smt finger product finger product - alink... · - stamping machine - multi-slide machine designing...

www.alink.com.tw SMT FINGER PRODUCT

Many different shape of SMT metal parts :

█ Manufacturing technology

- Stamping machine

- Multi-Slide machine

█ Designing & Testing

- Finite element analysis

- Automatic Compression Test

- 2D / 3D cad software support

Alink Precision Co., Ltd No.1.Lane 389,Huacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886‐2‐8521‐3168 Fax :886‐2‐8521‐8579 Website : www.alink.com.tw e‐mail : [email protected]

SMT Finger With the rapid of electronic technology go up,high frequency will let EMI and ESD become a big problem,especially in handheld equipment will let the problem get worse,and the solution will get more difficult,for that reason,part of designer use foam gasket for EMI solution,but it will be more difficult if the product is too small to assemble quickly,SMT finger is a good method to match the requirement,its good reliability and automatically position will let production smooth and good quality. Alink has developed a lot of SMT finger for designer and have a design team for customized project,2D & 3D drawing is available,with our forming technology by spring former ,will reduce its tooling cost and increase its life cycle than metal stamping technology,that is the reason why we insist produce by spring former.

Application SMT finger is used by different product in different function :

■ Grounding Contact

■ Signal Contact

■ Mechanical Application

■ Power Contact

■ Jump Bridge Contact


Link to the success with Alink

SMT finger structure Structure

SMT finger cross‐section drawing

Note

Electroplated(outside) : ‐ Au electroplated ‐ Tin electroplated Electroplated(inner) : ‐ Ni electroplated Raw material :

‐ Beryllium Copper

‐ Stainless Steel

‐ TiCu ‐ Phosphor Bronze ‐ customer assigned

Au plated (outside) : can resist bad circumstance and good electric conductivity. Tin plated (outside) : good solidarity,but easy to oxidize in air ,especially in high humidity. Ni plated (inner) : ‐ good stand for oxidization ‐ good adhesion for electroplated layer. ‐ good stand for friction.

Raw material : beryllium copper is the best material ‐ good thermal conductivity ‐ good electric conductivity ‐ easy to be forming



SMT finger design guide Compression height and range : In general,we will recommend about 30%~40% of total height for SMT finger compression or at least 0.25mm compression range to be a good electrical conductivity.

PAD recommend dimension : To match SMT finger for PCB lay out,we will give our customer a better PAD size to prevent from a bad junction between

part and PCB.

SMT finger action area : To keep from touching other component when SMT finger is acting,we will give our customer a safe area. Example :

X

Y

A

B

X * Y is the recommended pad size and A * B is action area

Part number definition

A B C1 C2 D1 D2 E1 E2 E3 F SMT Finger shape

Electroplated G: Au S: Tin

Widness (mm)

Length (mm)

Height (mm)

Raw mater B: BeCu S: Stainless Steel

T: TiCu

P: Phosphor Bronze



SMT finger application * Grounding contact

* Singal connector

* Battery contact

* Mechanical application

A major fuction for SMT finger is common grounding ,often applicated by notebook,cellular phone,digital

camera,projector .etc. another application also usable in different kind of product,like as bellows :

Application Photo for different function

Grounding Contact Grounding Contact Signal Connector

Horozontal ContactMajor function of SMT finger,usually be designed in case to PCB,PCB to PCB for common grounding effect.

Vertical ContactUsually design in PCB to side of case for common grounding effect,like projector,printer,settop box...etc.

Antenna spring connectorTo be a signal connector between external antenna and PCB for a good signal conduction.

Signal Contact Spacer Contact Clip for Cable & Wire

Embedded antenna connector To be a signal connector between embedded antenna and PCB for a good signal conduction conduction.

Spacer contactTo weld spacer connector on the copper pad to enhance the strength of standing for friction,especially in cellular phone speaker junction..etc.

