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The top documents tagged [package parasitics]
Packaging. Packaging Requirements Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal
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ADC Front-End Design Considerations for Telecommunication Satellite Applications presented by Dr. Rajan Bedi
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UK EXPORT CONTROL
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Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O Credits: David Harris Harvey Mudd College (Material taken/adapted from Harris’ lecture
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XC3090
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Fault-Tolerant design of RF front-end circuits P.R. Mukund, Ph.D. Gleason Professor of Electrical Engineering Director, RF/Analog/Mixed-signal Lab (RAMLAB)
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Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 13.1 EE4800 CMOS Digital IC Design & Analysis Lecture 13 Packaging, Power and Clock Distributions
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ADC Front-End Design Considerations for Telecommunication Satellite Applications presented by
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