The 16th IEEE International NEWCAS Conference will be held in Montréal, Canada, on June 24-27, 2018, at the La Plaza Congress center. As with previous editions, it will reflect the wide spectrum of topics, research and practice in the field of circuits and systems, and offer an international forum of exchange for ideas and results. There will also be tutorials, special sessions and keynote talks by prominent experts on current topics in microsystems research. This year’s edition is oriented towards IoT and smart low-power devices.

The topics include, but are not limited to:

Analog/mixed-signal circuits Biomedical circuits and systemsCAD and design tools Test and verificatiion

Communication circuits and systemsRF and microwave circuits

Computer architecture and memory Digital circuits Data and signal processing Low-power low-voltage designs Energy harvesting circuits Neuromorphic circuits and systems

Imaging and image sensorsEmbedded systems Sensory circuits and systemsTechnology trends

For detailed information on proposal and paper submission procedures, please refer to the conference website at www.newcas2018.org

Submission - Only electronic submissions will be accepted. Complete 4-page papers (in standard IEEE double-column conference format) should be submitted in PDF for-mat that is IEEE Xplore compliant. Accepted technical and special session papers will appear in IEEE Xplore digital library.

ScheduleDeadline for full paper submission: Feb. 17, 2018 Mar. 4, 2018Deadline for tutorial and special session proposals: Feb. 17, 2018 Feb. 24, 2018Notification of acceptance: Apr. 20, 2018 Apr. 23, 2018Submission deadline of final manuscript: May 18, 2018

About Montreal – The union of European charm and North American attitude, Montreal seduces with its harmonious chorus of the ancient and the new, from exquisite architecture to fine dining, and a joie de vivre refelected by numerous sporty and cultural events, of which the international jazz festival right after NEWCAS.

General co-chairs Mounir Boukadoum, UQAM, CAMohamad Sawan, Polytechnique Montréal, CA

Technical program co-chairsErkan Isa, Fraunhofer-Gesellschaft, DE Yvon Savaria, Polytechnique Montréal, CA

Tutorial co-chairs Glenn Cowan, Concordia University, CA Patricia Desgreys, Télécom Paris Tech, FR Yann Deval, Université de Bordeaux, FR

Special session co-chairs Hervé Barthélemy, U. Sud Toulon-Var, FR Nathalie Deltimple, U. de Bordeaux, FR Ahmed Lakhsassi, UQO, CA

Publications co-chairs Jean-Pierre David, Polytechnique Montréal, CA Ghyslain Gagnon, ETS, CA

Finance chair Wessam Ajib, UQAM, CA

Local arrangements chair Frédéric Nabki, ETS, CA

Industry liaison Éric Kerhervé, U. de Bordeaux, FRDaniel Massicotte, UQTR, CAPeter Stokes, CMC Microsystems, CA

Publicity co-chairs Majid Ahmadi, U. of Windsor, CAMagdy Bayoumi, U. of Louisiana Lafayette, US Jean-Baptiste Bégueret, U. de bordeaux, FRShuenn-Yuh Lee, National Cheng Kung U., TW Shahriar Mirabbasi, CARicardo Reis, U.F. Rio Grande do Sul, BR Zhihua Wang, Tsinghua University, CN

Conference logistics Éric Legua, ReSMiQ, CAJasmine Létourneau, EquusCreations, CA