tape and reel packaging for semiconductor devices

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Tape and Reel Packaging for Semiconductor Devices Technical Data Description This data sheet is intended to cover standards on tape and reel packaging for Avago Technologies’s semicon- ductor devices. This type of tape and reel packaging is designed to be compatible with available automated pick and place machines. 1. Package Outlines 05: 145 mil Surface Mount Plastic (B) 08A: Plastic SO-8 4 0.030 0.89 0.100 ± 0.010 2.54 ± 0.25 0.135 ± 0.015 3.42 ± 0.25 (4 PLCS) 1 3 2 0.008 ± 0.002 0.20 ± 0.05 0.0005 ± 0.010 (0.013 ± 0.25) 0.050 1.27 GROUND RF INPUT RF OUTPUT AND DC BIAS GROUND 0.030 0.76 0.030 0.76 0.145 3.68 0.020 0.51 DIA 0.030 ± 0.010 0.76 ± 0.25 (4 PLCS) Notes: (unless otherwise specified) 1. Dimensions are in 2. Tolerances in .xxx = ± 0.005 mm .xx = ± 0.13 3. Date code character on bottom of package mm 5.84/6.20 (.230/.244) 3.80/4.00 (.1497/.1574) Pin 1 1.27 (.050) 6x 4.72/5.00 (.186/.197) 0.10/0.25 (.004/.0098) 0.33/0.51 (.013/.020) 8X 1.35/1.75 (.0532/.0688) 0.19/0.25 (.0075/.0098) 0.41/1.27 (.016/.050) 0°/8° 0.38 ± 0.10 (.015 ± .004) x 45° 0.10 (.004) Note: 1. Dimensions are shown in millimeters (inches). Related Standard EIA RS481, “Taping of Leadless Components for Au- tomatic Placement.” In case of conflict regarding MSD product, this data sheet will govern.

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Tape and Reel Packaging for Semiconductor Devices

Technical Data

DescriptionThis data sheet is intended to cover standards on tape and reel packaging for Avago Technologies’s semicon-ductor devices. This type of tape and reel packaging is designed to be compatible with available automated pick and place machines.

1. Package Outlines05: 145 mil Surface Mount Plastic (B) 08A: Plastic SO-8

4

0.0300.89

0.100 ± 0.0102.54 ± 0.25

0.135 ± 0.0153.42 ± 0.25

(4 PLCS)

1 3

2

0.008 ± 0.0020.20 ± 0.05

0.0005 ± 0.010 (0.013 ± 0.25)

0.0501.27

GROUND

RF INPUTRF OUTPUTAND DC BIAS

GROUND

0.0300.76

0.0300.76

0.1453.68

0.0200.51

DIA

0.030 ± 0.0100.76 ± 0.25

(4 PLCS)

Notes:(unless otherwise specified)1. Dimensions are in

2. Tolerances in .xxx = ± 0.005 mm .xx = ± 0.133. Date code character on bottom of package

mm

5.84/6.20(.230/.244)

3.80/4.00(.1497/.1574)

Pin 1

1.27 (.050)6x

4.72/5.00(.186/.197)

0.10/0.25(.004/.0098)

0.33/0.51(.013/.020) 8X

1.35/1.75(.0532/.0688)

0.19/0.25(.0075/.0098)

0.41/1.27(.016/.050)

0°/8°

0.38 ± 0.10(.015 ± .004) x 45°

0.10 (.004)

Note:1. Dimensions are shown in millimeters (inches).

Related StandardEIA RS481, “Taping of Leadless Components for Au-tomatic Placement.” In case of conflict regarding MSD product, this data sheet will govern.

1. Package Outlines, continuedOutline SOT-23

Outline SOT-143

DIMENSIONS ARE IN MILLIMETERS (INCHES)

0.10 (0.004) 0.013 (0.0005)

0.92 (0.036)0.78 (0.031)

E

E

B

C

XXX

PACKAGEMARKINGCODE

1.40 (0.055)1.20 (0.047)

2.65 (0.104)2.10 (0.083)

0.54 (0.021)0.37 (0.015)

0.60 (0.024)0.45 (0.018)

2.04 (0.080)1.78 (0.070)

3.06 (0.120)2.80 (0.110)

0.15 (0.006)0.09 (0.003)

1.02 (0.041)0.85 (0.033)

0.69 (0.027)0.45 (0.018)

1. Package Outlines, continuedOutline SOT-323 (SC-70 3 Lead)

Outline 63 (SOT-363/SC-70)

4

1. Package Outlines, continuedOutline TQFP-32 (32 Pin Thin Quad Flat Package)

Outline TQFP-48 (48 Pin Thin Quad Flat Package)

1. Package Outlines, continued

36: Short Lead micro-X (B, D) 84: Short Lead 85 mil Plastic (D)

1

4

3

2

0.51 (0.020)

0.51 (0.020)

DIMENSIONS ARE IN MILLIMETERS (INCHES)DATE CODE MARK ON BOTTOM OF PACKAGE

0.20 ± 0.050(0.008 ± 0.002)

2.15(0.085)

1.52 ± 0.25(0.060 ± 0.010)

5.46 ± 0.25 (0.215 ± 0.010)

