toshiba's ara partnershiptoshiba.semicon-storage.com/content/dam/toshiba-ss/... ·...

SEMICONDUCTORS

Copyright 2014, Toshiba Corporation.

Toshiba’s Ara Partnership

2 Copyright 2014, Toshiba Corporation.

Agenda

• Toshiba Semiconductor Involvement in project Ara

• Bridge Chips Overview

• Reference Module plan


Toshiba’s Involvement In Project Ara

• New and Exciting Game Changer concept for Smart Phones

• Toshiba’s opportunity to expand Mobile world

• Potential to expand concept beyond Smart Phones

• Interested in open platform environment lowering barrier to entry

• Alignment with Toshiba’s core competency


Toshiba’s Involvement In Project Ara

• Two Bridge LSIs – AP Bridge:

AP/Camera/Display Bridge

– GP Bridge: General-Purpose Bridge

• And

– Switch IC

Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI. /M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.


BRIDGE CHIPS OVERVIEW Toshiba is collaborating with project Ara team, by developing bridge LSIs


Bridge Chips Overview - Two Bridge chips

• Application Processor • Display • Camera • Mic/Speaker • 2nd Display/Camera • etc

Equipped modules

• Wi-Fi®, Bluetooth®

• SIM • Modem • GPS • Memory Card • Mic/Speaker • etc

Equipped modules

CSI/DSI

CSI/DSI Host Bus Interface

I2C, I2S, GPIOs

2 La

ne M

-por

t U

niPr

oSM

L

ayer

CSI/DSI Tx0 4Lane D-PHY CSI/DSI Rx0

CSI/DSI Tx1 4Lane D-PHY CSI/DSI Rx1

HOST BUS I/F

AP/Camera/Display Bridge: AP Bridge

I2S master I2C master

GPIOs

Two types of bridges, “AP bridge” with CSI/DSI, and “GP bridge” w/o CSI/DSI

HSIC(HOST) SDIO(MASTER)

UART, I2C, I2S, EPM, GPIOs

2 La

ne M

-por

t

Uni

ProS

M L

ayer

HSIC 1.0 HOST

HSIC PHY

SDIO v2 master

UART I2S master I2C master

GPIOs EPM

General-Purpose Bridge: GP Bridge

Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license./UniProSM is a servicemark or registered servicemark of MIPI Alliance, Inc.


Bridge Chips Overview - AP Bridge Functions:

• UniProSM Interface: MIPI® UniProSM version 1.6 compliant UniPort

• CSI-2 interface: Two links of MIPI® CSI-2 compliant (Ver. 1.01)

• DSI interface: Two links of MIPI® DSI compliant (Ver. 1.1)

• Host Bus Interface -1 (TBD, HSIC is assumed for now)

• Host Bus Interface -2 (TBD, Parallel memory interface）

• Embedded Microprocessor (CPU) [for chip internal data transfer control purpose only]

• I2C Master: Support for normal (100KHz), fast mode 400 KHz) and fast mode plus (1MHz, 100pf)

• I2S Master • EPM (Electro-permanent magnet systems) control • GPIO signals

Package: TBD

AP Bridge

MIPI®, M-PHY® and UniProSM are trademarks, servicemarks, registered trademarks or registered servicemarks of MIPI Alliance, Inc.

D - PHY x4

REFCLK 19.2MHz

PLL

PLL

Other Logic

UniProSM v1.60 (L1 - L4)

M - PHY® Tx (x2 )

M - PHY® Digital Logic

M - PHY® Rx(x2 ) PLL

CSI - 2/DSI RX

CSI - 2/DSI T X

D - PHY x4 PLL

CSI - 2/DSI RX

CSI - 2/DSI T X

HSIC Slave

HSIC PHY

CPU

Boot

SPI

IF Bridge

Buffer

Parallel Memory

I/F

I2C master

GPIO

I2S master

EPM


Bridge Chips Overview - GP Bridge Functions:

• UniProSM Interface: MIPI® UniProSM version 1.6 compliant UniPort

• HSIC host: High-Speed Inter-Chip USB Electrical Specification V1.0 compliant (Sept. 2007), which supports all four data transfer types in USB2.0: control, isochronous, INT, and bulk transfers

• SDIO host: SDIO v2 host controller *SPI, not supported

• Embedded Microprocessor (CPU) [for chip internal data transfer control purpose only]

• I2C Master: Support for normal (100KHz), fast (400 KHz) and fast mode plus (1MHz, 100pf)

• I2S Master • UART • EPM (Electro permanent magnet) control • GPIO signals

Package: TBD

GP Bridge

CPU

UniProSM v1.60 (L1 - L4)

REFCLK 19.2MHz

HSIC1.0 Host

SDIO v2 host

PLL

Other Logic

I2C master

GPIO

Boot

SPI HSIC PHY

IF Bridge

PLL

M - PHY® Digital Logic

I2S master

UART

Buffer

EPM M - PHY® Tx (x2 ) M - PHY® Rx(x2 )

MIPI®, M-PHY® and UniProSM are trademarks, servicemarks, registered trademarks or registered servicemarks of MIPI Alliance, Inc.


