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The Rise of Biometric CardsWorld First Independent Research on Biometric Smart Cards

This work is licensed under aCreative Commons Attribution-NonCommercial 4.0 International License.

By Antonio D’Albore

Fingerprint Sensors Section curated by Jean-François Mainguet

Edition February 2018

http://creativecommons.org/licenses/by-nc/4.0/

The Rise of Biometric Cards | Embedded Security News | embeddedsecuritynews.comEdition February 2018 | © 2018 Antonio D’Albore, Jean-François Mainguet | All product names, logos, and brands are property of their respective owners.

Fingerprint Consumer Acceptance Timeline

Siemens and Triodata develop phone prototype with fingerprint sensor.

1998 2000

Sagem launch MC 959 ID, phone with STM fingerprint sensor

2011

Apple file Patent “Devices and Methods for Providing Access to Internal Components” (US20120258773A1)

2012

Apple buys AuthenTec for $356M

2013

Apple launch iPhone 5S

2


What is a Biometric Smart Card?A Biometric Smart Card (BSC), Fingerprint Card orBiometric System-on-Card (BSoC) is a Smart Card containing a fingerprint sensor where:

• Biometric sample capture (enrolment / verification)• Minutiae Template extraction• Template storage• Templates matching

is performed within the card.

3

A BSC shall never transfer any biometric sample and biometric reference data to any external terminal.

Template is normally stored in the SE Templates matching is normally performed by SE CPU


PotentialMan-in-the-Middle

Attack

Matching

FingerprintAcquisition

BiometricTerminal

Transfer toMatching System

MatchResult


Attack

Enrolment

Transfer toSmart Card

Template Stored in Secure Element


TemplateCreation

Template-On-Card (TOC)

4



Attack

Enrolment


TemplateCreation


Template Stored in Secure Element


Attack

Match-On-Card (MOC)Matching


BiometricTerminal


MatchResult

5


Enrolment

Fingerprintacquisition

In-Card templatecreation

Template stored in Secure Elementor Secure Flash

Matching

Fingerprintacquisition

In-Cardtemplatecreation

Match result

In-Card templatesmatching

Biometric-System-on-Card (BSoC) (1/2)

6


Extract

Measurement

QueryTemplate

Biometric-System-on-Card (BSoC) (2/2)

7

CapturePre-

ProcessingFeature

ExtractionTemplate Creation

Reference template

Compare Matching

Adaptive Score

decision

Authenticate

Enrolment

Authentication

Typical operation time 2 ~ 5 sec.

Typical operation time 1 ~ 2 sec.


NFC POS- In Store / In Branch- Contact or NFC- Before first use

or at first use- Assisted

Secure Kiosk- In Branch / Office- Contact or NFC- Non Assisted

or Assisted

Secure Tablet- In Branch / Office- Contact or NFC- Assisted by tablet

operator

Card Reader- Battery-powered

Reader or connected to a PC

- Contact only- At Home / Office- Not Assisted

or assisted

Smartphone- Smartphone with

enrolment App- NFC or custom

cable- Not Assisted

Standalone BSC- BSC interact with user

by means of display, LEDs or Audio

- Not Assisted- Needs

battery BSC

Examples of Enrolment Schemes

8

ATM- ATM with contactless

reader- In Branch- Not Assisted


Enrolment Schemes for Financial BSC (1/2)

9

Enrolment assistend by bank

staff

User fingerprint enrolment on a

secure tablet

Template is decrypted in a

PCI/DSS compliant environment

Fingerprint Template is encrypted and sent to card

personalization bureau

Bank customer

Bank

Template is injected into card at

personalization time

Bureau send Activation PIN to

customer

BSC is shipped to customer

User activate BSC using received

activation PIN

User smartphone

BSC ready for use


Enrolment Schemes for Financial BSC (2/2)

10

BSC is shipped to customer

Bank branchCard

personalizationBank staff activate BSC

into card network

BSC ready for use

Customer bring its non-active BSC at Bank branch

Card Bureau receives order to produce BSC

Card NetworkBank staff assist customer

fingerprints enrolment

User register its fingerprints directly on

the BSC


Considerations on Enrolment Schemes• Enrolment is probably the most critical and costly part of each BSC project.

• The quality of the reference template generated at enrolment will determine the

efficiency of the card during its life cycle.

• Enrolment, when possible, shall be done in a secure environment:

• To identify the rightful owner of the BSC.

• To ensure good quality fingerprint scanning.

• To limit potential attacks.

• Shall be done assisted by trained staff.

• Self-enrolment will probably become popular for non-critical applications.

11


BSC Applications• Financial Cards

• Debit / Credit Cards• OTP Cards• Cryptocurrency Wallet Cards

• Government• National ID Cards• National Healthcare Cards• Government Ration/Subsidy Cards• eSignature of Government documents• Driving License Cards• Online Voting

• Identity Verification• Loyalty / Membership• Online Gaming

• Access Control• Physical Access entry• Logical Access Login

• Healthcare & Insurance• Health Insurance Cards

Enabler of three-factors (3FA) authentication

Something I haveCARD

Something I knowPIN

Something I amFINGERPRINT

12


Real Life Issues solved by BSC

13

• Solve CPF (Card Present Fraud) in Payment industry

• Combined with Dynamic CVV would allow to solve Card-Present (CP) and Card-Not-Present (CNP) fraud

• Enabler of financial cards use to elderly people with reduced vision

• Enabler of financial cards use to elderly people that have difficulty to remember PIN (and tend to write

them down on paper)

• Allow identification of genuine card holder (eID, Driving License Card, Healthcare Card) by Law

Enforcement Agencies / Hospital staff / Border Control officials

• Reduce fraudulent physical access to sites protected by card-enabled access control systems

• Reduce fraudulent logical access to systems and IT infrastructure

• Distribution of asylum seekers / migrants / refugees / displaced cash aids by NGOs as secure alternative

to mobile payments


Anatomy of a Biometric Smart Card (BSC)

14


Back Side Overlay

Anatomy of a BSC: The Components

Back Side Layer

Inlay

Front Side Layer

Front Side Overlay

Micro module

Fingerprint sensor

Sensor Bezel

15


Anatomy of a BSC: The Inlay (1/3)

SE Contacts Pad

Antenna

Status LEDs

FPS Contacts Pad

Display Driver IC

Display

Buzzer

Power Button

Passive Components

MCU / ASIC

RF IC

FPS Controller IC

Secure Flash

Flexible PCB

Inlay size is 1 – 2 mm (0.04 - 0.07 in) smaller than card W / HSome BSC Integrators deliver inlays with FPS already embedded

16

Battery / SC

Test Pads



17

Inlay design sample forContact Only BSC

Antenna for Biometric Sub SystemMCU / ASIC

FPS Controller ICTest Pads

Inlay design sample forDual Interface BSC

Antenna for Dual Interface SE



18

Inlay design sample forBattery-powered, dual Interface BSC with separated FPS module

MCU

Area Sensor

Module Interface Pad

FPS Module

This solution allow card manufacturers to use sensors from different vendors without needs to

re-engineering the whole inlay.

When implemented by sensor manufacturers simplify the inlay

design because MCU and key elements for FPS management are

already integrated into the module.

Can only be manufactured with Cold Lamination.


Anatomy of a BSC: Cross Section Sample

19

Laminated Card bodyBSC Inlay Sensor – FPCB Connection

FPS Bezel

Bezel should not extend over card surface to avoid

scratches

Protective Coating

Fingerprint Area SensorA slightly recesses

sensor can increases component life.

The sensor below the card surface it also serve as finger tactile reference, allowing to a smoother user experience


Anatomy of a BSC: Card Body Lamination (1/3)

Card bodyConstruction

Hot Lamination

Cold Lamination

Mouldedcard body

Non-Moulded card body

20

Lukewarm 60~80°C

Warm80~120°C

Hot120~280°C


Anatomy of a BSC: Hot Lamination (2/3)

21

• World standard manufacturing process for all standard non-powered cards. Billion of cards made every year with Hot Lamination

• Use existing production process

• Need additional Milling + Implanting + Embedding modules and custom cutting tool (to detach the sensor from film)

• Additional step for FPS cavity making

• Cannot be used for cards with batteries and displays and other temperature-sensitive components

• Done at different temperature ranges according to layers materials and components to embed

• Allow making large lamination stacks (e.g. 32 or 64 cards per sheet)


Anatomy of a BSC: Cold Lamination (3/3)

22

• Only suitable process for cards that have batteries, LCD, e-paper display, dynamic magnetic stripes and buttons

• Process automation very complex, most players make use of manual labour

• Popular in Taiwan / South Korea / Thailand

• Normally more expensive than Hot Lamination

• Sheets need highly precise collation to avoid gaps between sensor and card surface

• Injection moulding OK for prototypes, practically not used for mass production

• Possible only small lamination stacks (e.g. 8 or 16 cards per sheet stacks)


Anatomy of a BSC: Card Body Lamination

23

Hot LaminationCard Cross Section

Cold LaminationCard Cross Section

Front Side OverlayFront Side Layer

FPCB InlayBack Side Layer

Back Side Overlay

Front Side LayerAdhesive

FPCB InlayAdhesive

Back Side Layer

Offset / Silk Screen Printed Layer Offset / Silk Screen Printed Layer

Offset / Silk Screen Printed Layer

Can have Magnetic Stripe, Signature Panel, Hologram

Offset / Silk Screen Printed Layer


Anatomy of a BSC: Operative Strategies


IC Power Supply

Power is supplied to SE only after successful fingerprint verification. No successful verification = no ATR.


