specialty electronic materials and sensors cleanroom · pdf filespecialty electronic materials...

UNCLASSIFIED

UNCLASSIFIED The Nation’s Premier Laboratory for Land ForcesUNCLASSIFIED – Approved for

Public ReleaseThe Nation’s Premier Laboratory for Land Forces

UNCLASSIFIED

Specialty Electronic Materials and

Sensors Cleanroom (SEMASC)

Paul Sunal, Ph.D.

Cleanroom Manager

(301) 394-1374

[email protected]

UNCLASSIFIED

UNCLASSIFIED The Nation’s Premier Laboratory for Land Forces- Approved for Public Release

Fast-paced technology development for tomorrow’s

nanotechnology systems

Spearhead research into innovative materials, devices, and high

risk processing techniques.

Stimulate collaboration and foster MEMS and nanotechnology

development with industry & academia.

Provide leadership in process development and toolset

Maintain state of the art micro- and nano-fabrication capabilities

through constant reinvestment.

Provide hands-on access and/or process support to explore the

interplay between device design and processing.

Provide straightforward intellectual property sensitive access for

private sector organizations to support innovation.

What We Offer

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What Can You Do In The SEMASC?

All aspects of NANOFABRICATION.

Substrates Sizes:

Piece parts up to 200mm wafer diameter

Materials:

Substrates supported include: Silicon, GaAs, Sapphire, Silicon

Carbide, Pyrex, Quartz and more

Materials Processed: Polysilicon, Metals, Dielectrics III-V, II-VI,

PZT, Aluminum Nitride, and variety of organic materials

Specialty materials deposition: MBE of III-V, III-N, and II-VI

materials, as well as carbon nanotubes and graphene furnaces

located on-site

Volume:

Piece parts and single wafers through cassettes

Mid-volume prototype runs

High volume manufacturability studies

Mission critical production

Secure fabrication through Secret, TS possible

Open to Foreign Nationals

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Architecture

10,000 GSF Class 100 (9 Bays)

5,000 GSF Class 10 (3 Bays)

Bay and Chase - Raised Floor Design

Fully Integrated into 375,000 GSF Zahl PSL

Dedicated Centralized Support Staff

– Process Engineers

– Tool/Process Technicians

– Administrative

Comprehensive External Facilities Support

– HVAC

– DI water plant

– Process cooling water

– Acid waste treatment system

– Pharmacy for chemical storage and distribution

– Ultrapure Nitrogen storage and delivery

– Hazardous process gas bunkers

The SEMASC Nanofabrication Facility

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Customer Base and Accessibility

CUSTOMER BASE

All branches of the DoD

25 Government Research Groups

59 Academic Research Groups

33 Large companies

98 Small companies and startups

MODES OF ACCESS

• Cooperative Research and Development Agreements (CRADAs) – provide Companies and Academics hands on access to the SEMASC fabrication toolset.

• Interagency Agreements – such as Memoranda of Agreement and MIPRs enable rapid facility access for Government Researchers.

• Test Services Agreements – enable ARL staff to perform work for Companies and Academics.

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Supplementary Slides

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Non-Recipe Inventions

Consortium Member’s Rights Facility Use Only R&D Member’s

Rights

R&D Member and

Consortium

Member Non-

Subject

Inventions

R&D member refrains from alleging

Consortium member infringement for

work performed under Articles of

Collaboration/CRADA/Space Act

Agreement/...

Consortium member refrains from

alleging R&D member infringement

for work performed under Articles of


Agreement/...

R&D Member

Subject

Inventions

Consortium member obtains no

license rights to Facility Use Only

R&D Member Inventions (unless

rights obtained through other

agreement Research Collaborator has

with Government).

First Right to File and Own Patent.

Consortium

Member Subject

Inventions

First right to file and own patent. R&D member obtains non-

exclusive, nontransferable,

irrevocable, paid-up license for

research.

R&D member has option to

exclusive field of use license, for

consideration, for commercial

purposes.

Joint Subject

Inventions

Co-own with R&D member. First right to file and co-own patent.

R&D member has option to

exclusive field of use license, for

consideration, for commercial

purposes.

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Consortium Member’s Rights Facility Use Only R&D Member’s

Rights

R&D Member and

Consortium

Member Non-

Subject

Inventions

R&D Member refrains from alleging

Consortium Member infringement for

work performed under Articles of


Agreement/...

Consortium Member refrains from

alleging R&D Member infringement

for work performed under Articles of


Agreement/...

