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Table of Contents

SIITME 2012 - Conference program

Welcome to SIITME 2012 CommitteesProgram at a glance Keynote speakersOral sessionsPanel discussionPoster sessionsGeneral informationContact information

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Editors: Paul Svasta, Detlef Bonfert, Cristina Marghescu, Bogdan Anton, Zsolt IllyefalviDTP: Bogdan AntonPublisher: Cavallioti www.cavallioti.ro

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Welcome to the 18th edition of the International Symposium for Design and Technology in Electronic Packaging

Thank you for your participation to this already traditional event. SIITME has established itself as a reference event on the topic of Electronic Packaging for the Central and Eastern Europe. For this maturity edition, the location of SIITME is the historical city of Alba-Iulia. This event, taking place each fall, has become a wonderful occasion for young researchers to present their active research and become acquainted with the challenges of defending their work in front of professionals from their area of expertise. Efforts are made to facilitate their participation, in order to raise their confidence in presenting their results.

Both oral and poster presentations will take place and these should offer the possibility for participants, be them young scientists, professors or members of industry, to have a fruitful exchange of ideas.

As general Chair I would like to address special thanks for the sustained work of the Publication and Scientific Committees. Their active involvement in reviewing the submitted papers led to the selection of a highly qualitative research work. Also, the effort made by the Steering Committee in promoting this event has increased its visibility and raised the scientific level. Moreover, a very important role was played by the young and very active University “1 Decembrie 1918” of Alba Iulia, which supported this scientific event as local organizer. For their effort I thank them.

Prof. DHC Paul SVASTA, Ph.D.SIITME General Chair

SIITME 2012 | Conference Program

Welcome to SIITME 2012

2 SIITME 2012 | Conference Program

DEAR PARTICIPANTS,Thank you for coming to SIITME 2012 Conference.

It has become a long tradition for our community to gather the most prestigious

scholars in electronics in Alba Iulia. As usually, the meeting takes place in a city

in the eastern part of Central Europe, the beautiful city of Alba Iulia, the other

capital of Romania. For a coupe of days Alba County becomes one of the most

important regions in Romania in the field of electronics.During these days the

main topics of our conference will be debated and we hope for the future to have

a consistent joint presence of industry and academia in SIITME papers.

As conference Chairmen, we are honored to be surrounded by a diligent and

steadfast organizing committee. In addition, an event like SIITME 2012 would not

be possible without the support of our sponsors, so we would like to thank them:

The Municipality ,The County Council, Bosch and Jidvei domain, as our Premium

Sponsors. Special remarks and deep gratitude to the Romanian National Authority

for Scientific Research - ANCS and “1 DECEMBRIE 1918” University of Alba Iulia,

where the Faculty for Science played a very important role in organizing the event.

We would like to say a few things about Alba county. Alba Iulia is situated in an

appealing territory, and travelers are warmly hosted here. The touristic potential of

the area is mirrored by the numerous traces of millenary history, by its architecture

and art, by the variety and beauty of nature.

We wish you good luck.

Assoc.Prof. Emilian CEUCA, Ph.D. SIITME 2012 Conference Co-Chair

Prof. Ioan Achim MOISE, Ph.D. SIITME 2012 Conference Chair


Happy Anniversary SIITME!!!

The edition of this year, being the 18th can be considered the point where the conference has reached its maturity, a cornerstone similar to a person’s coming of age.

So what does SIITME stand for at this important anniversary?

1. SIITME is the most representative event organized annually by the HU&RO

IEEE CPMT Joint Chapter.

2. SIITME is honoured every year by the presence of internationally

acknowledged personalities from the field of electronics technology

3. SIITME reunites each year participants from every corner of the world, having

a principal core based around central and eastern Europe

4. SIITME offers European and international visibility to the scientific

preoccupations from the field of electronic packaging

5. SIITME is a manifestation mainly open towards young researchers (students,

PhD students) who open the gates of knowledge and innovation in the area of

electronics technology

6. SIITME yearly promotes the best scientific papers in IEEE Explore

7. SIITME promotes the principle “all for one and one for all”, as a result all

presentations are common for all participants

8. SIITME places in the spotlight the poster sessions, where the interaction

between the presenter and the audience is much more direct

9. SIITME promotes excellence, the best oral and poster presentations being

awarded

10. SIITME is perceived as an event that promotes electronic packaging on the

central and eastern European front

11. SIITME is a scientific event perceived by the electronic companies as having

an important informative nature

12. SIITME is a major landmark for the research and academic structures from

Romania involved in the electronics packaging domain

13. SIITME is an opportunity for scientific interactions which have as their goal

international collaborations




14. SIITME promotes a multiculturalist mentality through its recreational activities

organized every year

15. SIITME is an opportunity to meet new people with scientific and cultural

personalities

16. SIITME is an occasion to build new friendships based on common scientific

interests

17. SIITME is a vector for promoting scientific quality in the field of the

universities which are involved in organizing the event

18. SIITME facilitates scientific communication for those belonging to different

generations

Wishing many more anniversaries to SIITME,

Dan PITICĂChair of HU&RO IEEE CPMT

Joint Chapter

5SIITME 2012 | Conference Program

Dear paper presenter of SIITME 2012

The quality of a conference is given by the published papers and the evaluation process. The International Steering Committee of SIITME promoted an extremely rigorous paper selection procedure, on the one hand, and presentation evaluation procedure of the accepted papers, on the other. The Publication and Scientific Committees were directly involved in the aforementioned selection and evaluation processes.

The Publication Committee together with the Scientific Committee reviews all papers carefully on various criteria such as suitability, scientific content and level, relevance of the results, correspondence to the template and proper use of English terminology. This means that papers with low scientific quality for example with a poor scientific background, no gain in scientific knowledge or detected as plagiarism by the iThenticate software are not accepted to the conference.

An important part, for the preparation of the SIITME is the selection, evaluation and final formatting of the papers received. The accepted papers will be published in the Conference Proceedings and available through IEEE Xplore. This publication creates a high impact on the reputation of the author, co-authors and the institution. It is the responsibility of the International Steering Committee of SIITME to select papers meeting high quality standards.

There are several measures implemented by the steering committee to ensure the quality of the conference by controlling the papers received.

The first step is the submission of the abstracts that are going to be evaluated by the steering committee and other scientists. To help the authors, some hints and also questions were included. The majority of the abstracts demonstrated a good overall quality. A marginal amount of the abstracts were rejected due to mismatch of the topic with that of the conference. In the evaluation step, the selected abstracts would be categorized either as an oral or as a poster presentation. This decision was made based on the proposal of the author, novelty of the subject, technical significance and other factors. The limited number of presentations and time of the session were also in consideration during the selection process. To clarify the assignment of a paper to the poster session is not downgrading (or second class) the paper.

