thermal and layout considerations for integrated fet chargers charles mauney october 2013
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Thermal and Layout considerations for Integrated FET chargers
Charles Mauney
October 2013
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Why this Topic?What design component is most often Overlooked?
PCB Design• PCB is as critical as any other component• Use the same care with the design of the PCB as other
designers take with designing the IC and FET switches
Why is layout Important?• Placement of Components effects connection impedance• Ground Plane design affects connection impedance• Electrical/thermal impedance affects current and heat flow• AC Current across impedance causes noise• Heat flow across thermal impedance causes temperature rise
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Copper is Good, but Not a Perfect Conductor
• Optimizing Placement, Copper Thickness & Routing impacts– Regulation– Transient Response– Efficiency– Temperature rise– Noise immunity
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Metals are good ConductorsSome better than others – ρ(Ω-length)
Material ρ(mW-cm) ρ(mW-in)
Copper 1.70 0.67
Gold 2.2 0.87
Lead 22.0 8.66
Silver 1.5 0.59
Silver (Plated) 1.8 0.71
Tin -Lead 15 5.91
Tin (Plated) 11 4.33
Palladium 11 4.3
wt
l
A
lR
yresistivit
w
t A
Cur
rent
Flo
w
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Count Squares to Estimate Trace Resistance
• Copper resistivity is 0.67 mW in. at 25°C and doubles for 254°C rise
Copper Weight(Oz.)
Thickness(mm/mils)
mW per Square(25oC)
mW per Square(100oC)
1/2 0.02/0.7 1.0 1.3
1 0.04/1.4 0.5 0.65
2 0.07/2.8 0.2 0.26
t
Current Flow
tR
tR
)(
)(
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Vias Have Resistance Too
• Typical rule of thumb is 1 A to 3 A per via
A
lR
)( 22io rr
lR
mR 7.0)009.001.0(
06.0107.022
6
5 mm(20 mils)
4.5 mm(18 mils)
1.5 mm(60 mils)
CurrentFlow
A
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Self Inductance of PWB Traces
• Due to the natural logarithmic relationship, large changes in conductor width have minimal impact on inductance
w_mm (in) t_mm (in)Inductance
nH/cm (nH/in)
0.25 (0.01) 0.07 (0.0028) 10 (24)
2.5 (0.1) 0.07 (0.0028) 6 (14)
12.5 (0.5) 0.07 (0.0028) 2 (6)
wt
Curre
nt F
low
)(2
15
)(2
12
innHwt
nL
cmnHwt
nL
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PWB Traces Over Ground Planes• Substantial inductance reduction• Inductance inversely proportional to width
nH/cm 2
w
hlL
nH/in 5
w
hlL
Metric English
h (mm) w (mm)Inductance
(nH/cm)h (in) w (in)
Inductance(nH/in)
0.25 2.5 0.2 0.01 0.1 0.5
1.5 2.5 1.2 0.06 0.1 3.0
w
h
CurrentFlow
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Leakage Inductance in AC (Pulsed) Circuits Matters – How much inductance is in a 3” wire?
• HP 4275A LCR meter – Sample tested at 1MHz• Shows 79nH for this loop of wire
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Inductance – Think again!PCB with copper on bottom
Placed next to loop
PCB with copper on topPlaced next to loop
AC current in loop generates opposing currents in copper
plane to partially cancel inductance
Wire loop area reduced; <LSame Loop area with PCB,
copper on bottom; <LPCB with copper on top; <L
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Leakage Inductance – 3” Wire cont’
• Loop area and length determine inductance• Leakage Inductance (Parasitic) becomes charged with current • When Current is abruptly stopped – Leakage inductance’s
voltage flips polarity and discharges energy typically as noise
Wire loop twisted – Reversing of current cancels
inductance; <L
PCB with copper on bottom added but loop does not
produce much of a field to cancel inductance
PCB with copper on top helps just a bit.
