the picture of quality

37
Market surveyon luminescence imaging reveals rival inspection technol ogies are reall y well- matched pals The picture of quality Text: Shravan Kumar Chu nduri o Hi ghlights This year's survey inc ludes 114 imag- ing systems and 32cameras Electroluminescence is becoming a standard inspection procedu re at var- ious stages 01module product ion At cell -level characterization, etec. trorummescence imaging is often used as a subsystem oliV testers With its non -con tact process for in- specting cells, onotciummescencc is emerging as a credible option Photoluminescence IDols to forecast electrical performance of as-cut Wil- lers before processing are already on the market 134 N ext to IV testing, a compulso ry quality check that every PV device produced has to undergo,dectroluminescence (EL) imaging is emerging as the most important character- izing technique to rate the quality of PV sub- strates. With its ability to peek into the silicon bulk and map a wide rangeoflnherent and pro- cess-induced defects in silicon substrates, El, imaging has already become a standard mea- surement practi ce at major module factories. But El is not the only imaging system on the ma rket. Anothe r proce ss for putti ng cells to the inherent-flaw test - photoluminescence (Pl)- cont inues to make headway. Unlike El , where handling the cells is essential for inspection tests, Pl is a non -contac t process. And Pl is not only proving extremel y attrac- tive for cells, but also in characterizing semi- processed and as-cut wafers to extrapolate potential efficiencies - it can even peer into silicon bricks to de tect flaws. And that is why El and PI., while perhaps rivals at the celllevel, are actually complimen - tary technologies that provide quality control along the value chain of production from sili- con bricks to finished modules. As a result, an increasing number of imaging suppliers are coming out with both El and PL systems. And the desire for Pl is set to grow. That is because this year's holiest news is about quasi- monocrystalline silicon wafers. This new class of silicon materi al, undoub tedly on the radar 5CRen of nearly every wafer manu facturer, is claiming it can marr y the higher-efficiency performance of monocrystalline with the manufacturing process and cost of multicrys- talline silicon (see PI 612011, p. 260). While quasi-mono wafers provide the same lumi nous response as other silicon substrates, the inter- nal flawsare different, mainly in regard to the higher dislocation density (see box, p_ 138). Pl involves the response of excitation of the sample by means of an external light source, while El is ob tained by biasing the subs tra te. In both cases, these systems are configured to capture the luminous response of PV sub- strates via a charge-coupled device (CCD) camera, the most important component of the systems. The electrons injec ted into the semicon ductor material recom bine radia- tively with the available holes by transferring their excess ene rgy to an emit ted pho ton. For silicon, this emitted light is in the range of 950 to 1,250 nm with its peak at nearly 1,150 nm . The CCD came ras integ rated into these system s record this low-level light. Ideally, homogeneous luminescence-inte nsity distri- bution is expected, but the defects present in the substrates cause disruption, enab ling the offending flaws to be mapped. PL also allows these wafers to be sorted at an earlier stage according to potential output. In a gambit to be ready for the day when quas i-mon ocrys talline blocks hit the big time, severalluminescence imaging supp liers are already working on developing algorithms Ph n tn n [nlernaltonal .......... 2012

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Market surveyon luminescence imaging reveals rivalinspection technologies are really well-matched pals

The picture of quality

Text: Shravan KumarChunduri

o Highlights

This year's survey inc ludes 114 imag­

ing systemsand32camerasElectroluminescence is becoming astandard inspection procedu re at var­ious stages 01module product ionAt cell -level characterization, etec.

trorummescence imaging is often

used as a subsystem oliV testersWith its non-con tact process for in­

specting cells, onotciummescencc is

emerging as a credible option

Photoluminescence IDols to forecast

electrical performance of as-cu t Wil­

lers before processing are already on

the market

134

Next to IV testing, a compulso ry quality

checkthat every PV device produced hasto undergo,dectroluminescence (EL) imagingis emerging as the most important character­

izing technique to rate the quality of PV sub­

strates. With its ability to peek into the siliconbulk and map a wide rangeoflnherent and pro­

cess-induced defects in silicon substrates, El,

imaging has already become a standard mea­

surement practice at major module factories.

But El is not the only imaging system on

the market. Anothe r process for putti ng cells

to the inherent-flaw test - photoluminescence

(Pl) - cont inues to make headway. UnlikeEl , where handling the cells is essential for

inspection tests , Pl is a non -contac t process.

And Pl is not only proving extremel y attrac­

tive for cells, but also in characterizing semi­

processed and as-cut wafers to extrapolate

potential efficiencies - it can even peer into

silicon bricks to de tect flaws.

And that is why El and PI., while perhapsrivals at the celllevel, are actually complimen ­

tary technologies that provide quality control

along the value chain of production from sili­

con bricks to finished modules. As a result, an

increasing number of imaging suppliers are

coming out with both El and PLsystems.

And the desire for Pl is set to grow. That is

because this year's holiest news is about quasi­

monocrystalline silicon wafers. This new classof silicon materi al, undoub tedly on the radar

5CRen of nearly every wafer manu facturer , is

claiming it can marr y the higher-efficiency

performance of monocrystalline with themanufacturing process and cost of multicrys­

talline silicon (see PI 612011, p. 260). Wh ile

quasi-mono wafers provide the same luminous

response as other silicon substrates, the inter­

nal flaws are different, mainly in regard to the

higher dislocation density (see box, p_ 138).

Pl involves the response of excitation of thesample by means of an external light sou rce,

while El is ob tained by biasing the substra te.

In both cases, these systems are configured

to capture the lumi nous response of PV sub­

strates via a charge -coupled device (CCD)

camera, the most importan t compo nent of

the systems. The electrons injec ted into thesemicon ductor mater ial recom bine radia ­

tively with the available holes by transferring

their excess ene rgy to an emit ted pho ton. For

silicon, this emitted light is in the range of

950 to 1,250 nm with its peak at nearly 1,150

nm . The CCD came ras integ rated into these

system s record this low-level light. Ideally,homogeneous luminescence-inte nsity distri­

bution is expected, but the defects present in

the substrates cause disruption, enab ling the

offending flaws to be mapped. PL also allows

these wafers to be sorted at an earlier stage

according to potential output.

