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TOWARDS A SUSTAINABLE ELECTROMAGNETIC ENVIRONMENT

April 2006

THE EMC TECHNOLOGY ROADMAP

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Prof. Dr. Ir. Ing. Frank Leferink, Thales Frank.Leferink@nl.thalesgroup.com

Ir. Marcel van Doorn, Philips Marcel.van.Doorn@philips.com

Dr. Amaury Soubeyran, EADS Amaury.Soubeyran@eads.net

Prof. dr. Christos Christopoulos, Univ. of Nottingham Christos.Christopoulos@nottingham.ac.uk

Dr. Marco Leone, Siemens Marco.Leone@siemens.com

Ir. Chris van den Dries, Dutch EMC-ESD Associaton cdr@fme.nl

CORE TEAM MEMBERS

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Page 4 RATIONALE AND OBJECTIVES 5 HISTORY 6 VISION: TRENDS & NEEDS 10 STRATEGIC RESEARCH AGENDA 14 NEXT STEPS 15 STAKEHOLDERS LIST

Representatives from the electronics industry together with the academic and research communities have developed Vision 2020: The EMC Technology Roadmap. This document charts a future direction for EMC technology that can meet the demands of tomorrow’s electronics industry. The roadmap serves as the starting point for a future focused dialogue among industry leaders, researchers and governments. Continued collaboration – including periodic updating of the vision and roadmap – will be key to realizing the vision on the EMC technology domain.

TABLE OF CONTENTS

Electromagnetic Compatibility (EMC)

is the ability of a device, equipment or system to functionsatisfactorily in its electromagnetic environment withoutintroducing intolerable electromagnetic disturbances toanything in that environment. The prevention of known adverse effects on health causedby human exposure to electromagnetic fields (EMF) is partof the EMC technology domain (from 0 Hz to 300 GHz).

PREFACE

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Electromagnetic Compatibility (EMC) underpins almost all engineering activities and influences our daily life more than ever in a time that the number of EMC problems is rapidly increasing. In the coming years the electromagnetic environment will drastically change. A high-speed digital lifestyle and a widespread proliferation of (wireless) devices will, without well-timed and properly informed action, result in an increase of interference problems in homes, vehicles, hospitals, factories, aircrafts, etc. In addition to this ‘natural’ environment, intentional electromagnetic threats are also now emerging to which unprotected systems will be vulnerable. Without a coordinated development program in which all stakeholders are involved, this increasingly complex electromagnetic environment cannot be controlled anymore and will lead to more and more interference problems and safety hazards, possibly aggravated by intentional malicious aggressions. Europe’s goal to achieve sustainable growth, competitiveness, and security can only be achieved through a better quality and cooperation of the entire EMC research and innovation community. This does not only include the capacity to create new EMC knowledge, but also an understanding of how the EMC knowledge might be used, applied and implemented by industry. Competitive advantage will also come from the existence of an effective know-how transfer from science to useful application in industry. In addition to that, the public fear of electromagnetic fields introduces often non-technical issues where a collaborative approach between researchers from different areas, including medical and psychological experts, is needed. However, because EMC issues arise everywhere, in any product and environment, research and engineering activities are fragmented. This fragmentation poses a big disadvantage, that is EMC research and innovation does not receive sufficiently coherent attention to establish a determined push towards lower costs and higher social and economic benefits. In our view, long-term fundamental work of strategic nature in EMC is required now to support emerging technologies and prevent new threats. A European Technology Network on Sustainable Electromagnetic Environments (ETN-SEE) has been established to facilitate, coordinate, and accelerate the development and acceptance of technologies that will create in the future an electromagnetic friendly and secure society.

RATIONALE AND OBJECTIVES

OBJECTIVES ETN-SEE • Establish a clear strategic vision on EMC • Strengthen EMC innovation • Enhance international cooperation • Improve cooperation between industry and

research institutes • Alleviate fragmentation in research

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September 2004: At the EMC Europe conference in Eindhoven industry experts and academics

decided to establish an Industry Forum on EMC, in order to include EMC as a strategic technology domain in the technology programs of the EU.

February 2005: At the EMC conference in Zurich the Industry Forum decided to go for a

European Technology Platform Sustainable Electromagnetic Environments ETP-SEE (EMC including EMF). Publication of the document “Towards an EMC Technology Platform” (47 pages).

March/May 2005: Presentation of the list of stakeholders and summary vision document to the

EU DG representatives. A formal application letter was sent to the European Commissioners with the request to establish an ETP on EMC & EMF.