APP Status

The terminal check APP status. Default APP state = Disabled. After successful fingerprint verification APP state = Enabled.


ATR ATR

Double ATR

Terminal checks for a 2° ATR to occur within a predefined number of clock cycles. If Fingerprint verification after the first ATR fails, then the second ATR is not sent.

24


Anatomy of a BSC: Power Supply (1/2)

With Replaceable Battery

With Rechargeable Battery+

Energy Harvesting

With Rechargeable Battery+

Chip Contact

With Non Rechargeable Battery

With Battery

No Battery+

Energy Harvesting

Without Battery

No Battery +

Supercapacitor (SC)

In some contexts SC are considered Rechargeable Batteries

25

No Battery+

Chip Contact


Anatomy of a BSC: Power Supply (2/2)• Flat, printed Lithium Ion batteries are easy to implement but can create issues:

• Transport issues (Air, Courier).

• In some countries, subject to certification.

• Supercapacitors (SC) can be used in Energy Harvesting BSC for short-term energy

storage. Use limited by high cost.

• BSC without battery requires card reader / NFC reader for enrolment.

• Replaceable batteries used in Non-ISO card (thickness) for Access Control applications.

• Most of BSC with display, buzzer, dynamic magnetic stripes and other electronics use

batteries to operate.

26


Anatomy of a BSC: FPS Cavity Making

27

Smooth and clean cavity

No debris removal

Injection Moulding

Complex industrialization for mass production

Chip and FPS sensor cavity are created during injection

Cavities punched out from PVC sheet

Operation performed after sheet printing

Sheet Punching

Requires precise alignment of lamination sandwich

Suitable for mass production

Only for sensors embedded after lamination

Require modification to chip cavity milling equipment

Mechanical Milling

Most popular method for cavity making

Suitable for mass production


Anatomy of a BSC: Swipe vs Area Sensors

Generate large Image

Problematic torsion/bending testSwipe

Sensors

Unreliable in many applications

Significant learning curveSmall footprint

Easy bonding to FPCB

AreaSensors

Accurate Subject to scratches

Large footprintEasy to use

Flexible are ideal for smart cards

28

Costly when largeand made out of silicon


Anatomy of a BSC: Area Sensors short specs

29

• Average thickness 0.25 ~ 0.3 mm (0.009 ~ 0.011 in)

• Full fingerprint scan ~ 1 sec

• 1.8 ÷ 3.3 V operations

• Resolution ≥ 500 dpi (sensors with lower resolution compensate with larger active area)

• Output 8 bit, 256 grey scale values

• Wakeup upon touch (few ms wait)

• Protective coating to increase durability

• ESD Protection ±15 kV (IEC 61000-4-2)

• Durability ≥ 1 M touches

• Some models include Bezel into their design

• For mass production shall be delivered in Super 35 mm Tape format

• Flexible Bump technology becoming popular for mass volumes embedding


Anatomy of a BSC: Sensor Position on Card• From a purely engineering point of view, the fingerprint sensor

can be placed anywhere on the card.

• From a practical perspective all current implementations place

the sensor on the right side of the card:

• The fingerprint acquisition can be performed even when

the card is working in “Contact” mode and is it inserted

into a POS slot.

• It’s the thumb ergonomic location when handling the card

for a contactless transaction.

• Swipe fingerprint sensors are placed more toward the right

edge of the card, to allow enough space for swiping process.

30

Area where fingerprint sensor is normally located in a BSC


Anatomy of a BSC: Bezel

Cover sensor bonding pads

Aesthetic

Cover sensor cavity walls

Bezel, when present, have Functionals and Aesthetic reasons:

Must be flexible enough to comply with dynamic torsional stress of ISO/IEC 10373-1 and Mastercard CQM

Electrically drive the fingertip during the sensing process

Cover gap between card and sensor

Functional

ESD protection

31


Anatomy of a BSC: MCU / ASIC• ARM Cortex M3 or M4, 32bit RISC de facto standard as general purpose MCUs

• Perform Template Match when this is not done by SE

• Coordinate/control BSC components

• Several BSC makers are designing their own ASIC:

• Integrate FPS IC + MCU + Flash + RF IC.

• Cheaper when manufactured in volume.

• Easier to integrate (less components).

• Will drive inlay cost down.

• Can be done only when product with generic MCU

reach maturity.

• Time-to-Market 18-24 months.

32


Anatomy of a BSC: RF IC• The RF IC can perform multiple tasks:

• Harvest power from RFID excitation field

• Voltage Regulator, when is not done by LDO

• Clock Generator / Clock Regulator

• Reset Generator

• Anti-collision mechanism

• Distribute power supply to both SE + BSC MCU/ASIC + FPS

• When present, charge Rechargeable Battery or

Supercapacitor

33


Anatomy of a BSC: Led, Buzzer & LCDOther elements that can be present on a Biometric Card:

LED

Buzzer

Flexible LCD / e-paper

Ensure compliance with ISO/IEC 17839-1:2014 - Biometric System-on-Card --Part 1: Core requirements

34


Anatomy of a BSC: Cless Interfaces / Transponders ICs

ISO 14443 Type A, B, C

NFC

Bluetooth LE

HID 125 kHz / HID iClass

Mifare Classic / DESFire EV1

Legic Advant

Atmel 5577

Popular on BSoC Access Cards

35


Anatomy of a BSC: Cless Interfaces / Transponders ICs

Popular on BSC Access Control Cards

HID 125 kHz / HID iClass

Mifare Classic / DESFire EV1

Legic Advant

Atmel 5577

36

ISO 14443 Type A, B, C

NFC

Bluetooth LE

Sony FeliCa

The Rise of Biometric Cards | Embedded Security News | embeddedsecuritynews.comEdition January 2018 | © 2018 Antonio D’Albore, Jean-François Mainguet | All product names, logos, and brands are property of their respective owners.

Inlay Making and BSC Personalization

37

BSC Production


BSC Production: Making of FPCBFPCB

Copper Plating

Laser Drill

Line Formatting

AOI & PSR

Gold Plating

Marking

SMD / COF

Solder Paste

Mount

Reflow

Prelam / Packaging

Placement on Template

Inlays Packing

Sensor mount on Inlay

FPCA Sheets Packing

Prelam sheets making

Inlays Packing

Bonding

38

Tray, Reelor FPCA

Tray, Reelor FPCA


Single steps when bezel is integrated into FPS design

BSC Production: Key Manufacturing Steps

Sheets PrintingSheet FPS Cavity

PunchingLayers Collation

Sheets Lamination

Sheet Punching

Cards GatheringMicromoduleCavity Milling

MicromoduleEmbedding

FPS Cavity MillingAnisotropic

conductive epoxy on contact pads

cavity walls coated with

adhesive epoxyFPS Embedding Bezel Placement

FPS embeddedafter lamination

FPS embeddedbefore lamination

39


BSC Production: Some Considerations

40

• As of today only Fingerprint Cards offer sensors delivered in a package (they call T-

Shape) able to be embedded after lamination.

• Companies are investing into making standalone FPS modules:

• Jinco Universal > allow them to use a common base inlay with several sensors from

different vendors

• Next Biometrics > allow them to offer a complete module for easy integration to card

manufacturers and BSC developers

• Some sensors (embedded on inlay) can also be placed under the overlay:

• Can be aesthetically very pleasant (flat)

• Provide additional scratch resistance to sensing area

• Does not help user experience, because won’t be any tactile reference neither

guidance for the acquisition


BSC Production: The Personalization

EmbossLaser engraving Direct-To-Card

Overlaminate

Overlay

Sensor bezel / card thickness can potentially create interference / jam in personalization equipment

Inkjet

Rear Indent

Front Indent

Retransfer

41


Section curated by Jean-François Mainguet

42

Fingerprint Sensors


Fingerprint Sensors : Types of Capture

43

The user just touches the sensing area The user sweeps their finger across the sensing area

Area Sensor“Static”

Sweep (Swipe) Sensor“Dynamic”

The larger the image, the better the recognition rates an area sensor must not be “too small”

• Ergonomics: almost no training required• Image size: smaller than Sweep Sensor• Cost: normally cost more than Sweep Sensor

• Ergonomics: some training required• Image size: normally larger than Area Sensor• Cost: normally cheaper than Area Sensor


Fingerprint Sensors: Substrate

44

Plastic

Flexible

Requires an external silicon chip (driver).

