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STORM’S PROPRIETARY SILVER SOLUTIONIntroduction

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BACKGROUND

•  Electroplated silver is used in an increasingly diverse range of applications and industrial segments for both decorative and functional finishes.

•  Replacing the traditional cyanide electrolyte was one of the key objectives of this product development.

•  Additionally, this new product should deliver:•  Excellent solderability •  Good adhesion over Copper and Nickel (with strike plate)•  Low contact resistance •  Bright to Semi-Bright, white appearance•  Wide operating window•  High efficiency

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STORM’S PROPRIETARY SILVER SOLUTION MAKE-UPCD<2ASD CD>2ASD

ChemicalsRequired Volume Volume

Storm’sProprietarySilverSolu2onMake-upSolu2on 400mL/L 400mL/L

Storm’sProprietarySilverSolu2onConcentrate 250mL/L(20g/LAg)

500mL/L(40g/LAg)

Storm’sProprietarySilverSolu2onBrightener 10mL/L 10mL/L

Storm’sProprietarySilverSolu2onHSAddi2ve --- 40mL/L

D.I.Water Tomakeonlitre Tomakeonelitre

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STORM’S PROPRIETARY SILVER SOLUTION OPERATING PARAMETERS

Parameter Range

SilverConcentra2on 20g/L(0.5–2ASD)40g/L(2–10ASD)

Freecomplexingagent 75g/L

Brightener 8–16mL/L

HSAddi2veforhighspeedapplica2ons 40-50mL/L

pH 9–10

Temperature 50–60°C

CathodeEfficiency 100%

Pla2ngRate 3µm/min at 5 ASD

Anodes Silver

Anode:CathodeRa2o .3:1


CHARACTERISTICS

1.  Cyanide-free electrolyte, pH 9-102.  Chemically stable solution vs. bath age3.  CD range: 0.5 – 10 ASD (up to 15 ASD for jet or

wire plating)4.  Cathode efficiency ca. 100%5.  Suitable for soluble anodes at this stage6.  Excellent adhesion over copper and copper alloys7.  Plating over nickel requires a strike layer8.  Does not contain metallic additive

1.  Deposit composition: ca. 100% silver2.  White, bright silver deposit over a broad CD range (0.5 – 15

ASD)3.  Matte deposit possible (optional)4.  Suitable for electrical/electronic and decorative applications5.  Excellent contact resistance 6.  Excellent solderability 7.  Harder than cyanide silver deposits, especially after

annealing at 155°C 8.  No tarnishing when applying Anti-Tarnish agents

recommended by Storm Power Components


PLATING SEQUENCE OVER COPPER AND COPPER ALLOYS

Step Process Notes1 Cleaning(standard)

Rinse

2 Storm’sProprietarySilverSolu2on

HotRinse(60-80°C) Requireddirectlya\erpla2ng

3 An2-Tarnish Op2onal

Rinse


PLATING SEQUENCE OVER NICKEL UNDERCOAT

Step Process Notes1 Cleaning(standard)

Rinse

2 NickelPla2ng

Rinse

3 Storm’sProprietarySilverSolu2onSilverStrike

4 Storm’sProprietarySilverSolu2onBrightSilver

HotRinse(60-80°C) Requireddirectlya\erpla2ng

5 An2-Tarnish Op2onal

Rinse


STORM’S PROPRIETARY SILVER SOLUTION SILVER STRIKE

ChemicalsRequired ParametersStorm’sProprietarySilverSolu2on–Make-UpSolu2on 300mL/L

AgusingStorm’sProprietarySilverSolu2onSilverConcentrate 0.3–0.5g/LAg

Temperature RoomTemperature

pH 9.5

CurrentDensity 0.5–3ASD

Time 10sec–2min

Anode StainlessSteel

Agita2on Mild

Notes:

1)Itisrecommendedtoop2mizetheparametersdependingonpla2ngtechniquesandcondi2ons

2)Bathmaintenance–useStorm’sProprietarySilverSolu2onStrikeReplenisher


STORM’S PROPRIETARY SILVER SOLUTION BRIGHT SILVER

Performance


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10

10 8 6 4 3 2.5 2 1.5 1 0.8 0.6 0.4 0.2 0.1

APPLICABLE CURRENT DENSITY1  At 20g/L Silver 0.5 à 2 ASD2  At 40g/L Silver 2 à 10 ASD (limited only by agitation)

40g/LAg;10ml/LBrightener;40ml/LHSAddiGve2A;3min;50°C

10ASD


DEPOSIT APPEARANCEApplicaGon MetallizaGon Sample

Connector CopperAlloy+Nickel+Storm’sProprietarySilverSolu2on

POP Copper+Nickel+Storm’sProprietarySilverSolu2on

POP Copper+Nickel+Storm’sProprietarySilverSolu2on

Wafer Copper+Storm’sProprietarySilverSolu2on


HARDNESS AND WEAR RATE

§  Storm’sProprietarySilverSolu2on:SilverDepositsshowhigherhardnessthandepositsfromacyanideelectrolyte,a\erannealing§  Storm’sProprietarySilverSolu2on:Silverdepositsshowlowerwearratecomparedtodepositsfromcyanideelectrolyte,especially

a\erannealing

Nano-Hardness WearRate(Silvervs.Steel)

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