status and opportunities in ev/hev power electronics

From Technologies to Market

Status and Opportunities in EV/HEV Power

Electronics

© 2017

2©2017 | www.yole.fr | Automotive World | [email protected]

OUTLINE

• EV/HEV MARKET Development: why and how?

• Are there remaining barriers?

• EV/HEV Market Forecast

• Technical Trends

• Innovations at module level: power packaging and integration

• Power devices: silicon and WBG

• Conclusion

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MEMS &

Sensors

Displays

Compound

Semi – LED

& OLEDs

Imaging Photonics

MedTech

Manufacturing

Advanced Packaging

Batteries / Energy

Management

Power

Electronics

FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

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4

A GROUP OF COMPANIES

Market,

technology and

strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Innovation and business maker

www.bmorpho.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

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EV/HEV MARKET Development: why and how?

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WHAT HAS CONTRIBUTED TO MARKET GROW IN THE LAST YEARS?

CO2 reduction is a major factor for electric vehicle development

AggressiveEuropeanregulation in terms of CO2 reduction ishelping the electric cars market to grow

• CO2 reduction isone of the keychallenges to facefor the 21st century

• Pushed byaggressivelegislation, carmakers need todevelop cleanervehicles

• To achieve theseambitious targets,best solutioncurrently available isthe electrification ofvehicles, withdifferent levels ofelectrificationdepending on thestrategies ofdifferent carmanufacturers


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DIFFERENT TYPES OF VEHICLES AND THEIR MARKET

Different level of electrification and their associated CO2 reductions

CO2 reduction compared

to thermal vehicles (in %)

Level of electrificationThermal vehicle

(Taken as reference)

SSV/µHEV

Mild HEV

Full HEV

PHEV/ EREV

EV (BEV or FCV)

5 – 10%

10 – 25%

25 – 40%

50 – 100%

100%

Car example

Tesla Model S

Mitsubishi Outlander

Toyota Prius

Honda Civic

Mercedes Class A

VW Golf

Yole Développement 2015

Different levels of electrification are available depending on the level of CO2reduction required by targets


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DIFFERENT TYPES OF VEHICLES AND THEIR MARKET

Description of the different types of electrification

Eachelectrificationlevel has an associatedelectricalpower output

Functions SSV + µHEV Mild HEV Full HEVPHEV (with

EREV)

EV (BEV or

FCV)

Start/stop: stop engine idle

when a vehicle slows down

and comes to a stopX X X X X

Regenerate braking X X X X

Additional power for a few

seconds (electric motor) X X X X

Additional power for mid

distance (city traffic)X X X

Power for long distance (10

to 40 miles)X X X

Recharge battery on the

grid or with a generatorX X

Energy savings 5-10%

(up to 25% in city

traffic)

10- 25% 25 – 50% 50 – 100% 100%

Electric power 3-8 kW 4 - 20 kW 30 - 75 KW 70 – 100 kW 70 – 100 kW


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Are there remaining barriers?

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Range increase reassures customers and boosts sales

Thanks to battery cost decrease and technical solutions developed, electric cars range keep on increasing, pulling the market

Driving range as a function of battery energy capacity

Nissan LEAF

Renault Twizy

Mercedes SLS

AMG Coupé

Toyota RAV4EV

Tesla Model S

BYD E6Car sharing

and small

city cars

Big and luxury

BEV

Source: Yole Développement


Yole Développement - 2016

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Charging infrastructure has been increasingly available over the last few years

As of March 2016, there were almost 13,000 DC chargers worldwide

Considering CHAdeMO and CCS

chargers

-1 000

1 000

3 000

5 000

7 000

9 000

11 000

13 000

DC chargers units evolution worldwide

Japan Europe USA Others Total

Amount of DC

chargers was multiplied

by 2 in one year

• Charging infrastructureis a key point todevelop in order toencourage growth inthe electric vehiclemarket; before buying aBEV a customer willcheck whether they areable to charge itquickly, easily andlocally

• Our current estimatessuggest that there are1.5x more AC chargersthan BEVs

• Governments help todevelop thisinfrastructure byfinancing DC, rapidcharging points



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WHAT ARE THE REMAINING BRAKES FOR ELECTRIFIED CARS GROWTH?