In a gambi t to be ready for the day whenquas i-mon ocrys talline blocks hit the big

time, severalluminescence imaging supp liers

are already working on developing algori thms

Ph n tn n [nlernaltonal .......... 2012

• Clearfuture: luminescence imaging iseVII lving asa reliable characterizingtechnique InPV processing. lNhileEL iseamingfaith inmodule manufacturing, PL isaddinga new feather to itscap byforecastingtheelectrical quality of as-cut wafers.

that can estimate the electrical performanceof this new class of substrates at the as-cutwafer stage.

In fact, PL imaging has already made te ­markabje progress in characterizing as-cutwafers currently on the market. Last year,Australia-based B1 Imaging Ply Ltd. intro­duced an inno\-ath'e PL imaging tool that ap­prorimates the electrical quality of as-cut wa­

fers at an lnline speed (sec PI 11201 1, p. 158).The system is configured to spot only thosewafer defects that would reduce the solar ceUioutput power. Followingthis lead, three morecompanies - Germany-based Op-tecttcnGmbH, and Ug-based companies 3i SystemsCorp. and lntevac Inc. - have also developedsimilar systems to characterize the electr icalquality of as-cut wafers.

The continuing development of PI.. and theincreasing credibility of EI.. is reflected in thisyear's examination of luminescence productson the market. This year's survey includes 32cameras (see table, p. 166), compared to 2Smodds last year, and 114 complete systems(see table, p. 142), up from 92. The number ofsuppliers increased by three to 28 comparedto our 2011survey. The reason for the trend issimple:on the supply side, traditional cameramakm are apamling into the quicklygIU"'ingsolarspact: on the demand side, wafer, cellandmodule mum arc using the handy lumines­cence lechnology to improve quality controland increaseyidd.

EL andPLsystems

In the past, manr system suppliersonly pro­vided users with the abilityto generate an im­

ageof the PVsubstrate, leavingthe decisiononhow to classifyit up to the operator. But now,system suppliers arc increasingly dt\'dopingproprietary algorithms to detect faults auto­matically. In addition to the traditional list ofdefectssuch as microcracks,shunts, metalliza­tion flaws and soldering-induceddamage,someluminescenceimagingsystems are offeredwithhigher-end applications such as series resis­tance lifetime mapping. The current marketalso offers systems with variable throughputs,camera resolutions and configurations that aresuitable for production-scaleoperations as wellas R&D-relatedapplications.

As noted, the applications for PI.. start highup in the value chain, first examining siliconbricks, then as-cut and semi-processedwafers,and finally finished cells. Wh ile ELcovers thecharacterization of cellsas well, it can also in­spect strings and modules. With the option ofcombining the technologiesto cover the wholesequenceof production, some companies havedecided to integratebothEL and PL tools intotheir product portfolios.

BT Imaging - measuring on the fty: Aus­tralian equipment manufacturer B1 Imagingis offeringsuch dual systems - hut mainly forlaboratory applications. The production-scalesolutions arc largely based purely on PL Its

iLS·Wl , with a throughput of 2,400 wafersperhour, not only maps, analyzes and quantifiesthe efficiency-limiting defects in as-cut wafers,hut by using a specifically developed image­processing algorithm. it alsoestimates the netadve rse effecton the final output power of thewafas, even before they arc processed intocells.According to wayne McMillan, the salesand marketing viee president,between Sand 10of these systerns wert shipped in 2{l11, hut Me­Millanwouldnot providethe met number.

Based on this success, in June, BTImagingis planning to come out with the iLS·W2, athird generation PLsystem upgrade, currentlyin beta testing. McMillansays the new versionwill have an increased throughput, raising thehourly wafer rate to 3,600by requiring only I

second per wafer to accomplish all of the nec­essary inspection procedures. 11 will achievethis by taking full megapixel-scale imagesson-the-fly;e a process in which the conveyorbelt never takes a break. According to B1 Im­aging's CTO, Thorsten Trupke, basically it isnot the actual image acquisition that limitsthroughput, but mainly the traditional stop­and-go automation mechanism. Trupke wouldnot give any specifics on the new optics, char­acterizing it as proprietary information. But ifthe process proves reliable, the iLS-W2 couldbe a game changer for luminescence imag­ing. The price for the il.S-W2 will be between$200,000 and 5250,000. The itS-WI is pricedfrom 5250.000 to 5300,000.

.&.Flying fast BTImaging, the first to irltrtdJa!awafersete at theas­cutstage topredicttheelectneal yield 01solarcellsbased onPI. irnaglflQ.

hasnowadded000the lIycmeasul'8ll'llWlt capabilitiesto itsnew il,S.W2.whichtestsandsortsat a rateof3.600wafers perhlu.

Pit","" Iam'utk&ol.....,2Oll

obtained.•The logk,« saysTrupke, . is that itconverts the measured PL intensityintoan abosolute quantity - a minority carrier lifetime.•This is the most importantmaterialparameterforprocessinga silicon wafer intoa solar cell.

Another key oflline characterizationmethod offered by the LIS-R2 series is resis­tance imaging at the cell Jevel. It is based ona combination of PL images that are taken atdifferentillumination intensities and variouscurrent levels. BT Imaging has developedaproprietary algorithm that gives the absoluteseries resistance value in ohm cm1• AccordingtoTrupke, this featureis veryuseful in process

.&.Pretty I:IrtpoorWithastartling resemblance toanexDtIC Google Mapsimage. this wafllfwasprocessed with BTlmaging's PI. deYice andanalyzed byits newsoftwara. nuallowsI runericgrade to be aSSJl1lE!d tor dislocations and alphabetic classifation01 inpumy

content. Inmiscase. it reveals anI.WlWanted highdislocation density anda lad:of impuritycontent. Its score? AnA4 rating,

tion and crystallographic structures such asdislocations. After the brick has been sliced,the L1S-R2can provideuncalibrated PLimagesshowing lifetime variations of as-cut wafers.Thisfeature isalsoapplicable tosemi-processedand completely processedcells.

