stars pp_ short version
TRANSCRIPT
HISTORY
CONFIDENTIAL PROPRIETARY
1995
1998
1999-2001
2002-2004 Founded Stars USA, Formed a distribution alliance in Germany
2005-2006
Listed in SET 2009
Launched production of camera modules Enter optical components & medical devices markets To certify ISO 13485 and TL 9000
Recovered from the Great Flood of Thailand
Won “National Innovation” awards 2010
2012-2014
2015-2016
Applied FCOG and FCOF for LCD Module assembly
Certified ISO 9001 and ISO 14001:1996
Moved to Plant 2, Received BOI privileges
Founded
SMT ORGANIZATION
CONFIDENTIAL PROPRIETARY
CEO Peerapol W.
CFO Yunyong S.
CPO Prompong C.
COO Dr.Kavee T.
CBDO Dr.Tattee K.
Finance
Accounting
Operation / NPI Infrastructure Management
Business Development
HR
Program Management
QA
Sr. Director Suwapat C.
Sales & Marketing
Customer Service
Advanced Engineering
Production Planning
Supply Chain
Inventory Management
WORLD CLASS CUSTOMERS
CONFIDENTIAL PROPRIETARY
Nor
th A
mer
ica
/ US
A E
urop
e Ja
pan
/ A
sia
Wafer Level Packaging / Sub-Assy Module Assembly PCBA / COB
MANUFACTURING STRENGTHS
CONFIDENTIAL PROPRIETARY
• Strategic Partnership with customers
(Cost , Sourcing, Design & Development)
• High volume / High mix low volume demand management
• Process design, Turnkey transfer and Ramp up capability, IP Protection
• Quality Systems: ISO9001:2008, TS16949, ISO14001, OHSAS18001, RoHS Compliance , EICC, CSR-DIW
ISO13485/TL9000 - Plan to certify in 2015-2016
ISO22301 - Plan to certify in Q4’2015
• ERP Syteline, MES, BI managing massive purchased parts and sub-assemblies to support customer products
• Complete product traceability from incoming material to Final product
• Lean Manufacturing Practices
! Continuous process improvement
! Six Sigma
ENGINEERING STRENGTHS
CONFIDENTIAL PROPRIETARY
• Provide “Vertical Integrated Solution” ! Wafer / Chip level ! Packaging / Sub assembly ! PCBA / COB ! Finished goods / Module assembly
• DOE, DFM, NPI, FMEA, Prototyping and Engineering Support Services
• Process development and optimization
• Tooling and fixture design ! Solidworks, Autocad ! Semi- Automation to full automation
• Test development
! Hardware and Software
• Diagnostic and failure analysis
CONFIDENTIAL PROPRIETARY
PROCESS & TEST CAPABILITY
Surface Mount Technology :
• Soldering Process ! IR Reflow and Wave Soldering ! 13 Heating zones and 3 Cooling zones ! 100% RoHS Compliant ! Solder printing / Jetting process ! Capacity 22 M points / day (15 Lines:
Assemble-on, Panasonic, Juki, Yamaha)
• Component Mounting ! Passive components as small as 01005 ! Various IC Packages : BGA, µBGA,
QFP, Flip Chip, COB ! Thru-hole Components
• Placement Accuracy +/- 0.02 mm
• Fine Pitch QFP 0.4 mm, BGA 0.8 mm
• Conformal Coating, IPC Class III
• Visual Inspection ! 3D Solder Volume Inspection ! X-Ray (2D and 3D) ! AOI
• PCBA Testing ! ICT (HP 3070) ! Functional Test
Packaging / Sub Assembly :
PROCESS & TEST CAPABILITY
Wafer / Chip Level Process :
CONFIDENTIAL PROPRIETARY
• Dispensing ! Dispensing or Stamping ! Air pressure / Lead screw ! Smallest dot size 0.1 mm ᴓ