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Sample Capacitance CalculationConsider two 10 mil traces crossing with 10 mil
PWB thickness
Capacitance is additive with multiple connected pads
t
AC OR
00025.0
00025.0
36
105
29
C
pFC 01.0Note: 10 mils = 0.00025 m
A = 0.00025 m x 0.00025 m
t
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Chaos Created by Noise Injection Ten 0.05 x 0.02 in2 pads in summing junction can
increase parasitic capacitance to 2 pF
2
6
3
4
7
8 GND
RT
FB
COMP
DTC
VCC
5
1
SCP
OUTC7R9
C6
R4
C13
R6
R5
CPARASITIC
R7
R3C5
C4+ 2
1R1
C8
Q1
D1C9
L2
VOUT
GND
+
U1TL5001D
CriticalComponents
VIN
Keep high impedance node area small and away from switching waveforms – above clean ground
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Bypass Capacitor Layout• Minimize lead inductance
– Short lengths Minimizes loop area– Use ground planes where possible– Bring current path across capacitor terminals
• Parallel different capacitor types – Reduced impedance across a frequency band
• Parallel different ceramic capacitors values and sizes
– Reduce impedance in the 2-20 MHz frequency range (0.1 mF & 0.01 mF)
• Use experienced Layout Person– Understands Circuit Operation and Layout concepts.
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Capacitors Are Inductive…Above Their Self-Resonant Frequency
• Measured ESL correlates well with rule of thumb inductance of 15 nH/inch
• High frequency converters use Ceramic caps of different values (10u, 1u, 0.1uF) for low impedance (low inductance) in MHz range.
5 nH
10 F Ceramic
1000 FOSCON
180 FSolid
Polymer
470 FTantalum
0.1 100001 10 100 10000.001
0.01
0.1
1
10Z
CA
P -
Im
ped
ance
-
f - Frequency - kHz
1 nH
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And Inductors Turn Into Capacitors• Inductive at low frequency• High frequency, distributed capacitance and mr
reduction
• Maximize inductance by choosing inductor with resonance above “switching edge” frequencies
1 k
1
Imp
edan
ce -
k
Frequency - Hz
10
100
L = 28 mH
C = 23 pF
10 k 100 k 1 M
Wire wound inductor Chip Inductor
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Effects of Layout Impedances
QH
QL
CIN
VIN+
VIN-L
RS
VOUT- VOUT+
COUT1
COUT2
• Good ground plane
• Small high frequency current loop
• Parasitics, LL, are reduce with integrated FETS
• Small area for high dv/dt node
• Good ground plane
• Small high frequency current loop
• Parasitics, LL, are reduce with integrated FETS
• Small area for high dv/dt node
Other Circuit
VIN VOUT
LQH QL
CO
CIN
LL
LL
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Connect Power Components Properly • Draw schematic to reflect desired location relative to other
components. • Understand circuit operation and AC currents• A pulses current is a noise signal – return this current to its source
in smallest distance (loop area) – Loop area is antenna.• Place power stage to minimize connection impedance
– Consider two sided mounting, FET’s one side, cap other– Use full ground planes to produce low impedance ground connection– Use VIAs to connect all component grounds to ground plane – Minimizes
return impedance.
C14330 F16 V
C310 F
Q4
Q2
L24.7 H
1
2
GND
5 V at13 A
VIN
+J2
HighCurrentPath
• Any inductance in di/dt path results in ringing on switched node
• Proper design can eliminate need for snubber
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Watch Out for Parasitic Components• Wiring inductance
– Added “parasitic” inductance raises impedance of low impedance circuits (filters, power switching) making them less effective.
– Use wide conductors and ground planes to minimize impedance• Board capacitance
– Allows path for AC signals– Good if part of design; Bad when coupling “noise” into sensitive
circuits. – High impedance nodes are susceptible to switching waveforms.
• Magnetic coupling– Loop to loop, minimize loop areas, use ground planes
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Single Point Grounds
Series
• Simple wiring – one layer• Common impedance causes
different potentials• High impedance at high frequency
(>10 kHz)
Parallel
• Complicated wiring – one layer• Reduced differential potentials at
low frequencies• High impedance at high frequency
(>10 kHz)
1 2 3 1 2 3
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Multipoint Grounding
• Ground plane provides low impedance between circuits to minimize potential differences
• Also, reduces inductance of circuit traces• Goal is to contain high frequency currents in individual circuits
and keep out of ground plane• Segregated circuits
– No current between Circuits– No current No ground noise shared between circuits, V=IR
1 2 3
Ground Plane
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Modeling Temperature Rise• Rjc: Junction to Case (PWRPAD of
IC), thermal resistance (ºC/W)
• Rcs: Case to Heat Sink (PWRPAD-IC to PWRPAD-PCB), thermal resistance
• Rsa: Sink (PCB surface) to ambient resistance
Interface Material
Heat Sink
Semiconductor Die
Package Case
RSA
RCS
RJC
GND = TA
I = PDISS
T = PDISS x (RJC + RCS + RSA) + TA
Electrical Equivalent
• Heat is conducted through device base into circuit board
• It spreads laterally through copper conductors
• Final path is convection cooling from board surface to ambient
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Thermal Conductivity of Other Materials
Material W/(cm ºC) W/(in ºC)
Air 0.0002 0.0007
Alumina 0.2 0.9
Aluminum 1.8 4.4
Beryllia 1.6 4
Copper (OFC) 3.6 9
Epoxy (PC board) 0.0003 0.007
Ferrite 0.04 0.10
Silver 3.8 9.5
Steel 0.15 0.60
Tin-lead 0.4 1.00
)( A
lR
• Thermal Conductivity is in the denominator Thus a large value is good for a low thermal impedance.• Silver is slightly better than copper but costs too much• FR4 (Epoxy) is very poor.