An expensive electro-mobility also due to high battery cost

0

50

100

150

200

250

300

350

400

450

2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

Pri

ce (

$/k

Wh)

Forecasts for battery pack price evolution

Source: “Energy Management for smart grid, cities and buildings: Opportunities

for battery electricity storage solutions” report, Yole Développement, 2015

In 2015, battery

pack was sold

around 370$/kWh

Official target for 2020 is

100$/kWh at cell level,

representing ~260$/kWh

for battery pack

• As unit cost alone is asignificant factor inchoosing a car, furthercosts are a seriousconsideration forbuyers.

• The differencebetween electric andthermal vehiclespresented on theprevious slide is inpart due to batterycost, whichrepresents a largeproportion of theoverall unit price.

• Even if targets for2020 are veryambitious, currentlevel of battery cost

Another financial barrier to uptake of electro-mobility: Battery cost.



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EV/HEV Market Forecast

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14

FUTURE AND PERSPECTIVES FOR ELECTRIFIED VEHICLES

Electrified vehicles market and forecasts up to 2021 – not including SSVs



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15

POWER ELECTRONICS AND AUTOMOTIVE APPLICATION

Presentation of definitions used in the report

Different markets are presented in the coming

slides

Car level

Power system level

Power module levelPower device level (die)


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16


Evolutions of markets relative to electrified cars between 2015 and 2021

Markets related to power electronics for EV/HEV are multiplied by 15 between the devices market and the systems market

2015

$465M

$4.1B

$671M

2015

3.2M $13B

Power systems (inverter + AC/DC +

DC/DC boost + DC/DC)

202121.58% CAGR

Cars (HEV + PHEV + BEV)

202127.14% CAGR

13.5M

2015

IGBTs Modules

2021

$1,63B

19 % CAGR

Power devices

2015

202120.1% CAGR


$1,2 M

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IGBT MARKET

EV/HEV in IGBT module market—evolution between 2015 and 2021

At module level, EV/HEV will represent almost half of the market by 2021

Total: $2.41B Total: $3.73B



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Power electronics market for EV/HEV (system level)

Growth rate 16.42% 20.46% 22.47% 28.23% 27.92% 24.50% 17.57% 9.86%

21.58%

44.38%

23.34%

14.26%

19.54%

CAGR 15-21



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Technical Trends

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20

POWER ELECTRONICS USED IN ELECTRIFIED VEHICLES

Technical targets: a power density roadmap

• Costs of EV/HEV systems are not yet competitive in comparison to combustion engines.

• Making EV/HEV systems competitive will require considerable investments in technology, integration with other vehicle systems, crossplatform sharing, etc.

Challenges

Traction Drive System

• Benchmarking technologies

• Innovative systems designs

Requirements: 55kW peak for 18 sec, 30kW continuous: 15 years life

Whole Traction Drive Systems Power Electronics Motors

Year Cost $/kW kW/Kg kW/l Efficency Cost $/kW kW/Kg kW/l Cost $/kW kW/Kg kW/l

2010 19 1.06 2.6 > 90% 7.9 10.8 8.7 11.1 1.2 3.7

2015 12 1.2 3.5 > 93% 5 12 12 7 1.3 5

2020 8 1.5 3.5 > 94% 3.3 14.1 13.4 4.7 1.6 5.7

2025 5 1.6 5 > 95% 2.1 15.8 17.6 2.9 1.7 7.4

Power Electronics• Innovative topologies

• Temperature-tolerant devices

• Packaging

• Capacitors

• Vehicle charging

• New materials

Electric Machines

• Permanent magnet (PM) motors

• Magnetic materials

• High-performance of non-PM motors

• Thermal system integration

• Heat transfer technologies

• Thermal stress and reliability

Specification: 55kW peak for 18 sec, 30kW continuous: 15 year life

Source: US Drive June 2013

DOE

objectives


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21

INVERTER LEVEL: TOPOLOGY AND MECHATRONICS

Converters co-integration• DC/DC Boost + Inverter + Generator• Inverter + LV-HV DC/DC• On board DC/DC + LV-HV DC/DC

• Improved cooling•Higher power density•Mechatronic improvement

Double sided cooling1-in-1 power modules

Co-integration motor + inverter:• Increase power density• Inverter mechatronic design

to fit with motor aspect ration

Main evolutions in power electronics:

In-wheel motor + inverter integration

Towards

system

integration

6-in-1 power modules

All-in-1 power modules

Coming technologies?

