the challenge and opportunity of more-than-moore … · the challenge and opportunity of...

Applied Materials Confidential

The Challenge and Opportunity of

More-Than-Moore (MTM)

Technology Transitions

Rossella MininniStrategic Marketing Manager, 200mm Equipment Product Group

Semicon Europe, November 15th, 2017

| Applied Materials Confidential

Outline

Changing Semiconductor Landscape

Applied Materials ≤200mm MTM Portfolio

Manufacturing Challenges

Example 200mm/300mm Transition Technologies

Conclusion

2


www

3

Semiconductor Market Evolution

PC + Internet

Mobile +

Social Media

Artificial Intelligence

+ Visual Computing

VR / AR

IoT / Smart devices

Big Data

AI / Machine learning

Smart vehicles

Industry 4.0

Additive manufacturing

* 2000 – 2009 ** 2010 – 2016

2000 2010 2016

Av. WFE = $25.5B* Av. WFE = $32.3B** Av. WFE =

External Use


Semiconductor Market Outlook

4

Gartner Forecast; Dec 2016

► Smart Phone: rising units number and need for new

technologies – despite overall growth slow down

► Automotive: ADAS, Electrification, Telematics (4G/5G),

Infotainment, miniaturization key factors

► Datacenter/Server: IoT / Increased ‘Cloud’ presence -

onset of photonic technology inflection

► Communication Infrastructure: 5G at the Base Station

& the Node

► Industrial: Industry 4.0, Building Automation and Control,

Robotics & Drones for industrial applications

► Consumer: IoT, 4G/5G, Virtual & Augmented Reality

(VR/AR), Artificial Intelligence (AI), Drones & Robotics,

Wireless Charging

► Markets post-2021: Automotive; 5G; Mobile Health; Next

generation Virtual and Augmented Reality; Robotics &

Drones

2016

Semi rev

($B)

CAGR 2016-20

$0

$20

$40

$60

$80

$100

-2% 0% 2% 4% 6% 8% 10% 12%

Smart Phone PC

Consumer Comm. Infras.

Industrial Auto

Server Tablets


Emerging/MTM Application Technologies on 200mm

Smartphone, Tablet & PC

Automotive(Safety, Navigation, ECM, Etc.)

Consumer

Industrial Applications

5

Today ≤200mm represent > 70% of all IC content across all major market segments

End Market Drivers

Communication

• Advanced Logic

• Advanced Memory

• Packaging : Fan-out

• Image Sensor (28nm - 180nm)

• Analog Device (90nm - 180nm)

• Power IC (130nm - 350nm)

• MEMS, Sensors, RF (0.5μm - 5μm)

• Packaging Fan-in

Enabling Devices (Nodes)


Emerging/MTM Application Technologies on 200mm

Smartphone, Tablet & PC

Automotive(Safety, Navigation, ECM, Etc.)

Consumer

Industrial Applications

6

Today ≤200mm represent > 70% of all IC content across all major market segments

End Market Drivers

Communication

• Advanced Logic

• Advanced Memory

• Packaging : Fan-out

• Image Sensor (28nm - 180nm)

• Analog Device (90nm - 180nm)

• Power IC (130nm - 350nm)

• MEMS, Sensors, RF (0.5μm - 5μm)

• Packaging Fan-in

Enabling Devices (Nodes)


