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Transformational GaN Substrate Technology Jacob Leach (PI) & Keith Evans (T2M) Kyma Technologies, Inc. March 28, 2017

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Page 1: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Transformational GaN Substrate

Technology

Jacob Leach (PI) & Keith Evans (T2M)

Kyma Technologies, Inc.

March 28, 2017

Page 2: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Transformational GaN Substrate Technology

1

Project Objectives

Highest Quality Seed

Technology

Highest Speed

Replication TechnologyBoule Based

Low Cost High

Quality GaN

Substrate

Manufacturing

Technology

Demonstrate High

Performance Vertical

GaN FET Devices

Uniqueness: HVPE + Ammonothermal High growth rate, superior

dopant control, superior seed quality

Challenges: Reactor chemistry control over 100+ hrs, Strain in thick

boules, Inter-company agreements

Performance Metrics: Quality of GaN substrates produced (structural,

electrical, mechanical, etc.), Performance of devices built thereon

Page 3: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Transformational GaN Substrate Technology

2

Project Objectives

Highest Quality Seed

Technology

Highest Speed

Replication TechnologyBoule Based

Low Cost High

Quality GaN

Substrate

Manufacturing

Technology

Demonstrate High

Performance Vertical

GaN FET Devices

• Challenges with ammonothermal GaN seed

availability have driven a pivot in our project

• Additionally, while SWITCHES goals could be

reached on 2” to 100mm GaN, most major device

manufacturers and foundries are focused

primarily on 150mm or 200mm wafers

• 200mm engineered GaN substrates wafers

becoming available & have seed-boule potential

HVPE GaN on

ammonothermal

GaN seed

Page 4: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

The Kyma SWITCHES Project Seed Pivot

3

MRL

Time

Ammonothermal GaN Seeds

• Seed DD ~104cm-2

• Grow boules by HVPE

• Make larger seeds

Engineered GaN Seeds

• Seed DD ~108cm-2

• Reduce DD thru

proprietary methods

• Grow boules by HVPE

Original Approach New Approach

Page 5: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

The Engineered QST™ Seeds

4

Page 6: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

The Engineered QST™ Seeds

5

Page 7: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Team and Concept

6

Thin engineered layer(s) with epi-ready surface

Very thick 200mm diameter

HVPE grown crystalline GaN boule

CTE-Matched Core

Low-Cost High-Quality GaN Substrates

Seed Supplier

Wafer Fabrication

& Boule Growth

Page 8: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

HVPE GaN-on-QST™ “Thin” Growth at 150mm

7

“Template” Growth

CL Image of 30 micron

layer TDD = 9x107 cm-2

Best XRD FWHM

{002}/{102} = 144/156 arcsec

Page 9: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

HVPE GaN-on-QST™ “Thick” