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Technics 800 Micro RIE Operating Manual Description Reactive Ion Etch Series 800 Plasma System (MICRO‐RIE) (Appendix: Figure 1) uses a radio frequency signal to generate plasma of chemically reactive gas used to etch various materials. The system generates low pressure, low temperature, and gaseous plasma. The surface to be etched is placed directly onto the cathode and momentum transfer plays a significant role in the etching process. Thus by varying the process parameters, etching may be done either isotropically and anisotropically. The RIE has three mass flow controllers (MFCs) to assure precise control of the process gases. The exhaust valve controller controls chamber pressure. The power supply provides up to 300 watts at 30KHz. The system can support four‐inch wafers however different size and shape samples can be mounted. Safety 1. Before using this tool, users must be properly trained and certified by Lab staff. 2. DO NOT rely on the interlocks or valve controls on this system to shut off gas bottles. Always use the manual shut‐off valves and proper purging procedures (Appendix: Figure 3). 3. Plasma is a source of UV radiation. Do not look directly into plasma for long periods. 4. If the machine malfunctions any time during the process, press emergency shut off button (Appendix: Figure 2) and call NCNC staff. a. Lab Phone 2‐9831 b. Bob Prohaska 2‐1094 Initial System Check 1. Check the logbook for latest entry and comments. 2. Make sure the system is ON. Check to see that the L.E.D. displays are ON (Appendix: Figure 1). 3. The system should be in MAN mode (Appendix: Figure 4). 4. Exhaust valve controller settings (Appendix: Figure 5). a. Make sure the exhaust valve controller is ON. If the controller is in OFF position, turn it on and allow fifteen minutes to warm up. b. Confirm that the INT/EXT toggle is in the INT position. c. The input toggle should be in 1V position. d. The set‐point dial should be set to zero.

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Page 1: Technics 800 RIE Operation Manual - Engineering Researchresearch.engineering.ucdavis.edu/cnm2/wp-content/...Technics 800 Micro RIE Operating Manual Description Reactive Ion Etch Series

Technics800MicroRIEOperatingManualDescriptionReactiveIonEtchSeries800PlasmaSystem(MICRO‐RIE)(Appendix:Figure1)usesaradiofrequencysignaltogenerateplasmaofchemicallyreactivegasusedtoetchvariousmaterials.Thesystemgenerateslowpressure,lowtemperature,andgaseousplasma.Thesurfacetobeetchedisplaceddirectlyontothecathodeandmomentumtransferplaysasignificantroleintheetchingprocess.Thusbyvaryingtheprocessparameters,etchingmaybedoneeitherisotropicallyandanisotropically.TheRIEhasthreemassflowcontrollers(MFCs)toassureprecisecontroloftheprocessgases.Theexhaustvalvecontrollercontrolschamberpressure.Thepowersupplyprovidesupto300wattsat30KHz.Thesystemcansupportfour‐inchwafershoweverdifferentsizeandshapesamplescanbemounted.

Safety

1. Beforeusingthistool,usersmustbeproperlytrainedandcertifiedbyLabstaff.2. DONOTrelyontheinterlocksorvalvecontrolsonthissystemtoshutoffgas

bottles.Alwaysusethemanualshut‐offvalvesandproperpurgingprocedures(Appendix:Figure3).

3. PlasmaisasourceofUVradiation.Donotlookdirectlyintoplasmaforlongperiods.

4. Ifthemachinemalfunctionsanytimeduringtheprocess,pressemergencyshutoffbutton(Appendix:Figure2)andcallNCNCstaff.

a. LabPhone 2‐9831b. BobProhaska 2‐1094

InitialSystemCheck

1. Checkthelogbookforlatestentryandcomments.2. MakesurethesystemisON.ChecktoseethattheL.E.D.displaysareON

(Appendix:Figure1).3. ThesystemshouldbeinMANmode(Appendix:Figure4).4. Exhaustvalvecontrollersettings(Appendix:Figure5).

a. MakesuretheexhaustvalvecontrollerisON.IfthecontrollerisinOFFposition,turnitonandallowfifteenminutestowarmup.

b. ConfirmthattheINT/EXTtoggleisintheINTposition.c. Theinputtoggleshouldbein1Vposition.d. Theset‐pointdialshouldbesettozero.

