M I C H A E L D. A N D E R S O N

T H E S E M I C O N D U C T O RT O O L K I T F O R J M P

Contents

Introduction 9

Annotate 11

Mapping 13

Analysis 19

Utilities 23

Credits and Information 25

List of Figures

1 The Main Interface 9

2 The Annotation Tool 11

3 The Mapping Interface 13

4 The Patterned Map Platform 14

5 Example of the output for The Patterned Wafer Map Tool. 14

6 The Bare Map Platform 15

7 Example of the output for The Bare Wafer Map Tool. 15

8 The Shape File Using Die Indices Platform 16

9 The Shape File Using Die Geometry Platform 17

10 The Shape File Using A Stepper Map Platform 18

11 The Analysis Interface 19

12 The Cluster Spatial Data Tool 20

13 The Explore Patterned Data Tool 20

14 An example of the summary report from the Explore Patterned DataTool 20

15 An example of the wafer details report from the Explore PatternedData Tool 21

16 An example of the die details report from the Explore Patterned DataTool 21

17 The Compare Wafer Maps Tool 21

18 The output of the Compare Wafer Maps Tool 21

19 The Utilities Interface 23

List of Tables

1 Symmetry transforms available in the Bare Wafer Map Tool. 16

Introduction

The Semiconductor Toolkit is an attempt to answer the needfrom the semiconductor industry for specialized visualizations andreframing of existing JMP capabilities. On its initial release, thetoolkit contained tools for generating patterned and unpatternedwafer maps, annotating existing graphics with wafer geometry, anda semiconductor specific frontend to the Hierarchical Clustering withspatial measures option. It has now been expanded to include ana-lytical methods for exploring die defect data, making comparisonsbetween wafers, and a collection of tools and utilities contributedby the user community. The toolkit is intended to be a collaborativeand living effort by interested parties. Constructive criticism, bugreports, and capability suggestions are welcome and encouraged.Please contribute questions and feedback to Add-in page on the JMPCommunity (www.community.jmp.com).

Figure 1: The Main Interface

The Main Interface

The Semiconductor Toolkit has three main parts: the Tool Boxesacross the top of the interface, the tool area below the tool box but-tons and the buttons for closing the Add-in and getting more infor-mation. By default the Annotate Tool Box is active when the Add-instarts. To select a new tool box, click the desired button. This docu-ment will go through each tool in each tool box in the order that itappears in the interface.

The Annotation Menu

The Annotation Tool draws different elements of the wafer ge-ometry over an existing graph or series of graphs in the same report.The tool is divided into four sections: Actions, Window List, Parametersand Origin and Exclusions. To annotate an existing graph select it fromthe window list. If the graph is not in the list click "Refresh List."Then click the button for the desired annotation.

Actions contains the options for what to draw on the report. DrawWafer draws the wafer edge, exclusion edge, and notch location.Draw Die draws only the die. Draw All draws both the wafer ge-ometry and die geometry. In all cases when an action button ispressed the previous annotations will be removed. Toggle WindowList hides the window list if it is too long or if additional screen spaceis needed. Toggle Color Control shows a set of controls for choosing adifferent color for the geometry lines.

Figure 2: The Annotation Tool

The Window List contains a list of available reports. Each reportwill have a radio button next to it. Use this radio button to indicatewhich report to draw on.

Parameters contains the wafer geometry information. All units areassumed to be millimeters, but can be changed to micrometers usingthe check box at the bottom of the parameters list. The dimensionparameters are for the active area of a die. The kerf parameters arethe width of the scribe lines between die. Wafer Radius and EdgeExclusion define the active area of the wafer. Notch location willchange where the notch is drawn. The default is "Bottom."

Origin and Exclusions contain the parameters for where the dieorigin is located including an option to define an arbitrary origin.The default is "UL Corner" (i. e., Upper Left Corner). The partial diecan be included using the Include Partial Die option.

The Mapping Menu

Figure 3: The Mapping Interface

The Mapping Tool Box contains tools for generating wafer mapsfor patterned and un-patterned (i. e., bare) wafers. While there issome element of modeling in building a wafer map1, the main reason 1 All Wafer Maps Are Wrong, JMP Discov-

ery Summit 2016, M. Andersonfor generating them is visual inspection of complex data. Because ofthis, these tools are mainly focused on creating visual representationsof spatial data. The tools are divided into two subsets: Map ExistingData and Build Shape Files. The tools in Map Existing Data providesome summary and analytical capability for creating maps from ex-isting data set. The Build Shape Files tools are for creating the supportfiles required for building patterned wafer maps in Graph Builder.

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Patterned Wafer Map

Figure 4: The Patterned Map Platform

Wafer MapsWafer Map for Wafer Lot ID = "ABCD123" & Soft Bin Name = "fail"

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Die X

Wafer Map for Wafer Lot ID = "ABCD123" & Soft Bin Name = "pass"

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Die X

Figure 5: Example of the output for ThePatterned Wafer Map Tool.