Additional

tools Productivity

On wafer

performance

New

materials &

Technologies

MTM Device Technologies: Opportunities for ≤200mm

State of the Art Manufacturing

Facility for New and

Refurbished Tools

Service Solutionsto Enhance

Tool Capability & Improve

Fab Efficiency

Product Development and Customer Demo Center

Spare Solutions for guaranteed

Quality,Value and Parts

supply

Extending Tool Lifetimes & Enabling New Technologies


200mm

Equipment

Availability

Supply ChainImprove

Performance

New HW and

Process

Development

MTM Device Technologies: Challenges for ≤200mm

Core Availability

Core Cost

PartAvailability

Qualified Supplier

New ToolsBuilt

PartCost

Obsolescence PartQuality

Process CIP

UpgradesNew

Material

New HW

Extending Tool Lifetimes & Enabling New Technologies

Technology Inflection


≤200mm Infrastructure

9

Implant - Gloucester &

Newburyport, MA

ViiSion, ViiSta,

z

Xi’an, China Demo & Development Lab - 6 systems

Endura® PVD Mirra Mesa®

CMPEtch CenturaProducer® CVDEndura® PVD Epi Centura

PDC - Rehovot, Israel

Multiple systems

CD/DR/WI Tools

PPC – Kalispell, MO

Multiple systems

z

Manufacturing Facility – Austin, TX


≤ 200mm Manufacturing Facility - Austin, TX

92,000 sq ft. of manufacturing and warehouse , with 22 Test Bays (full final test)

In-house component repairs/testing

Capability to ramp up to 50 tools / quarter

Manufacturing services for all Applied Materials product lines

Supply chain and direct materials management, Obsolescence Protection

10 External Use


≤200mm Equipment Portfolio

ImplantE220/500

Kestrel

VIISion 80/200

ThermalCentura

RTP

Epi (ATM/RP)

LPCVD

Gate

Inspection

& MetrologySEMVision

Compass

Complus

VeraSEM

NanoSEM

VeritySEM

PVD

Endura®

Al (Slab/Fill)

Liner/Barrier

iLB

CuBS

ALPS Al / Co

CleanW™

SIP TTN

CVD

Centura®

Producer®

DxZ Silane

DxZ TEOS

DxZ SACVD

Gigafill SACVD

Ultima HDP

WxZ and WEB

Etch

Centura

MxP®

Super-E

Metal/Poly DPS

ASP+

eMAX

CMP

Mirra®

Mirra Mesa

Oxide

Tungsten

STI / Poly

Copper

11

Supporting the MTM evolution with innovative ≤200mm platform technologies

External Use

| Applied Materials Confidential12

Key 200mm Upgrades

CVD Ultima to Ultima Plus Ceramic Clean Gas Manifold Slit Valve Door Vita™ Controller (Centura & Producer)

Etch Ceramic and EP E-chucks Black jacket turbo pump High temp. throttling gate valve Y2O3 Kit coating Slit Valve Door

PVD Source Magnet Tachometer EZ LCF (Local Center Finder) MCA E-chuck

Implant E2/E5: 1GHz Control System

Productivity PlusThin Wafer

VIISion: Memory Upgrade

Thermal Motorized lift Radiance WRLD Upgrade High growth rate Epi

PDC SEMVision “Plus” Upgrades ComPlus Generation Upgrades

EPG WF 150916

CMP Multi-Zone Heads EZ UPA PM Reduction Kit Distributed Slurry Delivery Arm


MTM Product Demo & DevelopmentXi’an, China based Customer Demo and Product Development Facility

c-Si/TF Solar

Labs

AGS Semi Lab

12 KW TF Solar

Array

B1

B2

AGS Training

Center

56KW c-Si Solar

Array

LED LabScreen Printer

Mfg

Located in Xi’an China

New products and applications development, customer demos

Product enhancements, material & software testing and qual

R&D Testing

13 External Use


Ch

am

be

r

Te

ch

no

log

y

Key Market Opportunities based on Technology Inflections

14

De

vic

e

Ap

pli

ca

tio

n

On

Wa

fer

Te

ch

no

log

y

Soliton™ Pronto™ HDR Al Altum™

Fingerprint

Sensor RF Filter

Next Gen

MicrophoneIGBT / SJMPower Device

EPI WafersPower / MEMS

AlN / ScAlN / PZT ATM Blanket Epi ≤12µm Al Critical Etch For MEMS

High Power MOSFETsNext Generation

MEMS Gyroscopes


Committed to New Product Development Execution

15

R&DMFG

Deliverables:

