©2020 Littelfuse, Inc.Specifications are subject to change without notice.

TVS Diode Arrays (SPA ® Diodes)

Revision: 04/14/20

Low Capacitance ESD Protection - SP4322

Description

Applications

SP4322 is specifically designed to protect high-speed interfaces against ElectroStatic Discharge (ESD), such as DisplayPort interfaces and USB 3.1 Gen 1. The signal line is protected by low line capacitance of 0.4 pF typical.

SP4322 can absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard without performance degradation and safely dissipate 11A of 8/20μs surge current (IEC 61000-4-5 2nd edition).

Excellent low capacitance, clamping capability, low leakage, and fast response time make this part an ideal solution for protecting high speed data lines.

Features

• ESD, IEC 61000-4-2, ±18kV contact, ±30kV air

• EFT, IEC 61000-4-4, 40A (5/50ns)

• Lightning, 11A (8/20μs as defined in IEC 61000-4-5 2nd edition)

• Low capacitance of 0.4pF (TYP @ VR=0V)

• Low leakage current of 1nA (TYP) at 5V

• Halogen free, lead free and RoHS compliant

• Moisture Sensitivity Level (MSL -1)

• AEC-Q101 Qualified

• USB 3.1

• DisplayPort

• S-ATA

• NFC

• 1G/2.5G/10G Ethernet

Pinout

Functional Block Diagram

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

RoHS Pb GREEN

1 2

0201 Flipchip

SP4322 0.4pF 11A Bidirectional Diode Array

SOD882

1 2

Note: This package image is for example and reference only. for detail package drawing, please refer to the package section in this datasheet.

©2020 Littelfuse, Inc.Specifications are subject to change without notice.

TVS Diode Arrays (SPA ® Diodes)

Revision: 04/14/20

Low Capacitance ESD Protection - SP4322

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Absolute Maximum Ratings

Symbol Parameter Value Units

IPP Peak Current (tp=8/20μs) 11 A

TOP Operating Temperature -40 to 125 °C

TSTOR Storage Temperature -55 to 150 °C

Electrical Characteristics (TOP=25ºC)

Note:

1. Parameter is guaranteed by design and/or component characterization.

2.Transmission Line Pulse (TLP) with 100ns width, 0.2ns rise time, and average window t1=70ns to t2= 90ns

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage VRWM IR=1μA 5 V

Breakdown Voltage VBR IR=1mA 9 V

Reverse Leakage Current ILEAK VR=5V 1 100 nA

Holding Voltage VHOLD I/O to I/O 2.3 V

Clamp Voltage1 VC

IPP=1A, tp=8/20μs 4 V

IPP=11A, tp=8/20μs 8 V

Dynamic Resistance2 RDYN TLP, tP=100ns 0.2 Ω

ESD Withstand Voltage1 VESD

IEC 61000-4-2 (Contact Discharge) ±18 kV

IEC 61000-4-2 (Air Discharge) ±30 kV

Diode Capacitance1 CIO-GND Reverse Bias=0V, f=1MHz 0.4 0.5 pF

Capacitance vs. Reverse Bias Clamping voltage vs. IPP for 8/20μs waveshape

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

Cap

acita

nce

(pF)

Bias Voltage (V)

0.0

2.0

4.0

6.0

8.0

10.0

1 3 5 7 9 11

Cla

mp

Volta

ge (V

C)

Peak Pulse Current-IPP (A)

©2020 Littelfuse, Inc.Specifications are subject to change without notice.

TVS Diode Arrays (SPA ® Diodes)

Revision: 04/14/20

Low Capacitance ESD Protection - SP4322

IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage

Negative Transmission Line Pulsing (TLP) Plot Positive Transmission Line Pulsing (TLP) Plot

IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage

-24-22-20-18-16-14-12-10

-8-6-4-20

-20 -15 -10 -5 0TLP Voltage (V)

TLP

Curre

nt (A

)

02468

1012141618202224

0 5 10 15 20TLP Voltage (V)

TLP

Curre

nt (A

)TL

P Cu

rrent

(A)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

Per

cen

t o

f I P

P

8/20μs Pulse Waveform

©2020 Littelfuse, Inc.Specifications are subject to change without notice.

TVS Diode Arrays (SPA ® Diodes)

Revision: 04/14/20

Low Capacitance ESD Protection - SP4322

Part Numbering SystemPart Marking System

SP 4322 01 T G

Series

Number ofChannels

PackageE: SOD882

T= Tape & Reel

G= Green

–

TVS Diode Arrays (SPA® Diodes)

E

1 2

Date codePart code

Ordering Information

Part Number Package Min. Order Qty.

SP4322-01ETG SOD882 10,000

Product Characteristics

Lead Plating Pre-Plated Frame, Tin

Lead material Copper Alloy

Substrate Material Silicon

Body Material Molded Compound

Flammability UL Recognized compound meeting flammability rating V-0

Time

Tem

pera

ture

TP

TLTS(max)

TS(min)

25

tP

tL

tS

time to peak temperature

PreheatPreheat

Ramp-upRamp-up

Ramp-downRamp-do

Critical ZoneTL to TPCritical ZoneTL to TP

Reflow Condition Pb – Free assembly

Pre Heat

- Temperature Min (Ts(min)) 150°C

- Temperature Max (Ts(max)) 200°C

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp (TL) to peak

3°C/second max

TS(max) to TL - Ramp-up Rate 3°C/second max

Reflow- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260+0/-5 °C

Time within 5°C of actual peak Temperature (tp)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (TP) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

©2020 Littelfuse, Inc.Specifications are subject to change without notice.

TVS Diode Arrays (SPA ® Diodes)

Revision: 04/14/20

Low Capacitance ESD Protection - SP4322

Embossed Carrier Tape & Reel Specification — SOD882

Symbol Millimeters

A0 0.70+/-0.045

B0 1.10+/-0.045

K0 0.65+/-0.045

F 3.50+/-0.05

P1 2.00+/-0.10

W 8.00 + 0.30 -0.10

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.

,Ref.

,Ref.

,Ref.8mm TAPE AND REEL

Drawing# : E03-B

D

E

TOP VIEW

BOTTOM VIEW-1

SIDE VIEW

1

L2

L1

e

A

Recommended Soldering Pattern

A1

0.30mm0.35mm

1.00mm

0.60

mm

BOTTOM VIEW-2

L2

L1

e

1

PIN#1 ID. (OPTIONAL)

Package Dimensions — SOD882

Symbol

SOD882

Millimeters Inches

Min Typ Max Min Typ Max

A 0.40 0.50 0.55 0.016 0.020 0.022

A1 0.00 0.02 0.05 0.000 0.001 0.002

L1 0.20 0.25 0.30 0.008 0.010 0.012

L2 0.45 0.50 0.55 0.018 0.020 0.022

D 0.95 1.00 1.05 0.037 0.039 0.041

E 0.55 0.60 0.65 0.022 0.024 0.026

e 0.65 BSC 0.026 BSC