But the most important featureof the LIS­R2 at this stage of PV processing is its abilitytomm a quasi-steady-statepholoconductancemeasurement. which allows a calibrated life­time measurement as a function of the injec­tion Ie'\-d.. This chla can be used in an auto­matic slation to calibrate the PLintensity sothatspecially resolvedlifetime mapping can be

BT Imagingalso has a newproduct tool forR&D applications covering both El, and PLThe US-RZ is set to hit the market at the be­ginningof this year. This multt-funcnonal tool,integrated withthe sameopticsusedin the iLS­WI, replaces the previously listed US·R1 andUS-P2w. According10 BTImaging, the L1S-R2enhances the imageacquisition speed by lentimes, requiring only 2 secondsto generateaPL image foran as-cutwafer.

The tool can be used at several process sta­tions in the PV valuechain, including the 0p­

tion of acquiringPL images forsiliconbricks,providing information aboulthelifetimevaria-

136

development, especially when evaluating newdevice structures such as selective emittersand experimenting with new metallizationpastes. Accordingly, BT Imaging is also offer­ing EL with this tool for a contacting setup.When compared to the LIS-Rl, the new LIS­R2has around a SO-percent smaller footprintand a lower price tagofS200,000to S35O,000.

In addition to making advancements to itsIab- and production-scale characterizationtools. BT Imaging is also developing grad­ing procedures for the tested multicrystal­line silicon wafers - the necessary softwarehas already been integrated into the iLS-WIand iLS-W2. The company is also workingon adapting the same grading algorithm forquasi-mono wafers.

Op-tec tion - a cluster of new products:Germany-based Op-tection GmbH is offering19tools, including several new and upgradedproducts. The most interesting among themis the OSIS Wafer Sorter Plowhich is cur­rently capable of handling mono- and mul­ticrystalline wafers based on PL imaging. Incooperation with Schott Solar AG,Op-tecticnhas developed an algorithm for integrationinto the tool that can forecast the energyyield of as-cut wafers. A similar softwaresuite for quasi-mono wafers is also underdevelopment. In the case of standard siliconsubstrates, the 0 51S Wafer Sorter PL uses aproprietary algorithm for sorting as-cut wa­fers based on the forecasted cell efficiencyby examining edge contamination fnctions,dislocation clusters and PL intensity, as wellas its dlsrr ibution.The tool is fully automaticand designed for box-to-box wafer sortinginto user-defined categories. Op-tecncn saysthe OSIS Wafer Sorter PLcan support a char­acterizing speed of up to 3,600 wafers perhour, depending on the configuration. It issold at a price range of £200,000 to £450,000(5267,200 to S60I,200).

Asfor purely Pl -basedinspection ofcells,thecompany is offering the 0515 ce ll Pl inline.It can checkcells for common defects such as

microcracks, contaminations and dislocationsat an inline speed of up to 3,600cells per hour.The price ranges from £89,000 to £102,000(SI 18,9OO to SI36,3OO).

Another new product for cellle vel charac­terization based on PL is the OSIS Cell meIEUPL). As the name indicates, it can do ELas wen. This tool is mainly promoted for labo­ratory applications. processdevelopment andrandom sampling.Thesystem is configuredtodetect microcracks, shunts, printing defectsand dislocations.

PLis an option for four other cell-level char­acterization systems - the OSIS Sorter Cell­1800, OSIS Sorter Cell-3000, OSIS Sorter Cell­2400, OSIS Sorter Cell-600. Thesesystems arcdesigned to beoptionally integrated with othertools for carryingout IV testing. automatedop­tical inspection (AOI) and color measurement'Ihe major difference between these similar­looking products is the throughput they cansuppon , as indicatedby the suffixes..

Theremaining three new products are mainlyaimed at module manufacturing. The OSISString 12K is an automattd suing inspectionsystemthatcharacterizes 120 string!:measuring2.000x 160nunperhour, basedon an automaticdefect-derecnon algorithm. The 0515 ModuleFis a similar system, but scans panels sizedupto 2,000x 1,000mm in size. Op-tecnon has alsointroduced a new model for thin-film modulecharacterization called the OSIS Module I lin­linelThin Film. Thetooltakesan ELimage ofthemodule so that the software can scan for flawssuch as laser-scribing defects, dart areas andshunts, Thetool. ispriced at €9O,lXXl (SI20,200).

For its previouslyfeatured models, Op-tec­lion is offering software upgrades, especiallywith improvedalgorithms.. In some cases, thetools can also be retrofitted with additional in­spection possibilitiessuch as IV, AOI and colormeasurement.

3i Systems - also for as-cut wafers : 3iSystems Corp. is movingtoward characteriza­tion of quasi.mono wafers. According to theUS-headquartered company's Wayne Chen, a

commercial-scale system should be availableduring the first quarter of2012.

For now, 3i Systems, has introduced two PL­based. systems for multi- and mcnocrystallinewafers.ThenewPl-B56is an automaticas-cutwaferinspectionand sorting tool. Like the toolsfrom Op-teeuon and BT Imaging, this systemis designed to test and son wafers accordingto their anticipated performance, cnabl.ing acell manufacturer to select the correct processrecipe. ThePL-B56comes with automatic WlII­

fer loading and unloading subsystems. Thistool is integrated with infrared (lR) inspectionin its standard configuration. It checks the 35­

cut wafers for defects such as black cones inmonocrystalline substrates, as well as blackedges and microcracks in both type of wa­fers, and the grain size in multicrystalline andquasi-monocrystalline wafers. The Pl -B56 canalso predict the potential watt peaks that canbe squeezedout of each wafer. Theentire taskis accomplished at the rate of 1,400 to 1,500

wafersper hour. Optionally, the PL-B56 can beintegratedwithan AOI and a lifetime measure­ment. 3i Systemsships the PL-B56 for a pricerange of 5300,000 to $450,000.

The other new model, the FL-B01, is a desk­top tool that is mainly for offline applicationssuch as R&D. The system has a combined ca­pability to accomplish both ELand PL imagingat one loading stage and can be used to inspectboth cellsand wafers. In as-curwafers, it is con­figuredto spot black cones,blackedges,micro­cracks, scratches. dislocations and impurities.while in cells it can additionally inspect themetallization patterns. The companyis sellingthis R&D tool. at a price range of 5200,000to5300.000. 3i's other systemspromotedlastyearhave not undergone any majorchanges.