Silicon

Flexible if thinned

Cost directly linked to sensor area. Area sensor cost more than swipe sensor .

Glass

Not flexible

Requires an external silicon chip (driver).

Used for BSC Not used for BSC Used for BSC


45

Optical

- Reflection FTIR - Direct image:

- Structured light- Pinhole

- Transmission- OCT

Capacitance- Passive- Active (RF field)

Pressure

- Piezo- Conductive membrane- Tactile (MEMS)

Electro-Optical

- Piezo-led- Emissive polymer

Thermal

- Passive- Active

Ultrasound

Fingerprint Sensors: Physics


Fingerprint Sensors: Passive Capacitive Sensing

46

Valley Capacitance

Sensing Pixel

A Passive Capacitive fingerprint work on the measurement of the capacitance between the skin and the sensing pixel. - Ridge: skin is touching the coating, there is only the coating capacitance.- Valley: the capacitance between skin and coating is in series with the coating capacitance, so a lower capacitance.

To provide enough sensitivity, the coating must be as thin as possible: a few microns is better, but some companies proposes hundreds of microns at the cost of a lower resolution (blurred images).

A significant drawback is the sensitivity to external electrical fields, the most dangerous being ESD (Electro-Static Discharge).

Valley Response Signal

Coating Layer

Finger Skin

Substrate

Ridge Capacitance

Ridge Response Signal


Fingerprint Sensors: Active Capacitance RF Sensing

47

Active capacitance sensing is using a RF signal that goes through the capacitance between the skin and the pixel. The main advantage is the ability to adjust the signal level, at the cost of a connection to the skin.

Finger

Signal

Substrate

Sensing PixelBezel

Protective Coating

Valley Capacitance

Ridge Capacitance

Response Signal


Fingerprint Sensors: Active Thermal Sensing

48

The sensor measures heat capacity. A low power heat pulse is applied to each sensor pixel over a short period of time and a response is measured.

- valley: the air is very thermally resistive, and so the heat stays inside the sensing element, the final temperature is high

- Ridge: the skin is pumping the heat, final pixel temperature is lower

Finger

Protective Coating

Time

Temperature

air

skin

Temperature

difference

Heat pulse

Valley: warmer

Sensing Pixel

Heat Pulse Injecting ElementRidge: colder

Heat transfer


Fingerprint Sensors: The choice for Smart Cards

49

Find a compromise:

A sensing type: swipe or area?• Swipe: larger image but ergonomic may be a problem• Area: easier to use but costly than Swipe

A sensing technology: active capacitance & thermal are the most common for smart cards

A sensor substrate:• A silicon substrate sensor must be small because of the cost and the flexibility requirements, so with

lower accuracy• A plastic substrate is less expensive, flexible and will be larger, but requires some silicon drivers

anyhow

Power consumption

Acquisition speed


Biometric Cards and Sensors Value Chains

50

The Value Chain


Fingerprint Cards Value Chain

51

BIOMETRIC CARDSOLUTIONPROVIDER

IPs

The Biometric Card Solution Provider can potentially design Biometric Engine, ASIC and Inlay in house.

SensorManufacturer

ASICFoundry

SensorSolution Provider

Inlay Manufacturer

ASICDesigner

BiometricEngine Designer

MCU / RF ICs Supplier

Inlays / Prelams

Sensors

APIs

Dev. Tools

Test Tools

Enrolment SW

Delivery

CardManufacturer

IP Licenses

SensorManufacturer


Fingerprint Sensors Value Chain

Specs

Sensor Module Packaging

Sensor Solution Provider

Sensor Manufacturing

Sensor Controller Foundry

Sensor Controller Packaging

BIOMETRIC CARDSOLUTIONPROVIDER

IPs

ASIC Foundry ASIC PackagingASIC Design

52

IC Foundry MCU PackagingMCU Design

Biometric Engine Firmware

OR


Past Trials2014Sparebanken DINNorwayZwipe + MasterCard

Payment 2017Pick n PaySouth AfricaOT-Morpho + MasterCard

2017Absa BankSouth AfricaOT-Morpho + MasterCard

2016BundesdruckereiGermanyBundesdruckerei

Physical Access

2015Danske BankDenmarkZwipe + MasterCard

Logical Access

Applications

2017Bulbank BankBulgariaOT-Morpho + MasterCard

2015BattistolliItalyCard-Tech + Ingenico

Identification

53


Ongoing Trials

Payment

Physical Access

Logical Access

Applications

Identification

2017Pleinair CasinoFranceMeReal Biometrics

2017United NationsSwitzerlandKSID + Elan + Jinco

2017AirPlusGermanyKona I + FPC

54

2018Bank of CyprusCyprusGemalto + Visa + Zwipe

2018Mountain American Credit UnionUSAKona I + Visa


Commercial Rollouts

Payment

Physical Access

2017Woori BankSouth KoreaKorea Smart ID

Logical Access

2017Istanbul MunicipalityTurkeyKorea Smart IDApplications

Identification

55


Future Trials & Commercial Rollouts2018Cartes BancairesFranceGemalto + Visa

2018Bank of CyprusCyprusGemalto + Visa + Zwipe

56

2018Cartes BancairesFranceIdemia + Mastercard

2018Multiple BanksJapanIdemia + JBC

2018Banca Intesa San PaoloItalyGemalto + Mastercard

2018United NationsSwitzerlandKSID

2018BarclaycardUKGemalto + Visa

2018Banco SantanderSpainIdemia + Mastercard

Payment

Physical Access

Logical Access

Applications

Identification

2018Mountain American Credit UnionUSAKona I + Visa


BSC Development at Major Payment Card Schemes

57

Late entrant into BSC businessFirst BSC presented at Bloomberg Next in Oct 2017

Cooperation with Gemalto and Kona ISeveral pilots expected during Y2018

Launched Idemia F-Code to Japan Nov 2017Current focus Japanese market only

Some pilots expected in Japan during Y2018

Early sponsor of BSC technologyAdvocate of battery-less BSC

CQM qualification of several products ongoingCooperation with Idemia and Idex

Working on BSC with China Datang TechnologiesCard specs updating in progress

No qualified products announce yet


Normative References

58

Standards developed by Technical Committee ISO/IEC JTC 1/SC 17 Cards and personal identification

The current area of work for JTC 1/SC 17 consists of: • Identification and related documents • Cards, and • Security devices associated with their use in inter-industry

applications and international interchange

Details at https://www.iso.org/committee/45144.html

https://www.iso.org/committee/45144.html



59

Type S1 “conventional”

Dimensions ID-1 as ISO/IEC 7810

Torsion and bending as ISO/IEC 7816-1

Contact interface as specified in ISO/IEC 7816-3

USB interface as specified in ISO/IEC 7816-12

Contactless interface as specified in ISO/IEC 14443

Type S2 (ID-T) “ticker” – NEW FORMAT

Card is 2.5 mm (0.098 in) thick

2.5 mm thick card cannot be inserted in card slot by mistake

Width / height as an ISO/IEC 7810 card

Need not conform to ISO/IEC 7816-1 flexibility

Supports only ISO/IEC 14443 contactless interface

Regardless of S1 or S2, a BSC must have some form of feedback mechanism such as LCD display, LED or buzzer

ISO/IEC 17839-1:2014 - Biometric System-on-CardPart 1: Core requirements



60

The minimum size of an area sensor shall be 169 mm2

(13 × 13 mm or 0.512 × 0.512 in)

Allows fingerprint sensor, voice microphone, camera for facial image, signature input pad

In the case of a swipe sensor, the effective area of fingerprint capture is bigger than the sensor size. A swipe sensor shall have a minimum width of 13 mm (0.512 in)

ISO/IEC 17839-2:2015 - Biometric System-on-CardPart 2: Physical characteristics



61

ISO/IEC 17839-3:2016 covers:• Commands and data structures• Internal Enrollment and External Enrollment• Initiation of verification• Status feedback• Processing time management and extension• Capability discovery mechanism

ISO/IEC 17839-3:2016 - Biometric System-on-Card --Part 3: Logical information interchange mechanism



62

• ISO/IEC 24787:2010 - On-card biometric comparison

• ISO/IEC TR 30117:2014 - Guide to on-card biometric comparison

standards and applications

• ISO/IEC 18584:2015 - Conformance test requirements for on-

card biometric comparison applications

Other ISO TS / TR



63

• Popular certification among:

• Chip vendors, module vendors, inlays manufacturers

• Card manufacturers

• Applicable only to ISO ID-1 (S1) biometric cards

• Self-assessment methodology controlled by on-site audits

• BSC products tested under CSI (Card Structure Integrity & Security) program.

