solutions for the 5g communications industry...as a leading global specialty ... • siridion® for...

Solutions for the 5G Communications Industry

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LEADING BEYOND CHEMISTRY

TO IMPROVE LIFE,TODAY AND TOMORROW

Evonik is one of the world leaders in specialty chemicals. The company is active in more than 100 countries around the world. Evonik goes far beyond chemistry to create innovative, profitable and sustainable solutions for customers. More than 32,000 employees work together for a common purpose: We want to improve life, day by day.

As the world moves towards 5G, the technology offers a huge variety of applications to enhance social and economic satisfaction.

Safer living

Smarter transportation

Wider electronics applications

More accessible education

Faster and more accurate healthcare

Increased enjoyment and entertainment

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Evonik supports the trend with 5G materials developmentAt a frequency of > 10 GHz, 5G technology relies on higher data transmission speeds and requires most electronic components to fulfill high frequency and high speed signal requests. In order to enjoy the full benefits of 5G, materials with low dielectric constant and dissipation factors are critical in terms of ensuring transmission speed loss is low. As a leading global specialty chemicals company, Evonik provides enhanced solutions for improving the development of 5G materials.

Evonik delivers a wide variety of fitting products for Copper Clad Laminates (CCL) and Flexible Copper Clad Laminates (FCCL) in order to enhance 5G capabilities of Printed Circuit Boards (PCBs)

CCL/FCCL PCB

Thermal resistance Antenna enhancement

• TAICROS® as a crosslinker for polymerization• Coating additives for improving processes• AEROSIL® fumed silica for rheology control• VISIOMER® for enhanced polymer modification• POLYVEST® for improving resin performance• Dynasylan® for improving adhesion and enhancing the

properties of resin/copper foil/glass fabric • Siridion® for glass fibers

• IDISIL® provides better CTE1 control for substrates• COMPIMIDE® and P84® polyimide enhance substrate

thermal resistance• Evonik Nanoresin enables more powerful designs to give

multiple substrates a longer-life

1 coefficient of thermal expansion

• ROHACELL® has great transmission properties and is the ideal substrate for 5G communication antennas, e.g. in base station applications. It is also perfectly suited as a core sandwich material for 5G antenna covers.

• VESTAKEEP® PEEK provides a new generation substrate with a lower dielectric constant (Dk) / dissipation factor (Df) , and improved properties in FCCL production

• P84® polyimide improves conventional FCCL properties on Dk/Df and offers low outgassing in vacuums and excellent thermal stability.

Resin improvements Dielectrical performance

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Evonik provides innovative solutions for the5G communications industry

Effect Products Applications Page

Resin improvement

TAC/TAICROS® as hardeners

Suitable for Polyphenylene Ether (PPE)-based Copper Clad Laminates (CCL)

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POLYVEST®Electric/moisture modifier for PPE CCL

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Dynasylan® silanesImproved adhesion of copper foil/fiber glass and 5G resin

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Siridion®Fiber improvement: Low attenuation rate in glass fiber cores

TEGO® and NANOCRYL® coating additives

Improved 5G CCL manufacturing process

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AEROSIL® fumed silicaRheology control for component manufacturing

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VISIOMER® specialty methacrylates

Improved 5G polymer/resin performance

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Thermal resistance

COMPIMIDE® bismaleimides

High glass transition temperature (Tg) of CCL for 5G PCB

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IDISIL® colloidal silica particles

CTE & thermal improvement 12

Dielectrical performance

VESTAKEEP® PEEK and P84® polyimide

5G FCCL 13

Antenna enhancement ROHACELL®Extremely high frequency transmission

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Your local contacts 15

5Functional Solutions

TAC, TAICROS® and derivatives as crosslinkers for the electronics industry and 5G resin applications

Crosslinkers in the TAICROS® family can, for example be used in printed circuit boards to meet modern 5G cellular standards, while tri-acetone amine derivatives are important building blocks for light stabilizers in many applications.

Our TAICROS® portfolio consists of the popular PPE and PPO resin crosslinkers used in high-frequency and high-speed copper clad laminates needed in 5G applications.

• Increased crosslinking density• Excellent thermal stability• Improved aging properties• High chemical resistance

• Low compression set of rubber• Improved hot set behavior of plastics• Shorter cure times and improved electrical insulation • Increased heat distortion temperature of plastics

Advantages:

Resin improvement

TAC TAICROS® TAICROS® TMT TAICROS® M

6Coating & Adhesive Resins

POLYVEST® is our brand for liquid polybutadienes, used as reactive plasticizers and impact modifiers in many plastic and resin formulations for 5G substrate applications.