Schmid - expending from El to Pl: TheSchmid Group has decided to take part in thesurvey for the first time. In addition to threemodels - one production scale and t\\'O of­fline products - already in its portfolio, theGermany-headquartered equipment supplierhas recently developed a new PL system. The

science &technologyIluminescence systems Isurvey

~mBJ

.... Thin fi lms. too: MBJ Solutions has come outwith its first two toolsdedicatedsolelytottecharacterizatioo olltlin-film modulesfordetectingdefectssuch as flaws inlaserscribing, asshown hereinthe screenslm

(.I

t.'!.... Unchanged: Sevenoutof11 MBJ Sollllionsprooucts, ioclooing the Solar Module Elbasiclormoduleanalysis. have notundergone any majorchangessince the last survey.

138

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A24off-line isa tabletop devicemainlysuitedforlab-scale applications. Based on the PLim­aging principle, it can inspect substrates fromthe stageof as-cut wafers to finished cells.Ac­cording to RubenW6ssner, the technicalheadof Schmid's engineering department, the firstA24, priced at 5168,000, willbe shipped in thefirst quarter of 2012. wossner saysworkis stillin progress todevelopa funy automatedversionofthis system. Hegave no informationon whenit wouldbeavailable.

Schmid has two other offline lab tools in itsA·series: the A20and A1S, both based on theEL-imagingprinciple.Thelatter,designed forof­flineinspection ofcellsbasedon theELprinciplewithalistedpriceS5O,000, hasbeenshippedfourtimes.Thecompanyhas registeredeight salesforits A20off-line ModuleELfor testing modules.Thedeviceispricedat $68,000.

In addition to these lab-scale systems,Schmid offers an inline production-scale tool.The Smart El Cell, which has already bunsold to three customers, automaticallydetectscracks,dark areas and finger defects.Itcan alsoidentifymicrocracks,but only in monocrystal­line substrates. The SmartEL: Cell supports athroughput of 1,200cells per hour. The basicconfiguration is pricedat €20,OOO (526,700).

Gsolar - reverse bias : Gsolar Power Co.Ltd. is offering a new system that features PLimaging.TheChinese company's GEL-PL,alsocapable of handling EL,can be used to charac­terizecellsas wenas wafers. But the tool, main­ly promoted for R&D needs, willnot be able tohandle quasi-monocrystalline material, saysRan Xu, the company's deputy general man­ager. The GEL-PL, offered with an automaticdefect-detection algorithm to map the typicallist of defects,is priced at SI5O,000.

Gsolar has three additional new tools, allbased on EL.The GEL-C4 is a multifunctional

tool, which not only takes ELand IR measure­ments, but canalsoaccomplish reverse-biasEL.While ELis carried out byexcitingthe samplewith forward biasing,Xusaysthat reverse-biasEL, for exampleat ·IOV, helpsin mappingaddi­tional materialdefects related to grain bound­aries. The GEL-C4 is pricedat $60,000.

Theother two new systems are for modulecharacterization. The GEL·MS, according toXu, is suitable for high-volume productionlines with a throughput of 120 modules perhour. It has two cameras, each with resolu­tions of 3,328 x 2,030 pixels, integrated intothe system, making it every goode for screen­ing the cell matrix before lamination, says Xu.TheGEL-M4-900has a 9 megapixelresolution,an upgrade of the 6.5 megapixel resolutionwith its GEL-M4. This improvement reducesthe measurement time to less than 5 secondsfor a 2,000 x 1,200 mm module. Gsolar hasnot made any Significantupgrades to the re­mainder of its systems.

Greateves - exci ting with LEOs: Whileall of the other PL systems featured in thesurvey use a laser light source to excite thesilicon substrate, Germany-based GreateyesGmbH is the only other company,apart fromUS-based Reltron Ll.C, to employ an array oflight-emitting diodes (LEOs) for its Lumi­Sola rCell system. LEOs have many advan­tages compared to laser-based systems, saysmanaging director Martin Regehly, such asreduced cost, easy scalability, low mainte­nance, higher safety and compact design.According to a technical paper presented byGreateyes at the 26'" European PhotovoltaicSolar Energy Conference (EU PVSEC) heldin Hamburg, Germany, in September 2011,the selection of the LED wavelength is an im­portant parameter.An LEDwavelengthbelow800 nm is highly desirable in order to avoid

Phnfn n 1n1. ,.". tlon al .........,10 12

LumiSolarProfessional

•I!

• Traffic light bingo: ThelumiSolarf'rofessionaJ serieslshown 00tl.eright is the Highiles versionl ofEl, systems from ureeteses isnow offered witha faultodetectionalgorithm. which is pictured intheSCfeenshot Ionmeleftl. The image displays therelative peltenla9l! ofdeviation from a.good. reference cell- green means goodto

lIO. yellow means walch out and red means l1ouble.

any overlap of the light from the excitationsource with thai of Pl., but at the same timehigh enough to ensure sufficient excitationofsilicon, Greereyeshas opted for LEOswith anapproximate wavelength of 650 om.

While this sounds exciting, the flip side ofthe technology is that LED-based excitationis currently limited to use on wafers after pas­sivation. That means the as-cut wafers cannotbe inspected with such a system setup. How­ever, Greateyes is working on this limi tation,

saysRegehly.TheLumiSolarCdl system mainly consists

of a cooled back-illuminated CCD camerawith a 1,024 x 1,024 pixel resolution andfour lED arrays and related filters. On re­quest, the system is supplied with vacuumcontact adapters for inspecting back-contactcells. TheLumiSolar<:ell is also capableof ac­complishing EL

The company's other twc systems - thel umiSola rProfess ional and lum iSolar­Professiona l High Ras - are configuredto test modules. According to Regehly, thesystem software has been upgraded for aneoptimizede process of stitching several im­ages together when scanning a module. Inaddition, the tools are now integrated withdefect detection algorithms. The design ofthe dark chamber has been Improvedby us­ing smaller doors that are more stable »inorder to allow frequent and reliable use ofthe system,., says Regeh.ly. Greateyes, whichalso produces cameras, says it has been ableto reduce the signal-to-noise ratio by 20 per­cent during module image acquisition for ELmeasurements.