• A LoA (Letter of Approval) is issued by MasterCard for each device that has passed all

tests.

Mastercard Card Quality Management (CQM)



64

Focus on EMV® 2nd Generation Specifications

• EMV 2nd Generation Specifications in progress:• Biometric Terminal effective from Jan 1, 2018

• EMV 3-D Secure 2.0• Specifies use of multiple options for step-up authentication, including biometrics

Visa, MasterCard and Amex have updated their Applet specs allowing Fingerprint Verification to be used as PIN alternative.

Contactless BPC

Payment Terminal wait for verification response from the BPC

CVM = CDCVM

Contact BPC

No Action is performed by the Payment Terminal

CVM = No CVM



65

Payment service (PSD2) – Directive (EU) 2015/2366

• It provides the legal foundation for the further development of a better integrated internal market for electronic payments within the EU.

• It puts in place comprehensive rules for payment services with the goal of making international payments (within the EU) as easy, efficient and secure as payments within a single country.

• Requires Strong Customer Authentication, using at least two independent elements categorized as:

Something I haveCARD

Something I knowPIN

Something I amFINGERPRINT

INHERENCEPOSSESSIONKNOWLEDGE



66

ICAO Doc Series 9303 – Machine Readable Travel Documents

• ICAO – Doc 9303 – Part 9: Deployment of Biometric Identification and Electronic Storage

of Data in eMRTDs.

• ICAO – Doc 9303 – Part 10: Logical Data Structure (LDS) for Storage of Biometrics and

Other Data in the Contactless Integrated Circuit (IC).

Focus on storage / format / interoperability of biometric data into eMRTD.

No references to BSC.


Fingerprint Cards Acceptance Factors

67

CONSUMERS

Familiarity with smart cardsFamiliarity with smartphones

Increasing acceptance for new technologiesSlow acceptance of mobile payments

LEGAL

Compliant with most regional / national legal frameworks demanding biometric data not to be

stored in public DB.EU GDPR effective May 2018 prohibits processing

of “Biometric Data”

INDUSTRY

Need to reduce Card-Present FraudImprove Identification / Verification processes

Growing focus on Safety/Security of physical assetsMinor or no infrastructure upgrade cost

Rising immigration control & MRTD verification

HEALTH

Risk of infection transmission with standalone Fingerprint scanner (rotavirus, norovirus, hepatitis

A virus, respiratory syncytial virus, rhinovirus, influenza virus, Shigella dysenteriae,

Enterohemorrhagic Escherichia coli, etc.)


Fingerprint Cards Potential Blocking/Risk Factors

68

• Rejection due to personal reasons.

• Cultural incompatibility.

• Absence of respective biometric feature.

• Insufficient characteristics of the respective biometric feature.

• Abnormal characteristic of the respective biometric feature.

• Criminal organizations might develop techniques to fool fingerprint sensor (liveness detector, blood

detector, etc.).

• Because Biometric features are static, stolen (capture, cloned, forged) biometric cannot be revoked or

changed.

• Challenge to get product working in Hot / Dry / Dirty environment.

• Competing mobile payment technology may impact the smart card market.

• Banks / Organizations might be unwilling to pay for the product high price.


BSC Drawbacks

69

• Much more complex to manufacture compared to a standard dual interface smart card

• Much more expensive than a standard dual interface smart card

• Need user going through a certain product use training, even if minimal

• More complex to activate compared to a standard dual interface smart card

• Payment BSC without battery cannot be used for user authentication at standard ATMs

• Payment BSC cannot be used or used with difficulty in stores that have POS terminal positioned far from

customers

• Issuer shall bear the additional cost for the enrolment process:

• For Assisted Enrolment, cost of trained staff + enrolment equipment

• For Self-Enrolment cost for additional device and its shipping to user


Tier 1 Card Vendors

70

The Companies of the Business


Tier 1 Card Vendors: Gemalto

71

• Initial approach was to use BSC licensed from two developers

• BSC Products:

• Licensed Contact-only BSC, with IDEX Sensor

• Licensed Dual Interface BSC, with FPC Sensor

• Dual interface, battery-less BSC, under development (FPC Sensor)

• Product industrialization completed at major plant in France. When business will pick-up

possible card body making at Singapore plant.

• Joint Marketing promotion with MasterCard

• Several trials, mostly in Europe, expected to deploy during Y2018

• Commercial launch expected Q1/Y2018

• Finalizing BSC system integration with Cartes Bancaires (France)


Tier 1 Card Vendors: Idemia

72

• First, among top card vendor to have started development of BSC

• Two in-house development from Oberthur and Safran Morpho teams

• BSC Products, all in-house development, F-Code line:

• Contact-only BSC (IDEX Sensor)

• Dual interface, battery-less BSC (FPC1320 Sensor)

• Dual interface, battery-less BSC (FPC1321 T-Shape Sensor) called F-Code Comfort

• Industrialization completed at major European plant. When business will pick-up

possible card body making at Shenzhen plant.

• Joint Marketing promotion with MasterCard

• Ongoing trial of F-Code Comfort at Cartes Bancaires LAB

• First Mass Deployment expected on Q2/Y2018 by Cartes Bancaires, France

• Partnering with JCB for Japanese market


Tier 1 Card Vendors: G+D

73

• Not aware of any development


BSC Developers

74



BSC Developers: Bundesdruckerei GmbH

1879

Founded

Germany

HQ

Sole Proprietorship

Type

Ulrich Hamann

CEO

• World leader in the field of ID technology and banknote printing• Owned by The Federal Republic of Germany• Producer of Germany National ID Cards and ePassports• Developed GoID, multifunctional Contactless ID BSC:

• Use capacitive sensor• Thick 2.5mm (Format ISO S2)• Made of hard-wearing fibre composite• Energy harvesting• Can have display, keypad and lanyard hole• Some components made with 3D printing process

bundesdruckerei.de

WEB

75


BSC Developers: CardLab ApS

2003

Founded

Denmark

HQ

Private

Type

Frank Sandeløv

CEO

• Strong IP Portfolio focusing on Powered Smart Cards• Partnership with QuardLock for development of a OTP BSoC• Trials in USA and UAE• Exclusive lamination process with variable temperature setup• New Thailand plant, expected launch of BSC products Q1 Y2018• Key Products:

• Non-rechargeable battery dual interface BSC inlay and cards• Non-rechargeable battery contactless NFC BSC inlay and cards• Inlays with multiple items: fps + display + dynamic magstripe + led• BSC with Swipe sensor FPC1080A (FIPS compliant)

Cardlab.com

WEB

76


BSC Developers: Card-Tech S.r.l.

77

2006

Founded

Italy

HQ

Private

Type

Fabrizio Borracci

CEO

• Holds global set of patents on Biometric System on Card• Manufacturing partnership with top-tier card vendor• Partnership with IDEX for sensors, sensor embedded on inlay• Flexible inlay engineered for seamless integration with existing

processes• No bezel design• Template Matching on SE• Key Products:

• Contact BSC inlay, next live pilot at bank Q1/2018• Dual Interface Energy Harvesting BSC inlay (under development)

card-tech.it

WEB


BSC Developers: Feitian Technologies

78

1998

Founded

China

HQ

SZSE: 300386

Type

Yu Huang

CEO

• Chinese professional card manufacturer specialized in PKI and Strong ID products• Y2016 revenue CNY882.43M (€112M)• Offering Mobile Payment Terminals, OTP Tokens, Card Readers, Software

Protection Tokens, Card OS licensing, ID and EMV Cards • Developing contactless BSC with Idex area sensor

ftsafe.com

WEB


BSC Developers: First Biometrics

79

2015

Founded

USA

HQ

Private

Type

Charlie Gomez

CEO

• Private funded start-up• Own IPs + acquired IPs for several patents on Biometric Cards processes and

manufacturing• Partnership with Next Biometrics for Large Area Sensors• Partnership with tier-one SE suppliers• Manufacturing base in East Asia and US• BSC under development:

• FIPS certified BSC for ID market, battery powered• Large area sensor BSC for Payment market, battery powered• Energy harvesting BSC

firstbiometrics.com

WEB


BSC Developers: Infinacom, LLC.

