technical challenges for sip transceivers for data center ... · sip allowed extensive use of...

Arlon Martin

OFC 2016

Technical Challenges for SiP Transceivers for Data

Center Applications

© 2016 Mellanox Technologies 2

High-Performance Designed 100Gb/s Interconnect Solutions

Transceivers, Active Optical

and Copper Cables, VOAs

(10 / 25 / 40 / 50 / 56 / 100Gb/s)VCSELs, Silicon Photonics and Copper

36 EDR (100Gb/s) Ports, <90ns Latency

Throughput of 7.2Tb/s

7.02 Billion msg/sec (195M msg/sec/port)

100Gb/s Adapter, 0.7us latency

150 million messages per second

(10 / 25 / 40 / 50 / 56 / 100Gb/s)

32 100GbE Ports, 64 25/50GbE Ports

(10 / 25 / 40 / 50 / 100GbE)

Throughput of 6.4Tb/s


How silicon photonics came to dominate the VOA market

The response time of the SiP VOA is 10-100x faster than competing technologies, enabling new applications


SiP allowed extensive use of low-cost FTTH packaging techniques

FTTH style

Fiber Assembly

VOA die

Ceramic

carrier

Glass block overlay

for durability

Second Fiber

Assembly

Attaches Here

• Scalable manufacturing

• Capacity of >1m/year

• Low-cost package

• Non-hermetic

• 3um waveguides

• Fiber arrays

• Butt coupling

• No TEC

• Multi-channel

Market for SiP VOAs continues to increase as new applications ramp into production


Low-cost 100G transceiver assembly borrows from VOA

This is the first and only 100G production transceiver with no laser subassembly

Flip-chip bonded laser

• No lens

• No isolator

• No TOSA

Integrated Ge detectors

• Broadband 1310-1550

• No ROSA

Non-hermetic package

• No TEC

• No seam sealing

• No leak tests

• No “gold bricks”

Fiber Arrays

• No grating couplers

• No lens

• No isolator


The 100Gb/s SiP chips which enable low-cost manufacturing

We can keep the same low-cost QSFP package and scale from 100G to 200G


Avoiding expensive “gold brick” approach

Seam sealing machine for hermetic packaging


Mellanox and InnoLight Announce the Availability and Interoperability of

100Gb/s PSM4 Transceivers at 1310 and 1550nm Wavelengths

Enables Ecosystem of Solutions for Next Generation Cloud, Web 2.0 and Enterprise

Data Centers


Silicon Photonics 100G WDM Tx and Rx Chips

Tx Chip

Rx Chip

Flip-chip

bonded laser

array

Fiber block


200G transmitter w/ F-K modulators: clean optical eye at 50Gb/s

Measured Lage Signal

RF Performance of FK Modulator

• 50Gb/s optical eye

• Measured large signal RF

performance of FK modulator

Small signal frequency response for FK modulator.

With -3.0V bias, and 3dB bandwidth of 60GGHz means

device is capable to modulate 60 Gb/s optical signal


200Gb/s SiP detector performance: very clean eye at 50Gb/s

50Gb/s germanium photodetector

Excellent large signal RF device

performance

Small signal frequency response for detector

3dB bandwidth > 45GHz means device is capable

of detecting >60 Gb/s optical signal


The Future for Silicon Photonics in Data Center Fabrics


Scales to 200G in QSFP56 Form Factor

LinkX™ Silicon Photonics: Designed for Data Center Economics

Mellanox silicon photonics chips, drivers and TIAs, QSFP modules, Integrated WDM

No WDM specific lasers, No laser sub-assembly, No hermetic packages

No active laser alignment, No detector sub assembly

Innovation

Integration

Low power

Visit us at Booth 3425

VOA

Thank You

technical challenges for sip transceivers for data center ... · sip allowed extensive use of...

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