Intevac - sen sor tai lor-made for PL.: US­based Intevac Inc. says it has made severalchanges to itsonly PLsystem, the NanoVista ,mainlyin regard to the algorithms to estimate

P h n l'nn IDt.,.....l1olUll Jn.y2D12

the energy yield of as-cut wafers. Accordingto Jan Latchford from Intevac's marketingdepartment, the tool analyzes around 15im­age features and mentes to forecast the finalcell efficiency, while edge impurities, grainboundaries and dislocations are the key de­fects checked. A mean absolute error of justI percent is routinely obtained between thepredicted and measured final efficiency,meaning a 99-percent accuracy. All of this isdone at a paceof up to 1secondper wafer, foran hourly throughput of up to 3,000 wafers.

According to Latchford, lntevac's tool hasalsobeen improvedin the areas of repeatabil­ity and reproducibility of the measurementssincelast year.Theother majorchange is a re­duction in NanoVista's listed price. While thesystem "..as previously priced at a wide rangeof5300,000to 5500,000, the shipment price isnowgiven as 52SO,000.

TheNanoYista uses Inttvac's own electron­bombarded active pixel sensor (EBAPS)technology. Thesensor consistsof an indium­gallium-arsenide (InGaAs) photocathodecombined with a complementary metal-oxidesemiconductor (CMOS) imaging anode. Thephotocathode spectral response is tailored tocapture almost the entire emission spectrumof silicon photoluminescence and is respon­sive to an emission band of 950 to 1,320 nm.The CMOS anode has a 1,280x 1,024 pixelresolution. It is capable of capturing up to 30framesper second at full resolution. The cam­en. is rated with a 25-percent quantum effi­ciency at 1.000 nm. Ho....ever, for unknownreasons. lntevac has not listed its cameraseparatelyin our survey.

Hamamatsu - optional camera: The Japa­nese supplier Hamamatsu KK has upgradedits EUPl Analyzer. Thesystem, which as thename indicates can characterize using both

EL and Pt-ba sed imaging, is offered withan option to select the camera either with orwithout a cooling mechanism. While the EUPi Analyzer relies on ELto identify process­induced defects, such asdiscrepancies in met­allization patterns and cracks, its PL imagingis mainly employed10 investigate the flaws inthe material and crystallographic structure ofsilicon substrates.

The system's fault-classification functionprovides a contrast between intrinsic and in­duceddefects, with the former shownas whitespots in the displayed image. According to atechnical paper provided by Harnamatsu, theintrinsicdefects leave clear imprints in the ELemission at 1,500nm, while the induced de­fectsdo not However, both defects are clearlyvisiblein the range of950 to 1,ISO nm. In ad­dition to this, the company sa)"S the systemis capable of measuring minority-carrierlifetime and series resistance. Hamamatsu issel hngthe tool for a price rangeof €72,000 to€34O,OOO (596,200 to 5454,300).

Reltron - new LED exc itation: The mostinteresting news about the Fast El Mapperfrom US-based Reltron is that it is now pro­moted as being able to carry out Pi-basedimaging via LED excuauon. Unlike Great­eyes, which also uses LEOs, Reltron excitesthe sample at a higher wavelength of850 nm.Still, according to Roberto Collins, Rehrcnspresident, the companyhas carefully selectedfilters so that the LEDlight does not interferewith PLsignals.

The Fast ELMapper is also capable of ac­complishing EL imaging. The reason forhaving both measurement options, accord­ing to CoUins, is to provide the opportunityto inspect wafers as well as cells in R&Dandprocess development, which is the targetedsegment for the system. While PL is mainly

139

science & technology Iluminescence systems Isurvey

Comet brickwafer

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Dial~tion e1US18r1

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~ The future is now: Op-teetion is one of four CClI'IIp<Wlies that lias tleYelapedPI.systeITI$ that canforecast theelectrical qualityof as-crt wafers. Its OSlS WaferSorter Pl (aboYel is adYertJsad as being able to IJ'edlct II substrate's futlft cell_ 1_1

...The ug'v. thebad andthegood; Op-teetiorfsOSlS Wafer Sorter PI. analyzes edge

contaminationfractions llefijanddislocation clusters (rNddle!usingPI. imagingto

lJedictperformance. Aogoodo wafer1r9ttiisshown asa rtlerenee.

used to identify cracks and afeU with re­duced carrier lifetime, ELis mostly employedfor taskssuch as resistance mapping. In addi­tion , Rehron can configure the same system

for production-scale applicatio ns. However,Collins notes that the system is limited to theELmeasurement principle in such cases. Theflexible platform of the Fast EL Mapper canhandle measurements for cells, strings andproduction-sin modules. Depending on theapplication, Reltron configures the system'speripherals. Collins says thai most of itsbuyers use the production-scale systems formodule manufacturing. Reltron claims thatthe Fast ELMapper only requires between ..and 6 seconds to scan a moduleor string. It is

priced at S6S,OOO.McScience - new entran t Although Mc­

Science Inc. is new to the survey,its lumines­cence imaging product - the K3300- is notnew to the market. TheSouth Korean compa­ny, a producer of inspection tools to the LEDindustry, has been making its K3300 since2008.The tool is configured to detect defectssuch as microcracks and abnormalities inmetallization patterns, while mapping sbuntsand the lifetime of cells in development us­ing either EL- or Pl-based characterization.But iI is not d ear how the K3300employs PLand what defects the tool maps with the helpof E1.. as McScieoce has not responded to ourinquiry seeking additional information. Ac­cording to the company's specifications, thetool has an hourly inspection rate of 60 to 70

modules and 1,200cells, It costs $90,000.