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5. Makesurethegasesyouwanttouseareconnectedtothesystem.

StartupandEtchprocedure

Determineyourrecipe1. Filmtoetched(SiO2,Si3N4,PR,etc).2. Thicknessifknown3. Lookupsimilarrecipeinthelogbook.Notethe(i)typesofgasesneeded,(ii)flow

ratesinsccm,(iii)pressureinmTorr,(iv)powerinwatts,(v)timeneededifrelevant.

LoadingSample

Toloadasample/samplesputSol’ntoCLOSEpositionandOPENVent.Waitaboutoneminutetoopenthechamberandwipeanyparticlesaroundthechamber.NowCLOSEVent.Loadyoursampleandclosethechamber.PutSol’ntoOPENposition(Appendix:Figure4).Note:Ifyouareusingsmallsamplesuseslowpumpoptionfor2‐5minutes(Appendix:Figure4).

SetetchparametersandetchingNote:Beforestartingtheetchingprocess,arrangeyourownstopwatch/timerforetching.1. Gotothecylindersandopenthemanualshutoffvalvefortherequiredgases

(SF6/O2orCF4/O2orO2).DONOTADJUSTthepressureregulatorsvalvebetweenthetwodialgauges.

2. Setyourgasflowsandflipontherequiredgasswitches(Appendix:Figure6).a. Selectthegasusinggasselectionknob.

i. A:O2ii. B:CF4iii. C:SF6

b. Settheread/setdialknobtoSET.c. Usegasregulatorknobforparticulargastosettheflows.d. Turnonthetoggleswitch.

3. Waittillthechamberhaspumpdownto25mTorr(.025Torr).Thenturnon(flipup)

theGAS1switch(Appendix:Figure4).YouwillseetheLEDlightslitup

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Note:Youcouldusemorethanonegas,followthesameprocedurefroma‐d.Settheread/setdialtoREADtoreadthegasflowoftheselectedgasonthegasselectionknob.

4. Adjustthesetpointdialoftheexhaustvalvecontrollertotherequiredsettings.DoublecheckwiththepressuredisplayontheRIE.Youshouldseethepressuredisplaychangingasyouturnsetpointdial.Waituntilthepressurestabilizes.

5. TurnONthepowerswitchandsetthepowersettingdisplayontheRIE.Plasmawillignite(Appendix:Figure4).

6. Onceyouaredonewiththeetchingprocessa. TurnthepowertoOFFpositionb. TurntheGas1switchtoOFF(flipdown)position.c. TurnOFFthetoggleswitchesongasses.d. Turnthepressurevalvecontrollertozero.DONOTTOUCHANYTHINGELSE.

UnloadingtheSample

1. WaittillthepressuredisplayontheRIEshows25mTorr.StopPumpDown(Sol’n

Close),purgebyventingonandoffquickly(VentOpenthenClose),andStartPumpDown(Sol’nOpen).Repeatfor3times.

2. StopPumpDown(Sol’nClose).StartVent(VentOpen).Waitaboutoneminuteandopenthechamber.StopVent(VentClose).RemoveSample.

3. WipeandcleanchamberwithIPAifnecessary.CloseChamber.PumpDown(Sol’nOpen).

4. WaittillpressuredisplayonRIEshows25mTorr,StopPumpDown(Sol’nClose)andnotethefinaldisplayedpressurereadingafter1mininthelogbook.

5. Gotothegascylindersandclosemanualshut‐offvalves.DONOTADJUSTTHEPRESSUREREGULATORKNOBthatisbetweenthedialgauges.

6. CommentontheLogBook.

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Appendix:

Figure1:Technics800RIESystem

Figure2:EmergencyShutoffButton

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Figure3:GasCylinderRegulator

Figure4:EtchParameters

Figure4:SystemControlPanel

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Figure5:Pressure/ExhaustValveControl

Figure6:GasSelectionandRegulatorPanel