Oscar Yang2010/12/14

Thermal Management Thermal Management SolutionsSolutions

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Polytronics MilestonesPolytronics Milestones

1998 Company founded, ISO9001 certified

2000 Accumulated break-even

2001 Wickmann Group takes equity position and signs strategic alliance

2002 Littelfuse acquires Wickmann: maintains equity and alliance

2003 IPO on Taiwan OTC market

TI Sensors & Controls (now Sensata Technology) signs JDA

2005 China plant comes on-stream

2006 Littelfuse signs five year OEM agreement

Sensata introduces 5HC motor control product using

2007 DENKA signs JDA & PPA for the TCB development

2008 New building in SPIB construction complete and moving-in

2009 Listed in Taiwan Stock Exchange

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ISO-9001ISO-14001TL-9000TS-16949

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UL TUV CSA

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Customers & Partners _TCBCustomers & Partners _TCB

Join-develops with DENKA.Qualified & Listed in Seoul Semiconductor QVL. FS MCPCB used in SONY Direct-lit LED BLU TV in 2004.LED BLU-ship to AUO & Coretronic Groups, LG, Sharp & CMO Group are using PTTCsMCPCB., Samsung LCD approved.LED Lighting-ship to Foxsemicon, Aop, BrightLED, Coretronic Group & many China lighting companies.

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Thermal Conductive TheoryThermal Conductive Theory

Material Polymer Ceramic filler DeviceDevice

Ceramic

Polymer

Simulation

T1

T2

-k(T2-T1)X

Q=

Q=Heat flux

T=Temperature

k=Thermal Conductivity

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TCB Product LineTCB Product Line

Resin Coated CopperPrepreg Thin Core

Multi-layer PCB(Complicated circuit design)

Foiled Substrate(Material Saving)

IMS(General Product)

Semifinished Product

Product

Metal Core(Power Module)

MCPCB

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Thermal ConductivityThermal Conductivity

FRFR--44: 0.36W/mK>120

TCB-2 : >2.0W/mK

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TCB P/P Road MapTCB P/P Road Map

Thermal Conductivity (k)

2

W/mK

4

6

8

TCB-2k: 2.7W/mKStatus: Mass Production

TCB-4k: 4W/mKStatus: Mass Production

TCB-8k: 8W/mKSize:510 x 610mmTg: >165Status: UL approving

TCB-Xk: 12~20 W/mKSize:510 x 610mmTg: >165Status: Developing

TCB-2Lk: 2.0 W/mKSize:510 x 610mmTg: >100Status: UL approving

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Evaluate a Good TCBEvaluate a Good TCB

Thermal Conductive Board

Thermal Conductivity Physical Property Reliability

High Thermal Cond.

2, 4,8 W/mK

High Tg > 130oC

Low CTE < 20ppm

High Td > 350oC

260oC 30min

PCT Test

Thermal Shock 1000hr

85oC/85RH 1000hr

UL 746E, SGS

Lower device Temp. Material Stability

Dimension Stability

Outdoor Usage

Certifications

Remarks-Base on IPC, JIS standardsReliability testing under critical environmentCertification by UL & SGS

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Comparison Comparison Data(IData(I))

Comparison of 2W/mK products with international companies & local companies

Sample TCB2W

TCB4W

A2W

B1.8W

D2W

F3W

G2W

H2W

I2W

K (W/mk) 2.7 4.2 2.0 1.6 2.4 1.4 1.4 1.6 1.0

Aging TestPCT, 48hr

Pass Pass Pass Pass Pass Fail Pass Fail Fail

International companies Local companiesPolytronics

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Comparison Comparison Data(IIData(II))

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Manufacturing ProcessManufacturing Process

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PrePre--pregpreg MFG ProcessMFG Process

Dry Process(Polytronics Technology)

Wet Process(Other Companies)

Process Flo

w

MixingPolymer + Filler

MixingPolymer + Filler

Solvent

Roll to RollExtrusion

PrintingScreen or Slit

Drying

Lamination Lamination

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Environment ConcernGreen product with non-solvent process

Flexible Product LineEconomic process flow for different product manufactories

High QualityWell mixed materials with good thermal conductivityNone volatile material contentNo fiber glass system causes low warpageproblem

Advantages of Dry Process P/PAdvantages of Dry Process P/P

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TCB IP & CertificationTCB IP & Certification

IPIssued: TW I270187Published: US 20070137835, US 20080057333, US 20080073623, TW 200812025, TW 200816235, CN 1997271, CN 101140915, CN 101161721

UL 746EUL File Number: E312082

SGSTest Report No.CE/2008/40704, CE/2008/81840

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ConclusionConclusion

Advantages of Polytronics TCB-Cost Advantage

Excellent performance but less expensive than other companies.High Performance vs Price Ratio

Completed Product CombinationHigh Thermal ConductivityHigh ReliabilityHigh Manufacturing Efficiency Competitive Lead Time

Polytronics is your best choice for Thermal Management!