July 2005: Response to the application letter by Viviane Reding, member of the European

Commission, to further analyse the best approach for developing a research agenda in the field of EMC, including EMF.

December 2005: Renaming of the envisaged ETP-SEE to European Technology Network on

Sustainable Electromagnetic Environments (ETN-SEE), in line with the advice of the European Commission to set-up an ETN to create a broad network and foster links with ETPs, acknowledge the importance of the subjects.

February 2006: Roadmap workshop with the ETN-SEE core team in Brussels. During this

workshop an EMC research topics questionnaire for the stakeholders was prepared.

March 2006: Strategic Research Agenda discussion with stakeholders during the COST 286

meeting in Barcelona. Input and feedback on the research topics questionnaire was discussed. Working groups to workout the EMC research proposals were defined.

EXAMPLES OF ELECTROMAGNETIC INTERFERENCE • Airbags activated by mobile telephones resulted in the recall of millions of cars. • Pacemakers disturbed by security ports. • Motor management system stopped a car unintentionally due to high field

strengths. • Wheelchair starts rolling when using a mobile phone.

HISTORY

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The developers of the vision on the EMC technology domain identified several technological, economical, and social trends that will impose new demands on EMC technology.

Semiconductors technology The main building blocks of an electronic system

are the Integrated Circuits (ICs). According to the International Technology Roadmap for Semiconductors 2004, the communication speed between the chips is increasing and is projected to be 29 GHz with an on-chip clock of 33 GHz in the year 2015. To reach these higher speeds ICs are using increasingly lower voltages, e.g. 0.8 V in 2015. This means that their logic thresholds are lower, the noise margin is going down and they are becoming more vulnerable to interference. Radiated emissions will increase because of faster switching edges and hence more energy in a harmonic spectrum that extends to higher frequencies. Signal integrity problems will also increase due to the continuing reduction in rise times and the increase in clock frequencies. Over the coming decade the number and variety of potential disturbance sources and victims is set to increase exponentially. This will lead to an astronomical increase in the risk of interference. The question of how to control interference is becoming a key issue in system design.

Explosion of wireless devices The number of users of mobile systems is growing exponentially. The wireless and wired spectrum will get overcrowded with applications such as GSM (Global System for Mobile communication), UMTS (Universal Mobile Telephone system), BlueTooth, WLAN (Wireless Local Area Network), UWB (Ultra Wide Band), ADSL (Asymmetric Digital Subscriber Line, and PLC (Power Line Communication). Legislation by itself (e.g. spectrum trading) will not be able to cope with assigning the extra channels and capacity needed. Technological improvements will be key to a sustained and compatible diversification and parallel operation of communication systems.

VISION: TRENDS & NEEDS

The Connected Home

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Information & Communication Technology A high-speed digital lifestyle is emerging. By 2010 all products are expected to have digital components incorporated. Time-to-market and product lifecycles are becoming increasingly shorter. EMC often lies on the critical path of the product creation process. The risk of re-design has to be reduced and design efficiency has to be improved. Future generations of sensor systems (‘smart dust’) will rely on wireless systems, because of fragility and impracticality of fibre-optic-based channels. Such systems are characterized by large numbers of highly sensitive and low-power sensor/actuator pairs. Both the integration of the sensor arrays in an existing EM ambient, as well as telemetry aspects will require the associated EMC problem to be defined and tackled from the outset.

Transport Cars, planes, vessels, and trains are more and more controlled by sensitive electronic systems, which make these transportation systems sensitive to electromagnetic interferences. The electronics inside the transportation systems are causing interference with radio communication systems. New transport applications with an EMC impact are: automatic driving with fail safe technology, radar technology for sensing obstacles and objects, intelligent traffic/weather sensors, wireless networking technology in and between cars, etc. Many systems, especially airplanes, are limited screened against electromagnetic fields due to the replacement of metal by composite materials, resulting in more and more vulnerable systems.

Human Exposure to EM Fields (EMF) There is growing concern about the potentially harmful effects on human beings of exposure to electromagnetic fields (EMF). Standardization bodies in Europe – and worldwide – are developing standards to limit EMF exposure for humans. The goal is to prevent any known adverse effects on health caused by exposure to electromagnetic fields in the frequency range from 0 Hz to 300 GHz. Legislation requires compliance with the EMF standards. To comply with the new EMF standards, it is necessary to develop an EMF competence. Future applications in the fields of wireless

VISION STATEMENTS • The coming 15 years ‘designing

for EMC compliance’ will stay on the critical path of the product creation process.

• In the coming years EMC/SI modeling & simulations at sub-system level will become essential.