Mapping > Patterned Wafer Map uses die indices and a re-sponse variable to generate a patterned wafer map. The platform alsoprovides summary statistic capabilities for the wafer map. To gener-ate a wafer map put the response into y, response. Next put the Xand Y die index columns into x, die. The Wafer ID goes in wafer

id and is required. If the response is Nominal or Ordinal, then theoptional y, label field will become active. Use this field to label thecategories in the response column, i. e., Pass/Fail, Failure Type, etc..A range of summary statistics can be selected from the summary

statistics drop down menu. Color and Die Style can be controlledusing the second and third drop down menus. The generate table

of maps check box will take the maps from the report and create aJMP data table with the map in an expression column.

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Bare Wafer Map

Figure 6: The Bare Map Platform

Contour Plot for Predicted Response By SamplingPattern Sampling Pattern=13 Site Production

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Figure 7: Example of the output for TheBare Wafer Map Tool.

Mapping > Bare Wafer Map uses coordinate information and aresponse variable to create a bare wafer map. The tool provides in-formation about the quality of the fit for the smoothing algorithmused. The tool currently supports Neural Network models - one typein JMP and two types in JMP Pro and Gaussian Process Models. Togenerate a wafer map put the response into y, response. Next putthe X and Y coordinate columns into x, coordinates. The wafersize and exclusion edge are controlled using the sliders in the wafer

parameters area. All units are assumed to be millimeters, but canbe changed to micrometers using the check box below the sliders.The fitting method can be selected using the drop down menu. Bydefault either Neural Network or Pro Neural Network are selected,depending on the version of JMP being used. The symmetry trans-forms drop down applys a transform to the (x, y) coordinates. Seebelow for more details. The map resolution increases the quality ofthe final map by increasing the step size of the grid used in the Con-tour Plot. The generate table of maps check box will take themaps from the report and create a JMP data table with the map in anexpression column. show data points will mark the final maps toshow where actual data was collected.

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Symmetry Transforms

The following symmetry transforms are provided:

Menu Item Description Usage Example Operation

Cartesian Use (x, y) as provided inthe data table.

Processes with no dis-cernible symmetry.

(x, y)

Radial Use the radius between(x, y) and the wafercenter.

Processes with radial or"bullseye" patterns.

√x2 + y2

Y-mirror Plane Treat data on the left andright side of the wafer asif they are on the sameside.

Process appears to havea mirror plane runningthrough the center ofthe wafer from top tobottom.

(|x|, y)

X-mirror Plane Treat data on the top andbottom of the wafer asif they are on the sameside.

Process appears to havea mirror plane runningthrough the center of thewafer from left to right.

(x, |y|)

Table 1: Symmetry transforms availablein the Bare Wafer Map Tool.

Shape File Tools

The Shape File Tools generate a pair of tables that Graph Builder canuse to generate wafer maps directly. These tools were developed sothat once a layout is determined for a particular product the shapefiles for that product could be generated and distributed within acompany. This would standardize the visual representation of thedata across the JMP users in that company. Due to the differencesin IT policy, the files are generated on the user’s Desktop and it isleft to the user to move these files to the correct location in the filesystem. These locations can be found on page 308 in the JMP 13 book"Essential Graphing." This book is included in the JMP install and canbe found under Help > Books > Essential Graphing in JMP.

Figure 8: The Shape File Using DieIndices Platform

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Mapping > Use Die Index uses a table of die indices to generatingapproximate wafer map shape files. The tool attempts to determinethe aspect ratio of the die based on the number of unique die inthe x and y directions. This will generally give a result that closelyapproximates the actual die layout, but incomplete data sets mayimpact the accuracy. To generate shape files provide the X and Yindex columns to the die x and die y fields. The map identifier

may be used to give the shape files a unique name. If the scribe linewidths are know they can be entered in the x/y kerf fields. As withthe Annotation Tool, adjustments can be made to the die origin,notch location, etc. using the menu items. See the section on thatAnnotation Tool for each of the options. A preview can be generatedbefore committing to generating a shape file by clicking preview.This will update the graphic and statistics in the Preview Area toshow where the origin die, i. e., die-(0, 0), is located and the statisticsfor number of die and wafer utilization. The origin die can be movedby clicking the correct origin die in the preview window. The dieindices will then be adjusted in the preview. Once the map lookscorrect in the preview pressing the generate button will create afolder on the desktop with the shape files and a test file to test themap behavior in Graph Builder.

Figure 9: The Shape File Using DieGeometry Platform

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Mapping > Use Geometry is the most general form of the shapefile generation tools. To generate shape files provide a name for themap in the map identifier field. All units are assumed to be mil-limeters, but can be changed to micrometers using the check boxat the bottom of the parameters list. The dimension parameters arefor the active area of a die. The kerf parameters are the width of thescribe lines between die. Wafer Radius and Edge Exclusion define theactive area of the wafer. Notch location will change where the notchis drawn. The default is "Bottom." Where the die origin is locatedmay be changed using the origin option. The default is "UL Corner"(i. e., Upper Left Corner) but there are options for "Body Centered"as well an option to define an arbitrary origin. The partial die canbe included using the Include Partial Die option. A preview can begenerated before committing to generating a shape file by clickingpreview. This will update the graphic and statistics in the PreviewArea to show where the origin die, i. e., die-(0, 0), is located and thestatistics for number of die and wafer utilization. The origin die canbe moved by clicking the correct origin die in the preview window.The die indices will then be adjusted in the preview. Once the maplooks correct in the preview pressing the generate button will cre-ate a folder on the desktop with the shape files and a test file to testthe map behavior in Graph Builder.

