Automotive PEG

Chair: Jim Spall, Delphi

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Automotive PEG TOCTECHNOLOGY/MARKET DRIVERS

Contents

Automotive Product Sector ..........................................................................................................1

Executive Summary .................................................................................................................1

Introduction ..............................................................................................................................3

Situation Analysis ....................................................................................................................6

Benchmark state of the Industry and Technology ...............................................................6

Key Drivers: Cost, Size, Quality, Reliability .....................................................................20

Changes from 2013 ............................................................................................................22

Key Attributes Product Emulator ...........................................................................................24

Critical (infrastructure) Issues ................................................................................................26

Identify Paradigm Shifts ....................................................................................................26

Provide Vision of Final Assembly Process ........................................................................27

System Test ........................................................................................................................27

Prioritized Technology Requirements and Trends: ...............................................................28

Research .............................................................................................................................28

Development ......................................................................................................................29

Implementation ..................................................................................................................30

Glossary .................................................................................................................................31

Contributors ...........................................................................................................................31

Tables

Table 1 World Unit Volume Passenger Cars 2008-2021..........................................................10

Table 2 Automotive Product Sector Selected Parameters Compared with the 2013 Roadmap22

Figures

Figure 1. Automotive Underhood Temperatures ........................................................................5

Figure 2 A Monolithically Integrated, Active, Infra-Red Sensor .............................................19

Figure 3 A Monolithically Integrated Micromachined Capacitive Pressure Sensor. ...............20

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Key Automotive Market Issues

• The automotive electronics industry accounted for Factory OEM Revenues ($M) of $107Bn in 2013.

• The sector is expected to experience relatively strong growth through 2025, increasing at a CAAGR of about almost 4.4% per year.

• The confluence of accelerating electronic content across the globe with strong emerging market vehicle sales growth helps explain the automotive electronics market potential over the next six years.

• From a low of just over 60M vehicles produced in 2009 during the recession, global passenger car and light commercial vehicle unit shipments rebounded to over 75M in 2011.

• China has surpassed the US as the largest car market in the world.

• Overall vehicle unit shipment growth off the 2011 base is expected to grow by just under 6% per year thereafter.

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Major Trends Driving Auto Electronics

•Stricter fuel economy and emissions mandates

• Legislated requirements for advanced safety systems,

such as advanced airbags and on-board tire pressure

monitoring

•Consumer demand for greater vehicle efficiencies driven

by escalating global crude oil prices

•Consumer demand for greater safety, comfort, and

convenience features

•Consumer demand for luxury features

•Growth of hybrid and electric vehicles

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Electronic Modules Addressing Drivers

• Powertrain Electronics such as engine controllers, transmission controllers, voltage regulators, and any other systems that control the engine or driveline of the vehicle

• Entertainment Electronics ranging from standard AM/FM radios to on-board video entertainment systems, satellite radio receivers

• Safety and Convenience Systems such as airbag sensors, climate controls, security and access controls, anti-lock braking systems

• Vehicle and Body Controls that manage specific vehicle functions, such as suspension, traction, power steering

• In-Cabin Information Systems such as instrument clusters, trip computers, telematic products

• Non-Embedded Sensors such as speed sensors, temperature sensors, fluid level sensors, and many others

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Automotive Electronics Temperature Environments Figure 1. Automotive Underhood Temperatures

Component Location

Passenger Compartment

Engine Compartment

On-Engine and On-Transmission

Wheel-Mounted Components

Operating Temperature(Baseplate)

-40 °C to 85 °C

-40 °C to 125 °C

-40 °C to 140 °C

-40 °C to 250 °C

Passenger Compartment

Wheel-Mounted Components

Engine Compartment

On Engine & On-Transmission

Salt

High Humidity

Rapid Change Temp.

