LETI WEEKLY STATUS REPORT

Tom McMullen

Week 9

1/4/2013 – 5/4/2013

LETI wafer thinning project flowPhase 1

ID Project Name Owner Days Start End 3-Feb 10-Feb 17-Feb 24-Feb 3-Mar 10-Mar 17-Mar 24-Mar 31-Mar 5-Apr 12-Apr 19-Apr 26-Apr

1.0 Thin Wafer Assemblies T. McMullen 0 1-Feb 30-Sep

Week 0 Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8  week 9      

                                     

1.1

PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to Advacam LETI - 3D 10 1-Feb 29-Mar

LETI accpets CERN proposal

                       

1.1.1 Send gds to LETI T. McMullen 5 1-Feb 8-Feb                          

1.1.2Send 2 FEI4b wafers to LETI R. Bates 5 1-Feb 6-Feb

                         

1.1.3

Confirm step size on wafer and centre ofset variation on wafer LETI 5 1-Feb 6-Feb

                         

1.1.4Layout and mask production LETI 10 1-Feb 11-Feb

 

Deliverable 1: Microbumb

gds files

                     

1.1.4

First 2 wafers with micro bumps delivered to Advacam LETI 49 12-Feb 2-Apr

               

Deliverable 2: First 2 wafers

with micro bumps

delivered to Advacam

       

Current

Deliverable

Target not met

Action ListPhase 1 and 2

Action What Who When Comment7 Bow measurement set-up TMcM 31/2/2013 visit SMC and set up program for bow measurement

9 Assembly probe test solution TMcM 19/3/2013 Pobe test solution for flip-chipped assemblies - yield maps

10 FEI4B probe card and probe set-up Rbates/TMcM 19/3/2013 FEI4B test solution for assembly testing yeild maps

11 Experience with FEI4A probe card set-up Rbates/TMcM 19/3/2013FEI4A probe card set-up and testing of assemblies on

Wentworth

12Source other suppliers of wafer bow

measurements TMcM 29/3/2013 Ongoing. Requested update from SMC on FSM coming online

Highlights and issues First instalment of 36,000 euro was confirmed to be released to LETI after completion of the mask design,

layout and delivery of the mask. (see attached purchasing agreement with email for conditions) LETI have an issue processing wafers at the moment as their Argon sputter clean is down in copper PVD tool

and will delay the shipment of technology run 1 till the 15th of April It is essential we run with a sputter etch prior to copper deposition as without it would most likely result in

poor electrical contact New estimated completion time 26th April Bump mask is out of alignment by 20um in both x and y-directions

○ This could be the result of the stepper off-set in IBM that we were informed about but no figure was supplied○ LETI will align to the pads and don’t foresee any down-line issues for flip-chip alignment○ LETI will supply alignment measurements post exposure to confirm this○ There maybe a few more days delay due to this.

Meeting required to discuss sensor availability for the flip-chip process Amount of sensors for flip-chipping – good statistical analysis required for micro-bump yield – Richard and

I have begun discussions on this. ○ List has been made by Richard just awaiting the file

FEI4b Assembly testing○ FEI4b probe card required○ Test equipment/apparatus required○ Semi-auto testing solution required for assemblies

Highlights and issues (Cont’d) SMC FSM thermal cycling tool is out of use at the moment. I have given them dates for when the tool is

needed and asked for assurance that the tool will be ready by this time. Feedback from SMC is that they hope to have the tool running for when we require it, but have given no

guarantees as yet.○ I have asked SMC to keep me updated on the progress of this

Sourcing alternatives○ Southampton only have this ability to 150mm ○ JEMFIRE is another possibility

Wafer Inventory

Wafer # Wafer ID Yield (60 chips max) Purpose Comment

1 VMB8WDH G= 34, y=17, R=8, B=1 Full thickness micro-bump test Delivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies

2 V6B8WUH G= 43, y=13, R=4, B=0 Full thickness micro-bump test Delivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies

3 VUAYCRH   First technology run. Run 2Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at

SMC. Ship to LETI. Shipped to LETI

4 ABPJXGH G=28, Y=24, R=8  First technology run. Run 2Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at

SMC. Ship to LETI. Shipped to LETI

5   Second technology run. Run 3 Wafer identified and will be shipped from CERN to LETI. Awaiting wafer ID and yield

6     Second technology run. Run 3 Wafer identified and will be shipped from CERN to LETI. Awaiting wafer ID and yield

7     Third technology run. Run 4 Wafer to be identified and delivered to glasgow

8     Third technology run. Run 4 Wafer to be identified and delivered to glasgow

9     Forth technology run. Run 5 Wafer to be identified and delivered to glasgow

10     Forth technology run. Run 5 Wafer to be identified and delivered to glasgow

LETI wafer thinning project flowPhase 2