×
Log in
Upload File
Most Popular
Study
Business
Design
Technology
Travel
Explore all categories
The top documents tagged [package lead frame]
Packaging. Packaging Requirements Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal
222 views
Lecture32
105 views
Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O Credits: David Harris Harvey Mudd College (Material taken/adapted from Harris’ lecture
225 views
S. Reda EN1600 SP’08 Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging Prof. Sherief Reda Division of Engineering,
243 views
Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 13.1 EE4800 CMOS Digital IC Design & Analysis Lecture 13 Packaging, Power and Clock Distributions
238 views