Oxides of Nitrogen

High Vibration

Gasoline

Oil

Brake Fluid

143º

38º

149º C Alternator Surface

129º C Ignition Surface

Current Air Flow Dynamics

90º to

110º

Transmission Oil 148ºC

Exhaust System 587ºC

Engine Block 129º C

Engine Oil 148ºC

90º to 110º

Road Surface 66º C

Underhood Temperatures

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Embedded Semiconductors’ Growth Forecast

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A Monolithically Integrated, Active, Infra-Red Sensor

(Courtesy: Delphi Delco Electronics Systems, Kokomo, Indiana, USA)

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Miniaturization: This table provides a view of

miniaturization impact in automotive electronics

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Selected Parameters Compared with the 2013 Roadmap(2013 vs. 2015)

FIRST YEAR OF SIGNIFICANT PRODUCTION 2013 2015 2017 2019 2025

Roadmap Year

Parameter Metric

2013 Substrate Cost (6 layer conventional)) $/cm2 0.020

2015 Substrate Cost (6 layer conventional) 0.017 0.014 0.012 0.009 0.009

2013 IC Package Cost ¢ per I/O 0.5

2015 IC Package Cost 0.4 0.4 0.3 0.2 0.16

2013 Max Component Complexity I/O per part 484

2015 Max Component Complexity 516 516 516 518 600

2013 Avg. Component Complexity I/O per part 60

2015 Avg. Component Complexity 60 60 70 70 70

2013 Max Component Density prts per cm

2

25

2015 Max Component Density 25 30 32 35 40

2013 Package I/O Pitch (perimeter) mm 0.5

2015 Package I/O Pitch (perimeter) 0.5 0.5 0.5 0.5 0.4

2013 Area array pitch (array package) mm 0.65

2015 Area array pitch (array package) 0.5 05 0.5 0.4 0.35

2013 Impedance Tolerance (+/- %) 20

2015 Impedance Tolerance 20 10 10 10 5

2013 Substrate Lines and Spaces (microns) 100

2015 Substrate Lines and Spaces 100 100 75 50 40

2013 Substrate Land Diameter (microns) 150

2015 Substrate Land Diameter 150 150 100 75 70

2013 Maximum Power/Device Watts 125

2015 Maximum Power/Device 200 300 350 350 400

2013 Frequency on Board MHz 200

2015 Frequency on Board 200 300 400 500 700

2013 Off Chip Driver Rise Time V/ns 1.6

2015 Off Chip Driver Rise Time 1.6 0.33 0.33 0.1 0.1

2013 Number of Voltages # 5

2015 Number of Voltages 3 3 5 5 5

2013 Relative Humidity Max % 95-100

2015 Relative Humidity 95-100 95-100 95-100 95-100 95-100

2013 Ambient Operating Temperature Deg C -40 to +125

2015 Ambient Operating Temperature Deg C -40 to +125

-40 to +125

-40 to +150

-40 to +150

-40 to +150

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Selected Automotive Industry Electronic

Component/Process Issues• Low-cost, high-temperature, high-density circuit board

• Integral passives are needed with accuracy and performance matching discrete components.

• Substrates that meet the high-frequency requirements spelled out in the emulator.

• A judgment on the need, and if needed, development of robust thick-film copper conductors on ceramic substrates for high-current applications.

• Capacitors capable of higher voltages (400 V)

• Higher value capacitance (~ a few thousand microfarads)

• Current carrying capability of conductive adhesives is inferior to that of solders and needs to be improved.

• Elimination of Pb on solder die attach for large power silicon devices

• Low cost BGAs and CSPs that are reliable for harsh environment applications

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Selected Automotive Industry Electronic

Component/Process Issues (2)

• High density, manufacturable, low-cost connectors / connector systems

• Innovative thermal management solutions

• Automotive electronics manufacturers are exploring alternate alloys including low temperature melting point alloys and low silver (Ag) content alloys to be used especially in multimedia, infotainment, comfort and navigation systems.

• Sn96.5Ag3.0Cu0.5 alloy is at the edge of its performance capacity for the more challenging thermal cycling requirements. Nano doped and mixed lead free alloys are being used for thermal cycling needs above 125°C.

• More and more automotive electronics assemblers are integrating type 4 mesh metal powder in the solder paste used

• Increasing number of electronics combined with more components on populated boards results in a higher risk of failure in critical areas, including mechanical failures in solder joints.

• Projects like Germany’s Industry 4.0 mention including traceability in the system of each solder paste printing cycle, so as to get to the outmost detail of manufacturing.

• A group of German automakers is pushing a new material labeling standard (“MAT-label”) to assure material and information flow from suppliers to customer is aligned through all of the supply chain.