Pilot capability

Producibility engineering

Low cost sourcing

Testing strategies

Lead time reduction

DFX

Deliverables:

Meet Customer needs

New product designs

Prototypes

Mfg support

New Products

Revised HW Designs

Customer

Performance Feedback

Clear ownership

with strong ties

to Business Unit

Increased new products customization drives need to rapidly commercialize through manufacturing

External Use


AGS Service & Spares Portfolio

On Demand Comprehensive ServicesPerformance ServiceKPI: On wafer specs

UNIT

PROCESS

ValuePerformance service with advanced service

technologies and Equipment specific

performance commitmentsManaged ServiceKPI: Supplier Dependent Uptime

OUTPUT

ValueIncreased Uptime at a predictable cost for

greater Equipment availability. Preventive Maintenance1

KPI: First Time rightOUTPUT

Included to meet KPI‒ Shift coverage as required

‒ Response Time as required‒ Corrective Maintenance labor‒ All PM labor, Wet Cleans

‒ Consumables‒ TKM (All Cleaning), Swap Kits

‒ DPY parts

‒ Non Consumables2

‒ Access to Experts for escalations

‒ Proprietary Service Technologies (FSS)‒ Fab Vantage

‒ Software: Enhancements, Upgrades

SUPPLY CHAIN ASSURANCEValuePreventive maintenance done right

TransactionalTotal Kit ManagementKPI: Kit to qualify

Included to meet KPI‒ Response Time: Scheduled – On Time‒ Shift coverage ≤7X12‒ All PM labor, Wet Cleans included

‒ Consumables‒ TKM( All Cleaning), Swap Kits

Included if required to meet KPI‒ DPY parts

‒ Access to Experts for escalations

‒ Proprietary Service Technologies (FSS)‒ Fab Vantage3

ValueApplied Certified

ValueKit availability on time

‒ Kit management for chamber process kits.

‒ Paid Service‒ Transactional Spares, Repair

Standard ServiceKPI: Response Time

OUTPUT

Forecast Parts ManagementKPI: On Time to Schedule

ValueExpert response to Equipment downs for

corrective maintenanceValueSupply Chain management Included to meet KPI

‒ 5x8 coverage, Response time: 8 covered hrs.

‒ Access to Experts for escalations‒ Corrective maintenance labor‒ ≥ Quarterly PM labor, Wet Cleans excluded

‒ Consumables b illable‒ Non consumables2

‒ Software Bug fixes

Included to meet KPI‒ Shift Coverage, Response time as required

‒ Corrective maintenance labor‒ All PM labor, Wet Cleans ‒ Consumables,

‒ TKM ( All Cleaning), Swap Kits

‒ Non Consumables2

‒ Software Bug fixes

Included to meet KPI ‒ Scheduled:>97% within 24hrs of schedule, remaining within 7

days of schedule.

‒ Unscheduled: >90% within 7 business days of request,

remaining within 14 business days of request.

1Attachable to Warranty, Post Warranty & Standard Service. Not sold separately2Some parts exclusions apply.

3One FV project included if>12Tools covered.

For additional Service products, get in touch with your Account Sales ManagerV 4.2 01/27/17

What We Offer - Service

► Flexible portfolio for custom

solutions

► Advanced predictive and

diagnostic technologies

► Innovative technology

extension and conversion

► World-class expertise and

knowledge-base systems

What We Offer - Spares

► Broad portfolio with focus on

value and parts availability

► Steady stream of available parts including CIP

► Solution to refurbishment and quality issues

► Performance guaranteed on new or refurbished parts

Work with customers to boost Fab operational excellence


Manufacturing ChallengesOvercoming The Supply Chain For ≤200mm

17


200mm Used Open Market Inventory Overview

External Use

Cores scarcity on the open market driving up the cost of used 200mm equipment

EPG building more 200mm new tools to be able to fulfill customer demand

Revenue Quarters

Q1'12 Q2'12 Q3'12 Q4'12 Q1'13 Q2'13 Q3'13 Q4'13 Q1'14 Q2'14 Q3'14 Q4'14 Q1'15 Q2'15Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17