The microstructure of our POLYVEST® grades make them highly reactive as cross-linking binders that can be applied in CCL and PCB formulations to provide properties including:

• Excellent chemical resistance• High water resistance• Outstanding electrical properties

• Very good compatibility with various plastics• Low moisture and oxygen permeability

Resinimprovement

POLYVEST® as performance modifiers for 5G applications

Grade Viscosity at 20°C[mPa s]

Mean molecular weight [g/mol]

1,2-vinyl content [%]

Tg[°C]

POLYVEST® 110 700-860 ≈ 2600 < 1 ≈ -100

POLYVEST® 130 2,700-3,300 ≈ 4600 < 1 ≈ -99

POLYVEST® EP MAT 5,000-7,000 ≈ 3000 ≈ 22 ≈ -83

POLYVEST® EP MV 5,000-7,000 ≈ 2000 ≈ 61 ≈ -65

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Evonik Dynasylan® silane products are suitable for many applications in the PCB and telecommunication industry, and can easily deal with the more demanding requirements of 5G.

Copper clad laminate, the main material of PCBs is mainly composed of prepreg substrate and copper foil. Silanes provide good adhesion between the three electronic materials; special synthetic resin, glass fabrics and flat electrolytic copper foil that ensure the high signal strength needed for 5G.

Our waterborne silanes are used in the copper foil processing and micro-etching of PCBs, achieving low VOC emissions and long-term stability.

Compared with the traditional epoxy functional silanes on the market, VPS 4721 meets the environmental protection requirements of low VOC emissions, and can also be applied to water-based systems.

This material provides a high degree of heat resistance and transparency, and has excellent crosslinking ability.

Dynasylan® HYDROSIL VPS 4721 VPS 7163

• Extraordinary product purity ensures high-speed signal transfer in glass fiber cores• Tailored supply solutions to match complex customer production processes• Excellent technical support in container handling and safety trainings• On-time delivery to any destination worldwide

Siridion®: Ultrapure tetrachlorosilanes for glass fibers with low attenuation rates

Evonik's product and service advantages

The key raw material for the production of optical fiber preforms is high purity silicon tetrachloride. Silicon tetrachloride (SiCI4) is an ultra-high purity chlorosilane which is formed by the reaction of metallurgical silicon with hydrogen chloride or chlorine. The high purity of Siridion® STC HP and STC UHP chlorosilanes ensures the purity of the glass fiber and therefore the excellent signal flow which enables the data to transfer at extremely high speeds.

The ultrapure silicon tetrachloride Siridion® STC UHP is especially designed for optical fiber preform production with very high purity requirements. The product is most appropriate for 5G networks which need to transport high volumes of data at 200 megabits per second. This corresponds to a tenfold increase of the existing 4G telecommunication standard.

Silanes

Resinimprovement

Dynasylan® and Siridion® silanes for high-performance materials in telecommunication applications

8Coating Additives

Our world-leading brands include ACEMATT®, AEROSIL®, SURFYNOL®, and TEGO®, and our wide range of product solutions help improve the formulation and manufacture of coatings applications.

Two of the key products for the electronics industry are our TEGO® Twin 4100 and NANOCRYL® C 150. • TEGO® Twin 4100 is capable of reducing the emulsion surface tension, and by applying it on glass fabric and prepeg

surfaces, it will improve PTFE prepeg processability and performance.• NANOCRYL® C 150 is a high performing nano-resin which gives the highest scratch and abrasion resistance for UV-cured

coatings.

As a siloxane-based gemini surfactant, TEGO® Twin 4100 combines substrate wetting and anti-crater effects with some defoaming properties. It is highly compatible and suitable for a wide range of different coatings and applications.

Key benefits• Universal application• Good effectiveness• Excellent crater prevention and elimination

NANOCRYL® C 150 shows the highest performance in scratch and abrasion resistance without influencing the gloss or transparency of the cured UV-coating.