• EMC expert systems will close the gap between complete system and sub-system simulations.

Brain-implants

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connectivity, wearable electronics, on/in-body sensors, and healthcare add further weight to the EMF issue.

Intentional EM interference (terrorism) Intentional and/or high-power electromagnetic interference is increasingly seen as a potential weapon of large scale malfunction and terrorism. A proper understanding of the threats and how to mitigate fall-out in a variety of critical systems and components is essential to tackling the problem head-on, and must be addressed at supra-national and governmental level. The fact that targeted systems are often situated in consumer rather than military markets, makes this a focus issue for the civilian sector as well. A recent example of intentional EMI is a small source capable to disturb or even destroy RFID devices. EMC standardization New EMC standards have to be developed for products with high clock frequencies, digital modulation techniques and wired & wireless communication devices. There are enough changes taking place in the electrical environment to warrant reassessment of the present limits, such as digital services, consumer awareness, and the increase in amount of electronic equipment. We need to develop a database of defined protection levels for radio services that can be used as a basis for deriving future EMC limits. The current EMC test methods have their origins in analogue technology and the limits are based on the protection of analogue radio and TV services below 1 GHz. Digital radio services have different tolerances to broadband and narrow band interference than analogue radio services. Urgent investigations are needed into what the effect of this will be in terms of interference limits and test methods for digital radio/TV products. Resolving the digital EMC problem is going to be a major challenge in the coming decade. EMC of networks and installations is a missing link in the current mass of EMC standards. Many wired home networks use the existing power or telephone wiring and – without co-ordination – this will lead to EMC problems. Ever since the publication of the first European Directive 89/336/EEC on EMC of 03 May 1989 (enforced 1 Jan 1996), the interest of product committees in standards and their application has

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been growing. Several international standards related to EMC, often with European participants or organizers as key members have been, or are in the process of being developed. Progress has often been slowed by the shortages in concerted funded efforts related to some more fundamental research on specific test facilities and methods.

Increasingly dense EM environment Increasingly, co-existence and compatibility of electrical and electronic systems is an issue of complex and dynamically changing environment of partially known or specified sources of radiation. Therefore, traditional approaches based on (over) simplified models and isolated operation and performance are no longer adequate in today’s increasingly dense EM environment. An integral systems approach rooted in sound electromagnetic principles and design and analysis techniques, as offered by EMC technology, offers the best guarantees for sustained benign electronic developments. EMC as enabling technology EMC is inherently a question of EM interactions within complex environments and/or systems. As an individual discipline, EMC studies EM interactions, both at the fundamental and applied level. EMC must therefore be seen as an enabling technology for continued improvement and successes in electronic technologies.

Integral design approach

EMC COSTS

The EMC related costs constitute 1 – 5% of the sales price of electrical andelectronic goods. With a European sales volume in electronics of around 500Billion euro, the EMC financial impact is in the range of 5 to 25 Billion euro ayear.

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Achieving the vision will require strategies for investing in EMC research and development. Four main EMC technology themes emerged from the vision and roadmapping process: Theme 1: EMC Methodologies Theme 2: EMC Standardization / Control Theme 3: EM Safety / Security Theme 4: EM Modeling & Simulation These strategies are supported by a series of high-priority activities that will directly lead to their fulfillment. These activities were judged by the stakeholders to be achievable in the short (less than three years), medium (three to ten years) to long-term (more than ten years). The tables on the next pages show the strategic research agenda in more detail. For each theme the topics that were ranked with the highest priority have been marked bold.

STRATEGIC RESEARCH AGENDA

EMC TECHNOLOGY ROADMAP FRAMEWORK

EMC TECHNOLOGY DEVELOPMENT STRATEGIES • Develop new methods & tools to decrease emission and increase

immunity of components, and (sub-)systems. • Control the future EM environment by legislation &

standardization: new test methods, frequency-bands, limits, …

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TIMEFRAME*

No

EMC RESEARCH TOPICS

S M L THEME I:

EMC METHODOLOGIES

1 Materials / meta-materials - Innovative materials for EMC applications - Incl. nanotechnology, shielding, and

filtering

x x

2 Signal- & Power Integrity x x 3 EMC impact of new technologies

- Communication technologies - Automotive hybrid drives - Power electronics drives - Sensor technologies

x x x

4 Interconnects - Wireless (antenna’s, co-existence, …) - Wired (PLC, High-Speed buses, …)

x x x

5 EMC of semiconductor devices x x x 6 Transients protection (ESD, lightning) x

*S = Short-term (< 3 years), M = Medium-term (3 to 10 years), L = Long-term (> 10 years)