Nu

mb

er

of

Ite

ms

200mm Core Quarterly ActivityCores OUT Cores IN Net Open Market Items


150mm/200mm Core Market ASP Trends

Scarcity of cores on the open market increasing ASP pressure for specific tool or chamber

19

Revenue Quarters

External Use

Ave

rag

e S

ale

s P

rice (

AS

P)

0

100

200

300

400

500

600

Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17 Q4'17 Q1'18Proj

150/200mm Core Market Price Changes

Mirra Mesa

Mirra Stand Alone

Producer Split

Centura DxZ

CII DPS+ Metal Etch

CII Oxide Etch

TPCC Xe+ (3 CH)

Endura iLB

Endura PVD / Al

SEMVision G3


Refurbished vs. New Tool Builds

Increasing percentage of new tools adding pricing challenges AND parts supply issues

20 External Use

Revenue Quarters

Nu

mb

er

of

Syste

ms

0%

10%

20%

30%

40%

50%

60%

70%

Q1'14 Q2'14 Q3'14 Q4'14 Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17 Q4'17 Q1'18(Proj)

Core Refurb vs. New Mainframe BuildsCore Refurb New Mainframe Builds % of New Mainframe Builds


Used vs. New Content Utilization

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Q2'14 Q3'14 Q4'14 Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17

QoQ Material Utilization

From Core Value Used Content Value New

21

Mate

rial


Example 200mm/300mm Transition

TechnologiesMTM Defined As ≥45nm Technology Node

22


200mm to 300mm Transition

The 200mm/300mm transition will occur in MTM on an opportunistic basis23 External Use

Drivers for

300mm transition

Available Depreciated300mm Line

OpportunityFor

Disruption

Technology Existing on

300mm

WLCSPRequired

More Sophisticated

ASIC

Volume / ASP Pressure

Examples of device transitioned to 300mm

Analog

RF AlN / ScAlN

Based Devices

Disruptive Technologies

MCUCIS

Examples of device that may transition to 300mm


Smart Phone Consumer* Automotive Industrial Communication

Infrastructures

Server Other

2016 2020 2016 2020 2016 2020 2016 2020 2016 2020 2016 2020 2016 2020

End User Application Market IC Revenue - by Wafer Size

24

4337

1915

4

27

161616

504755

49

6

4

159

8

510

1311

17

13

1113

44

1515141317

13

2727

2323

62

72

58

2

1

2

4

49

41

1616

21

13

35

2120

63

26

300mm Legacy 300mm Leading Edge200mm Legacy

Source EPG marketing, Gartner 2016, Yole Developpement 2016;, Data Beans Est. (TI, 2013)

* Consumer includes PC and Tablets

300mm IC Revenue increasing in all application markets through 2020 and representing ~70% of the total IC revenue 300mm legacy IC revenue growing ~3x faster than 300mm leading edge IC revenue driven

200mm IC Revenue flat to slightly up through 2020 in application markets reflecting increased wafer starts and capacity adds

Eroding ASPs and profits shifting up the supply chain negatively impacting 200mm IC Revenue despite increased wafer demand

CMOS: Memory 300mm & 30% of total CMOS revenue; Logic revenue @ 200mm 30% of total logic

CIS, Analog and Power revenue would be either 200mm or 300mm (legacy ), MEMS all 200mm

YoY % of 300mm revenue +2% for CMOS and CIS / +6% for Analog and 9% Power 1% 300mm revenue by 2020 for MEMS

IC Revenue ($B) 2016 2020 CAGR 2016-2020

200mm 108 111 0.5%

300mm Legacy 47 71 10.8%

300mm Leading Edge 184 211 3.5%

Total IC Revenue 340 393 3.7%


Advanced RF/pDC PVD Chamber For MTM Films

Soliton serves a broad variety of PVD films : Piezo-Films, AlN, Sc:AlN, VOx, Mag. Aligned Films, Others (Al2O3, Ta)