The last step in the evaluation process of the paper quality takes place at the conference. The presentation of the paper is one important precondition for its acceptance as an IEEE publication. The oral presentations will be evaluated by all members of the steering committee. The criteria are the novelty of subject, the technical significance, the technical depth, the methodical correctness and the clarity of the presentation.



The poster session starts with a short (3 minutes) oral presentation for every poster. The time restriction makes it compulsory to focus on drawing attention to the poster itself. The main message should be: “Please visit my poster, it would be of good interest to you!”. A discussion at the poster with the evaluation committee (and to other interested participants) will provide you an extended opportunity to show your scientific results.

The best posters and oral presentations will be awarded.

Points to be noted:

The main goal for you should be focused on the acceptance of your paper as an IEEE publication for the Conference-Proceedings and the availability through IEEE Explore. Scientists, researchers in the industry, students and other interested people are able to read your results. Please note, it won’t be stated whether the paper was an oral or a poster presentation at the conference.

We wish you success for the conference

Dr.- Ing. Habil. Heinz WOHLRABEPoster Session General Chair and

Scientific Co-Chair of SIITME 2012

Zsolt ILLYEFALVI-VITÉZ, dr.techn (BME), CSc/PhD (MTA/BME),

DHC (UPB)Publication Chair, Scientific Co-Chair



General ChairPaul SVASTA, “Politehnica” University of Bucharest, Romania

General Co-ChairDan PITICĂ, Technical University of Cluj-Napoca, Romania

Conference ChairMoise Ioan ACHIM, “1 Decembrie 1918” University Alba Iulia, Romania

Conference Co-ChairEmilian CEUCA, “1 Decembrie 1918” University Alba Iulia, Romania

Technical Program ChairDetlef BONFERT, Fraunhofer EMFT, Munich, Germany

Technical Program Co-ChairsCristian FARCAS, Technical University of Cluj-Napoca, RomaniaHeinz WOHLRABE, Dresden University of Technology, Germany

Scientific ChairVlad CEHAN, “Gheorghe Asachi” Technical University of Iaşi, Romania

Scientific Co-ChairsHeinz WOHLRABE, Dresden University of Technology, GermanyZsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary

Publication ChairZsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary

Publication Co-ChairNorocel CODREANU, “Politehnica” University of Bucharest, Romania

WebmasterBogdan ANTON, “Politehnica” University of Bucharest, Romania

International Steering Committee

Tiberiu ABRAHAM, ROEL, RomaniaMoise Ioan ACHIM, “1.Dec.1918” University of Alba Iulia, RomaniaDorel AIORDACHIOAIE “Dunărea de Jos” University of Galaţi, RomaniaMarius BAZU, National Institute for Microtechnologies Bucharest, Romania

Detlef BONFERT, Fraunhofer EMFT, Munich, GermanyAlexandru BORCEA, ARIES, RomaniaPaul Nicolae BORZA, “Transilvania” University of Brasov, RomaniaMihai BRANZEI, “Politehnica” University of Bucharest, RomaniaDaniel BREAZ, “1.Dec.1918”University of Alba Iulia, RomaniaAttila BUCHMAN, North University of Baia Mare, RomaniaVlad CEHAN, Technical University “Gheorghe Asachi” Iaşi, RomaniaEmilian CEUCA, “1.Dec.1918”University of Alba Iulia, RomaniaNorocel Dragoş CODREANU, “Politehnica” University of Bucharest, RomaniaGabriel DIMA, “Politehnica” University of Bucharest, RomaniaPetrin DRUMEA, Research Institute for Hydraulic and Pneumatic, RomaniaRosemari FUICĂ, Association for Promoting Electronic Technology, RomaniaAurel-Stefan GONTEAN, “Politehnica” University of Timişoara, RomaniaTecla GORAŞ, Technical University “Gheorghe Asachi” Iaşi, RomaniaAdrian GRAUR, Universitatea “Ştefan cel Mare” Suceava, RomaniaIoan ILEANA, “1 December 1918” University of Alba Iulia, RomaniaBalázs ILLÉS, Budapest University of Technology and Economics, HungaryZsolt ILLYEFALVI-VITEZ, Budapest University of Technology and Economics, HungaryCiprian IONESCU, “Politehnica” University of Bucharest, RomaniaRadu IONESCU, Radioconsult srl, RomaniaWilhelm KAPPEL, ICPE-CA, RomaniaOliver KRAMMER, Budapest University of Technology and Economics, HungaryIoan LIŢĂ, University of Piteşti, Romania, Pavel MACH, Technical University Prague, Czech RepublicAlexandru MARIN, “Politehnica” University of Bucharest, RomaniaIoan P. MIHU, University “Lucian Blaga” of Sibiu, RomaniaJohann NICOLICS, Vienna University of TechnologyPetre OGRUŢAN, “Transilvania” University of

Committees


Braşov, RomaniaŞtefan ONIGA, North University of Baia Mare, RomaniaGheorghe PANĂ, “Transilvania” University of Braşov, Alena PIETRIKOVA, Technical University of Kosice, SlovakiaDorin PETREUŞ, Technical University of Cluj-Napoca,Dan PITICĂ, Technical University of Cluj- Napoca, RomaniaMaria POPA, “1 December 1918” University of Alba Iulia, RomaniaValentin POPA, “Ştefan cel Mare” University of IaşiJerzy POTENCKI, Rzesow, University of Technology, PolandMarius RANGU, “Politehnica” University of TimişoaraCorina ROTAR, “1 December 1918” University of Alba Iulia, RomaniaWilfried SAUER, Technical University of Dresden, GermanyPaul SCHIOPU, “Politehnica” University of Bucharest, RomaniaGheorghe ŞERBAN, University of Piteşti, RomaniaPaul SVASTA, “Politehnica” University of Bucharest, RomaniaIuliu SZEKELY, “Sapientia” University of Targu Mures, RomaniaMarius TOADER, ALFA TEST RomaniaAdrian TULBURE, “1 December 1918” University of Alba Iulia, RomaniaCarmen TURCU, INTRAROM Bucharest, RomaniaSlavka TZANOVA, Technical University of Sofia, BulgariaDaniel VISAN, University of Pitesti, RomaniaGabriel VLĂDUŢ, ARIES Oltenia, RomaniaDan VUZA, Institute of Mathematics of the Romanian Academy, RomaniaHeinz WOHLRABE, Dresden University of Technology, GermanyKlaus WOLTER, Dresden University of Technology, Germany

Scientific CommitteeVlad CEHAN, Technical University “Gheorghe Asachi” Iaşi, Romania, ChairZsolt ILLYEFALVI-VITEZ, Budapest University of

Technology and Economics, Hungary, Co-ChairHeinz WOHLRABE, Dresden University of Technology, Germany, Co-Chair

