iron and zinc intermetallic compounds such is opposite to the polarity of the third and that the dross is separated from the first fourth magnets extending along the outer compartment. peripheral edge.

Magnetron Sputtering Apparatus U.S. Patent 5358,749. Sept. 24, 1996 M. Yokoyama and I-f. Hayata, assignors to Matsushita Electric /ndusfria/ Co. Lfd., Osaka-b, Japan

In a magnetron sputtering apparatus in- cluding a ring-shaped flat target, the ring- shaped flat target having an inner periph- eral edge and an outer peripheral edge and opposite front and rear surfaces defining respective target planes of the target, the improvement comprising first and second magnets of the same polarity located on a front side and a rear side, respectively, of the respective target planes and extending along the inner peripheral edge of the tar- get; and third and fourth magnets of the same polarity located on the front side and the rear side, respectively, of the respective target planes and extending along the outer peripheral edge of the target, wherein the polarity of the first and second magnets extending along the inner peripheral edge

Sputtering Process and System U.S. Patent 5,558,750. Sept. 24, 1996 J. Szczyrbowski, assignor to Leybold AG, Hanau, Germany

A process for coating a substrate, com- prising providing a target carrier, which carries a target in front of a magnet, said target carrier having a part that projects into a target carrier coating chamber and a part that projects into a sputtering chamber; rotating the target carrier so that the part that projects into the target carrier coating chamber passes continuously into the sput- tering chamber thence back into the target carrier coating chamber; applying a coating of target material to the target carrier by introducing the target material into the tar- get carrier coating chamber continuously from outside the coating chamber, said coating of target material serving exclu- sively as the target on the target carrier, and coating the substrate by sputtering.

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Dual-Cathode Sputter Coating Apparatus U.S. Patent 5,558,751. Sept 24, 1996 P Mahler et al., assignor to feybold AG, Hanau, Germany

Sputter coating apparatus comprising a pair of side-by-side electrodes at common potential connected to a common power supply, a pair of electrically nonconductive targets soldered to respective electrodes, each having a straight edge, which abuts the straight edge of the other target, and a common dark space shield surrounding both of said electrodes and said targets together.

Electrolytic Treatment Process U.S. Patent 5,558,757. Sept. 24, 1996 E. HObe/, assignor to Atotech Deutschland GmbH, Berlin

Process for preventing differences in layer thickness during electrolytic coating of workpieces that are arranged in a row at intervals one after the other attached in a substantially longitudinal direction on at least one cathode rail or on carrier rods, said carrier rods being attached at opposite

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