80

• Private company, spinoff from Diamond Sun Labs, founded by Francisco (Cisco) Schipperheijn (Founder), Keith Goldstein (CEO) and Thomas Ziemkus (CTO)

• R&D activities ongoing, target products:• Dual Interface Battery-less Payment BSC• Virtual Payment BSC

• The Virtual BSC is intended to be an APP provided to customer, associated with the real BSC.

• Developing Biometric Engine based on SE, inlay without MCU.• Licensing business model targeting card manufacturers.

Founded

2017

HQ

USA

Type

Private

CEO

Keith Goldstein

WEB

infinacom.com

https://www.linkedin.com/in/ciscoschipperheijn/

https://www.linkedin.com/in/keithegoldstein/

https://www.linkedin.com/in/thomas-ziemkus-821b864/


BSC Developers: Jinco Universal Co. Ltd.

81

HQ Type CEO

• Asia’s strongest OEM/ODM of customized powered smart cards / inlays• Partnership with Korea Smart ID (KSID) for Card Production• Partnership with Elan Microelectronics for sensors• Strong promotion in South Korea / China / Taiwan / South East Asia• Specific patents on BSoC• Working on retina recognition smart card (patented)• Key Products:

• Contactless BSC with rechargeable battery• Dual Interface, energy harvesting BSC• Dual Interface, rechargeable battery BSC with dynamic magstripe and display

WEBFounded

2005 Taiwan Private Ted Lin (林武旭) Jinco.com.tw


BSC Developers: Kona I

82

HQ

• South Korea largest manufacturers of smart cards• Strong Card OS and manufacturing know-how• Supplier to Visa for trial BSCs• Sensors from FPC, biometric engine by Precise Biometrics• Offer a full range of BSC, in house Inlay development:

• Non-rechargeable or rechargeable Battery• Energy-Harvesting• e-paper display• PKI engine

WEBFounded

1998 South Korea

Type

KOSDAK052400

CEO

Jung-il Cho (조정일) konai.com


BSC Developers: Korea Smart ID

83

• Subsidiary of UNISEM Group, South Korea industrial group manufacturer of equipment for semiconductor manufacturing

• Company focus is BSC system integration• Cooperation with Kona I (Card OS) and Jinco Universal (BSC Inlay) • So far, KSID is the company with the largest number of BSC

deployed in the market:• UN Geneva, Logical and Physical access control BSC• Woori Bank, bidding system for National Market Agency

of the Public Procurement Service• Istanbul Municipality, taxi drivers License ID card

Founded

2013

HQ

South Korea

Type

Private

CEO

Dong Su Kim (김동수)

WEB

emobileid.co.kr


BSC Developers: Linxens

84

• World-class provider of component-based solutions for the security & identity market, shipped more than 90 Billion connectors since its founding.

• Cooperation with FPC on the T-Shape packaging• Developer of OEM inlay technology, powered by Contact, Antenna or Battery,

supporting several components:• Sensor• MCU• SE• Contact Plate• RF Antenna / Battery

Founded

1986

HQ

France

Type

Private

CEO

Christophe Duverne

WEB

linxens.com


BSC Developers: Lion Security Co., Ltd.

85

• Private South Korean company leveraging VP Mr. Daniel Park previous experience in E-Smart Technologies.

• Developing BSC on Cold Lamination technology• Key product is LS-BMC (Lion Security - BioMetrics Card):

• Energy harvesting dual interface• Area sensor FPC 9.6 x 9.6 mm, 508 dpi• Arm M4 MCU

Founded

2015

HQ

South Korea

Type

Private

CEO

In-Beom Kang (강인범)

WEB

lioncu.net


BSC Developers: Maneul Lab Inc.

86

2004

Founded

South Korea

HQ

Private

Type

JunYoung Chang (장준영)

CEO

• South Korean start-up working on several IT solutions:• M-Cube: Indoor Location Service• MobiTalk: Messaging solution• Red POS: POS solution• The Card: battery-powered wallet card – up to 200 cards - with Fingerprint sensor.

• First prototype publicly demo at Trustech 2017 was with sensor under overlay• Currently working on area sensor from FPC• Biometric engine by Precise Biometrics

maneullab.com

WEB


BSC Developers: Mereal Biometrics Ltd.

87

2009

Founded

Hong Kong

HQ

Private

Type

Philippe Blot

CEO

• Investment by French Groupe Partouche (Casino, Hotel, Events)• Co-founded by Philippe Blot (UINT CEO)• Patented Acoustic / RFID OTP transmission to terminal• Sales & Marketing base in Hong Kong• UINT Limoges (France) engineering & manufacturing plant• Current production capacity ~250K cards / month• Key Products:

• Dual Interface, rechargeable battery BSC with Swipe Sensor• Dual Interface, rechargeable battery BSC with Area Sensor from FPC• Contactless Portable Charger

merealbiometrics.com

WEB


BSC Developers: MoriX Co., Ltd.

88

2005

Founded

Japan

HQ

Private

Type

Morihiko Kubota(久保田守彦)

CEO

• Partnership with Toshiba Solutions Corp.• Selling Cards & Fingerprint Sensors• In-house Fingerprint Matching algorithm development• COF Sensor Co-developed with ASD: 508 dpi, 9.4 x 11 mm active area• NFC BSC under development• Key Products:

• BSC contact with non-rechargeable battery• BSC contact with display and non-rechargeable battery• Fingerprint Sensor module

morixjp.com

WEB


BSC Developers: NXP Semiconductors (1/2)

89

1953

Founded

Netherlands

HQ

Nasdaq: NXPI

Type

Richard L. Clemmer

CEO

• On October 31, 2017, NXP announced to be working with Fingerprint Cards on a BSC solution. No details where given. I can only speculate that it will be something like this:

nxp.com

WEB

ISO/IEC 14443

SmartMX2P60-Like SE

M4-LikeMCU

Power Management IC

ISO/IEC 7816

FPS (SPI) FPS (Vdd)

BSC App

I/O VDD

Most likely Extraction and Matching from Precise Biometrics.

NXP has license to embed BioMatch into their solutions.

Biometric OS Layer into User ROM

FPC Sensors Firmware NXP solution, I believe will be available in FFC or PDM package


90

BSC Developers: NXP Semiconductors (2/2)

• However, if it will be like expected, will be a disruptive innovation with consequences:

• Extremely simplify the task of inlay development, because it will carry simply an antenna with two wiring to sensor (SPI and VDD) plus sensor bonding pads

• Drastic reduction of Inlay cost

• Combined with FPC T-Shape sensor, will allow 2nd tier card manufacturers to enter into the BSC business using the production process that they already in place for financial cards (Hot Lamination + Milling + Embedding)

• Will pose an extremely serious threat to companies such as Card Tech, Zwipe and others that have heavily invested into own BSC inlay development and are without differentiating factors (e.g. own card OS, e-paper displays, acoustic authentications, batteries, dynamic CVV).


BSC Developers: SmartDisplayer

91

2002

Founded

Taiwan

HQ

Private

Type

George Ou(檔案)

CEO

• Company specialized in design and manufacturing of powered cards such as Display Cards, OTP Cards, Dynamic CVV Cards and All-in-one cards

• Delivered to market > 8M Display Cards including 600.000 All-in-one Cards• HQ, R&D and Production unit in Taiwan• Battery-powered BSC with area sensor under development

smartdisplayer.com

WEB


BSC Developers: Tactilis Pte

92

2014

Founded

Singapore

HQ

Private

Type

Michael Gardiner

CEO

• Firm founded by industry seasoned professionals• Privately funded• Exclusive, patented manufacturing process• Fully equipped plant in Penang, Malaysia• Offering BSC Inlays & complete cards• Supporting a tier-one card vendor• Integrate secure flash up to 4GB• Low profile communication strategy• Key Products:

• Dual interface, energy harvesting, BSC with large area sensor card + inlay

tactilisltd.com

WEB


BSC Developers: Toshiba Corp.

93

1875

Founded

Japan

HQ

TYO: 6502

Type

Satoshi Tsunakawa(綱川智)

CEO

• BSC developed by Toshiba Infrastructure Systems & Solutions Corp.• First product targeting mainly ID applications• Main specs of first BSC launched in the market:

• Contact only, no battery• Enrolment performed on USB fingerprint scanner• Minutiae extraction and template creation done by App on PC, then

transferred to SE• Uses a Morix FPSF105AU Area Sensor, 8 x 8mm, 160 x 160 pixels• Hot laminated card body

toshiba.co.jp

WEB


BSC Developers: Zwipe AS

94

2009

Founded

Norway

HQ

Private

Type

Kim Kristian Humborstad

CEO

• Strongest IP Portfolio for Biometric solutions with >50 patents• Kuang-Chi Group partner for China JV and 20.1% stake• First company to have trials with MasterCard• Inlay-based solution tailored for card manufacturers• Sensor agnostic solution, currently delivering FPC FPS• Supplier of Dual Interface BPC Inlay to Gemalto• Key Products:

• Access Control BSC (non-ISO, replaceable battery) • Contactless Energy harvesting BSC (ID, Access Control) • Dual Interface Energy Harvesting BSC inlay (Payment)

zwipe.com

WEB


BSC Developers: Whom is Offering What

95

Non-Rechargeable

Battery

Rechargeable Battery

+Chip Contact

Rechargeable Battery

+Energy Harvesting

No Battery+

Chip Contact

No Battery+

Energy Harvesting

Replaceable Battery

Sell Complete Card?