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Thermal ResistanceA single via has about 100°C/W thermal resistance
and they can be paralleled
)( A
lR
)( 22io rr
lR
WCR o /100
0.5 mm(0.02 in)
0.45 mm(0.018 in)
1.5 mm(0.06 in)
HeatFlow
• Multiple VIAs will reduce the thermal resistance proportionally
10VIAs would be 10C/Wo
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Lateral Heat Flow
Metric English
2-oz, 0.07-mmthick copper
2-oz, 2.8-milsthick copper
1.5-mm FR4 0.06-inch FR4
WCR
R
tl
lR
o /40
)07.04.0(
1
)(
WCR
R
o /2400
)5.100028.0(
1
WCR
R
ttl
lR
o /40
)0028.09(
1
)(
1
)(
WCR
R
o /2400
)06.0007.0(
1
Q
t
• A square of 2oz copper with 1W of heat applied will result in a 40C rise, R = 40C/W
• A square of 0.060” thick FR4 with 1W of heat applied will result in a 2400C rise, R = 2400C/W
• Only copper spreads out heat
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Thermal Resistance Gap • Copper plane has cut out due to routing a signal.• Thermal resistance gap significantly adds to temperature rise
)( wt
lR
English)06.01007.0(
01.0
R
Metric )5.14.250003.0(
25.0
R
PWB1.5 mm0.060 in
0.25 mm0.01 in
w = 2.54 cmor 1 inch
Copper
• Cutting the Cu plane added (23C/W – 0.018C/W = 23C/W)
R = 23C/W for 10mil gap of FR4
English)06.019(
01.0
R R = 0.018 C/W for 10mil gap of Cu
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Thermal Resistance for FR4Through board is much less than board-ambient
)( A
tR
Metric )4.254.250003.0(
5.1
R
English )1007.0(
06.0
R
in. 1sqfor C/W 8
• 1W applied to 0.125 in sq, 0.060” thick, FR4 (IC area) has temp rise of 548C• 1W applied to 1in sq, 0.06” thick, FR4 has a temp rise of 8C.• FR4 ok for thermally conductivity through large areas. • Poor through small area - IC power pad (need VIAs) or cross-section of PCB.
Q
t
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Convection Cooling
• h - heat transfer coefficient ~0.006 W/in2/°C, 0.001 W/cm2/°C for air
• 1 W/1in2 =166°C rise; 1 W/cm2 = 1000°C rise • Equation for the nonlinearity of h
)( hArea
PT
)100(7.08.0 CSaPT o
)006.0()(
Sa
P
hSa
PT
Sa
PT
166
SaP
TRSA
166
)001.0()(
Sa
P
hSa
PT
Sa
PT
1000
SaRSA
1000
)650(7.08.0 CSaPT
in2
cm2
in2
cm2
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Typical Thermal Requirements• Ambient temperature: 70°C, TA
• Maximum semiconductor: 125°C, Max TJ
• Maximum board temperature: 120°C• Typical semiconductor loss: 2 W• PowerPAD™ SO-8 thermal resistance: 2.3°C/W• Calculated PWB temperature under semiconductor is
125°C – (2 W x 2.3°C/W) = 120°C Allowed PCB Temp• Allowed Temperature Rise of PCB = 120°C – 70°C = 50°C
IC Body
Thermal Vias
PowerPAD-to-PWBSolder Connection
Top Layer Copper
Internal CopperTied To Vias
Internal CopperNot Tied To Vias
Bottom LayerCopper Tied to Vias
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Convection Cooling Area Calculations• Solving for Surface Area, for 2W dissipation & a 50°C rise
Sa
PT
166
T
PSa
166
750
2166
Sa
4050
21000
Sa
in2
cm2
Sa
PT
1000
T
PSa
1000
• The component heat-sink (PWRPAD) is much smaller than the required cooling area 7 in2, so a heat sink or PCB copper plane has to be used (~2 in2 PCB).