Strictly electrolumin escence

While Pl is attractive for inspection of so­lar substrates at the WOlfer and cell stages. itbecomes mort difficult to U~ the technologyfarther down the value chain as the substratesize grol<l"S, For modules, EL is the preferred

140

imaging process, Unlike in cell processing.in which ELis only applicable for completelyprocessed cells, in module manufacturing the,measurement principle can be applied at ev­ery stage of module manufacturing. In fact,ELsuppliers havespecificallydevelopedtoolsfor different applications. 'lhe EL systemslisted in the survey support different setups- from offline to fully inline, with variableimage resolutions of up to 72 megapuels, andsuitable for variousbudgets, with prices rang·ing between $21,400 and S850,OOO.

Pi4_ robotics - portab le ons ite syst ems:Ge:rmany's Pi4_robotics GmbH increased itsrange of EL-based products by a third 10 18.mainly catering to the needs of various stagesin module manufacturing, While many mayappear to benew. that is only because mostof the systems introduced in previous rearshave been renamed.

Pi4_robotics is offeringmodule inspectiontools for onslre use before installation withits new Portable Module In, pectien series,with one providing an 8 megapixel imageresolution and the other lA, Both models areable to inspect module sues of up to 2.000 x1,100 mm but art not integrated with an auto­matic defect-detection algorithm. The imageresolution also differs between the two sys­tems for flasher integration. While the 2010

version of the Module Automatic for RasherIntegration offered an 8 megaplxel image res­olution with a tu-secced inspection time, theupdated model has increased the resolutionnine-fold to 72 megapixels, albeit requiring alonger inspection time of 25 seconds.

For the lnllne module characterization,Pi4_robotics is again offering five differentmodels. Allarecapableofacceptinga substratesize of up to 1,970 x 1,040 mm with an imageresolution of72 megapirels. Each model is in­tegrated with an automated defect detectionalgorithm for shunts. spots of excesscurrent

density, dead cells, luminescence distributionand dark spots. The major differentiating fac­tor among the tools is the cycle time. Of thetwo Module High Speed Automatic tnunetools, one has a tu-secood cycle time and theother 28 seconds. Theother three, prefixed asthe Module Automatic lnline models, eithertake 45, 70 or 90 seconds to inspect a modulein an inline configuration.

While the two models in the Module Ba­sic Inline/Offline series can either be usedas inline or manual tools. they-are mainlydesigned for manual operation in modulefactories. Themajor difference between themis the image resolution, with either 8,6 mega­pixels or 4.3. Both have the same maximumthroughput of 120 modules per hour. lhtyart not offered with defect-detection soft­ware, thus leaving the job of analyzing theproduced images to the operator.

Pi4_robotics has also developed twostand-alone systems. designated as ModuleEconomic Offline, purely for offline applica­tions, The company says these are the mostcost-effective solutions it offers as they can

provide high-resolution images with up to72 megapixels and can beintegrated with anautomatic defect-detectjen algorithm. OnC'has a 3O-second cycle time and the othera 6O-second cyde time. Both are capable ofcharacterizing thin-film modules as well

For str ing inspection s, Pi4_roboti cs is of­fering three tools - the string inspection,s tring ins pection & alignment and StringIns pection High Spee d. The first two havethe same throughput of 360 strings perhour but with differing resolut ions of 1.44megaplxels or 8. The high-speed version is

rated with a lower cycle time of 3 seconds,which accounts for a nominal throughputof 1,200 str ings per hour at a 1.44 mega­pixel resolution,

tellt continues OCI p, 165..

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...Fromcellstomodules: Germany's Pi 4_roboticsincreased itsrangeof EL'based ptoducts bya thirdto lB, mainly caterirog to theneedsofvarious stages in module manufacturing. However, thecompanyalsooffers a product series lortastingsolarcells lshown ontheleft)

lor mapping a typical list 01 de!ectssuchas Illie:rtlaacts (shown on.. ,",0.

For cell inspec tion, Pi4_ robot ics is again

promoting two Inline-capable mood s. Its

Cell Inspection has a picture resolution of1.44 megapixels and an hourly prod uction

Bowof 1,200 in the muimum and nominal

modeof operation, while the cell inspection& alignment is a 4 megaplxel version with aI,440-(ell throughput per hour.

In addition to developing products suitablefor various applications and configurat ions,

Pi4_robotics is again offering an innovativeplatform called PV-Identfor its products. PV·Ident records the unique crystal patterns inthe silicon substrates. The stored data func­

tions like a fingerprint for solar cells to tracethei r history. including nat ive defects and

process quality at important process stationssuch as metallization and soldering. The PV­Idem can be used as an alternativeto physicalmarking methods.

MBJ Solutions-going inline: Germany­headquartered MBJ Solutions GmbH hasprovided the data for 11 systems. Amongthe four new 10015 is the SolarModule EL­Inline2S, a multi-camera, high-resolut ion ELtester with a resolution of6,000x 12,000pix.els and a maximum throughpul of 72 mod­ules per hour. Compared to the SolarModuleEl .- Inline launched last year,the newversioncosts up 10 26 percent less with a price rangeof £52,600 10 5lI,OClO (S70,3OO to Sn,500 ).According to MBJ's Dieter Lorenz, the systemis ideally suited for small factories. However,the company is also offering the possibilityto upgrade the system to a higher speed byreplacing the cameras.

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The SolarModule EL·quickline comeswith an increased medium-scale resolutioninline syslem of 7.8 megapiJ:els due to anupdated multi-camera design that enableswhat Lorenz describes as egocd image qual­ity.• The new model, an inline version of thepreviously listed SolarModuie EL·quickchecksystem, is now offered with automatic-load­ing and unloading,and an automated contactunit for bus ribbons.

MBJ Solutions has come out with its firsttwo1001s dedicatedsolelyto the charactertaa­tion of thin-filmmodules- the SolarModuleTF-Lab for offline R&D and the SolarMod­ule TF-inline for inline applications. Bothhave a measurement time below 60 secondsper module. MBJ Solutions has not made anychanges to its other 10015.

