track a: 2.5d/3d chip stacking supply chain integration/ kurt huang, ph.d
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TRANSCRIPT
2.5D/3D Chip Stacking Supply Chain Integration
Kurt Huang, Ph.D.
Director, Corporate Marketing, UMC
ChipEx, 2013
Outline
2.5D/3D Applications
Ecosystem Work Flow
Summary
P. 2
2.5D/3D Applications
2.5D Si Interposer Stacking
Logic/logic: FPGA, networking infrastructure
Logic/memory: Gaming, HPC
3D Logic/Memory Stacking- Via-Middle TSV 28nm Logic + Memory Cube
Mobile WideIO, Computing WideIO, HMC
Never-Enough Memory Bandwidth- Mobile AP Driving Wide IO Memory
Dimensioning use case: 3D video streaming playback to external display via wireless
+ on-line 3D gaming local
Keeping Power Under Hood
•LPDDR3 @800Mhz dual-channel
•LPDDR3 @800Mhz
Real Value Drives Adoption
Motivations:
Higher BW, lower W/BW, smaller form-factor
Opportunity of return on 3D IC investment:
Chip process node optimization Homogeneous partition Cross-node combinations
BOM cost optimization Less demanding substrate/PCB,
lighter cooling assembly, ...
Ultimately: better product, better margin
Xilinx Virtex 7
Micron HMC
Application Examples
Market Segment Overview
High performance driving 2.5DIC
Mobile AP driving 3DIC SoC + Mobile Memory
Next wave: heterogeneous 3DIC Logic + Memory +
Analog/RF Ecosystem more
complex Expect driving force
emerges after 3DIC matures
Ecosystem Work Flow
Example 2.5D Stacking Flow
Various Work Models
Service scopes distinguished by MEOL inclusion Consult your foundry/OSAT
Work flow optimization may depend on BOM cost, stack recipe and test strategy
Foundry TSV Design Collaterals
Consider TSV a passive device with rule decks/models Typical foundry engagement applies under ecosystem work flow
(UMC 2.5D Si interposer documents)
Innovations by Open Eco-System Wafer thinning and handling
Thermal/stress
consideration
Testability
Reliability
3D EDA tool
Seamless business model
Cost
…
Evolution Of the Supply Chain Technology exploration Feasibility study
Interface definition Handover criteria
Model convergence Flow standarization Cost down
Service differentiation Further innovation
UMC Ecosystem Effort
1Q12
2Q12
1Q13
2Q13
Summary
Summary Foundry TSV process demonstrated
Applicable to both 2.5D/3D Leverage existing CMOS process technology Key process issues identified & conquered
Ecosystem work flow Typical foundry/OSAT engagement flow applies for both
2.5D/3D, among other models
Foundry TSV next step: ecosystem focus Product level reliability assessment 3D package level reliability demonstrated for open
ecosystem model Potential EDA collaboration for emerging 3D tools
BTW, Dreams Do Come True!