R&D Member

Subject

Inventions

Consortium Member obtains non-

exclusive nontransferable irrevocable,

paid-up license for research or other

Consortium Member purposes.

First Right to File and Own Patent

Consortium

Member Subject

Inventions

First Right to File and Own Patent. R&D Member gains access to Recipe

Invention for use in the accessed

facility.

R&D Member obtains non-exclusive,

nontransferable, irrevocable, paid-up

license for research.

R&D Member has option to exclusive

field of use license, for consideration,

for commercial purposes.

Joint Subject

Inventions

Co-own with R&D Member. First right to file and co-own patent.

R&D Member has option to exclusive

field of use license, for consideration,

for commercial purposes.

Recipe Inventions

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Lithography

E-beam Lithography

Raith (Vistec) EBPG 5000+ HR HS E-Beam Direct Write

Repeatable linewidths down to 7nm

50kV and 100kV operation, 50MHz scan speed, high speed stage, large scan field, 10 substrate loadlock

Laser Lithography

Heidelberg VPG-200++ high resolution, fast write platform

Heidelberg DWL2000 freeform laser PG

Heidelberg DWL200 laser pattern generator

Contact Lithography

(1x) Suss MA8/BA8 and (1x) Suss MA6/BA6 aligners all with front-back alignment

Mask Making

Heidelberg VPG-200++ high resolution, fast write platform

Heidelberg DWL200 laser pattern generator

Vistec EBPG capable of writing mask plates

Resist Processing

EVG120 resist processing cluster tool

Suss Altaspray spray coater

Axcelis / Fusion 200 UV resist curing tool

Three wet benches with spinners, hot plates, and ovens for manual photoresist and polyimide processing

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Deposition I

Atomic Layer Deposition:

(2x) KJ Lesker ALD 150LX w/6-wafer loadlock & in-situ 4lelliposometer

Cambridge Nanotech FIJI F200 – 200mm capable

Thermal, Ozone, Water and Plasma Activation

Precursors for Platinum, Hafnium Dioxide, Silicon Dioxide, Alumina, Ruthenium, Titania

Evaporation:

Evatec – E-beam evaporator with ion-gun for film modification (stress tuning), and reactive deposition

CHA – E-beam evaporator

Lesker PVD 75 – Thermal Evaporator

Aluminum, Chrome, Copper, Germanium, Gold, Nickel, Palladium, Platinum, Silicon, Silver, Tin, Titanium, Ti-Nitride, Ti-Tungsten, Tungsten

PECVD

PlasmaTherm790+ – Silicon dioxide, Silicon Nitride and Oxy-Nitrides

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Deposition II

Sputtering

AJA ATC2200 – Co-sputter system for custom alloy deposition

(4-gun), heated stage (800° C), capable of reactive

depositions (oxides and nitrides)

Unaxis CLC 200 – chambers for PZT, AlN, platinum, titanium, as

well as rf sputter clean and RTA

CVC 610 – research tool, 3” and 8” targets, substrates can be

heated, supports reactive deposition, rf and pulsed dc power

supplies

EMS 300TT – Coats w/Au-Pd on substraup to 200 mm

Deposition Materials Available – Aluminum, boron, BN,

chromium, copper, gold, indium, iron, molybdenum, nickel,

palladium, platinum, silicon, silver, tin, tantalum, titanium,

TiN, Ti-W, tungsten and more.

Sol-Gel

Sol-gel PZT preparation and manual deposition

C&D P9000 Cluster tool to support automated piezoelectric PZT

sol-gel processing

RTP-3000 Advanced Rapid Thermal Processing System

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Etch I

Plasma

PVA TePla Ion 40 with rf source

PVA TePla Ion Wave 10 with microwave source & cooled shelf

Anatech MP1000 – Barrel asher

Metroline M4L – Resist/Oxide/Nitride etching

Axcelis – Downstream plasma asher

Inductively Coupled Plasma (ICP)

Unaxis VLR 700 PM2 – Metal and III-V etch

Unaxis VLR 700 PM3 – Oxide/Nitride ICP

Oxford Plasmalab 100 – ICP etching (cryogenic and heated stage)

ULVAC NE-550 – Broad etch capability using supermagnetronplasma and heated stage

Unaxis Versaline ICP – III-V etching (heated stage)

Bosch Process ICP

(2x) PlasmaTherm VLN – Silicon DRIE

PlasmaTherm 770 – Silicon DRIE

Unaxis VLR 700 – PM1 - Silicon DRIE

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Ion Milling

4-Wave Ion-mill (Argon Ion Milling)

