top 5 bga rework challenges
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BGA Rework-Big Challenges
I.I. Drivers for BGA Challenges-Pitch, Thin Packages, Drivers for BGA Challenges-Pitch, Thin Packages, Handheld Packages, Higher TempsHandheld Packages, Higher Temps
II.II. Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage
III.III. Lurking Challenges in BGA Rework-0.3mm pitch, lower Lurking Challenges in BGA Rework-0.3mm pitch, lower temp solders, shields in the areatemp solders, shields in the area
IV.IV. Q/AQ/A
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Issue # 1Warpage
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Removal-controlled heat source-bottom side preheat; multi-zone bottom heaters
Warped Packages
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Removal-proper board holdersWarped Packages
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Head-in-Pillow
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Shadow-Moire-is a non-contact, full-field optical technique that uses geometric interference between a reference grating
and its shadow on a sample to measure relative vertical
displacement at each pixel position in the resulting image.
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Issue # 2Neighboring Device
Damage
Shielding of Neighboring Devices
Shielding of Neighboring Devices
Experimental MethodShielding of Neighboring Devices
Experimental MethodShielding of Neighboring Devices
Experimental MethodShielding of Neighboring Devices
Experimental MethodShielding of Neighboring Devices
Experimental MethodShielding of Neighboring Devices
Clay GelShielding of Neighboring Devices
Results
Distance from test IC Speaker 30.95mm
Battery 9.73mm
Connector 6.14mm
Rework Location
Control (no shields) 123° C 177° C 227° C 232° C
Copper Tape 106° C 129° C 128° C 232° C
Stainless Steel 61° C 143° C 158° C 239° C
Clay/Water Gel 66° C 86° C 89° C 231° C
Kapton™ Tape 99° C 145° C 153° C 241° C
Ceramic Fiber 63° C 111° C 113° C 231° C
Shielding of Neighboring Devices
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Issue # 3Underfill
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Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Chemical Softening and Standard Hot Air Method-Post Device RemovalUnderfilled BGAs
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Chemical Softening and Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Chemical Softening and Standard Hot Air Method-Post Device Removal
Underfilled BGAs
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Underfill
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Issue # 4Mask Damage
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Extensive Mask Damage
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Methods for Mask Repair
I.I. PensPensII.II. UV-Cured Mask (IPC 7721 2.4.1)UV-Cured Mask (IPC 7721 2.4.1)III.III. Thermally-Cured Mask (IPC 7721 2.4.1)Thermally-Cured Mask (IPC 7721 2.4.1)IV.IV. Stay in Place Stencil (IPC 7721 5.7.2)Stay in Place Stencil (IPC 7721 5.7.2)V.V. Stenciling Technique (IPC 7721 2.4.2)Stenciling Technique (IPC 7721 2.4.2)
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“Pens” for Mask Replacement
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Damaged Solder Mask
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Placement of Stencil
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Squeegeeing Mask Through Stencil Apertures
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Damaged Solder Mask Post Removal
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Reduced ball size as solder flows down the via.
Solder short
Stay-in Place Stencil-Eliminates Shorts
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Uniform, consistent ball size. No solder flow along traces or to vias.
Stay-in Place Stencil-No Flow of Solder Down “Dogbone”
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With Stay-in-Place Stencil
With Stay-in Place Stencil
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Without Stay-in-Place Stencil
Without Stay-in-Place Stencil
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Issue # 5Lifted Pads
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Damaged/Lifted Pads Post Removal
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Damaged/Lifted Pads Post Removal
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Damaged/Lifted Pads Post Removal
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Pad Repair IPC 7721 4.7.1 Epoxy or 4.7.2 Film
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BGA Rework-Big Challenges
Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage
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