Sell Inlay?

CardLab ✓ ✓ ✓ ✓ ✓ ✓ ✓

Card Tech ✓ ✓ ✓ ✓

Gemalto ✓ ✓ ✓

Idemia ✓ ✓ ✓ ✓

Jinco Universal ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓

Kona I ✓ ✓ ✓

KSID ✓ ✓ ✓ ✓

Lion Security ✓ ✓

Linxens ✓ ✓

Maneullab ✓ ✓

MeReal Biometrics ✓ ✓

Morix ✓ ✓ ✓

SmartDisplayer ✓ ✓ ✓

Tactilis ✓ ✓ ✓ ✓

Zwipe ✓ ✓ ✓ ✓


Fingerprint Sensors Developers

96



FPS Makers: Datang Microelectronics

97

1996

Founded

China

HQ

Private

Type

Yanhui Yang (杨延辉)

CEO

• Belonging to Datang Telecom Technology, a State owned 3.3B$ industrial group• China largest design house + foundry for Smart Card ICs• In-house development + production of Capacitive Area and Swipe sensors• In-house development + production of MCU + RF Chip• Business cooperation with Chengdu Finchos Electronics• China strongest company in smart card-related development• Key Products:

• Capacitive Sensor DMT-FS-PB4F, 208 x 288 pixel, 14.4 x 10.4 mm, 508dpi, UnionPay and FIPS Certified

• MCU DMT-FAC-CG4Q, Core ARM SC300, EAL 4+ certified

dtm.com.cn

WEB


FPS Makers: Elan Microelectronics Corp.

98

1994

Founded

Taiwan

HQ

TPE: 2458

Type

I. H. Yeh (葉儀晧 )

CEO

• Company listed on Taiwan Stock Exchange with $750M Market Cap.• Y2016 revenue of $218M• HQ in Taiwan, offices also in China and USA, >1000 employees, >55% in R&D• Products: FPS, Smart Human Interface, Notebook Input Device, MCU• Hold multiple patents on sensors, registered in Taiwan, China and USA• Partner on BSC cards with Jinco (FPCB + Lamination) and KSID (SE)• Cards with Elan sensor currently under test at United Nations• Low-power Area Sensor for Battery-Less BSC under development (target Q2/Y2018)• Key BSC Products:

• eFSA160S-H701Z Area Sensor, 160 x 160 pixel, 8 x 8 mm

emc.com.tw

WEB


FPS Makers: Fingerprint Cards AB (1/2)

99

1997

Founded

Sweden

HQ

STO: FING-B

Type

Christian Fredrikson

CEO

• Biometric company, focus on sensors, algorithms, software and packages• Listed in Nasdaq Stockholm, Y2016 revenue €678M, 39% operating margin• 550 employees on 13 offices in Sweden, USA, India, China, Korea, Japan, Denmark• Strong player in fingerprint sensors for mobile• Offering capacitive silicon-based area and swipe sensors optimized for smart cards• Most recent area sensors are delivered in LGA or T-Shape packaging• Developed FPC1300-Serie optimized for smart card application:

• FPC1320, 508dpi • FPC1321, 508dpi, smaller and lower power consumption than FPC1320

• FPC 1080A, swipe sensor, FIPS compliant

fingerprints.com

WEB


100

• The Fingerprint Cards T-Shape is a packaging option for the FPC 1300 series

• Optimized for hot lamination + milling + embedding process

Bonding PadsBezel Sensing Area

35mm TapeTape on Sensing Area act as protective layer

Exte

rnal

Sid

e

Inte

rnal

Sid

e

FPS Makers: Fingerprint Cards AB (2/2)


FPS Makers: IDEX ASA

101

1996

Founded

Norway

HQ

OSE: IDEX

Type

Dr. Hemant K. Mardia

CEO

• Company listed on Oslo Stock Exchange with NOK 2.739B ($ 336M) Market Cap.• Biometric company, focus on fingerprint imaging and fingerprint recognition technology• >120 employees, with offices in Norway, UK, USA, China• Offer silicon and polymer sensors for mobile, IoT and smart card applications• Patented Off-Chip technology where MCU and Sensor controller are integrated under

the polymer-base sensing area• Main offering of off-chip sensors optimized for smart cards:

• IDX3010, sensing area 8.9 x 8.9 mm, 130 x 129 pixel, 373 dpi• IDX3200, sensing are 9.5 x 9.5 mm, 132 x 131 pixel, 350 dpi• 13 x 13 mm sensor under development, release expected during Y2018

idex.no

WEB


FPS Makers: Infinity Electronic Biotech

102

2007

Founded

Taiwan

HQ

Private

Type

Ye Jian Tim(葉健添 )

CEO

• Subsidiary of Super Wings International Ltd, an Hong Kong company operating in Textile and Biometrics.

• Specialised in silicon-based capacitive fingerprint sensors• Offering BSC-optimized sensor IFE338:

• capacitive area sensor• 192 x 192 pixel @ 508 dpi• I/F UART or GPIO• Module with integrated MCU• Module size 13.5 x 26 x 0.61 mm (W x L x T)

ifebiotech.com

WEB


FPS Makers: MoriX Co., Ltd.

103

2005

Founded

Japan

HQ

Private

Type

Morihiko Kubota(久保田守彦)

CEO

• In-house Fingerprint Matching algorithm development• Key specs of BSC optimized FPSF 105 AU fingerprint sensor:

• Capacitive area sensor 8 x 8 mm, 508 dpi, 160 x 160 pixels• Built-in 8 bit ADC• Finger present detection• SPI Interface• Power consumption:

• Standby mode 1.5 mA• During fingerprint scan 7 mA

morixjp.com

WEB


FPS Makers: New Imaging Technologies

104

2005

Founded

France

HQ

Private

Type

Francois Coursaget

CEO

• French company pioneer in Wide Dynamic Range solutions• Developer of optic-less high resolution, up to 2000 dpi, fingerprint sensors• At least two BSC developers are working to integrate NIT sensors into their

products

new-imaging-technologies.com

WEB


FPS Makers: Next Biometrics Group AS

105

2000

Founded

Sweden

HQ

OSE: NEXT

Type

Ritu Favre

CEO

• Company listed on Oslo Stock Exchange with $80M Market Cap.• HQ in Oslo, offices in Czech Rep., USA, Taiwan and China, 60 employees• Core business design and commercialize flexible fingerprint sensors• Fingerprint sensing through patented Active Thermal principle• Manufacturing partnership with Innolux Taiwan• Sensor used in Tactilis, and First Biometrics (under development) BSC• Only supplier offering an ISO-Compliant area sensor (11.9 x 17.9 = 201 mm2)• Key BSC Products:

• NB-0610-S2, 11.9 x 16.9 mm, 385 dpi, • NB-4410-S2/I2 (sensor + flexible inlay module)

nextbiometrics.com

WEB


FPS Makers: FlexEnable Ltd

106

2015

Founded

UK

HQ

Private

Type

Chuck Milligan

CEO

• Offer flexible platform based on high performance organic thin-film transistor (OTFT)• Company platform enables flexible, thin, robust displays

and sensors• Key solutions for BSC:

• Capacitive fingerprint sensor• Optical fingerprint sensor with vein sensing capability

• FlexEnable business model:• IPs license• Prototypes making• Technology transfer

flexenable.com

WEB


Developers of BSC-Optimized Biometric Engines

107



Developers of BSC-Optimized Biometric Engines

Precise Biometrics ZwipeFulcrum Biometrics

Idemia id3Innovatrics

108

NeuroTechnology


BSC Key Industry Organizations

109

Russian Biometric Society

Russiarusbiometrics.com

European Association for Biometric

The Netherlandeab.org

Biometric Institute

UK / Australiabiometricsinstitute.org

Swedish National Biometric Association

Swedenbiometricassociation.org

International Biometrics + Identity Association

USAibia.org

Center for Biometrics and Security Research

Chinacbsr.ia.ac.cn

Fido Alliance

USAfidoalliance.org

National Institute of Standards and Technology

USAnist.gov


Global BSC Shipment Forecast Y2018-2020

110

Source: ABI Research, Fingerprint Cards, Gartner, HIS Markit, Nilson Report, Precise Biometrics, Statista, Carnegie Research, Strategy Analytics, Swedbank, Antonio D’Albore estimates.