SOURCE

DRAIN

SOURCE

GATE

Outline 8676: 70 mil Ceramic

1. Package Outlines, continued

MSOP-3 Surface Mount Plastic Package

SSOP-16

2. Tape Dimensions and Product Orientation

For Outlines SOT-23, SOT-143, and 08A (SOIC-8)

SOT-23 and SOT-143 Dimensions

8

2. Tape Dimensions and Product Orientation, continued

For Outline 08A (SOIC-8)

For Outline 05

add line to bottom of table in Illust file

2. Tape Dimensions and Product Orientation, continued

For Outlines 36, 76, 84, and 86

10

2. Tape Dimensions and Product Orientation, continued

Device Orientation

For Outline 63

11

2. Tape Dimensions and Product Orientation, continued

For Outline SOT-323 (SC-70 3 Lead)

1�

2. Tape Dimensions and Product Orientation, continued For Package MSOP-3

1�

2. Tape Dimensions and Product Orientation, continued For Package SSOP-16

14

2. Tape Dimensions and Product Orientation, continued

For Outlines TQFP-32 and TQFP-48

1�

3. Reel Dimensions

For Outlines SOT-23 and SOT-143

CARRIERTAPE

REEL

COVER TAPE

IDENTIFICATION TAG(EXAMPLE ONLY)

USER DIRECTIONOF FEED

DEV. HSMS-XXXXDATA CODEWAFER #LOT #QTY.Q.A. DATEC.O. MALAYSIAOPTION

DEV. HSMS-XXXXDATA CODEWAFER #LOT #QTY.Q.A. DATEC.O. MALAYSIAOPTION

Ω

C

B

G

T

t

N A

DESCRIPTION SYMBOL SIZE (mm)

7" REEL

SIZE (INCHES)

DIAMETER

THICKNESS, MAXIMUM

SPACE BETWEEN FLANGE

OUTER DIAMETER

SPINDLE HOLE DIAMETER

A

T

G

N

C

178 ± 2.0

14.4

9.50 ± 1.0

66 ± 1.0

13.0 ± 0.5

7.00 ± 0.079

0.570

0.374 ± 0.040

2.598 ± 0.040

0.512 ± 0.020

FLANGE

KEY SLIT WIDTHDEPTHLOCATION

B

Ω

θ

2.0 ± 0.54.0 ± 0.5120° ± 5°

0.079 + 0.0200.16 ± 0.020

SIZE (mm)

13" REEL

SIZE (INCHES)

330 ± 2.0

14.4

9.15 ± 0.75

55 min

13.0 ± 0.5

13.0 ± 0.079

0.570

0.361 ± 0.03

12.16 min

0.512 ± 0.02

1.5 min4.0 ± 0.5120° ± 5°

0.059 min0.16 ± 0.020

HUB

Notes:1. Metric dimensions will govern. �2. Drawing is not to scale. �3. Diodes available on 7" reels only. �4. Monolithic amplifiers and transistors available on 7" (-TR1) and 13" (-TR2) reels. ��

1�

3. Reel Dimensions, continued

For Outlines 05, 08A, 36, 76, 84, and 86

1�

4. Packing—Leader and Trailer

For Outlines SOT-23 and SOT-143

PackingFor Outlines 05, 08A, 36, 76, 84, and 86

18

5. MaterialsFor Outlines 23 and 143

A. Carrier Tape: Static dissipative polystyrene Surface resistivity: 10� Ω/square maximum

B. Cover Tape: Antistatic semi-transparent polyester

C. Reel: Cardboard (�")

6. Device Orientation and Ordering Information for DiodesFor Outlines 23 and 143

Specify part number followed by option. For example:

HSMS - XXXX L XX �0 = Bulk or �1 = Tape and Reel Option

L = Low Profile

Part Number

Prefix*

* AT = Transistor MSA = Monolithic Silicon Amplifier HSMS = Surface Mount Schottky SOT-��/14� HSMP = Surface Mount PIN SOT-��/14�

Conforms to Electronic Industries Standard RS-481 “Taping of Surface Mounted Components for Automated Placement.” Standard Quantity is �,000 Devices/Reel for SOT-��/14�.

For Outlines 05, 08A, 36, 76, 84, and 86

A. Carrier Tape: Conductive PVC Surface resistivity: 1.8 x 10� Ω/square

B. Cover Tape: Semi-transparent polyester

C. Reel: Plastic

Option L31 for SOT-23 Packages. Option L31 for SOT-143 Packages.

1�

6. Device Orientation and Ordering Information for DiodesFor Outlines 05, 08A, 36, 76, 84, and 86Tape and Reel Options

Package 05

Packages 36, 76, 84, and 86

Part Number Ordering Information

Package Tape Width Reel Devices Part Number Style (mm) Size per Reel Suffix

0� 1� �" �00 -TR1 08A, ��, �4, 84, 8� 1� �" 1,000 -TR1 SOT-14� 8 �" �,000 -TR1Notes:1. Minimum order quantity is one (1) reel.�. Orders are required to be in increments of the single reel quantity.�. To order, specify the device part number followed by the appropriate suffix.

Example: ATF-13136-TR1

Package ���" reel1,000 devices/reel

Package 08A

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5091-2201E5966-3702E - November 1, 2007