Detlef BONFERT, Fraunhofer EMFT, Munich, GermanyMihai BRANZEI, “Politehnica” University of Bucharest, RomaniaStefan CASTRAVETE, CAE – LYNX Europe, Craiova, RomaniaEugen COCA, “Stefan cel Mare” University of Suceava, RomaniaEmilian CEUCA, “1 December 1918” University of Alba Iulia, RomaniaGabriel CHINDRIS, Technical University of Cluj- Napoca, RomaniaGabriel DIMA, “Politehnica” University of Bucharest, RomaniaJuraj DURISIN, TU Kosice, SlovakiaAndrei DRUMEA, “Politehnica” University of Bucharest, RomaniaCristian FARCAS, Technical University of Cluj-Napoca, RomaniaLaurentiu FRANGU, “Dunarea de Jos” University of Galati , RomaniaAurel-Stefan GONTEAN, “Politehnica” University of Timişoara, RomaniaTecla GORAS, Technical University “Gh. Asachi”, Iaşi, RomaniaBalázs ILLÉS, Budapest University of Technology and Economics, HungaryCiprian IONESCU, “Politehnica” University of BucharestRadu IONESCU, Radioconsult srl, RomaniaOliver KRAMMER, Budapest University of Technology and Economics, HungaryPavel MACH, Technical University of Prague, Czech RepublicJohan NICOLICS Vienna University of TechnologyDorin PETREUS, Technical University of Cluj Napoca Alena PIETRIKOVA, Technical University of Kosice, SlovakiaDan PITICA, Technical University of Cluj-Napoca, RomaiaMarius RANGU, Politehnica University of Timisoara, RomaniaAna RUSU, Royal Institute of Technology (KTH) Stockholm, SwedenPaul SCHIOPU ,”Politehnica” University of

Committees

Bucharest, RomaniaPaul SVASTA ,”Politehnica” University of Bucharest, RomaniaSlavka TZANOVA, Technical University of Sofia, BulgariaDaniel VISAN, University of Pitesti, RomaniaMarian VLADESCU, “Politehnica” University of Bucharest, RomaniaDan VUZA, Institute of Mathematics of the Romanian Academy, Romania

Publication Committee

Zsolt ILLYEFALVI-VITEZ, Budapest University of Technology and Economics, Budapest, Hungary, ChairNorocel-Dragos CODREANU, “Politehnica” University of Bucharest, Bucharest, Romania, Co-Chair

Reka BATORFI, Budapest University of Technology and Economics, Hungary,Andreea BONEA, “Politehnica” University of Bucharest, RomaniaRadu BOZOMITU, “Gheorghe Asachi” Technical University of Iaşi, RomaniaEugen COCA, “Stefan cel Mare” University of Suceava, RomaniaRadu COSACEANU, Cavallioti Publishers, Bucharest, RomaniaAndrei DRUMEA, Politehnica University of Bucharest, RomaniaJuraj DURISIN, TU Kosice, SlovakiaCristian FARCAS, TU Cluj-Napoca, RomaniaOliver KRAMMER, Budapest University of Technology and Economics, HungaryMihaela PANTAZICA, Politehnica University of Bucharest, RomaniaDaniel VISAN, University of Pitesti, Romania

Technical Program Committee

Detlef Bonfert, Fraunhofer EMFT, Munich, Germany, ChairCristian FARCAS, Technical University of Cluj- Napoca, Cluj- Napoca, Romania, Co-ChairHeinz WOHLRABE, Dresden University of Technology, Dresden, Germany, Co-Chair

Bogdan ANTON, “Politehnica” University of Bucharest, Romania

Reka BATORFI, Budapest University of Technology and Economics, HungaryAndreea BONEA, “Politehnica” University of Bucharest, RomaniaAlexandru BORCEA, ARIES, RomaniaEmilian CEUCA, University “1 Decembrie 1918″ Alba Iulia, RomaniaGabriel CHINDRIS, Technical University of Cluj Napoca, RomaniaAndrei DRUMEA, “Politehnica” University of Bucharest, RomaniaLaurentiu FRANGU, “Dunarea de Jos” University of Galati , RomaniaRosemari FUICA, Association for Promotion of Electronic Technology, RomaniaAurel-Stefan GONTEAN, “Politehnica” University of Timisoara, RomaniaBalazs ILLES, Budapest University of Technology and Economics, HungaryCiprian IONESCU, “Politehnica” University of Bucharest, RomaniaCristina MARGHESCU, “Politehnica” University of Bucharest, RomaniaGheorghe PANĂ, “Transilvania” University of Brasov, RomaniaMircea RISTEIU, University “1 Decembrie 1918” Alba Iulia, RomaniaAdrian TULBURE, University “1 Decembrie 1918” Alba Iulia, RomaniaAlexandru VASILE, “Politehnica” University of Bucharest, RomaniaDaniel VISAN, University of Pitesti, Romania

Technical Secretariat

Oana BUFU, University “1 Decembrie 1918” Alba Iulia, RomaniaCiprian CUCU, University “1 Decembrie 1918” Alba Iulia, RomaniaConstantin HUTANU, University “1 Decembrie 1918” Alba Iulia, RomaniaDelia LEPADATU, “Politehnica” University of Bucharest, RomaniaMariana PĂTULEANU, “Politehnica” University of Bucharest, RomaniaIoan POCAN, University “1 Decembrie 1918” Alba Iulia, RomaniaSimona SALAJAN, University “1 Decembrie 1918”Alba Iulia, RomaniaAlexandru VASILE, “Politehnica” University of Bucharest, Romania

Committees



Thursday, October 25

19:00 – 21:00 Welcome reception (Hotel restaurant)

21:00 – 22:00 Steering Committee Meeting (Salon Room)

12:00 – 19:00 Registration (Registration desk, Hotel Lobby)

22:00 IEEE – CPMT Hu & Ro Joint Chapter Meeting (Salon Room)

Friday, October 26

06:45 – 07:50 07:30 – 12:00 08:00 – 08:15

08:15 – 09:45

09:50 – 11:10 11:15 – 11:30 11:30 – 12:3012:30 – 13:30 13:30 – 13:40

13:45 – 15:00 15:00 – 15:15 15:15 – 16:40 16:45 – 17:45

18:00 – 19:30 19:30 – 22:00

22:00 – 22:45

Breakfast (Hotel restaurant)Registration (Registration desk, Hotel Lobby)Opening ceremony, Welcome words (Conference Room) Paul SVASTA, SIITME General Chair, “Politehnica” University BucharestDaniel BREAZ, Rector of “1 Decembrie 1918 “ University of Alba Iulia Plenary Session Invited speakers (Conference Room)Oral Session I (Conference Room)Coffee BreakApplication Presentation (Conference Room), (ANSYS 3D Simulation)Lunch (Astoria Hotel restaurant)Evaluator’s panel - Evaluation process, Poster Session General Chair, Heinz WOHLRABE, Dresden University of Technology (Saloon Room)Poster Session I (Conference Room)Coffee BreakPoster Session II (Conference Room)The INNOVATIVE UNIVERSITY, Changing the DNA of Higher Education from the Inside OutModerators: Alexandru BORCEA, President of the Employers Commission ARACIS (Romanian Agency for Quality Assurance in Higher Education)