Key benefits• Highest scratch and abrasion resistance• Suitable for all gloss levels• Totally transparent

Coating additives for improving processability in the electronics industry

Resinimprovement

TEGO® Twin 4100 NANOCRYL® C 150

Substrate wetting additive: Nanocomposite:

Substrate wetting

Anti-crater effect

Flow promotion

Defoaming

Reduction of static surface tension

Reduction of dynamic surface tension

Scratch and abrasion resistance

No decrease of gloss or transparency

Barrier effect

Flexibility

Reduction on cure shrinkage

Adhesion on glass/aluminium

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AEROSIL® fumed silica is widely used in electronic adhesives during electronic component manufacturing for bonding, sealing etc. AEROSIL® fumed silica precisely adjusts the rheological properties of the formulations to overcome the increasing challenges of complicated structure and process.

VP NKC 130 and VP NK 200, as well as AEROSIL® R 805 are AEROSIL® grades with characteristics highly suited for electronics applications.

Silica

Resin improvement

• High degree of hydrophobicity• Very low VOC content• Excellent thixotropy and storage stability• Very fast viscosity recovery

AEROSIL® fumed silica to enhance the processability of electronic adhesives

10Specialty Methacrylates

VISIOMER® can be used as a co-monomer to functionalize resins towards better thermal resistance, broader processability and improved compatibility between composite polymers and their components. With our large portfolio of methacrylate monomers we offer a versatile toolbox to solve the many challenges in the electronics industry. We go beyond the boundaries. Our technical and production capabilities enable us to support our customers to develop new solutions for their specific problems, such as new methacrylate structures with tailor-made functionalities.

VISIOMER® specialty methacrylates provide:

• Adjustable crosslinking density and resin functionality• Excellent thermal stability with high Tg molecules

• Processing flexibility• Dimensional stability

Resin improvement

VISIOMER® specialty methacrylates: Improving the thermal resistance of resins used in electronics and 5G applications

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The thermosetting COMPIMIDE® bismaleimide family represents a full range of proprietary, high-performance resins and specialties developed for use as matrices in advanced composites, adhesives and moldings. COMPIMIDE® bismaleimide matrix resins are characterized by their high glass transition temperature (Tg), making them suitable candidates for use in the PCBs designed for 5G applications. COMPIMIDE® resins are used as binders or co-binders in the production of CCLs to improve their high temperature performance.

Thermal resistance

Monomers and toughening modifiers Preformulated resin specialities

Quality Innovation

Track record Flexible production assets

• High quality monomers• Unique toughening modifiers

• Eutectic mixtures of monomers with softening points starting at < 50 °C

• RTM systems and resin solutions

• Quality is key - critical for 5G applications • Established and reliable production supply

• Continuous improvement of our BMI systems and launch of new products

• Exclusive developments possible

• > 30 years of experience in BMI development and production

• Access to four multi- purpose production sites

COMPIMIDE®BMIs

• Easy processing (various techniques)• Excellent mechanical property retention at high temperatures• Good solvent resistance

• Excellent performance in hot or wet conditions• Superior flame and radiation resistance• Low smoke and non-toxic emissions

COMPIMIDE® bismaleimide's outstanding features:

COMPIMIDE® bismaleimides: High performance resins and monomers for high speed and high frequency applications

Health Care

12Silanes

IDISIL® Colloidal Silica particles can be used to enhance electrical and physical properties of Copper Clad Laminates in 5G applications. With their perfect spherical shape they can be used as a resin modifier to reduce the coefficient of thermal expansion (CTE). IDISIL® can also facilitate resin flow by acting as a spacer in between larger particles.

Evonik’s IDISIL® Colloidal Silica particles enhance the properties of the laminate on PCBs. The particles act as a resin modifier to improve mechanical strength, increase thermal stability and enhance dielectric properties. IDISIL® particles have a very narrow particle size distribution high purity (metals in ppb range) which can be customized to fit individual formulations.

Thermal resistance

• Reduced CTE and high temperature resistance• No volatile organic compounds (VOC)• Custom surface functionalization to achieve best mechanical

performance• Easy incorporation into the resin with minimal increase in

viscosity

• Formulation freedom is ensured by the availability of dried particles and particle dispersions, as well as particle sizes ranging from a few nanometers (nm) to micrometers (µm)

Our IDISIL® grades offer the following advantages in PCBs:

IDISIL® improves mechanical strength, thermal stability and the dielectric properties of PCBs

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VESTAKEEP® polyetheretherketone (PEEK) compounds and P84® polyimide can be used for a wide range of applications. With the widespread usage of portable devices in today’s society, plastics play a very important role in the FCCL industry.