Figure 10: The Shape File Using AStepper Map Platform

Mapping > Use Stepper Map uses a table of Lithography Steppercoordinates, some times called a "shot map," to create a shape file ofthe lithographic exposure fields. Where there is one die per field thiswill be equivalent to a die map, however in production settings it iscommon to have multiple die per exposure (field). So this may differin those cases. The settings are otherwise identical to the Die Indextool.

The Analysis Menu

Figure 11: The Analysis Interface

The Analysis Tool Box contains a collection of tools for doingvarious analytical processes that are common in the semiconductorindustry. The goals of the tools here are to move away from visualinspection to towards conclusions and statistical analysis. The toolsare divided into two groups: Spatial Analysis and Comparisons andModeling. The spatial analysis tools focus on examining patternedwafers, while the other group will focus on statistical comparisons,root cause analysis and predictive modeling.

Cluster Spatial Data

Analysis > Cluster Defects is a front end for the HierarchicalClustering Platform with the spatial measures option used. Thisfront end recasts the general terms used in the Hierarchical Cluster-ing Platform into terms that are more familiar to the semiconductor

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Figure 12: The Cluster Spatial Data Tool

industry. To run a clustering analysis place the columns in the ap-propriate fields and click ok. Not all columns are required, but allcombinations of columns must be represented for each row in thedata set.

The Shapes of Interest area contains options for refining what theclustering algorithm looks for and how important each feature typeis for the analysis. In general, leaving die: off will speed up theanalysis and is recommended.

Explore Patterned Data

Figure 13: The Explore Patterned DataTool

Patterned Data ExplorerSummary Map

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Display summary of : Display Wafer details for:

Figure 14: An example of the summaryreport from the Explore Patterned DataTool

Analysis > Explore Patterned Data generates a report thatsupports exploration of binning and test data. It provides the samesummary statistics as the Patterned Wafer Map tool with additionaldrill-down capabilities. To run the analysis provide the response intoy, response. Next put the X and Y die index columns into x, die.The Wafer ID goes in wafer id and is required. If the response isNominal or Ordinal, then the optional y, label field will becomeactive. Use this field to label the categories in the response column, i.e., Pass/Fail, Failure Type, etc.. A range of summary statistics can beselected from the summary statistics drop down menu. Color andDie Style can be controlled using the second and third drop downmenus.

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Patterned Data ExplorerSummary Map

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Display summary of : Display Wafer details for:

Map for Wafer ID: 9

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Bin Namepassfail

N325138

Yield70.229.8

Figure 15: An example of the wafer de-tails report from the Explore PatternedData Tool

Clicking ok will generate a report with a summary wafer mapand two drop down menus. The first drop down is a list of responsesor response labels in the data set. The second pull down is for thewafers in the data set. Selecting a wafer will open a view of the se-lected wafer. Clicking on a die in the summary map will produce asummary report for that die across all wafers.

Details for Die: (12,12)

Wafer DistributionTabulate

Wafer ID12456791011121314151618192021222325

fail passSoft Bin Name

Summary StatisticsDistributions

Soft Bin Name

90%

10%

fail pass

FrequenciesLevel failpassTotal

Count192

21

Prob90.5%9.5%

100.0% N Missing 0

2 Levels

Figure 16: An example of the die detailsreport from the Explore Patterned DataTool

Compare Wafer Maps

Figure 17: The Compare Wafer MapsTool

Analysis > Compare Wafer Maps compares two wafer mapswith dissimilar sampling patterns, i.e., different products on the sametool or process. The tool requires two data tables with the same col-umn names. To generate a comparison select the two tables from thelist of open data tables. Move the response into y, response. Nextput the X and Y coordinate columns into x, coordinates. Selectthe modeling method from the first drop down menu (Gaussian Pro-cess is the default). Select the wafer size from the second drop downmenu. Click ok. The tool generates a Gaussian Process Model foreach of the wafers and then creates a contour map of the differencebetween the two models.

Contour Plot for Difference

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Figure 18: The output of the CompareWafer Maps Tool

The Utilities Menu

The Utilities Tool Box contains tools that help with various datamanipulation tasks common to the semiconductor industry.

Figure 19: The Utilities Interface

Attach Table Limits

Utilities > Attach Table Limits is a port of the tool by @txnel-son. Detailed documentation for its use can be found on the commu-nity2. 2 JMP Community > File Exchange >

Add-ins > Write Limits to a Data Tablefrom a Limits Table

The Credits and Information Menu

Look here for information about the contributors and the versionhistory of the Add-in. This is also where you can find the licenseagreement for the Add-in.