Marian VLĂDESCU, Member of the Employers Commission ARACIS

Transport to Jidvei – Cetatea de BaltaDinner at Cetatea de Balta, with Culture of the vine, offered by JIDVEI VineyardTransport to Hotel Astoria

Program at a glance


Saturday, October 27

06:45 – 07:50 08:00 – 09:20 09:30 – 10:50 10:50 – 11:15

11:15 – 11:30 11:30 – 12:15

12:15 – 13:00 13:00 – 13:15 13:15 – 14:15 14:15 – 15:35 15:40 – 16:00 16:00 – 17:20 17:30 – 20:00 17.30 – 19:15 19:15 – 20:0020:00 – 23:00 23:00 – 23:45

Breakfast (Hotels restaurant)Oral Session II (Conference Room)Poster Session III (Conference Room)Coffee Break. Preparing for Cultural Program, visit to Alba IuliaTransport from hotel to Alba IuliaThe Guard Changing Ceremony, at the 3-rd Gate of the CitadelVisiting the route of the 3 Fortifications of the CitadelTransport from Alba Iulia to hotelLunch (Astoria Hotel restaurant) Poster Session IV (Conference Room)Coffee BreakOral Session III (Conference Room)Steering Committee Meeting (at Temple of Knights)Cultural Program Visiting Ramet MonasteryTransport to Temple of KnightsConference Dinner and Awarding session (Temple of Knights)Transport to Hotel Astoria

Sunday, October 28

07:30 – 09:0009:00 – 10:00 10:00 – 11:00

Breakfast (Hotel restaurant)Closing ceremony, looking for SIITME 2013, (Conference Room)Farewell coffee, End of Symposium

Program at a glance


Keynote speaker:

Prof. Dr.-Ing. habil. Klaus-Jürgen WolterTechnische Universität Dresden, Germany

Presentation: ”Manufacturing und Characterization of transparent conductive layers for flexible Optoelectronic Devices”

Professional Experience:• Since 2006 Deputy Head of Fraunhofer IZFP Dresden• Since 2003 Director of the Electronic Packaging Lab at Dresden University of Technology• Since 2002 Director of the Centre of Microtechnical Manufacturing• 1992 Appointment to the chair of Procedure Technology of Electronics

Fields of research:• Substrate technologies• Assembly technologies of devices, components, MEMS• Joining technologies• Reliability of electronic packages• Non-destructive test methods Publications:• Co-author of four books in Electronics Packaging• Editor of book series: „Elektronik-Technologie in Forschung und Praxis“• Verlag Dr. Markus Detert, Templin, Band 1 - 16• Editor of book series: „System Integration in Electronic Packaging“• Verlag Dr. Markus Detert, Templin, Band 1 - 5• The research activities result in more than 80 conference presentations /proceedings and in 3 patents.

Fellowships and Honours• Member of: IEEE-CPMT (since 2005), IMAPS, VDE• General Chair of “International Spring Seminar on Electronic Technology” since 2003• Chair of the 5th and 8th International Academic Conference on Electronic Packaging Education and Training• General Chair of 1st Electronics System- Integration Technology Conference 2006• Governor of IEEE-CPMT board since 2006

Keynote speakers


Keynote speakers

Keynote speaker:

Alain Michel Business Development Manager Electronics, EuropeANSYS France

Presentation: ”ANSYS Workflow for Signal Integrity, Power Integrity and EMI/EMC Design”

Alain received his B.Sc. degree from the Technical institute of Ville D’Avray, France, June 1990, having specialized in electronics option ‘microwave technique’.

Dassault Electronique (now Thales Systemes Aéroportés)

CAE support engineer doing training and support for MMIC and MIC designers, and customization and evaluation of microwave CAE tools.

Ansoft France

Application Engineer for high frequency and signal integrity applicationTechnical director, Europe, for high frequency and signal integrity application

ANSYS France

Since January 2011, Business Development Manager Electronics, Europe

SIITME 2012 | Conference Program 15

Keynote speakers

Keynote speaker:

Dr.-Ing. habil. Heinz WohlrabeTechnische Universität Dresden, Germany

Presentation: ”Voids, Solder Balls, Wetting Quality. How we can setup an optimum Soldering Quality?”

Professional Experience:• Since 2000 at the Centre of Microtechnical Manufacturing, Department of Electrical Engineering and Information Technology of Technische Universität Dresden• Dr. –Ing. habil. (Statistical analysis for the quality assurance of the production of electronically devices, 2008) at chair of Procedure Technology of Electronics• Lectures and practical work for students

Fields of research:• mathematical and statistical methods for the production of electronics especially for the quality assurance• Statistical process control• Machine and process capabilities analysis• Design of Experiments and reliability analysis

Publications:• The research activities result in more than 95 conference presentations/proceedings and in 3 books.

Fellowships and Honours• Member of: DGQ, IEEE-CPMT (since 2005)• General Chair of “International Spring Seminar on Electronic Technology”, 2012 elect• Scientific and Technical Programm Co-Chair, SIITME


08:15 – 09:45 Plenary Session Invited Paper

Session Chair:Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary Dan PITICA, Technical University of Cluj-Napoca, Cluj-Napoca, Romania

Invited Papers:

I.1 Manufacturing and Characterization of transparent conductive layers for flexible Optoelectronic DevicesK.-J. WOLTERDresden University of Technology, Dresden, Germany

I.2 Ansys solution for high performance Electronic applicationsA. MICHELANSYS Inc., Europe

Friday, October 26

09:45 – 11:15 Oral Session I Modelling & Simulation

NOTE: Each author must deliver a 20 minutes slide show presentation of his/her work.