TIMEFRAME*

No

EMC RESEARCH TOPICS

S M L THEME II:

EMC STANDARDIZATION / CONTROL

7 New test methods - Test methods above 1 GHz: RVC, TEM, - Statistical vs. deterministic data

evaluation - Diagnostic methods - IC/module testing for system

characterization - Methodologies for translation of EMC

requirements between various (sub)-system levels

- In-situ testing (large systems) - Measurement / compliance uncertainty - Fast emission measurements in time domain

x x x

8 Unification of standards - Multimedia, Defense, Automotive,

Aerospace, Electro-medical devices

x x

9 EM spectrum management - Intentional and unintentional radiators

x x x

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TIMEFRAME*

No

EMC RESEARCH TOPICS

S M L THEME III:

EM SAFETY / SECURITY

10 EMF: Human exposure to EM fields - Exposure assessment and mitigation

techniques

x x

11 Product Safety (EMC for functional safety) - Risk based EMC

x x

12 IEMI: Intentional Electromagnetic Interference

x x

TIMEFRAME*

No

EMC RESEARCH TOPICS

S M L THEME IV:

EM MODELING & SIMULATION

13 New computational techniques - Hybrid techniques for multi-scale

problems (FDTD, TLM, PO, …) - Multidisciplinary techniques for concurrent

engineering (EMC, thermal, mechanical, …)

x x x

14 Modeling of novel materials x x 15 Non-deterministic modeling x x 16 Expert systems / design tools

- For components, board, cables/connectors, and systems

- EMC/SI/PI verification, analysis, synthesis

x x x

17 Certification by simulation x x 18 EM dosimetry x

BENEFITS FROM EMC RESEARCH & DEVELOPMENT • Predictable development time; prevention of a delayed market introduction

due to EMC/EMF problems. • Risk reduction in new technologies/applications/business. • Reduction of costly interference reduction techniques. • Balance between quality and cost price of a product. • Fewer complaints from the field. • Compliance with the statutory international standards on EMC and EMF.

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Can these aims be achieved within existing Technology Platforms? Several existing Technology Platforms (TPs) have an interest in EMC, EMF and associated topics. There is no doubt that some EMC related work has been done over the years as part of ongoing work in other thematic areas. What has been missing however is a coordinated effort to address generic technology issues. There are several examples: • The general development of modeling and simulation techniques as part of a con-

current design environment. It is not sensible to believe that such a major development can be accomplished piece meal by addressing specific sectoral requirements when a generic approach would result to more powerful tools of general applicability. This however must be done in close association with industry so that tools are developed that are relevant to and usable by industry.

• The development and harmonization of standards can best be done within the context of sound science and a general outlook encompassing the present and future needs of a multitude of users. It is a truism to say that one industry’s signals are noise and interference for another.

• Novelty and innovation can best be fostered when the resources and the vision of dedicated professionals are merged together to push forward major high-risk research programs. We mention in particular, the use of simulation for compliance assessment, a statistical view of EMC, the treatment of complexity in practical systems etc.

• There is considerable fragmentation of research with the current way of doing things. Is there sufficient interaction between practitioners in EMC, Signal Integrity and Communications to ensure that the linkages, compromises and optimization between different technologies (not forgetting the human factor) are all fully considered in a design? We believe that a long-term coordinated research effort is required to address these issues, which are central to the development and acceptance of new technologies, and products, where compatibility, inter-operability, co-existence and multi-functionality will be paramount.

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The EMC Technology Roadmap outlines a view of where the electronics industry is today, a vision of where its stakeholders want to go tomorrow, and strategies on how to get there. It provides guidance to government, industry, and academia on the direction of future activities.

Working Groups are established for each strategic research topic. The task of the Working Groups is to create high-level brief project descriptions for their specific research topics. Through the definition of a strategic research agenda they will influence policy in the Seventh Framework Program (FP7) and hence, in due course, lead to the development of specific projects, which will be submitted through normal channels for EU funding.

The European Technology Network on Sustainable Electromagnetic Environments (ETN-SEE) will seek to work with and not replace the work of existing Technology Platforms (TPs). Many areas of concern mentioned in this document represent “horizontal issues” and therefore can be best addressed by the new ETN-SEE coordinating and focusing the work in the relevant area of several TPs. In some cases, where no existing TPs have a significant activity, the ETN-SEE will play a more independent role. The objective in all cases will be to address all issues which impact on the electromagnetic design of complex systems.

