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The top documents tagged [filmsubstrate interface]
ICSM conference in Turkey
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Cubic Boron Nitride Ppt
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Two Simple Models of Thermal Stress Voller-Guzina-Stelson University of Minnesota 1.Residual stress in solidification 2. Crack Patterns in Thermal Processing
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Photonic Curing and the PulseForge Toolset Stan Farnsworth VP Marketing May 2014
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Computational Nano & Micro Mechanics Laboratory UCLA Measurement of Tungsten Armor - Ferritic Steel Interfacial Bond Strength Using a Nanosecond Laser
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Addition of Hydrogen to Ni-Ti Multilayers:
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