Cable fix and put to orderTo fix the cable and grounding function

Clip for Shielding Cover

East to repair &assemblyTo be a clip for shielding cover will save the space & frame cost,also be flexible to different shape shielding cover


GROUNDING & SIGNAL & POWER CONTACT FUNCTIONPART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG0820010B BeCu 0.08 Ni/Au 3,000PCS /7”REEL

W (mm) 0.80

L (mm) 2.00

H (mm) 1.00

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG0820013B BeCu 0.08 Ni/Au 2,500PCS/7”REEL

W (mm) 0.80

L (mm) 2.00

H (mm) 1.30

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKLG1725014B BeCu 0.08 Ni/Au 4,000PCS/13”REEL

W (mm) 1.70

L (mm) 2.50

H (mm) 1.40

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG1527015B BeCu 0.08 Ni/Au 3,500/13”REEL

W (mm) 1.50

L (mm) 2.70

H (mm) 1.50

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG2032015B BeCu 0.08 Ni/Au 2,500PCS/REEL

W (mm) 2.00

L (mm) 3.20

H (mm) 1.50

W

L

H

W

L

H

W

L

H

W

L

H

H

W

L

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG1228017B BeCu 0.12 Ni/Au 3,800PCS /13”REEL

W (mm) 1.20

L (mm) 2.80

H (mm) 1.70


W (mm) 0.80

L (mm) 4.60

H (mm) 1.80

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG1527020T TiCu 0.10 Ni/Au 3,500PCS/13”REEL

W (mm) 1.50

L (mm) 2.70

H (mm) 2.00


W (mm) 2.00

L (mm) 3.80

H (mm) 2.00


W (mm) 2.00

L (mm) 4.00

H (mm) 2.10

H

W

L

HW

L

H

W

L

H

W

L

H

W

L

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKZG1835025B BeCu 0.08 Ni/Au 3,000PCS/13”REEL

W (mm) 1.80

L (mm) 3.50

H (mm) 2.50

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK3G2030025B BeCu 0.08 Ni/Au 5,500PCS/13”REEL

W (mm) 2.00

L (mm) 3.00

H (mm) 2.50


W (mm) 2.00

L (mm) 3.00

H (mm) 2.50

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG2028028S SUS 0.08 Ni/Au 2,500PCS/13”REEL

W (mm) 2.00

L (mm) 2.88

H (mm) 2.80


W (mm) 2.00

L (mm) 3.00

H (mm) 3.00

H

W

L

L

H

W

W

H

L

H

W

L

H

L

W


W (mm) 2.00

L (mm) 3.00

H (mm) 3.10

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKSG2030031B BeCu 0.08 Ni/Au 2,300PCS/13”REEL

W (mm) 2.00

L (mm) 3.00

H (mm) 3.10

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKZG1237032B BeCu 0.10 Ni/Au 2,500PCS/13”REEL

W (mm) 1.20

L (mm) 3.70

H (mm) 3.20


W (mm) 2.00

L (mm) 3.00

H (mm) 3.50


W (mm) 2.50

L (mm) 4.30

H (mm) 3.50

W

L

H

H

W

L

H

L W

W

L

H

H

W

L

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG2545035B1 BeCu 0.10 Ni/Au 2,000PCS/13”REEL

W (mm) 2.50

L (mm) 4.50

H (mm) 3.50

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKSG2030036B BeCu 0.10 Ni/Au 2,000PCS/13”REEL

W (mm) 2.00

L (mm) 3.00

H (mm) 3.60


W (mm) 2.00

L (mm) 4.00

H (mm) 3.70


W (mm) 2.00

L (mm) 3.00

H (mm) 4.00

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKCG2530040B BeCu 008 Ni/Au 2,000PCS/13”REEL

W (mm) 2.50

L (mm) 3.00

H (mm) 4.00

L

H W

H

W

L

H

L

W

W

L

H

H

L

W

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKXG2535040B BeCu 0.08 Ni/Au 2,000PCS/13”REEL

W (mm) 2.50

L (mm) 3.50

H (mm) 4.00

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKZG3050040B BeCu 0.08 Ni/Au 2,000PCS /13”REEL

W (mm) 3.00

L (mm) 5.00

H (mm) 4.00


W (mm) 2.50

L (mm) 4.00

H (mm) 4.10

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK5G2035042S SUS 0.10 Ni/Au 2,500PCS/13”REEL

W (mm) 2.00

L (mm) 3.50

H (mm) 4.20

ART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK8G2045045B BeCu 0.10 Ni/Au 3,500PCS/13”REEL