Buchanan Systems - upgrades un­known: As Buchanan Systems GmbH has notresponded to our requestfor additionalinfor­mation on its latest specifications, it is hardto judge what has changed. Butby comparingthis to the German company's specificationsin the last survey, it appears that most of itstools have not been altered. Buchanan appearstohave dropped its El-MESString Inline toolfor determining soldering-inducedproblems

Althoughits Inline LaminateTester SEMIwas introduced in 2010, Buchanan has onlynow included information on the inline sys­tem, mostlikelydesignedto test the laminatesbefore framing. The company has also pre­sented first-time specifications for anothertool introduced in 2010, its EL-MES CellTester. But now the company seems to have

updated it with a new version, the EL-MESCellTester 12. The toolsare completely iden­tical,except that the newerversionreplacesanoutscurced camera from vtsicn ComponentsGmbH with Buchanan'sown camera.With itsmuch higher resolution, the latest modelcosts£12,000 (529,400).

Nisshinbo -low cost. high performance:[apans Nisshinbo Industries Inc. has comeout with its first new product since 2009, thePVE1020i-MTW. According to Milio Makinofrom the sales department, the system com­bines the ad\'anlage of high resolution andlower prices. The PYEI020i-MTW employsa camera with a resolution of 2,672 x 4,0Cl0pixels, far higher than the original threemodels. While the PVEI020i-MTW requires5 seconds to scan a module, a similar prod­uct, the PVE1120i-T, needs3 seconds. But theDew PYEI020i·MTW is priced at ' 8 million(5102,800), a little more than I quarter of themuch more erpenstve PVE11201-T.

GPP Chemnitz - updates unknown: GPPChemnitz GeseUschaft flIr Prozessrecbner­programmierung mbH is offering its firstnew product in 2 years, the SolarModuleln­speet-ELVIS. The German company enteredour surveywith two products last year, bothstill on offer.and added three more modelsfor its current listing. Oddly, GPP Chemnitzhas nowsubmitted details for another modelcalled SolarModulelnspect-El with exactlythe same name and nearly identical specifi­cations as its other model. The only obviousdifference is the camera resolution, which iseither 24,000)( 12,000 pixelsor 1,388 x 1,038

165

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pixels. Undoubtedly due to the higher reso­lution of the fint tool - though it is hard toimaginethatanyPv-relatedapplication wouldrequire such a high resolution - GPPChem­niu is promoting the system for higher-endapplications with a seUing price of £150,000($200,400),three times the listed priceof theother model. Thecompanyhas not providedany information regarding advancements as­sociated with its older systems.

Chroma - new to survey: Chroma ATEInc. is a new name in the list of ELsuppliers.However, the Taiwanese companyhas beensellingits 7218·Mmodel since 2009. Accord-

.. Ouub:n? No JrobIern: n. eIpor1i series 01 a testers

from P'i4_robotics is offered n I~ des9I thattnabIeslI'lSlIe IIIdJIe I8Stitg beftn instaDation.

ing to Grayson Cheng, the EL product man­ager, Chroma's tool detects typicaldefects inmodules, such as dark areas, cracksand fin­ger interruption. Ho...~er, he notes, _It'sstillthe operators call to pass or fail the module.•Chengaddsthat the companyis in the processof integrating its knowledge base in buildingcellinspection AOisystemsinto the 7218·M"ssoftware. Chengis optimisticthat Chromawillbe ready with the automatic detection func­tion in the first quarter of 201 2. Thesystem iscurrentlycapable of generating an ELimageof a solar module with a resolution of 3,326x 2,504 pixelsat a maximumcharacrenzaconpaceof 360modulesper hour.The7218-M issold fora price range 0( $40,000 to 550,000.

Koma. -new product for thin-filmmod­ules: While most ELsystem suppliers comefrom the field of inspection tools, the simple

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operating principle of luminescence imagingtechnology is alsoattracting equipment mak­ers to developtheir own tools to be integrat­ed into manufacturing equipment. US-basedKomu Solar Inc. is a typ ical example, Thecompany, with its leading position in makingof combined rabber and stringer (CTS) andlay-up systems, has developed an extensiverange of EL systems mainly for stations inmodule manufacturing.

For the current survey, while appearingtohavecut itsoverallportfoliofrom 13to 11, Ko­maxhas just . simplified itscatalog_bygroup­ing several moods into series, says PhilippeGenin, the general manager for test equip­ment.Infact, it has actuallycome out withonenewproduct - the X5000i se ries , focused onthin-film technology. As with the other mod­ule characterizing tools from the company,

<lI High ~iction llCtlJf!C'(. lntevecclaims itsNanoVistaPI. systemcancal­cuIa:e anas-anwafer's eo.oentual csllpertoonanc:e WIth a9!}-pertent acawa­(y. Thetoolis said10 analyze ilIOIKld 15image features andmetrics to forecastthe fi nal cell effic iency. while edge im­purities, grain bourldaries and disloca­tions are the key defects ched:;ed.

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this device is alsocapableof detectingshuntsand inactive areas, in addition to thin-film­specificflaws such asdefects in laserscribing.It emplcys a IA megapixel camera and testsup to 80 thin-filmmodules per hour. Komal:is selling this newsystem for a price range of€70,000 to £170,000 (593,500 to 5227,1(0).Another two models dealing with crystallinemodules are planned to be launched in 2012.Its X4800i thenno module tester will be in­tegrated with thermography mapping capa­bilities to detect hot spots. in addition to ELmapping.TheX600Ili EL towerflesher willbeintegrated into a module Dasher.

Except for the X11XDs EL string tester andthe X2000s EL module tester, all of Komax'sproducts are offered with an automatic fault­detection algorithm, as well as backlight andfront opticalInspection optionsfor measuring

dimensional accuracy, busbar alignment. con­tamination detectionand cell-edge inspection.

Berger - seluticn for modules: WhileBerger Lichttechnik GmbHis stilloffering itsPSLEL2asa subsystem for its tools related tocell characterization , the German companyhas expanded into module characterizationwith its PSL MEl. Although introduced in2010,Berger has onlyprovided the data now.Most of the parametersfor this tool resemblethe PSLEL2, except for the fact that it has alarger field view of up to 1.800 x 1,200 mmto accommodate module testing. The othermajor difference is price. While the PSLEL2is sold for £66,000(588,200), the newlaunchis shipped for £45,000 (560,100). Both ofthese ELsystems are offered as subsystemsfor IV measurement and additionally per­form IRsubstrate scans.