Session Chair:Klaus-Jürgen WOLTER, Dresden University of Technology, Dresden, Germany Ismail TAVMAN, Mechanical Eng. Dept., Dokuz Eylul University, Izmir/Turkey

O.1.1 Efficiency Evaluation via Finite Element Method of Magnetostatic Shields using Different Types of Magnetic PotentialsD. Cazacu, S.-C. Castravete 1)

Universitatea din Pitesti, Romania 1) Caelynx Europe, Romania

O.1.2 Forbidden Switching Patterns to Mitigate Crosstalk on Parallel Data Buses - CODEC DesignM. Daraban and D. Pitica, Tehnical University of Cluj-Napoca, Cluj Napoca

Friday, October 26

Oral sessions


08:00 – 09:30 Oral Session II Applied Reliability & Thermal Management


Session Chair:Dorel AIORDACHIOAIE, “Dunarea de Jos” University of Galati, Galati, Romania Ioan ILEANA, ”1 December 1918” University of Alba Iulia, Alba Iulia, Romania

Invited Paper:

I.3 Voids, Solder Balls, Wetting Quality. How we can setup an optimum Sol-dering Quality?H.WOHLRABEDresden University of Technology, Dresden, Germany

O.2.1 Thermal Analysis of Thin Film Transistor Liquid Crystal Display (TFT-LCD) TV Panels with Single Sided LED Bars I. Tavman, A. Turgut, M. Iz1)

Mechanical Eng. Dept., Dokuz Eylul University, Tinaztepe- Buca Izmir/Turkey1) VESTEL Elektronik Sanayi ve Ticaret A.S. Manisa, Izmir/Turkey

O.2.2 Reliability Comparison of Infrared and Vapour Phase SolderingO. Krammer, M. Nagy, Budapest University of Technology and Economics, Budapest, Hungary


Oral sessions

O.1.3 Application-Oriented Robustness Optimization based on MetamodelsA. Oros1), M. Rafaila2), M. Topa1), M. Neag1), and G. Pelz2)

1) Technical University of Cluj-Napoca, Cluj-Napoca, Romania,2) Infineon Technologies, Automotive, Munich, Germany


Oral sessions

16:00 – 17:30 Oral Session III Electronic Design & Technology


Session Chair:Carmen GERIGAN, “Transilvania“ University of Brasov, Brasov, RomaniaDetlef BONFERT, Fraunhofer EMFT, Munich, Germany

O.3.1 Transmission Line Effects in Class D Amplifiers – The Peak Control Function as a Design ToolD. T. Vuza, R. Frosch1), and M. Vlădescu2)

Institute of Mathematics of the Romanian Academy, Bucharest, Romania,1) Freaquent Frosch Electronics GmbH, Graz, Austria

O.3.2 Capacitive Displacement Sensor Embedded in LTCC PackagingN. Blaž1), A. Marić1), G. Radosavljević2), Lj. Živanov1)

1) University of Novi Sad, Faculty of Technical Sciences, Novi Sad, Serbia 2) Vienna University of Technology, Vienna, Austria

O.3.3 Condensation Model of Vapour Phase SolderingB. Illés, A. GéczyBudapest University of Technology and Economics, Budapest, Hungary



Panel discussion

EUR-ACE: The Innovative University

Changing the DNA of the Higher Education from the Inside Out

The world is changing and we have to change our self if we wish to be or remain competitive in a more global world. Traditional, emergent or modern cultures, from the entire world are fertilizing and synergizing each other to create new attitudes, cultures and competences. In one decade, over 40% of the world population will live in the innovation driven economy and the knowledge society. The world values will change radically and the nations which will be not able to start now will have a major handicap to surpass the follower stage, and probably, they will have to wait long time for a new opportunity. The “Europe 2020” strategy is already mentioning a big challenge regarding the future university financing.

But University, as always in the history, could and have to be the communities’ leading force for competitiveness. We have to build on our foundation, but we have to audacious to move forward in the world which is knocking at our doors.EUR-ACE, the European quality label for engineering degree programs developed by ENAEE (European Network for Accreditation of Engineering Education), is a response to all the question marks and challenges of the future engineering programs as leading base of technological innovation by a natural and organic integration of the education in the educational paradigm, related community and global challenge of innovation driven economy and knowledge society.

There are only seven countries of which higher education quality assurance agencies were been accredited for the EUR-ACE label and Romania will be the eights. Even a new one (less than eight years), the EUR-ACE standard is already labeled in more than 360 engineering programs in Germany and over 300 in France as leading countries in implementation of it. Well known universities like Cambridge, TU Munich and TU Berlin already labelled almost all engineering programs of them.ARACIS (Romanian Agency for Quality Assurance in Higher Education) and its Employers Commission is very proud to be one of few organizations worldwide already accredited to label Romanian engineering programs worldwide.

The Panel Discussion at SIITME intends to be an open forum to clarify the impact of the new EUR ACE standard over the engineering education programs.

Alexandru Borcea, MBA – President of the Employers Commission ARACIS

(Romanian Agency for Quality Assurance in Higher Education)


Poster sessions

13:45 – 15:00 Poster Session I (Conference Room)


Session Chair: Ioan LITA, University of Pitesti, Pitesti, Romania Session Co-Chair: Oliver KRAMMER, Budapest University of Technology and Economics, Budapest, Hungary

Evaluators :Dorel AIORDACHIOAIE “Dunărea de Jos” University of Galaţi, Romania Vlad CEHAN, Technical University “Gheorghe Asachi” Iaşi, Romania Laurentiu FRANGU, “Dunarea de Jos” University of Galati , RomaniaCarmen GERIGAN, Transilvania University of Brasov, RomaniaBalázs ILLÉS, Budapest University of Technology and Economics, HungaryZsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, HungaryGheorghe PANĂ, “Transilvania” University of Braşov, Brasov, RomaniaPaul SVASTA, “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P1.1 Personal Assistant RobotA. I. Alexan1), A. R. Osan1) , S. Oniga2)

1) Technical University of Cluj Napoca, North University Center Baia Mare, Romania2) Faculty of Informatics, University of Debrecen, Debrecen, Hungary

P1.2 Effects of technological parameters onto OTFTs’ electrical performanceA. Bonea1), T. Hassinen2), A. Vasile1), P. Svasta1)

1) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania2) VTT Research Center of Finland, Espoo, Finland

P1.3 Capacitive Structures Produced by Printing TechnologyA. Brodeala, A. Vasile, P. Svasta“Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P1.4 Determination of the Sn/IMC Ratio in Solder Joints by Combining Electrochemistry and Confocal MicroscopyT. Hurtony1), A. Bonyár1) and M. Müller2)

1) Budapest University of Technology and Economics, Budapest, Hungary2) Dresden University of Technology, Dresden, Germany

P1.5 Investigations on Organic Printed Resistors Based on PEDOT:PSSC. Ionescu1), D. Bonfert1), P. Svasta1), A. Vasile1)

1) “Politehnica” University of Bucharest, CETTI, Romania2) Fraunhofer EMFT, Munich, Germany

Friday, October 26 Presenter: Stick-up poster before session!