Bridge Chips Overview - Configuration variation

Basic configuration Feature-up configuration

Configuration can be varied when adapting much wideband data transferring modules as high spec cameras or displays

Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI. /M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.

Display

Application Processor

Camera


Bridge Chips Overview - Configuration Variation

CSI Single use CSI Dual use DSI Single use DSI Dual use

CSI x1 / DSI x1 use on single AP bridge

CSI x2 / DSI x2 use on dual AP bridges

Close view of the previous page

AP Bridge

Camera Bridge Display Bridge

Display

Display

M-PHY® M-PHY® M-PHY®

M-PHY® M-PHY®

M-PHY® M-PHY®


Camera

Camera


M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.


Bridge Chips Overview – Release Milestones

Q4

Q1

Q2

Q3

Engineering Samples

Data Sheet [Preliminary ver.]

Data Sheet

White paper [Product overview]

Toshiba Ara Bridge web-site starts*

Commercial Sample

2014

2015

Note: The schedules above mentioned are subject to change.


REFERENCE MODEL IDEA Toshiba is planning to provide reference model or reference design of Ara modules to module vendors, by utilizing industry competitive elements with Toshiba bridge LSIs.

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Toshiba’s Plan Of Reference Modules for Project Ara

Toshiba plans to - supply Bridge LSIs and collaborate development with Ara team - provide reference design of modules to facilitate module makers’

developments

Ara Module

MDK

Google

Support Request

Ara Phone & Module

Bridge Chips and Reference model

(=module)

Ara Store or

Retail seller Ara

Module Developer

Google is a trademark or registered trademark of Google Inc.


Reference model (=module) Development Plan

• TransferJet™ Reference Module – GP Bridge + TransferJet™ : TC35420

• Activity meter Reference Module – GP Bridge + ApP Lite™ : TZ1011MBG

• Camera Reference Modules – AP Bridge + Computational Array Camera: TCM9518MD – AP Bridge + 13MP, FHD 240fps Camera: T4K82

TransferJet and TransferJet logos are licensed by the TransferJet Consortium. ApP Lite is a trademark of Toshiba Corporation.


Depth Map Deep Focus Image

• Refocus • Size estimation • Extraction of any objects of

images • Gesture operation etc.

Computational array camera enables various apps

TCM9518MD

Dual 5 Mpix Cameras Preprocessor LSI

Application examples

“Computational Array Camera” Reference Module


Preprocessor TC358842XBG

ISP AP Bridge

CSI-2 5MP RAW x2

CSI-2 13MP RAW + Depth MAP(VGA)

CSI-2 13MP YUV/JPEG + Depth MAP(VGA)

Dual 5MP camera Pre processing (Depth map)

Post processing

System Block Diagram

< 5mm

40mm

20mm

Module Design Image

18mm Pre- processor ISP AP Bridge

18mm

40mm

“Computational Array Camera” Reference Module Plan

TCM9518MD Module

Connector


T4K82: 13MP image sensor, that is enabling “bright mode high quality slow motion video”

• 1/3” 13MP camera, 1.12um BSI pixels • High speed video: 240fps/1080i, 480fps/720i, 900fps/QVGA • x4 brighter images • Competitive low power consumption

13MP AF Camera

ISP AP Bridge

“13Mpix AF Camera” Reference Module Plan

T4K82 Module

Connector

Camera Module Design Image

Features


“Close Proximity Wireless” Reference Module Idea

Easy operation Just touch, Data Transfer on w/o Internet connection

Close Proximity Radio 3cm distance Low Power transfer!

Ultra Fast Transfer Many pictures and Movie can be quickly transfer & share

Pictures few second transfer 30 pictures@3MByte

Movie few second transfer 100MByte video clip

Ultra fast Transfer


“Close Proximity Wireless” Reference Module Idea

TransferJet is licensed by the TransferJet Consortium.

GP Bridge

OUTPUT 1.2

SDIO

1.8

Module Connector TransferJetTM

microSDIO Card TJM35420USQ

TransferJet™ module

μ-SD socket


“Activity Meter” Reference Module Idea

TZ1011MBG

18mm

10mm

Module Design Image

Module Block Diagram Application Examples

Attach onto a wristband

TZ1011MBG ・ARM® Cortex®- M4F processor ・Bluetooth® Low Energy ・ 9 axis sensor

Jogging Calorie Consumption Light

exercise

Heavy Exercise Light exercise

No of steps : 9,123 steps (7.2km), TTL Power consumption 520kcal

ARM® and Cortex® are registered trademarks of ARM Limited in the EU and other countries. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.

Bluetooth®


RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively

"Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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TOSHIBA CONFIDENTIAL


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