Widely used 6-in1 power modules

Towards more integration


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Summary: BEV

• Different mechatronics trends can be predicted depending on the electrification level and architecture of the cars

Motor + inverter integration would be mainly used for fully electric cars

BEV

PHEV

Full

HEV

Mild

hybrid

Small electric

motor + inverter

Mechatronics trends

Centralized power

unit box

Motor + inverter

integration could start

being implemented in

BEVs beyond 2020.

For PHEVs and full HEVs, a

centralized power unit box

might be preferred, as the

synergy between their

numerous converters can have

a bigger impact on size

reduction

?

New trend towards using

ICE’s cooling loop?


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Mild hybrid vehicles: Motor-Inverter integration

• So far the integration of power converters into the electric motor housing has only been seen in mild hybrid cars, as low powers are involved (5-15kW).

• This integration between the electric motor and the inverter will be a strong trend for this category of electrified vehicles.

• The electric motors are considered an auxiliary help for the ICE traction (belt-connection mainly).

• Continental provides a motor-inverter solution of permanent 5kW power (peak 13kW), for a 48V mild hybrid architecture.

• The weight of the whole assembly is 12kg.

• The mild hybrid Volkswagen Golf TSI is using this technology from Continental.

The 48V mild hybrid architecture is fast-spreading among car OEMs. In several cases, motor + inverter integrated solutions are used.

Continental’s 5kW (max. 13kW) motor + inverter

used by Volkswagen

Close integration is achieved with motor-inverter mechatronics in mild hybrid vehicles.

Mild hybrids


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SINGLE COOLING LOOP

Mild hybrid’s increasing temperature

• In today’s electric/hybrid cars, several cooling systemscan be found (see the picture below)

• The ICE has its own cooling system, and so too the power converter units and the battery (if needed)

By the end of 2016, the first 48V mild

hybrids will be commercialized. By 2018, single cooling loop technology will

be widespread.


• There is a new trend towards using a unique cooling loop betweenthe ICE and the power electronics. This increases cooling looptemperature from a maximum of 70 - 90°C to 105°C.

• The temperature junction is increased to 150°C (just for mild hybrids)

• Nearby electronic components must handle temperatures up to ~110°C

• DC-link capacitors must use polyester films (PET)

• Several German and French car manufacturers are working on 48Vmild electric vehicles. These will be the first to use a commoncooling loop.

• This trend might expand to other hybrid vehicles where higherpower must be handled:

• The Tj will then be at 175°C. Yole expects this after 2021 - 2022.

• The capacitors must support temperatures up to 130°C

• Alternative films will require analysis: PET, PEN, PPS, etc.

• Regarding Dupont Teijin’s PENHV, some car manufacturers are testing these capacitors, but so far elevated cost is a critical barrier

• Laminated busbar technology will also be challenged by increased temperature, as its glue is limited to 105°C

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Case study: Tesla S model

• The Tesla S inverter is another example of a particular form factor for the power converter in other to integrate a cylindrical axe defined by the electric motor.

• Each phase of the inverter is located in a lateral side of a triangle support, which correspond to the cooling system.

• Tesla uses discrete IGBTs which allows them to get the flexibility to adapt its inverter to the desired form factor.

Tesla uses a specific mechatronic on their S model inverter, in order to integrate the form factor of their motors

Tesla S model’s cylindrical inverter design

BEV

One leg of the inverter using 2x14 discrete IGBTs


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Case study: Tesla S model

• Luxury electric cars can also pretend to bring all-wheel drive solutions

• This is the case for theTesla S 85 kWh P85D model

• Two independent electric motors with their respective inverters are used for each wheel axle

• Needless to say, the use of several electric motors an inverters for an electric car will not be a trend for mass oriented BEVs

• All-wheel drive solutions will be an offer dedicated for niche luxury products

For their luxury high-end solution of Tesla S model, an all-wheel drive solution has been chosen

BEV


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Innovations at module level: power packaging and

integration

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28

POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION

Different types of modules used for automotive

Differenttypes of modules

existdepending on the numberof switches integrated

2in1 power module

MOTOR3-phase

6in1 power module

MOTOR3-phase

“all-in-1” power module

Optional boost

Optional boost

Toyota model

Source: ORNL

Source: ORNL

4in1 power module

MOTOR3-phase

Optional boost

Source: ORNL

1in1 power module


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29


Power module types and positioning of manufacturer

2in1 power module

6in1 power module

“all-in-1” power module

4in1 power module

2010 2014

Renault Zoe

Nissan Leaf

BYD e6

Volkswagen Golf

Volkswagen e-up!