Poster sessions

P1.6 Bidimensional Empirical Mode Decomposition: Application to Images IndexingO. Ait Zemzami, B. Aksasse , and M. Ouanan LEASIA, “Moulay Ismaïl” University, Errachidia, Morocco

P1.7 Practical Behavior of DC-DC Converters in Home Applications - Induction HobE. Ceuca, and E. A. Tulbure“1 Dec 1918” University of Alba Iulia, Alba Iulia, Romania

P1.8 Programmable Hybrid Electric System with Low Electro-magnetic EmissionsB. Mihailescu, P. Svasta, A. Vasile “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P1.9 A Current Distortions Compensation Method for Frequency ConvertersI. Orha1), S. Oniga2)

1) Technical University of Cluj Napoca, North University Center Baia Mare, Romania2) Faculty of Informatics, University of Debrecen, Hungary

P1.10 Practical Behavior of Modern Capacitors for Power Factor CorrectionA. Tulbure1), V. Popa2), and E. Ceuca1)

1) “1 Dec 1918” University of Alba Iulia, Alba Iulia, Romania,2) Maintenance Department, Boromir Ind., Sibiu, Romania

P1.11 LTCC Integrated Miniature Rb Discharge Lamp Module for Stable Optical Pumping in Miniature Atomic Clocks and MagnetometersV. Venkatraman1), F. Vecchio2), T. Maeder2), P. Ryser2) and H. Shea1)

1) LMTS, École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland2) LPM, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland

P1.12 Wireless Sensor Location Systems Comparative Performances EvaluationE. Coca, V. Popa“Stefan cel Mare” University of Suceava, Suceava, Romania

P1.13 Improved Performances Filtering Method for Wireless Sensor Location Positioning SystemsE. Coca, V. Popa”Stefan cel Mare” University of Suceava, Suceava, Romania

P1.14 Over-current and Short-circuit Protection for IGBT’s used in Plasma Generator InverterI. Ciocan, C. Fărcaş, D. Petreuş, N. Palaghiţă and A. GramaTechnical University Cluj-Napoca, Cluj-Napoca, Romania


Poster sessions

P1.15 Implementation of Interactive Communicational Elements on E-Learning Educational PlatformsI. Ciocan, C. Fărcaş, D. Petreuş, N. Palaghiţă and V. Todor, D. Pitică, R. JánóTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

15:15 – 16:40 Poster Session II (Conference Room)


Session Chair: Norocel D. CODREANU, “Politehnica” University of Bucharest, RomaniaSession Co-Chair: Cristian FARCAS, Technical University of Cluj-Napoca, Romania

Evaluators :Detlef BONFERT, Fraunhofer EMFT, Munich, GermanyMihai BRANZEI, “Politehnica” University of Bucharest, RomaniaAurel-Stefan GONTEAN, “Politehnica” University of Timişoara, RomaniaCiprian IONESCU, “Politehnica” University of Bucharest, RomaniaDan PITICĂ, Technical University of Cluj-Napoca, RomaniaPaul SVASTA, “Politehnica” University of Bucharest, Romania Daniel VISAN, University of Pitesti, Romania Klaus WOLTER, Dresden University of Technology, Germany

P2.1 On Wide Frequency Range Airborne Ultrasonic TransducersS. Epure, and D. Aiordachioaie“Dunarea de Jos” University of Galati, Galati, Romania

P2.2 Process Parameter Optimization of Selective Soldering Z. Oláh, M. Ruszinkó, R. Bátorfi, Zs. Illyefalvi-VitézBudapest University of Technology and Economics, Budapest, Hungary

P2.3 Solder Paste Optimization in Thermal Pad PadstackI. Damian, C. Branescu and V. SoarePCB Design Dept., – Bucharest Office, Elmet International SRL Bacau, Romania

P2.4 Investigating Micro-alloyed Solders with Thermal Shock Tests T. Garami, O. KrammerBudapest University of Technology and Economics, Budapest, Hungary

P2.5 Thermocouple Attachment Methods for PCB Profiling During Vapour Phase SolderingA. Géczy, B. Kvanduk, B. Illés and Zs. Illyefalvi-VitézBudapest University of Technology and Economics, Budapest, Hungary

Friday, October 26


Poster sessions

P2.6 Conductive Layer Separation on Biodegradable PCB SubstratesM. Kovacs, A. Geczy, I. HajduBudapest University of Technology and Economics, Budapest, Hungary

P2.7 Study of Glass Transition Temperature of Electrically Conductive AdhesivesD. Bušek and P. MachCzech Technical Univesity in Prague, Prague, Czech Republic

P2.8 Investigating of Electrochemical Migration on Low-Ag Lead-Free Solder AlloysB. Medgyes, D. Rigler, B. Illés, G. Harsányi, and L. GálBudapest University of Technology and Economics, Budapest, Hungary

P2.9 Comparison between Two Surface Insulation Resistance Tests regarding Different Soldering TechniquesM. Pantazică1), C. Marghescu1), C. A. Tămaş2), P. Svasta1), G. Vărzaru1), and I. Plotog1)

1) “Politehnica” University of Bucharest, CETTI, Romania2) Application Design Department, O2Micro, Bucharest, Romania

P2.10 New Approach for Measuring the Surface Tension of SnAgCu 305 Molten Alloy I. Pencea1), C.E. Sfat1), I. Plotog2), M. Branzei1), G.I. Dumitru2)

1) Faculty of Material Science and Engineering, ”Politehnica” University of Bucharest2) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P2.11 Pressure Measurements in a Batch Type Vapour Phase Soldering Station Zs. Péter, A. Géczy, B. Illés, Zs. Illyefalvi-VitézBudapest University of Technology and Economics, Budapest, Hungary

P2.12 Microstructure Comparative Analysis of the Solder Joints Based on SAC/SN100 Soldering Alloy Type Depending on the Cooling RateI. Plotog1), M. Branzei2), I. Pencea2), M. Tarcolea2), G. Dumitru1), N. D. Codreanu1), A. Vasile1)

1) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania2) Faculty of Material Science and Engineering, “Politehnica” University of Bucharest

P2.13 Investigation of the Oxidation Process at the Copper-Solder Interface with Atomic Force MicroscopyAttila Bonyár, Tamás Hurtony, Szabolcs DávidBudapest University of Technology and Economics, Budapest, Hungary


Poster sessions

P2.14 Mechanical Test for Vapor Phase Solder JointsG. I. Dumitru1), A. Tudor1), S. Cănănău1), I. Plotog2), G. Vărzaru2)1) Faculty of Mechanics and Mechatronics, “Politehnica” University of Bucharest2) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P2.15 Lead-Free Solder Joints Testing for Reliability Studies – Mechanical StimulusV. E. Ilian1), M. Bâzu1), V. L. M. Ilian2), L. Gălăteanu1), D. Vârtescu1), and A. Pietriková3)