0

50

100

150

200

250

300

2018 2019 2020

Mill

ion

s o

f C

ard

s Other

Access Control

ID

Payment


Global BSC ASP Forecast Y2017-2020 (K pieces)

111

$-

$5

$10

$15

$20

$25

$30

$35

$40

2017 2018 2019 2020

Clamshell BSC

Battery BSC

No battery BSC


The Future

112

• Vein sensing capability• Blood flow / heartbeat detection• FPS IC + RF IC integrated into Smart Card Chip• Dynamic CVV/DCV + FPS for full CP and CNP fraud

protection• FPS under conductive plastic• Contactless fingerprint• Behavioural biometric• DNA scanner• Associate template with finger temperature

vein pattern


Biometric Cards: latest developments (1/2)

113

• A leading company, manufacturer of secure elements has started developing a SE with

integrated interfaces for fingerprint sensor.

• Two tier-1 BSC developers are developing enrolment solutions based on POS and ATM.

• KSID is developing a new BSC with ePaper display

• Visa announces BPC trials in Mountain America Credit Union and Bank of Cyprus

• A South East Asia-based company started developing a BSC inlay targeting card

manufacturers. Product expected to be announced during Y2018.

• Idex ASA working on a new polymer-based area sensor and an innovative solution for

self-enrollment


Biometric Cards: latest developments (2/2)

114

• Toshiba launched contact-only BSC with Morix area sensor

• SmartDisplayer have started development of BSC with area sensor

• Elan is developing a low power consumption area sensor optimized for battery-less BSC

• Idemia and JCB announced launch F-Code card in Japan. Not sure if this announcement

can have any effect on the ongoing partnership between Idemia and MasterCard.

• IDEX officially announced their partnership with MasterCard

• Germany company Mühlbauer involved in customization of equipment for Milling +

Embedding of fingerprint area sensors onto cards.


ACKNOWLEDGEMENTS

115

Thank you to the following people for all their contribution, effort, motivation provided to me during this work: Ondřej

Adámek, Rouzet Agaiby, Massimo Edoardo Baumgartner, Paolo Bean, Fred Benkley, Luca Bertoletti, Fabrizio Borracci,

Adriano Canzi, Unho Choi, James Chuang, Mona Chung, Laszlo Csercsa , Renato Comelli, Thomas Decker, Pascal Dufour,

Ritu Favre, Sebastian Gallschütz, Michael Gardiner, Franck Germain, Kim Kristian Humborstad, Min-ki Jung, In-Beom Kang,

Dong Su Kim, Ariyuki Kishimoto, Charlotte Knudsen, Henrik Knudzon, Julien Larsonneur, Ted Lin, Joe Lo, Christopher A

Ludden, Hemant Mardia, Giovanni Memoli, Anne McAleer, Chuck Milligan, Marc Muller, Robert Mueller, Henning Bonde

Nielsen, Francesco Pesenti Barili, Nicolas Raffin, Michel Roig, Frank Sandeløv, Michele Scarlatella, Stan Swearingen, Mindy

Tan, Luca Tenzi, Enrico Vainieri, David B. Walshak, David Wyatt, Jin Yiwen.

Finally, to my caring, loving, and supportive wife, Tina: my deepest gratitude. Your encouragement when the times got

rough are much appreciated and duly noted. My heartfelt thanks.


Contacts

116

Antonio D’Albore

Editor-in-Chief

Embedded Security News

[email protected]

+39 392 5198737

@AndongESN

@embedded.sec.news

embeddedsecuritynews.com

Jean-François Mainguet

biometrics.mainguet.org

Fingerprint Sensors section curated by

mailto:[email protected]


References

117

- http://coe.int/en/web/conventions/full-list/-/conventions/treaty/005- http://cordis.europa.eu/search/result_en?q=cardlab- http://dhl.it/en/express/shipping/shipping_advice/lithium_batteries.html- http://dmt.com.cn/product/aqkz/zwsb/529.html- http://ec.europa.eu/justice/policies/privacy/docs/95-46-ce/dir1995-46_part1_en.pdf- https://en.wikipedia.org/wiki/Biometrics- https://en.wikipedia.org/wiki/Data_Protection_Directive- https://en.wikipedia.org/wiki/General_Data_Protection_Regulation- https://en.wikipedia.org/wiki/Fingerprint_recognition- https://en.wikipedia.org/wiki/Personally_identifiable_information- https://en.wikipedia.org/wiki/Supercapacitor- http://fingertec.com/download/tips/whitepaper-01.pdf- http://www.gemalto.com/govt/biometrics/biometric-data- http://heritage.org/homeland-security/report/biometric-technologies-security-legal-and-policy-implications- http://horizon2020projects.com/special-reports/technical-information-card-fraud-identity-theft-protection-

technologies/- http://iata.org/whatwedo/cargo/dgr/Pages/lithium-batteries.aspx- https://www.icao.int/Meetings/a38/Documents/WP/wp094_en.pdf- https://www.icao.int/publications/pages/publication.aspx?docnum=9303

https://en.wikipedia.org/wiki/Fingerprint_recognition









https://en.wikipedia.org/wiki/Personally_identifiable_information

https://en.wikipedia.org/wiki/Supercapacitor

http://fingertec.com/download/tips/whitepaper-01.pdf

http://www.gemalto.com/govt/biometrics/biometric-data

http://heritage.org/homeland-security/report/biometric-technologies-security-legal-and-policy-implications

http://horizon2020projects.com/special-reports/technical-information-card-fraud-identity-theft-protection-technologies/

http://iata.org/whatwedo/cargo/dgr/Pages/lithium-batteries.aspx

https://www.icao.int/Meetings/a38/Documents/WP/wp094_en.pdf

https://www.icao.int/publications/pages/publication.aspx?docnum=9303


References

118

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Murdoch, S.J., Drimer, S., Anderson, R., Bond, M.: Chip and PIN is broken. In: 2010 IEEE Symposium on Security and Privacy (2010)

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Specs

121

ISO/IEC 7816-4:2013 Identification cards – Integrated circuit cards – Part 4: Organization, security and commands for

interchange

ISO/IEC 7816-11:2014 Identification cards – Integrated circuit cards – Personal verification through biometric methods

ISO/IEC 9797-2:2011 Information technology – Security techniques – Message Authentication Codes (MACs) – Part 2: Mechanisms

using a dedicated hash-function

ISO/IEC 17839-1:2014 Biometric System-on-Card: Core requirements

ISO/IEC 17839-2:2015 Biometric System-on-Card: Physical characteristics

ISO/IEC 17839-3:2016 Biometric System-on-Card: Logical information interchange mechanism

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ISO/IEC 18033-3:2010 Information technology – Security techniques – Encryption algorithms – Part 3: Block ciphers

ISO/IEC 19092:2008 -- Financial services -- Biometrics -- Security framework

ISO/IEC 19785-3 Information technology – Common Biometric Exchange Formats Framework – Patron format specifications

ISO/IEC 19794-1:2011 - Information technology -- Biometric data interchange formats -- Part 1: Framework

ISO/IEC 19794-2:2011 - Information technology –- Biometric data interchange formats –- Part 2: Finger minutiae data

ISO/IEC 19794-2:2011/Cor 1:2012 - XML encoding and clarification of defects

ISO/IEC 19794-2:2011/Amd 1:2013 - Conformance testing methodology and clarification of defects

ISO/IEC 19794-2:2011/Amd 2:2015 - Conformance testing methodology and clarification of defects

ISO/IEC 19794-3:2006 - Information technology -- Biometric data interchange formats -- Part 3: Finger pattern spectral data

ISO/IEC 19794-4:2011 - Information technology -- Biometric data interchange formats -- Part 4: Finger image data

ISO/IEC 19794-5:2011 - Information technology -- Biometric data interchange formats -- Part 5: Face image data

ISO/IEC 19794-6:2014 - Information technology -- Biometric data interchange formats -- Part 6: Iris image data

ISO/IEC 19794-7:2014 - Information technology -- Biometric data interchange formats -- Part 7: Signature/sign time series

data

ISO/IEC 19794-8:2011 -- Information technology -- Biometric data interchange formats -- Part 8: Finger pattern skeletal data

ISO/IEC 19794-9:2011 -- Information technology -- Biometric data interchange formats -- Part 9: Vascular image data

