Thermal Simulation Request and Definition Form

Version 20121205

Introduction

One of the most important parts of any analysis, thermal or not, is proper setup and definition. Without clear and precise setup, an analysis can be off by orders of magnitude, with meaningless results. This document will guide you through a step by step process to define the thermal model and associated boundary conditions to ensure accurate results.

Throughout this document, there will be places to add text, makes selections, and add pictures. These places will be indicated in YELLOW highlighting or shapes. Please add information as required in the indicated yellow areas by using your mouse to click (or double click) until the text cursor appears, then type in the requested information. When done typing, use the mouse to click elsewhere on the page to finish text entry. Additionally, areas of RED show important notes, reminders, or cautions.

Customer Information:

Company Name – Company Name Here

Requester Name – Requester Name Here

Luminaire Name – Luminaire Name Here

Date – Date Here

Company Name –

Requester Name –

Luminaire Name –

Date –

__________________________

__________________________

__________________________

__________________________

Company Name Here To edit text fields, move your mouse cursor over the yellow box and click (or double click) until the text cursor flashes in the yellow box. Delete the existing text then type the necessary information. Finally, use your mouse to click outside of the box to disable text entry

Requester Name Here

Luminaire Name Here

Date Here

Material Definition

# MaterialConductivity

(W/m·K)

1 ABS Plastic / Acrylic 0.17

2  Aluminum 6061 180

3 Aluminum 6063 218

4 Aluminum ADC6 130

5 Aluminum Cast A360 113

6 Aluminum Cast A380 116

7 Brass 120

8 Copper (99% pure) 390

9 Fiberglass (FR4) 0.25

10 Glass 1.0

11 Nylon / Polycarb / PVC / Teflon 0.20

12 Steel, Low Alloy 50

13 Steel, Stainless 16

14 Zinc 116

Other (Specify)

O1 - - - - - - - -

O2 - - - - - - - -

O3 - - - - - - - -

O# - - - - - - - -

#

Make sure all components have been defined

Material Definition (continued)

#

Make sure all components have been defined

Interface Definition

*Air gap (1 mil) is equivalent to standard part to part contact, with no thermal interface material in between.

**DO NOT specify thermal interface between the module and the heat sink. All XSM, XLM, & XPM ship with eGRAF HT-1205 thermal pad attached and will be used in the analysis.

#

# Interface***Contact Resistance

(ºC·m2/W)

A Air Gap (1 mil)* 9.37 x 10-4

B eGRAF HT-1205** 1.27 x 10-5

C  Bergquist Q-pad3 2.26 x 10-4

D Wakefield Grease 3.46 x 10-5

Other (Specify)

O1 - - - - - - - -

O2 - - - - - - - -

O3 - - - - - - - -

O# - - - - - - - -

Make sure all interfaces have been defined

Interface Definition (continued)

#

Make sure all interfaces have been defined

System Definitions – Product SelectionFamily Series Performance

Current (mA)

350 500 700 1050

XSM

80

400 lm NA

700 lm

1000 lm

1300 lm

2000 lm

3000 lm

Artist

700 lm NA

1000 lm

1300 lm

XPM 80 5 cd/mm2

XLM80

3000 lm

4000 lm

Artist 3000 lm

Please only select highest drive current required. Multiple selections will delay results.

Maximum Thermal Class – ______ *See following slide for corresponding Thermal Class

Goal of Analysis – ______________________________________

Maximum Operating Ambient Air Temperature – _______ºC

Color of Heat Sink or Primary Thermal Dissipator – ______________

Will the fixture be in-ground or in a sealed cavity? – ______________(if Yes, please fill out details on next page

Determine Maximum XSM Tc Temperature

40

Black

?

Y/N

In-Ground or Sealed Cavity Definition• Please leave as “N/A” if this doesn’t apply, otherwise delete “N/A” and define cavity size,

materials and orientation.# Material

Conductivity(W/m·K)

1 ABS Plastic / Acrylic 0.17

2 Glass 1.0

3 Nylon / Polycarb / PVC / Teflon 0.20

4 Air 0.025

5 Plywood 0.13

6 Concrete-Light 0.1

7 Brick 1.31

8 Drywall 2.2

9 Soil- Unkown Type 0.06-0.25

10 Soil- Clay 0.25

11 Soil- Sand 0.20

12 Soil- Peat 0.06

13 Soil- Chalk 0.09

Other (Specify)

O1 - - - - - - - -

O2 - - - - - - - -

O3 - - - - - - - -

O# - - - - - - - -

N/A

#

#

#

Thermal Classes (–C XSM)

Family Series PerformanceCurrent (mA)

350 500 700 1050

XSM

80

400 lm A A B NA

700 lm A A B D

1000 lm A B C E

1300 lm B C D F

2000 lm C E F K

3000 lm E G J P

Artist

700 lm C D F NA

1000 lm C D F H

1300 lm C E G K

XPM 80 5 cd/mm2 C D F J

XLM80

3000 lm D F J N

4000 lm F J M T

Artist 3000 lm G J N U

Thermal Classes also listed in module Data Sheets

Simulation Orientations

jj

Legend

Gravity9.81m/s²

(1.64m/s² if luminaire installed on moon)

180°

0°

270°90°

Orientation 1 ____ ° Orientation 2 ____ ° Orientation 3 ____ °0 ### ###

Additional Notes

• Submit completed forms to thermal.sim@xicato.com along with exported CAD files.

• Simulation results should always be verified by making prototypes and comparing measured temperature values.

• Simulation does not qualify under the Xicato Luminaire Validation Program – see program requirements for details.

• Simulation results do not guarantee performance or lifetime: results should be used as design guidance only.

• Drivers and electronics can be simulated for power dissipation, but due to complexities and accuracy issues with individual temperature (i.e. capacitors, ICs, etc.), temperatures of drivers and electronics will not be accurate and therefore not reported. Electronics temperature gradients shown in thermal plots should be disregarded.

• For additional help or information, please contact your Xicato technical representative, or email support@xicato.com.