1) Reliability Laboratory, National Institute for R&D in Microtechnologies, Bucharest2) “Politehnica” University Bucharest, Euroqualrom Laboratory, Romania3) Technical University of Košice, Košice, Slovakia

P2.16 Software in the Loop Environment Reliability for Testing Embedded CodeM. Muresan and D. PiticaTechnical University of Cluj-Napcoa, Cluj-Napoca, Romania

P2.17 Application of Particle Filter Algorithms in an Accurate and Reliable Localization and Tracking of WSN’s Mobile DevicesD. Zevedei, M. Jurian, A. ScutariuUniversity of Pitesti, Pitesti, Romania

09:30 – 10:50 Poster Session III (Conference Room)


Session Chair: Detlef BONFERT, Fraunhofer EMFT, Munich, Germany Session Co-Chair: Laurentiu FRANGU, “Dunarea de Jos” University of Galati, Romania

Evaluators :Stefan CASTRAVETE, CAE – LYNX Europa, Craiova, Romania Emilian CEUCA, “1.Dec.1918”University of Alba Iulia,Romania Norocel Dragoş CODREANU, “Politehnica” University of Bucharest, RomaniaBalázs ILLÉS, Budapest University of Technology and Economics, Hungary Ciprian IONESCU, “Politehnica” University of Bucharest, RomaniaMarian VLADESCU, ”Politehnica” University of Bucharest, RomaniaDan VUZA, Institute of Mathematics of the Romanian Academy, RomaniaKlaus WOLTER, Dresden University of Technology, Germany

P3.1 Software Application for Monitoring and Protection Systems in Low-Voltage Distribution SystemsL.E. Aciu1), P.L. Ogrutan2), and C. Gerigan2)

1) “Transilvania” University of Brasov, Brasov, Romania



Poster sessions

2) Electronics and Computers Department, “Transilvania” University of Brasov, Romania

P3.2 An Embedded Architecture for Distributed ProcessingA. Avadanii and M. NicolaeFaculty of Automatic Control and Computers, “Politehnica” University of Bucharest

P3.3 Resonance in Power Converters CircuitsI. H. Baciu and S. LunguTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.4 Real-time Sensor Acquisition Interfacing using MatLABV. Bande, S. Pop, D. Pitica, I. CiascaiTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.5 Ćuk Converter Employing Indirect Current Control Loop for TEG Energy Harvesting DevicesM. O. Cernaianu, A. Gontean“Politehnica” University of Timisoara, Timisoara, Romania

P3.6 An Inductive System for Measuring Microampere CurrentsC. Cirstea, M. Cernaianu, and A. Gontean”Politehnica” University of Timisoara, Romania

P3.7 Laboratory Platform for Board Temperature Profiling inside Reflow OvensM. Vidraşcu, N. D. Codreanu, R. Lecu, and I. Plotog“Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P3.8 Design Considerations for a Low Power Variable Gain Amplifier for UltrasoundsA. V. Craciun1,2), O.-I. Dudas1)

1) Siemens CT Department, Siemens PSE SRL Brasov, Romania2) ”Transilvania” University of Brasov, Romania

P3.9 Creating a Transducer Electronic Datasheet using I2C Serial EEPROM Memory and PIC32-Based Microcontroller Development BoardB. S. M. Croitoru1), M. Abrudean2), L. Boca1), M. Risteiu1)

1) ”1 Decembrie 1918” University of Alba Iulia, Alba Iulia, Romania2) Technical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.10 Developing a C/C++ Algorithm for Making Analog Sensors Plug & Play over a Network using a Microcontroller Development BoardB. S. M. Croitoru”1 Decembrie 1918” University of Alba Iulia, Alba Iulia, Romania


Poster sessions

P3.11 Comparison between Digital Average Current Mode Control and Digital One Cycle Control for a Bridgeless PFC Boost ConverterR. Etz, T. Patarau, and D. PetreusTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.12 Thermal Modeling and Analysis of a Power Device Heat SinksC. Fărcaş, I. Ciocan, D. Petreuş, and N. PalaghiţăTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.13 A MATLAB Tool to Optimize the Selection of the Decoupling Capacitors in a Power Distribution NetworkR.T. Fizeşan, O. PopTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.14 Thermal Modeling of Through Hole CapacitorsJánó Rajmond, Pitică DanTechnical University of Cluj-Napoca, Cluj-Napoca, Romania

P3.15 Design and Modeling of 13.56 MHz RFID Antenna in Ink-Jet Printing TechnologyM. Kisic1), B. Dakic1), M. Damnjanovic1), A. Menicanin2), N. Blaz1), and Lj. Zivanov1)

1) University of Novi Sad, Faculty of Technical Sciences, Novi Sad, Serbia 2) University of Belgrade, Institute for Multidisciplinary Research, Belgrade, Serbia

14:15 – 15:35 Poster Session IV (Conference Room)


Session Chair: Vlad CEHAN, “Gheorghe Asachi” Technical University of Iaşi, RomaniaSession Co-Chair: Balazs ILLES, Budapest University of Technology and Economics, Hungary

Evaluators :Detlef BONFERT, Fraunhofer EMFT, Munich, GermanyCristian FARCAS, TU Cluj-Napoca, RomaniaCarmen GERIGAN, Transilvania University of Brasov, Romania Ioan ILEANA, „1 December 1918” University of Alba Iulia, Romania Oliver KRAMMER, Budapest University of Technology and Economics, Hungary Ioan LIŢĂ, University of Piteşti, RomaniaPaul SCHIOPU ,”Politehnica” University of Bucharest, RomaniaAdrian TULBURE, University “1 Decembrie 1918” Alba Iulia, Romania



Poster sessions

P4.1 Spherical Coordinates Control System for Accurate Orientation of Directional AntennasI. Lita, D. A. VisanUniversity of Pitesti, Pitesti, Romania

P4.2 FSK Transmission Circuit for Remote Sensors Integration in Distributed Measurement SystemsD. A. Visan, I. LitaUniversity of Pitesti, Pitesti, Romania

P4.3 Computation of a Directional Coupler for RFID SystemsD. T. Vuza1), R. Frosch2), and M. Vlădescu3)

1) Institute of Mathematics of the Romanian Academy, Bucharest, Romania,2) Freaquent Frosch Electronics GmbH, Graz, Austria3) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P4.4 Smart Sensor Implemented with PicoBlaze Multi-Processors TechnologyC. Lung, S. Sabou, C. Barz Techical University of Cluj Napoca, North University Center of Baia Mare, Romania

P4.5 Optimization of LED Assembly for LCD Backlight using Photo-electro-thermal Modeling and Simulation C. Negrea1), E. Lazarciuc1), L. Gabor1) and P. Svasta2)

1) Continental Automotive, Timisoara, Romania2) “Politehnica” University of Bucharest, CETTI, Bucharest, Romania