• Die Bonding (28 Automatic Machines) ! Eutectic and Epoxy Bonding ! Mounting Accuracy down to +/- 1.5 µm (post
bonding) ! Can handle chips from Blue ring, Waffle tray, Gel-pak ! Die shear test
• Wire Bonding (99 Automatic Machines) ! Ball, Wedge and Ribbon Bonds ! Ball-Stich-on-Ball (BSOB) ! Deep access / large area ! Au, Ag alloy, Cu, CuPd and Al (wedge) Wires ! Pitch 70 µm ! Wire pull test
• Back Grinding (6”, 8”,12”) ! Down to 50 µm thickness ! Accuracy 2 µm
• Laser Dicing ! Stealth accuracy +/- 2 µm, Die size 0.4 mm ! Hasen cut to handle Multi-Chips size in the same
Wafer ! 8 inches wafer
• Mechanical Saw
ROBUST SUPPLY CHAIN
CONFIDENTIAL PROPRIETARY
Strategic
- Global Supply Chain with Low Cost
Region Focus
- Material Cost Reduction ! Volume leverage/Consolidation ! Localization ! Vertical Integration
- Material Lead Time Reduction ! Fast Commitment to
Secure Business
- Excellent Warehousing and Logistics Management
- Reduced Exposure to Excess and Material Cancellation
Technical
Tactical
KEY EMPLOYEES BACKGROUND
CONFIDENTIAL PROPRIETARY
Engineering (Avg. Experience 10 yrs)
Management 22 Engineering 112 Marketing / Program 15 MC / PC / Production 70 QE 18 Support 56 TOTAL 293
MC / PC / Production
QE Support
Management
Marketing / Program
“We have various fields of Engineer:- Electrical, Telecom., Mechanical, Industrial, etc.”
“We can provide high mix low volume demand with very lean manufacturing practice.”
11 CONFIDENTIAL PROPRIETARY
2009-2011 2012-2014 2015-2016
Leaded
Leadless 0.85 mm. Nominal
Leadless 0.75 mm. Nominal
Leadless 0.50 mm. Nominal
Leadless 0.40 mm. Nominal
Leadless 0.33 mm. Nominal
Leadless 0.28 mm. Nominal
Technology
8L SOIC
8/14/16/20/28/38L TSSOP
3/5/6L SC70
5/6L TSOT23
8L SOIC EPAD
5/6L SOT 8/10L MSOP
8/10L MSOP EPAD
COL/ Stack die COL / Stacked die
6L DFN2.5x2 6L DFN 3.5x2.5 6L DFN5.0x3.2 4L DFN 2.5x2 4L DFN 3.5x2.5 4L DFN 5.0x3.2
8L TDFN2x3 12L TDFN3x3 12L TQFN3x2
4L UDFN 1x1 8L UDFN 2x2 8L UDFN 2.0x1.2 2L UDFN COL 8L UDFN 2.2x2.0
4L XDFN1x1 6L XDFN1.2x1.2 8L XDFN1.6x1.2
4L XDFN1.1x1.1 8L XQFN1.6x1.6 8L XQFN2.0x2.0
6L X2DFN 0.825x0.85
2L XDFN1x0.6
8L UDFN 2x3
3L SOT 4L SOT143
DAF WBC 12 in Wafer Ag wire FCOL
16L TQFN 3x3 6L TDFN3x3
10L UDFN 3.2x1.2 8L UDFN 3.5x2.0
IC PACKAGING PORTFOLIO & ROADMAP
Temperature Cycling
Pressure Cooker Test
Stress Test
Moisture Sensitivity Test
Analysis Capability
Reliability Capability
Temperature-Humidity Test High / Low Temp. Test Temperature Storage Test Solderability Test
Destructive
Cross-Sectioning
De-Capsulation
Createring Test
Dye & Pry
Mechanical Microprobing
Electrical Analysis
Non-Destructive SEM (Scanning Electron Microscopy) X-Ray Radiography Optical Microscopy EDX (Energy Dispersive X-Ray) SAM (Scanning Acoustic Microscopy)
FA AND RELIABILITY TEST CAPABILITY
CONFIDENTIAL PROPRIETARY
FA CAPABILITY
CONFIDENTIAL PROPRIETARY
Visual Inspection / SEM / EDX
SAM / X-Ray examination
Decapsulation / Cross-Section
Electrical Analysis
Mechanical Micro-probing
Bond Pad Cratering Test
Dry & Pry
Non-Destructive :
Destructive :