Multi-wafer, multi-angle system

Configured for reactive milling

SIMS endpoint detection

Vapor Phase Etching

Xactix – Xenon difluoride isotropic Si etching

Primaxx – Vapor phase HF etching

Wet Etching

15 wet decks

Wafer clean

Organic strip

Dielectric etch

Anisotropic and isotropic silicon etch

III-V etch

II-VI etch

Metal etch

Lift-Off

PZT etch

Etch II

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Furnaces

Tystar MiniTytan Furnace Stack (three tubes) – Gate Oxide,

Oxidation and Anneal

IVI High Temp Furnace - High temperature anneals (<1800º C)

Bonding

Karl Suss SB8 - Wafer-to-Wafer anodic, eutectic, thermo-

compression and fusion pre-bond

Karl Suss MA8/SB8 and Karl Suss MA6/BA6 - Wafer-to-Wafer

align & pre-bond

EVG IR Inspection - Wafer-to-Wafer bond inspection

Rapid Thermal Anneal

AW810 – RTA up to 1250 C on 200 mm wafers w/susceptors for

50 - 150 mm

AG 410 Heat Pulse – III-V material systems RTA

AG 610 Heat Pulse – Oxide and nitride RTA

RTP-3000 Advanced Rapid Thermal Processing System –

Cassette load RTA

Thermal

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Microscopes

Zeiss Auriga - Field Emission SEM

Olympus LEXT – Laser scanning confocal microscope

Microscopes – Multiple device/lithography/mask inspection tools

Compumetrics Inspection Microscope - Line Width

measurement

Film Thickness

J.A. Woollam M2000F - Multi- wavelength / Multi-Angle

ellipsometer

KLA UV1280 – Combination spectrophotometer / ellipsometer

Nanometrics 3000 PHX Nanospec - Resist/Oxide thickness

Step Height

KLA-Tencor P-15 - Surface profilometer

KLA-Tencor Alpha Step IQ - Surface profilometer

Metrology I

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Thin Film Stress Measurement

Toho FLX 2320-S – Stress measurement, -65 C to 500 C

Electrical Measurements

4Dimensions 280SI Four Point Probe - Resistivity measurements

Probe Stations - In-process electrical characterization

Additional Capabilities

Extensive additional facilities on site (outside of the cleanroom)

including:

– Multiple AFMs

– Multiple SEMs including an Environmental SEM, and

capabilities for Cathode Luminescence and STEM

– TEM

– X-ray diffraction

– SIMS

– Auger Spectroscopy

– XPS with C60 depth profiling

Metrology II

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Piezoelectric Lead-Zirconate-Titanate (PZT)

Microrobotics

Microswitches

Delay lines

Compact RF devices (Radar, communications)

Corrugated Quantum Well Infrared Photodetectors (C-QWIP)

Megapixel AlGaAs focal plane arrays

Launched by NASA in February 2013

Carbon Based Electronics

Carbon Nanotube and Graphene transistors

GHz transistors demonstrated

Microspray

Atomizer fabrication for micropower fuel combustion

Applications in micro-cooling

Representative SEMASC Process

Technologies

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Enabling the entire device lifecycle under one roof and one

agreement.

Design and Simulation

Expertise, CAD and FEA

Specialty Materials

Carbon Nanotube and Graphene furnaces

Molecular Beam Epitaxy deposition chambers (6)

MetalOrganic Chemical Vapor Deposition systems (3)

Biomolecule evaporation

Microanalysis

Packaging & Backend Processing

Dicing, grinding/lapping, die-attach, wirebonding

Flipchip bonding

Electroplating

Testing

Comprehensive unique testing facilities

Additional Available Capabilities

Outside the Cleanroom

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Specialty Electronic Materials and Sensors Cleanroom

Paul Sunal, Ph.D. (Cleanroom Manager), [email protected]

http://www.arl.army.mil/www/default.cfm?page=428

Sensors and Electron Devices Directorate

William Benard, Ph.D. (Senior Campaign Scientist, Materials Research), [email protected]


ARL Office of Research and Technology Assessment

Thomas Mulkern (Technology Transfer), [email protected] and [email protected]


Contacts


mailto:[email protected]





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Cooperative Research and Development Agreement (CRADA)


Test Services Agreement (TSA)


Memorandum of Agreement (MOA)


MEMS and Nanotechnology Exchange Customer Agreement

https://www.mems-exchange.org/policies/customer_agreement

Agreements




https://www.mems-exchange.org/policies/customer_agreement

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