W (mm) 2.00

L (mm) 4.50

H (mm) 4.50

W

L

H

L

H

W

L

H

W

H

W

L

H

W

L

L

L

W


W (mm) 2.50

L (mm) 4.80

H (mm) 4.50


W (mm) 2.00

L (mm) 4.50

H (mm) 4.80


W (mm) 2.50

L (mm) 4.50

H (mm) 4.80


W (mm) 2.50

L (mm) 4.00

H (mm) 5.00


W (mm) 2.00

L (mm) 5.80

H (mm) 5.00 H

H

L

W

L

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L

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H W

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HL

W


W (mm) 3.00

L (mm) 4.00

H (mm) 5.10


W (mm) 2.00

L (mm) 4.00

H (mm) 5.30


W (mm) 2.00

L (mm) 4.70

H (mm) 5.70


W (mm) 2.00

L (mm) 3.80

H (mm) 6.20


W (mm) 2.50

L (mm) 7.00

H (mm) 6.20

L

H

L

W

L

W

H

L

W


W (mm) 2.00

L (mm) 4.50

H (mm) 7.00

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK3G2548070B BeCu 0.10 Ni/Au 1,000PCS /13”REEL

W (mm) 2.50

L (mm) 4.80

H (mm) 7.00

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK8G2570075B BeCu 0.15 Ni/Au 700PCS/13”REEL

W (mm) 2.50

L (mm) 7.00

H (mm) 7.50


W (mm) 2.50

L (mm) 7.00

H (mm) 9.00


W (mm) 3.00

L (mm) 6.00

H (mm) 10.0

H

W

H

L

H

W


W (mm) 2.50

L (mm) 7.00

H (mm) 10.0

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK8G2590130B BeCu 0.15 Ni/Au 300PCS /13”REEL

W (mm) 2.50

L (mm) 9.00

H (mm) 13.0

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARK

W (mm)

L (mm)

H (mm)


W (mm)

L (mm)

H (mm)


W (mm)

L (mm)

H (mm)

L

H

W

L

H

W

L

W

W

W

L

W L

H

SPACER CONTACT FUNCTION PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKPG1019001P PHOSPHER BRONZE 0.10 Ni/Au 8,000PCS/7”REEL

W (mm) 1.00

L (mm) 1.90

H (mm) 0.10

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKPG1020001B BeCu 0.10 Ni/Au 9,000PCS/7”REEL

W (mm) 1.00

L (mm) 2.00

H (mm) 0.10


W (mm) 1.80

L (mm) 3.80

H (mm) 0.10

ART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKPG1625002B BeCu 0.20 Ni/Au 4,000PCS/7”REEL

W (mm) 1.60

L (mm) 2.50

H (mm) 0.20


Φ (mm) 3.20

H (mm) 0.20

H

L

H

H

Φ(O.D.)

L


W (mm) 3.00

L (mm) 3.80

H (mm) 0.50

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKOG2554027P PHOSPHER BRONZE 0.20 Ni/Au 2,600PCS/13”REEL

W (mm) 2.50

L (mm) 5.40

H (mm) 2.70

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKPG2176005P PHOSPHER BRONZE 0.50 Ni/Au 3,000PCS/7”REEL

W (mm) 2.10

L (mm) 7.60

H (mm) 0.50


W (mm)

L (mm)

H (mm)


W (mm)

L (mm)

H (mm)

H L

W

W

L

H

L H

W

CLIP FOR SHIELDING COVER PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKSCS0865128S SUS 0.15 Ni/Sn 10,000PCS /13”REEL

W (mm) 0.80

L (mm) 6.50

H (mm) 1.28

D (mm) 0.15

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKSCS0865012S SUS 0.15 Ni/Sn 10,000PCS /13”REEL

W (mm) 0.80

L (mm) 6.50

H (mm) 1.20

D (mm) 0.09



H

W

L

D

W

L

H

D

W

CLIP FOR RF CABLE & WIRE PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKDS1445014S SUS 0.15 Ni/Sn 10,000PCS /13”REEL

W (mm) 1.38

L (mm) 4.50

H (mm) 1.40

D (mm) 0.78

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKDS1752022B BeCu 0.10 Ni/Sn 3,000PCS/13”REEL

W (mm) 1.73

L (mm) 5.25

H (mm) 2.23

D (mm) 0.46

PART NUMBER MATERIAL THICKNESS(mm) ELECTROPLATED SMT PACKING REMARKDS1355015S SUS 0.10 Ni/Sn 4,000PCS/13”REEL

W (mm) 1.30

L (mm) 5.45

H (mm) 1.5

D (mm) 0.60



H

D

L

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D

smt finger product finger product - alink... · - stamping machine - multi-slide machine designing...

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