ISO/IEC 19794-10:2007 -- Information technology -- Biometric data interchange formats -- Part 10: Hand geometry silhouette

data

EMV® Specification Bulletin No. 185 - First Edition March 2017 - Biometric Terminal Specification


Patents (1/5)

122

CA 02581230 C Apparatus for fingerprint sensing and other measurements

CN 2010 20665177 非接触式包含指纹辨识的电子智能卡片 (Non-contact intelligent electronic card comprising

fingerprint identification )

CN 2010 20671893 非接触式电子式智慧卡片 (Non-contact electronic smart card )

CN 2015 20355127 智慧卡片指纹按压装置 (Wisdom card fingerprint press device)

CN 2016 02176914 U Fingerprint identification smart card

DE 2002 10257111 A1 Chipcard and method for production of a chipcard

DE 2016 10101609 A1 Authentifikationsvorrichtung, Authentifikationsdokument und Verfahren zur

Authentifizierung einer Person

DE 2016 10201976 B3 Vorrichtung und Verfahren zur Bearbeitung eines Substrats

GB 2012 00019750 D0 Enrolling fingerprints by combining image strips to obtain sufficient width

GB 2013 00004639 D0 Fingerprint sensor

GB 2015 00022870 D0 Biometric smartcard with multiple modes of operation

GB 2015 00008294 D0 Biometric enrolment authorisation

GB 2015 00008296 D0 Contactless biometric identification device allowing multiple configurations

GB 2016 00000892 D0 Low thickness biometric card

GB 2016 00003099 D0 One-time password device

GB 2016 00004138 D0 Apparatus for testing a battery-powered device

GB 2016 00009572 D0 Smartcard and method for controlling a smartcard

GB 2016 00014998 D0 Biometric smartcard for providing feedback to a user

GB 2017 00004847 D0 Calibration method

GB 2017 00006460 D0 Biometric smartcard


Patents (2/5)

123

IT 2006 UD00028 A1 Carta Elettronica Universale Personale

IT 2006 UD00046 A1 Metodo Per Realizzare Una Scheda Personale Sicura E Suo Processo Di Funzionamento

IT 2006 UD00075 A1 A method for making a secure personal card and its working process

JP 2011 0105750 A ic card with fingerprint authentication

JP 2014 0529123 A Biometric authentication available smart card

JP 2016 0115098 A 指紋認証付スマートカードとこれを用いた決済方法(Smart card with fingerprint authentication and settlement method using the same)

KR 2014 0164109 B1 RF Smart Combi-card Of Fingerprint Type And Dealing Method Thereof

KR 2015 0056437 RF Smart Card Of Fingerprint Type With Battery

KR 2015 0121247 Fingerprint Recognition Card and Authentication Method Using the Same

KR 2015 0180446 B2 Smart Card Integrated With Thermoelement And Fingerprint Verification Chip As Laminated

Structure

KR 2016 0064133 A Smart Card Comprising Fingerprint Detecting Device And Method For Driving The Same

KR 2016 0090633 A Smart Card And A Fingerprint Recognition System Using Thereof

KR 2016 0125877 A RF Smart Card of Fingerprint Type with Battery

KR 2016 0129832 B1 Fingerprint Smart Card Having A Prevention Function Forged Fingerprint

TW 2010 0009718 A Method of manufacturing secure personal card and manufacturing processes thereof

TW 2016 0029842 A Fingerprint press device for smart card

TW 2016 0202811 U Switch structure of electronic module


Patents (3/5)

124

US 1983 4621190 A Card with an IC module

US 1999 6325285 B1 Smart card with integrated fingerprint reader

US 2004 0129787 A1 Secure biometric verification of identity

US 2005 0178827 A1 Flexible fingerprint sensor arrays

US 2005 0212657 A1 Identity verification system with self-authenticating card

US 2006 0000892 A1 Method for biometric security using a smartcard

US 2006 0000899 A1 Method and system for dna recognition biometrics on a smartcard

US 2006 0113381 A1 Batteryless contact fingerprint-enabled smartcard that enables contactless capability

US 2007 0223179 A1 Fingerprint recognition smart card

US 2007 0228154 A1 System and method for sensing biometric and non-biometric smart card devices

US 2008 0164325 A1 Universal Smart Card

US 2008 0054875 A1 Biometric sensor and sensor panel

US 2008 0040615 A1 Biometric embedded devicer

US 2009 0084858 A1 Method For Making A Secure Personal Card And Its Working Process

US 2012 0241524 A1 Activation and indication of an RF field on a device including a chip

US 2013 0036463 A1 Biometric-enabled smart card

US 2013 0320464 A1 Integrally molded die and bezel structure for fingerprint sensors and the like

US 2015 0049925 A1 Method of manufacturing an electronic card

US 2015 0286855 A1 Fingerprint matching algorithm

US 2015 0371077 A1 Fingerprint recognition for low computing power applications

US 2015 0379250 A1 Secure biometric verification of identity

US 2017 0161528 A1 Smart card systems comprising a card and a carrier

US 2017 0213097 A1 Flexible Card with Fingerprint Sensor

US 2017 0213122 A1 Document with Sensor Means


Patents (4/5)

125

US 2017 0228631 A1 Smartcard and method for controlling a smartcard

US 2017 0262692 A1 Capacitive Fingerprint sensing Device and Methon for Capturing a fingerprint using the

sensing device

USD 693874 S1 Electronic payment card with biometric verification means

USD 776664 S1 Smart card

USD 786355 S1 Smart card with a chip and finger-print sensor

USD 788847 S1 Smart card with a chip and finger-print sensor

USD 791772 S1 Smart card with a fingerprint sensor

WO 1998 052735 A1 Method of making smart cards

WO 2011 083241 A1 Multiple application chip card having biometric validation

WO 2006 080929 A1 Method of making a memory card by injection molding

WO 2013 155040 A1 Smart connect devices for the interconnectivity of data cards with computing devices to

enable the performance of various functions upon authentication by a user's fingerprint

and/or a user's photograph

WO 2013 160011 A1 Method of manufacturing an electronic card

WO 2016 016129 A1 Multi-layer composite for a security and/or value document and method for producing same

WO 2016 055660 A1 Contactless Biometric Identification Device Allowing Multiple Configurations

WO 2016 055661 A1 Biometric enrolment authorisation

WO 2016 055662 A1 Power load management

WO 2016 055663 A1 Power harvesting in a passive rfid device

WO 2016 055665 A1 Self-contained fingerprint identification device


Patents (5/5)WO 2016 160816 A1 Smart data cards that enable the performance of various functions upon

activation/authentication by a user's fingerprint, oncard pin number entry, and/or by

facial recognition of the user, or by facial recognition of a user alone, including an

automated changing security number that is displayed on a screen on a card's surface

following an authenticated biometric match

WO 2016 190678 A1 Smart Card Including Fingerprint Detection Device And Driving Method Therefor

WO 2017 017085 A1 Smart card with main application and persistence application

WO 2017 025479 A1 Security protected passive rfid device

WO 2017 025481 A1 Power optimization

WO 2017 064097 A1 Multiple finger fingerprint authentication device

WO 2017 081268 A1 Value or security document made of a fiber composite material, and method for producing

the value or security document

WO 2017 089216 A1 Identification document and method for identifying an individual

WO 2017 093514 A1 Fingerprint card

WO 2017 093516 A1 Biometric card

WO 2017 102699 A1 Id token having a protected microcontroller

WO 2017 102984 A1 Device

WO 2017 109173 A1 Biometric device

126


Acronyms2FA Two-Factors Authentication

3FA Three-Factors Authentication

ASIC Application-specific integrated circuit

AOC Authentication On Card

ASP Average Selling Price

BSC Biometric Smart Card

BSoC Biometric System on Cards

CBEFF Common Biometric Exchange File Format

CLESS Contactless

CNP Card Not Present Fraud

COF Chip On Film

CQM Card Quality Management

CP Card Present

CVM Cardholder Verification Method

FPC Fingerprint Card

FPCA Flexible Printed Circuit Assembly

FPCB Flexible Printed Circuit Board

FPS Fingerprint Sensor

FPU Floating Point Unit

FTIR Fourier-transform infrared spectroscopy

JV Joint Venture

LDO Low-Dropout Regulator

MEMS Microelectromechanical systems

MAC Multiplier-accumulator

MOC Match-on-Card

MCU Micro Controller Unit

MPU Memory Protection Unit

NFC Near field communication

OTP One Time Password

OCT Optical Coherence Tomography

PC Polycarbonate

PETG Polyethylene terephthalate

PII Personally Identifiable Information

PSD2 Payment Service Directive

PVC Polyvinyl chloride

RFID Radio-frequency identification

SC Supercapacitor

SE Secure Element

SW Software

TIP Terminal Integration Process

TOC Template-On-Card

127