NEXT STEPS

Links between EMC technology themes and European Technology Platforms

European Technology Platforms: ACARE Advisory Council for Aeronautics Research in Europe ARTEMIS Embedded Systems ECTP The European Construction Technology Platform EMobility The Mobile and Wireless Communications Technology Platform ENIAC Nanoelectronics Initiative Advisory Council ERRAC European Rail Research Advisory Council ERTRAC European Road Transport Research Advisory Council ESTP The European Space Technology Platform NEM European Initiative on NETWORKED and ELECTRONIC MEDIA ……..

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The following companies and organizations actively participated in the development of the EMC technology roadmap:

National Physical Laboratory, England National Centre for Scientific Research “Democritos”, Greece EADS, France University of Rome ‘La Sapienza’, Italy Cherry Clough Consultants, England NPL, England Centro Ricerche Fiat, Italy EMC Srl, Italy Swedish Defence Research Agency, FOI, Sweden LAAS-CNRS, France University of Liege, Belgium Philips, Netherlands IEEA, France Renault, France IETR, France Technische Universiteit Eindhoven Bolls Radgivning, Denmark Thales, France Flomerics, France CERPEM, France Electronics Cell, Belgium Politecnico di Torino, Italy University of Fiorentina, Italy Qinetiq, England Katholieke Hogeschool Brugge-Oostende, Belgium University of Nottingham MBDA, United Kingdom Wavecontrol, Spain SIQ, Slovenia Mier Comunicaciones, S.A., Spain Montena emc sa, Switzerland Ficosa International, S.A., Spain University of Lille, France Sharp Electronica, Espana, Spain Laboratoire National de Métrologie Vereniging FME-CWM, Netherlands University of Rennes, INSA, France ST Microelectronics, France Groupe President Electronics, Spain University of L’Aquila, Italy Selenia Communications SpA, Italy Audi AG, Germany Hrvatska Elektropriveda d.d., Croatia University of Hannover, Germany CE-test, Netherlands

BAESYSTEMS Avionics Ltd., England INRETS, France TNO Prevention and Care, Netherlands QinetiQ, England N.V. Nederlandsche Apparatenfabriek “Nedap”, Netherlands Dutch Amateur Radio Organization, VERON, Netherlands RadioCAD Ltd., England Bolls Radgivning, Denmark Fraunhofer-Izm, Germany Technical University of Lodz, Poland Airbus Deutschland GmbH, Germany EADS, Germany CISPR, England Ministry of Defence, Royal Navy, Netherlands Slovak University of Technology, Slovakia Infoplan Mérnökiroda Kft., Hungary Stork Fokker AESP B.V., Netherlands KPN Mobile, Netherlands ARC Seibersdorf Research GmbH, Austria INDIBA S.A., Spain University of Twente, Netherlands Thales, Netherlands Siemens A.G. Germany BAE Systems, England Ministry of Defence, France National Institute of Telecommunications, Poland Siemens VDO Automotive, Italy IRSEEM, France INTESPACE, France University of Fiorentina, Italy CST, France Polish Office of Telecommunications and Post Regulation, Poland Ecole Polytechnique Fédérale de Lausanne, Switzerland ONERA, France ESEO, France ESAOTE, Italy Eurocopter, England ATMEL, France University of Split, Croatia EXENDIS, Netherlands

EPF Lausanne, Switzerland PROTECTA Co. Ltd., Hungary Ramon Llull University, Spain Gps microSAT S.A., Spain Skydata Engineering s.r.l., Italy Zuken, Germany AA / SSEA, Italy MIRA, England AD TELECOM, Spain Aristotle University of Thessaloniki, Greece CE SEAT, S.A., Spain SIEMENS-CNX, Italy Institute of Logistics and Warehousing, Poland Technical University of Catalonia, Spain Wroclaw University of Technology, Poland Ministry of Defense – United Kingdom, England Nederlands Meetinstituut, Netherlands Université Paul Cézanne d’AIX – MARSEILLE, France Eindhoven University of Technology, Netherlands Galileo Avionica, Italy ETH, Switzerland Royal Philips Electronics, Netherlands Budapest University of Technology and Economics, Hungary NLR, Netherlands TÜV Product Service Ltd, England Swedish National Testing and Research Institute, Sweden Nederlandse EMC-ESD Vereniging, Netherlands The University of York, United Kingdom

STAKEHOLDERS LIST

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For more information, contact: European Technology Network on Sustainable Electromagnetic Environments (EMC and EMF) Website: http://www.emc-esd.nl/ (link: ETN-SEE)

CONTACT