Tesla Model S Tesla Model X

Ford C-max

Ford Focus electric

Toyota Prius

Toyota Prius

Toyota Camry

Lexus LS600h 2008

Honda Civic

Nissan Leaf

Toyota YarisToyota Auris

Mitsubishi Outlander

1in1 power module

Discrete devices

2015201320122011 2016

Chevy Volt

Honda Accord

Amount of switches in

1 module

Each car manufacturer has a specific strategy,

and the power module chosendepends on the

car model. A generic trend seems to be a

reduction in the amount of

switches in the module



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How is a standard power module designed?

A standard power

module is a complex

assembly of different materials including

active devices

Heatsink

Thermal grease

Substrate

SBD IGBT

Baseplate

DBC

Busbar connection

Solder

Copper metallization

Plastic case

Die attachInterconnection

Gel filling

Substrate attach

- A power module with a baseplate is the standard design, used in most available power modules.

- Modules built with a substrate (mainly DBC, Direct Bond Copper) are the most common.

- Common failures in power modules are caused by thermal cycling. Mismatched coefficients of thermal expansion (CTE) can make layers detach from one another. Some gel fillings also cannot handle high temperatures.


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Main technical progress for packaging for automotive

In automotive industry, cost, reliability and weight are the most important parameters

Cost and reliability issues

Weight reduction

Layers suppression

Use of epoxy resin instead of silicon gel

Reliability and efficiency increase

Die attach innovations

Cooling improvements (double

side cooling…)

Cooling has a key role to play

considering the increase of

temperature inside the module

• Cost and reliability arethe most importantparameters in theautomotive industry.

• Cost encompassesother parameters:

• Weight (and thuspower density)

• Efficiency (morelosses representmore consumptionand thus higher cost,and CO2 regulationsare tough)

• These imperatives havehuge impact at thepackaging level.


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Reducing the number of layers is important

• Some modules have been developed that combine substrate and baseplate into a single layer.

• The new layer must combine the roles of the two former layers:

• Allow electrical conduction on the surface and insulation underneath, and thermal conduction all through the layer. Die-attach must be of good quality as well.

• Act as a mechanical and thermal support for the module

• Mitsubishi Electric (JP), the worldwide leader for power module manufacturing, launched its new IGBT power module at PCIM 2015 (Germany, May 2015). This new module uses an Insulated Metal Baseplate (IMB).

In order to reduce the number of

layers, some manufacturers are combining the substrate and baseplate.

Source: Mitsubishi Electric

presentations

An IMB consists of an

insulating resin sheet with

high thermal conductivity,

copper baseplate and thick

copper foil.©2017 | www.yole.fr | Automotive World | [email protected]

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33


Comparison of encapsulants used for power packaging in automotives

Epoxy resinand silicone gel are the mainstays in automotivepower packaging.

• There are two mainsolutions currentlyused for powermodule filling inautomotives.

• Silicone gel is themost mature andwidespreadsolution.

• Epoxy resin is nowwell developed andis grabbing moreand more marketshares, thanks togood thermal andmechanicalperformance and amuch lower pricecompared tosilicone gel.

Material

Tensile

Strength

(MPa)

Elastic

Modulus

(GPa)

Conductivity

(W/mK)

Coefficient

of

Expansion

(ppm/°C)

Resistivity

(Ω.cm)

Dielectric

Constant

Silicone gel 10.3 2.21 0.15-0.31 70 1015 -1017 2.9-4.0

Parylene 45-76 / 0.08-0.12 35-69 / /

Polyurethane 5.5-55 0.172–34.5 0.07–0.31 100–200 3 x 108 5.9–85

Epoxy 55-82 2.76–3.45 0.17–0.21 45–65 1013–1016 3.2–3.8

Acrylic 12.4–13.8 0.69–10.34 0.12–0.25 50–90 7 X 1013 /

Different types of materials that can be used for power packaging

Silicone gel and epoxy resin are the most widespread solutions for automotives.


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34


Overmolded modules and double-side cooling: a future generic feature?