P4.6 Considerations regarding the Radio Design of GSM-R Systems, inside Railway TunnelsL. M. Nemţoi, I. M. Moise, A. E. Stanciu and C.M. Surugiu“Politehnica” University of Bucharest, Bucharest, Romania

P4.7 Dynamic Measurement Circuit for the Resistive TransducersS. Pop, V. Bande, D. Pitica, I. CiascaiTechnical University of Cluj- Napoca, Cluj- Napoca, Romania

P4.8 Wireless Sensor Network Localization ScenarioR. I. Rusnac, A. Gontean and L. Crişan“Politehnica” University of Timişoara, Romania

P4.9 Inertial Navigation Modular SystemS. Sabou1), C. Lung2), I. Orha2)

1) Technical University of Cluj- Napoca, Cluj- Napoca, Romania2) North University Center of Baia Mare, Baia Mare, România


P4.10 Analog Front-End and Signal Acquisition via Sound ChannelF. Sandu, A. C. Stanca, A. Pasaroiu and G. Pana“Transilvania” University of Brasov, Brasov, Romania

P4.11 Compact Solution forMobile Phono-CardiographyF. Sandu, A.C. Stanca, A.I. Dumitru and C.Gerigan“Transilvania” University of Brasov, Brasov, Romania

P4.12 Method of Emphasis, using Second Order Active Filters Sallen-KeyG. SauciucTechnical University ”Gheorghe Asachi”, Iaşi, România

P4.13 Surface Temperature Measurement with Thermocouple Matrix Using a Switch Control UnitR. Szabó, A. Gontean, and I. Lie”Politehnica” University of Timişoara, Timişoara, România

P4.14 Automatic Capacitor Evaluation and Testing with Characteristic GraphR. Szabó, A. Gontean, and I. Lie”Politehnica” University of Timişoara, Timişoara, România

P4.15 A Matlab Tool for Simulations of Power Resonant Converters A. Tăut and O. PopTechnical University of Cluj-Napoca, Cluj-Napoca Romania

P4.16 A New Methodology for Dynamic Reconfiguration of Structured ASICT. T. TulbureDepartment of Electronics and Computers, ”Transilvania” University, Brasov, Romania

Poster sessions


History and location

Alba Iulia is the site of the ancient Apulum, founded by the Romans in the 2nd cent. A.D., and destroyed by Tatars in 1241. It was the seat (16th–17th cent.) of the princes of Transylvania, of a Roman Catholic bishop, and of an Eastern Orthodox metropolitan.

Alba Iulia

From 1599 to 1601, Alba Iulia was the capital of the united principalities of Walachia, Transylvania, and Moldavia. It was the site (1918) of the proclamation of Transylvania’s union with Romania and of the coronation of King Ferdinand in 1922.

The bulwark fortress of Alba Iulia has been set up between 1714 and 1738 and it is considered to be the most representative of Vauban type in Romania.

The fortress was designed by the Italian architect Giovanni Morando Visconti.

The fortress

Between the 18th and 19th centuries the fortress has served as the military center of Transylvania and also as general armament dump. The perimeter of the walls is about 12 km; 20.000 serves built the walls. The fortress has seven bulwarks (that make it a star shaped one, common to Vauban fortresses.

It is possible to attend cannon shootings and admire the Guard parade.

General information


General information

Jidvei wines are nurtured in the Tarnave Vineyard, laid along the two Tarnave rivers, on the Tarnava Mica, from Zagar to Craciunelul de Jos, and on the Tarnava Mare, from Sighisoara to Craciunelul de Jos.

Some kilometers away from Alba Iulia and 150 kilometers away from the ancient Dacian fortress Sarmisegetuza, the cradle of the old Dacian civilization, the Tarnave Vineyard represents the heart.of a place filled with history and histories, some true, others imaginary, which bring Transylvania a touch of charm. Spread now on a surface of more than 2000 hectares, the vineyard is situated at an altitude between 200- 500 meters, most of the vineyards being set on slopes with southern exposure, which makes the sun rays and atmospheric circulation to favor vine cultures.

Jidvei CastleHistorically attested since 1202 by the name Villa Cuculensis Castri, the locality Cetatea De Balta was the residency of Tarnave county until 1866 when the administration is moved in Tarnaveni.

The present castle was build between 1570 and 1580 and it was rebuild between 1615 and 1624 by the count Stefan Bethlen following the design of the French castle Chambord.

Dinner at Cetatea de Balta, with Culture of the vine, offered by JIDVEI Vineyard

The source of wine – the beautiful vineyards of Jidvei

Waiting to “mature”

Jidvei Castle

General information

According to tradition, the monastic establishment was founded by Father Ghenadie and Father Romulus, who were monks, in 1214.

Visiting Râmeţ Monastery

The painting of the old church is multilayered: the first layer is from 1300, and the second layer from 1310; these two layers could be identified in the pigments of the surface paint by the painter C. Boambes between 1987 and 1988. The third layer, on which a text that dates back to 1377 can be deciphered, was laid on the surface of the arch that is situated between the nave and the pronaos; the fourth layer dates from 1450, the fifth layer from 1600, the sixth layer from 1741, and the seventh layer from 1809.

http://bit.ly/Qv8UQQ

Temple of Knightshttp://www.castel-templul-cavalerilor.ro

The Temple of Knights Castle is situated in the beautiful Trascau Mountains.


CONFERENCE REGISTRATION

The conference fee includes the opening ceremony and welcome reception, full access to all technical (oral and poster) sessions, exhibition area, all meals (breakfasts, coffee breaks, lunches and dinners), three nights accommodation, printed abstracts proceedings, conference proceedings on memory stick, conference kit (conference bag, badge, booklet, pen, and other related objects), and participation to the cultural programme.

CONTACT INFORMATION

Registration Officer

Travel Advisor

Multimedia

Delia Lepădatu0040.745.093.9450040.769.247.904

Emilian Ceuca0040.727.277.627

Adrian Tulbure0040.757.107.210

Bogdan Mihăilescu0040.723.077.221

LOCATION

The conference will take place at Hotel ASTORIA. The address is DN 1, km 387, Romania.

GPS:N 46°4’1”E 23°34’12”Altitude 330 mTime zone EET (UTC+2)Summer (DST) EEST(UTC+3)

General information

SPONSORS

www.aries.ro www.apte.org.ro

www.upb.rowww.mct.ro

www.cetti.ro

www.ieee.rowww.uab.ro

www.cjalba.ro

www.cavallioti.rowww.romstrade.ro

www.alfatest.ro casa-de-vinuri.ro/vin-de-ciumbrud

www.blueairweb.com www.elinclus.rowww.microchip.ro

www.apulum.ro www.jidvei.ro

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