rank‧REF: Forward Voltage Rank‧LOT No: Lot Number‧

Reel Dimensions

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Carrier Tape Dimensions:

Minimum packing amount is 1000 pcs per reel


Moisture Resistant Packing Process

Aluminum moistue-proof bag LabelDesiccantLabel


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Precautions for Use

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big current

change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 168Hrs under 30℃ or less and 60% RH or

less.If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

Pre-heating

150~200°C60~120sec.

3°C/sec.Max.

Above 217°C 60~150sec.

260°C Max.10sec. Max.

6°C/sec.Max.

Above255°C 30sec.Max.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

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5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

6.Directions for use

The LEDs should be operated with forward bias. The driving circuit must be designed so that

the LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is

continuously applied to the LEDs, It may cause migration resulting in LED damage.

Application Restrictions

High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight Americas before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond thespecification described in this document.

smd reflector - everlight americas

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