Application segments include MEMS & Sensors , Power Device & LEDs (e.g., GaN on Si)

External Use

Next Generation

RF/pDC PVD


Advanced RF/pDC PVD Chamber For MTM Films

Soliton serves a broad variety of PVD films : Piezo-Films, AlN, Sc:AlN, VOx, Mag. Aligned Films, Others (Al2O3, Ta)

Application segments include MEMS & Sensors , Power Device & LEDs (e.g., GaN on Si)

External Use

300mm pDC PVD

(Wafer Carrier 2”, 4”,6”,8”)

200mm Next Generation

RF/pDC PVD

Key Challenge: Transfer High Temp

(800°C) capability


High Deposition Rate Thick Aluminum (Al) For Applications In Power and MEMS Devices

27

200mm HDR Al

External Use

Single pass solution for ≤12µm films

High productivity <3µm/min deposition rate

(2x) productivity of standard Al chamber

> 50% improvement compared to the available solutions in

marketplace

Defect free films, no whiskers, hillocks

Production proven at an automotive customer site

Lowest CoO – available as an upgrade or chamber add to

existing platforms, no need to introduce a new platform

Thick Aluminum

(400°C )

Thermal Grooving Aluminum Whisker Hillock Formation


High Deposition Rate Thick Aluminum (Al) 200mm/300mm Transition

28

200mm HDR Al 300mm Alexandria

External Use

key challenge: match power density

and wafer temperature

control


Advanced Deep Reactive Ion Etch (DRIE)DRIE for Power, MEMS and Packaging Technologies

New Etch Processes for SiC

and GaN Applications

GaN Etch SiC Etch

DPS-DTM

(≤200mm)

DPS II – Silvia / Silvia-N

(200mm/300mm)

Transitioning MTM Technologies to

200mm/300mm Capable Tools

High Aspect Ratio

(>110:1)

Sub-Micron CD

(<< 200nm)

High Etch Rate

(>25µ/min)

29 External Use


Improved Productivity

Tighter Process Control

New Software Capability

Hardware

Thickness Profile (nu. <0 .7%) Resistivity Profile (nu. < 2.0%)

Growth Rate Profile

0

1

2

3

4

5

6

7

8

0 5 10 15 20 25 30

Gro

wth

Rate

(u

m/m

in)

TCS Flow (slm)

STD Chamber GR (um/min) HGR GR (um/min)

95

969798

99100101102

103104105

-100 -75 -50 -25 0 25 50 75 100

Th

ick

ne

ss

Distance from center [mm]

Y Axis X Axis

37

38

39

40

41

42

43

44

45

-100 -75 -50 -25 0 25 50 75 100

Rs

Distance from center [mm]

Y Axis X Axis

HGR Epi Chamber

High Growth Rate Epi-SiliconPower Device, MEMS & Wafering Applications

External Use30


Summary: MTM Opportunities & Challenges

MTM applications are growing surely driving up demand for ≤200mm

and potentially boosting legacy 300mm (≥45nm tech node) production

technologies

There are both HW and process challenges fostered by this

increasing demand at 200mm and below …. and migrating even

existing MTM processes from 200mm to 300mm will pose additional

one

Refurbished tool market slowly drying up leading to increasing ASPs

of the legacy tools and higher percentage of new tool builds

31 External Use


Conclusion

Applied Materials Supports MTM Device Technologies by:

Continued Investments to enhance productivity and develop new

materials and process addressing the latest requirement and inflections in MEMS,

Power, Analog, CIS, Packaging & CMOS

Working with leading R&D organizations to ensure our film and

technologies are demonstrated at the device level

Constantly looking for new ways to grow our portfolio of advanced tools

and comprehensive service— we're eager to collaborate with you!

Applied Materials - Your trusted Partner for

≤200mm and 300mm Technology and Equipment

32 External Use

the challenge and opportunity of more-than-moore … · the challenge and opportunity of...

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