Manz- shorter exposure time: Manz hasbeen integrating its Manz EL 2400 systemfor ELcell characterization as a subsystem inits leT 2400 cell sorter since 2008. The onlychange the system has undergone since ourprevious listing is that the exposure time hasbeen reduced to 0.3secondsfrom0.4seconds.The product is still featured with a 1,024 x1,024 pixel resolution camera and supportsthe measurement of 2,400cells per hour.lt issoldfor€103,OOO (5137,600), but onlyto usersof the leT 2400cell sorter.

Vitronic - on- and offline dete ction likebefore: Germany-based Vitronic Dr.-log.Stein Bildverarbeitungssysreme GmbH tntro­ducedits V1NSPECsolarin 2009. It is capableof characterizing cells,strings and modules,mapping contour defects, grid-line defects,cracks with electrical effects and inactive

169

science & techno logy Iluminescencesystems Isurvey

Cameras for luminescence imaging

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cells. For modules, the tool also inspects thespacing betweencells, as well as the ribbonsbetween cells. This EL inspection system,which can be installed at various processstations, is offered in both inline and stand­alone configurations. Vitronic, which is alsopromoting the toolfor thin-filmmodulechar­acterization, has not madeanymajor changessince last year. Thedevicecan support a test­ing speed of up to 3,600 cells, and 900stringsand modulesper hour. The companyissellingthe tool for£40.000(553,400).

Zenith Sollr - sime product for manyconfigurations: China-based Zenith So­lar Technological Co. Ltd. is still offeringits EL-4P system, first introduced in 2007.The company claims that in addition tocharacterlztng the PV substrate at variousstages in crystalline silicon (c-SOsolar cell

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manufacturing, such as cells, strings andmodules, the tool is also capable of testingthin-film modules at a number of process­ing steps. Zenith has not made any majorchanges to the system since last year. Thesystem is again offered with the option tochoose either a 1,360 x 1,024 pixel or 3,326

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to 560,000.

lumines cence cameras

Excluding the automatic defect-detectionsoftwart, EL and PL systems are not worthmuch without a decent camera. For cell andmodule manufacturers that do not require

high-endalgorithms and simply need to gener­ate images, then buyinga luminescencecameraand building their own peripherals is a muchmorecost-effective solution.

The most important parameter of thecamera is its sensitivity governed by the sen­sor technology. The luminescence signalsfrom the solar substrate under investigationare near the IR wavelength. Thus, the cam­eras must be sensitive enough to capturethis low-level light. The cameras are alsoexpected to produce accurate images with

a sufficient resolution. Following this lead,other camera terminology parameters comeinto play, such as quantum efficiency, read­out noise. dark current, resolution, pixel sizeand readout rate.

Princeton - tailored for PL: US-basedPrinceton Instruments is the only company

from last year's participants to comeout witha new product. Its PloNIR; 640 is well-suitedfor PLimaging of PV wafersand cells in low­light conditions, according to product man­ager Ravi Guntupalli. The camera. with itshigh sensitivity in the near-infrared (NlR)band, he says, is built on an InGaAs focal­plane array (FPA) sensor. The responseband­width wavelengthof the sensor is 900 to 1,700

nm, with a quantum efficiency at 1,000 nm ofup to 80 percent.

For PL, Guntupalli says that the newcamera is better al capturing images thanPrinceton's silicon CCDsensor-based PIXIS;t 024BR camera with a silicon response that_is nOI ideal at the peak PL wavelength of1,150 nm.e The other advantage of the PI·oNIR: 640, he says, is that due to the highersensitivity, the camera has a high image-

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capturing speed. Indeed, at 110 frames persecond at 10 MHz., it is the highest in thesurvey, The camera comes with a complete

software acquisition package for R&D orfor U~ by original equipment manufac­

rurer s (OEM) of PL inspection systems . At5110,000, Princeton's PloNIR: 640 is the

second mosl expensive camera in the' sur­'"Cr. Princeton's other camera moods. allfeatured in our previous overview, have notundergone any changes.

Vitran ic - not for separate sale: WhileVitronic is new to the segment on cameras,Ir has actually been designing and producingspecialline-scan and area camerassince 1995.According to deputy sales director RichardMoreth, the German companyhas integratedethousands« of inspection systems with Vil­

romcscameras.

Yltrenk , bowerer, doesnol seD its VICAMEl camm separately, but onlyas an integral

part afits EL inspectionsystem. Thatcouldbethe reason for its incomplete spec sheet.Theonly valuable information avillable for thisCMOS sensor-based camtn is its resolution.givenas 2,000x 2.000pinls. Theprice listedin the camen table is misleading: Vitronichas not entered the amen price, but ratherthe cost of the complete inspectionsystem.

Boostsolar- sparse specs: China's Boost­solar PhotovoltaicEquipment Co. Ltd. is an­other new entrant to the camera segment.Like Vitronic, Boostsolar is also promotingone camera, for which it has provided "eryfew details, even though it hasn't sent anyinformation for a system. According 10 theavailable data, the LMEL01 employs a Sony­branded interline transfer CCO se nsor with a

resolution of 1,392 x 1,040 pixels. The pixelsize is given as 6.45 x 6.45 urn. BoostsoIarsellsthe camera for 180,000CNY (528.300).

Hamamatsu - sill1fl:ly adding models: Ex­cept for reduced prices. Hamamatsuhas DOt

reportedany majorchangesto its wide prod­uct rangeofseven cameru. Butit hasprmi dedsomedetailsOD a _nN e camen mood intro­duced in 2009. The C1lOJO.701 , lin Hama­matsu's CtOOlJO.401 , isbasedona back-illumi­nated time-ddayed integration (TOI) sensor.However, the 4,096 x 128 pirel resolutionofthe C10000-701is twiceas high. Thecamera israted with a quantum effickncyof 20 percentat 1,000run. WhileHarnarnatsu has nO( filledin the dark current data (also the case for itsother models), the O()()OO.701 readout noiseisput at 100e (ems ).As with mostof itsotherproducts, this camera is suitable for both EL

172 Phnl'nn 1Illerntl oD&l .,lonurj2llll