Double sidecooling fits wellwith overmoldedmodules. Considering the context, weexpect thosemodules to become more widely used in the future

2020 202520152010

Level of electrification / Power of the module

Mild HEV

Full HEV

PHEV

BEV

Cost

reductionTime

Other

companies

Major companies already have overmolded double-side

cooled modules in their portfolio

• Overmolded moduleswere first used due totheir low cost,especially in hybridvehicles.

• Double-sided coolingallows better thermalmanagement in areduced volume, whichis a key constraint inhybrid vehicles.

• On the other hand,with the increase injunction temperature,thermal management isalso key for fullyelectric vehicles.Pressure to reducecost is also very strongon this segment.

• We are confident instrong development ofovermolded double-sidedcooled modulesin the future.



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35


Double-side cooling: designed for a better thermal management

• To improve thermal dissipation, some manufacturers decided to cool the module on both sides: this is the double-side cooling technology

New Infineon module, targeting

automotive application, combines

molded package and double side

cooling

• As explained by Infineon:

• Electrical isolation is provided by DCB (Direct Copper Bonded) ceramic substrate. Heat is transported to the lower heatsink by soldering the chip directly onto the substrate. The heat to the upper heatsink is realized by “spacers”, which adjust the height of the module. This does not only improve manufacturability but provides the necessary space to integrate multiple safety features like current and temperature sensors.

• The realized tests also show that thermal resistance directly depends on the heatsinks attachment force, as shown on the chart on the left => interface between DBC and heatsink remains an important step to master

Source: Infineon presentations

Heatsinks are assembled

to each DCB, on the

bottom and on the top of

the module


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• Infineon went further in the development of a new module, providing a product that benefits both from a double-sided cooling system and from the reduction of the amount of layers


Double side cooling module can be directly exposed to cooling circuit

This module doesn’t integrate

a heatsink for cooling

Source: Infineon presentations

• The module presented (intended for mainly automotive applications) can be used with a standard assembly with a heat sink as seen in the previous slide, but it can also be directly exposed to the cooling circuit

• This represents a very interesting development as previous designs comprised 3 layers between the die and the cooling system (substrate, baseplate, heat sink), whereas the new design has only one. This design also does not require the use of thermal interface material (TIM)

• According to Infineon, the thermal resistance of the entire module can be reduced by more than 40% using direct cooling instead of an assembly with a heat sink and TIM


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37


Presentation of Bosch Automotive double side cooled module

Bosch has a power module + inverter solution

for electrified vehicles Source: Bosch presentation

Heatsink in copper

300µm Insulating layer in Aluminum

nitride – 85µm

Top Copper Leadframe –

1mm

Detailed view of the cross-section (Optical photo).

Top Solder SAC – 120µm

Source: System Plus Consulting

• Bosch Automotive Electronics has developed a double-side cooled 2-in-1 power module, integrated into their inverter for electrified vehicles

• The Bosch power module is used by the Volkswagen Group in many electrified cars (e-Golf, e-Up!, Audi A3 e-tron, etc.)

• The Bosch power module is specially designed for automotive applications:

• IGBT developed in partnership with Infineon

• Molded Package

• Chips soldered on massive copper substrate for enhanced thermal spreading and junction temperature management

• Thin Film Insulator

• Temperature sensor inside the package

• Inductance: 10nH


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38


Presentation of the Mitsubishi double-side cooled module

• Mitsubishi Electric was one of the first companies to offer double-side cooled modules for automotive applications.

• Mitsubishi modules are used in many electrified cars from Japanese manufacturers, including the Honda Fit.

Mitsubishi electric power modules are

widely used by Japanese car

makers

• T-PM J-Series

• 2-in-1 transfer-molded package

• 600V/300A capability

• On-Chip current sensor & temperature sensor

• Tjmax = 175 °C

Source: System Plus Consulting

Package Top view back view

Bottom Copper Leadframe – 3mm

Total Height

6.5mmheat sink – 100µm

Insulating layer – 210µm

Top Copper LeadframeIGBTDiode


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Roadmap of power module packaging design

In the future power

modules will have been entirely

reshaped, with the changes

depending on the power targeted

Bosch example• Molded package• Double side soldering• Low inductance

Mitsubishi example• Six Pack IGBT/Diode Package• Cooling fin• Thick copper layer for thermal

spreading• Direct substrate cooling

Mid-power modulesDesign evolution

Die on heatsink• Die attach: film

sintering? Gold sintering? Glue? Silver oxalate?