in2
cm2
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Dissipation on Double-Sided Board2 W of point source dissipation on double-sided
board calculates to ~30°C rise under the source
0 61 3 4 50
5
20
25
35
TJ
- T
emp
erat
ure
- °
C
2
10
15
30
2.50 1.0 1.5 2.00
5
20
25
35
TJ
- T
emp
erat
ure
- °
C
0.5
10
15
30
Radius From Heat Source (cm) Radius From Heat Source (inches)• Shown is ~ 33C rise for a 2.5”x2.5” PCB x 2 sides or 12.5in2
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Even a Whisper of Air can Reduce Temperatures
System airflow yields 20% to 60% drop in temperature rise
Metric English
61 3 4 50
5
20
25
Tem
per
atu
re R
ise
- °C
Air Flow - m/s
2
10
15
30
0 1200200 600 800 10000
5
20
25
Tem
per
atu
re R
ise
- °C
Air Flow - LFM
400
10
15
30
0
88 LFM = 1 mph
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PWB Cooling Strategy
• Temperature Rise is a FCN of power dissipate divided by surface area; Low Temp Rise PSMALL/ALARGE = dTSMALL
• Use thick copper, 2oz, to spread heat to larger area.• Use multiple common planes on different layers
connected by vias • Internal Copper Planes are as effective as surface
planes for spreading heat, but has temp rise through FR4 Very little penalty once heat is spread out.
• Use both side to cool• Avoid breaks in planes as they substantially degrade
lateral heat flow Reduce Area
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AgendaWhy this Topic?
PCB Electrical Characteristics• DC Parasitics (Resistance)• AC Parasitics• Grounds and Grounding
PCB Thermal Characteristics• Conduction Concepts• Convection Concepts
Examples• Common “Poor” Thermal Layouts• Good Thermal Layout• Good Electrical Layout
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Top and Bottom Layers – Poor Thermal DesignTop Layer – Quad bqIC is isolated from top copper plane – No Conduction of heat
Bottom Layer – bqIC PWR-PAD vias connected to bottom plane, but area is cut away due to a cutout, parts and Cu pours. Result is limited cooling area.
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Two Inner Layers1st Inner Layer – bqIC PWR-PAD vias connected to plane.
Plane is very small due to Routing, vias. Result is limited cooling.
2nd Inner Layer – bqIC PWR-PAD vias connected to plane. Plane is very small due to Routing on all sides. Result is limited cooling.
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2 Layer bqIC Layout – Good Layout
Top Layer – Quad bqIC is isolated from top copper plane
Bottom Layer – bqIC PWR-PAD vias connected to bottom plane. Best thermal layout – heat from vias can flow in all directions on bottom plane
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EVM Thermal Plot – 2.23W Dissipated1”x2” 2 Layer, 2oz Cu, 0.031” Thick PCB
Boost Converter –Top LayerVbatin=3.3V, 5Vout, Iout=2.12A, 1) IC, 2) Inductor, 3) PCB, 4) Edge of PCB
Boost Converter – Bottom LayerVbatin=3.3V, 5Vout, Iout=2.12A, 1) IC, 2) Whole PCB, 3) Ambient, 4) ~1”sq Center
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EVM Thermal Plot – 0.71W Dissipated 1”x2” 2 Layer, 2oz Cu, 0.031” Thick PCB
Boost Converter –Top LayerVbatin=3.3V, 5Vout, Iout=1A, 1) IC, 2) Inductor, 3) PCB, 4) Edge of PCB
Boost Converter – Bottom LayerVbatin=3.3V, 5Vout, Iout=1A, 1) IC, 2) Whole PCB, 3) Ambient, 4) ~1”sq Center
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Good Electrical Layout
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Electrical and Thermal Layout Summary• Place components to minimize inductive loops• Understand circuit operation
– Keep loop area small for high frequency, di/dt, signals and away from high impedance circuits (Magnetic coupling)
– Keep high dV/dt signal’s area small and away from high impedance circuits (Electric Coupling)
• Use ground planes to lower over all impedance of the ground plane, thus reducing noise.
• Identify hot components and make sure there is a at least one 2oz copper plane to remove heat, >1.5” Radius
• Use multiple vias to conduct heat to different plane layers
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A Good Layout
Makes For A Successful Design
• Power supply layout is as important as any other design consideration
• The power supply engineer must be involved in parts placement and routing
• It is not black magic, but it is an understanding of AC and DC parasitics, grounding, and cooling that makes a successful design