The critical requirements of 5G film materials include low Dk, low Df and low CTE as well as good adhesion to copper foil. VESTAKEEP® and P84® serve all of those requirements very well. P84® polyimide gives semiconductor and electronic processing equipment with low outgassing in vacuum,

excellent thermal stability, low dielectric constant and high dielectric strength. VESTAKEEP® PEEK offers wear, moisture and chemical resistance along with exceptional strength, dimensional stability and stiffness.

Applications benefit from the high electric strength and resistivity of polyimides: Insulation layers can be thinner, or higher voltage can be applied. PEEK in addition, also offers high chemical, hydrolysis, and improved wear resistance.

We are working closely with several key stakeholders in the FCCL value chain and are confident that VESTAKEEP® PEEK and P84® polyimide will continue to serve the communications industry successfully, supporting the next generation of 5G technologies.

High Performance Polymers

Dielectrical performance

VESTAKEEP® and P84® enhance high- frequency and high-speed substrates applications

14High Performance Polymers

ROHACELL® is the original high performing PMI foam, featuring low dielectric constants and superior high frequency transmission. Designed to meet the evolving needs of communication technology, its exceptional high permittivity performance makes it ideal for substrates or dielectric spacers in state-of-the-art antennas and 5G applications. The foam’s ultra fine cell structure enables precision shaping of delicate structures. Plus, its high strength and stiffness contribute to providing secure protection of sensitive antenna designs while maintaining transparency for electromagnetic waves ensuring maximum efficiency in antenna operation. It combines the RF transparency of air with unrivaled processing performance of up to 190 °C and superior mechanical properties.

• Housings of high frequency antennas in base stations (5G)

• Housings of “Satcom on the move”

• Radome applications

• PCB parts of Phased Array Radar (PAR)

• Array antenna and micro-strip board

• Device holders for electronics testing

• Consumer electronics covers

Applications in electronics and communication include:

ROHACELL® grades Core properties Related requirements

All High mechanical strength at low density Lightweight design of structural parts

All Closed cell structure Controlled and reproducible resin absorption

All Easy to shape by milling or thermoforming Efficient production of complex 3D shapes

All (except EC) High electromagnetic wave transparency Unimpeded antenna performance

EC Electromagnetic wave absorption Electromagnetic shielding of sensitive equipment

HF, RIMA, HERO Fine cell structure High surface quality and low resin absorption

WF(/-HT), RIST(/-HT),RIMA(/-HT), XT(/-HT), HERO

High processing temperature and compression; resistance up to 180/190 °C

Fast curing processes and high service temperatures

HF, RIMA, HERO Possible to slice into ultra-thin films <0.3 mm Precise manufacturing of very thin structures

Antenna enhancement

ROHACELL® - the core of sandwich solutions for 5G application substrates

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Your contacts

Functional Solutions

EMEA+49 151 1202 [email protected]

ASIA+886 2 2175 [email protected]

Americas+1 281 644 [email protected]

Silanes




Coating & Adhesive Resins

EMEA+49 2365 49-84855 [email protected]



Coating Additives




Silica




Specialty Methacrylates

+86 21 6119 [email protected]

www.visiomer.com

Health Care | Exclusive Synthesis


Colloidal Silica


www.colloidal-silica.evonik.com/product/colloidal-silica

High Performance Polymers




Evonik Operations GmbH Rellinghauser Straße 1–1145128 Essen, Germany

Evonik Specialty Chemicals (Shanghai) Co., Ltd.55 Chundong Road, Shanghai, ChinaPHONE +86 21 6119-1000

Evonik CorporationParsippany, NJ 07054, United StatesPHONE +1 973 929-8000

www.evonik.com

AEROSIL®, Compimide®, Dynasylan®, IDISIL®, Nanocryl®, P84®, POLYVEST®, ROHACELL®, Siridion®, TEGO®, VESTAKEEP®, VISIOMER® are registered trademarks of Evonik Industries AG or its subsidiaries.

This knowledge and all further technical advise is based on our present knowledge and experience. However, it implies no liability or other legal responsibilities on our part, including with regard to existing third party intellectual property rights, especially patent rights. In particular, no warranty, whether express or implied, or guarantee of product properties in the legal sense is intended or implied. We reserve the right to make any changes according to technological progress or further developments.

The customer is not released from the obligation to conduct careful inspections and testing of incoming goods. Performance of the product described herein should be verified by testing, which should be carried out only by qualified experts in the sole responsibility of a customer. Reference to trade names used by other companies is neither a recommendation, nor does it imply that similar products could not be used.

solutions for the 5g communications industry...as a leading global specialty ... • siridion® for...

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