• Ceramic heatsink?• Ball bonding?

2018

2020

2014

2025

• Wide use of leadframe• Over-molded package• Top interconnections• Ag sintering for die attach

• Encapsulation with parylene• Ribbon bonding• Silver (Ag) sintering for die

attach• Pin-fin baseplate


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41

POWER DEVICES: SILICON AND WBG

Power device technology positioning

WBG devices are primarily positioned in high-end applications

1200V or more

600V or less

Pro

du

ct r

ange

Voltage

IGBTThyristor

IGCT…

SiC

MOSFET

Triacs

Bipolaretc.

3.3kV and more200V

GaN GaN

• Historically, silicon had a complete monopoly over the semiconductor industry in integrated circuits (IC), microchips and power electronics

• Other semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have been in development for some decades now


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42

Converters SSVMild

HEV

Full

HEV

PHEV (with

EREV)

EV (BEV

or FCV)

1. Start/stop moduleMOSFET

1.5 to 10kW

Av: 3.5kW

2. DC/DC converter 14V (toMOSFET – 1.5 / 3kW – Av: 2.25kW

3. DC/AC inverter ( + DC/DC

booster option )

MOSFET or

IGBT

5 /20kW

Av: 15kW

IGBT – 20 / 150kW

Av: 70kW

4. GeneratorIGBT – 20 / 40kW

Av: 30kW

5. Battery charger

MOSFET - 3/6kW – Av: 4.5kW

and then

IGBT - 10 / 20kW – Av: 15kW

Total average

power / car 3.5kW 17.25kW 52.25kW 56.75 to 102.5kW

(for a single motor setup)

These applications are specific to EV/HEV. Standard ICE power device applications such as oil pump, steering, braking and HVAC are not considered.

Auxiliary inverters have not been considered because they use few power devices.


Device types and power levels: opportunities for WBG

WBG devices could

replace Si-based IGBTs

and MOSFETs in

EV/HEV applications.

Could be replaced by WBG


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43


IGBT technology evolution and roadmap

PT(planar)

1988

1995

1985

NPT(planar)

1997

Trench gate

Thin wafer

technologies

2002

FS (planar)

Trench FS

(thin wafer)

2008

2011

CSTBT

Trench FS

LPT-

CSTBT

Advanced

trench FS

2014

Trench

enhanced FS

LPT-CSTBT

(thin wafer)

SPT+

2007

Evolution

2020

Advanced HiGT

SJ IGBT

SiC IGBT

There is still room for improvement for

Si-based devices


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44


How WBG adds value

WBG materials offerhigherjunctiontemperatureand reducedsize comparedto silicondevices

• WBG devices allow reduced system size and weight.

High electron mobilityHigh Junction T°

No recovery time

during switching

Low lossesless energy to dissipate

Fewer cooling

needs

System size and

weight

reduction

High switching

frequency

Smaller filters

and passives

Intrinsic

properties

Impact on

operation

Impact on

power module

Impact on

power system


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45


Converters and inverters in EV/HEV: where are SiC & GaN?

The choice of SiC or GaN in

EV/HEV is complex

DC/DC

boost

converter

DC/AC

Inverter

Powertrain

Electric

motor

DC/AC

inverter

AC/DC

converter

200-

450VDC

DC/AC

Inverter

Air conditioner

Torque to

drive wheels /

braking

energy

recovery

DC/DC

converterEngine

generator

12V

battery

AC electric

accessory load

Toyota only

High voltage

battery

Power device positioning within an EV/HEV

Yole Développement

Battery

charger

DC electric

accessory load

• GaN and SiC arecandidates for newinverter and converterdevices for EV/HEV.

• Technologicallyspeaking, SiC is used forhigh-power DC/ACinverters and GaN isbetter adapted to low-power DC/DC andAC/DC converters.

• However, the choice ofSiC or GaN is morecomplex and dependson numerous criteria.

• SiC technology mightalso be implemented inlow-power convertersdue to GaN’scomparative lack oftechnological maturity.


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46


GaN vs SiC * : Yole’s vision of WBG penetration in EV/HEV by 2020

GaN and SiChave

opportunities in different applications.

On-board charger topology (3 or 7kW)

The topology of on-board fast charger is similar to that of inverter: SiC possible

400V

Standard InverterTopology (generator)

400V

230V

Already SiC

SiC Possible

SiC Possible

GaN or SiCTransistor + SiC diode

GaN or SiCTransistor

LV-HV DC/DC converter topology

GaN or SiCTransistor + SiC diode

GaN Possible

DC/DC booster

SiC Possible

on-board

Wireless charger

* Our vision is based on the current status, the situation could evolve with further development.


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47


Roadmap of implementation of SiC devices in EV/HEV

SiC diodes are already used in on-

board chargers. Full

SiCpowertrain solutions

require more maturity.

AC/DC

charger

DC/DC

Diode

Switch+

diode

AC/DC

DC/AC

Powertrain

Year

Power

2kW

3kW

7kW

55kW+

2015 2018 2023

Augmentation of

current capacity

900V/30A from Cree could be well-

positioned for this segment

Introduction of SiC components into

devices in EV/HEV (axes not in scale)Yole Développement


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48


SiC component evaluation by Toyota

Test of SiCcomponents in hybrid vehicle and fuel cell bus.

• Project led by:Toyota (JP)

• Evaluation of the performance of SiC power semiconductors,which could lead to significant efficiency improvements inhybrids and other vehicles with electric powertrains.

• Goal: to assess the improvement in efficiency achieved by thenew SiC power semiconductors.

• Two types of testing vehicles:• Toyota Camry hybrid prototype

• Fuel cell bus

• Toyota Camry hybrid prototype:• SiC power semiconductors (transistors and diodes) installed in

the power control unit (PCU)’s internal voltage step-upconverter and the inverter that controls the motor.

• Fuel cell bus:• SiC diodes installed in the fuel cell voltage step-up converter,

which is used to control the voltage of electricity from the fuelcell stack.

• The bus is currently in regular commercial operation in ToyotaCity.

• The technologies behind these SiC power semiconductorswere developed in Japan jointly by:

• Toyota

• Denso Corporation

• Toyota Central R&D Labs., Inc.

• The SiC transistor is a trenched MOSFET manufactured witha 4-inch SiC wafer.

Toyota Camry hybrid prototype with

SiC components

SiC diode chips

SiC transistor chips

Toyota fuel cell bus with

SiC diodes


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49


SiC devices add value in EV/HEV: Toyota’s vision

Toyota’s goal is 10% improvement in fuel efficiency and PCU downsizing of 80%. Over 5% fuel efficiency improvement was confirmed.

• According to Toyota, approximatively 20% of an HEV’s total electrical power loss is associated with powersemiconductors. SiC power devices allow increased fuel efficiency and reduced PCU size.

• Toyota’s goal is 10% improvement in fuel efficiency and PCU downsizing of 80%. Over 5% fuel efficiency improvementwas confirmed.

• They adopted a trench structure SiC device.

Courtesy of Toyota


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50

SIC & GAN POWER DEVICE MARKET

to 20201

The total WBG device

market is expected to catch up in EV/HEV in the coming

years


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51©2017 | www.yole.fr | Automotive World | [email protected]

CONCLUSION

• EV/HEV Market is promised to an important growth driven by CO2 reductionregulations

• Most of the challenges are beeing overcome maket this market become a reality

• With such an important growth, important technology evolutions are expected inthe field of:

• Power converters

• Power Modules

• Power Devices

• Cost, relibility and value proposition will be the path toward emergence of thesetechnologies.

• To catch EV/HEV business opportunities, the overall supply chain is reshaping withemergence of new players

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Any question?

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53

Biography & contact

ABOUT THE AUTHOR

Pierric Gueguen

Dr. Pierric Gueguen is Business Unit Manager for power electronics and compound semiconductor activities at Yole Développement. He

has a PhD in micro- and nanoelectronics and a master’s degree in micro- and nanotechnologies for integrated circuits. He worked as a PhD

student at CEA-Leti in the field of 3D integration for integrated circuits and advanced packaging. He then joined Renault SAS, and worked

for four years as technical project manager in the company’s R&D division. During this time, he oversaw power electronic converters and

integration of wide band gap devices into electric vehicles. He is author and co-author of more than 20 technical papers and 15 patents.

[email protected]


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mailto:[email protected]

status and opportunities in ev/hev power electronics

Technology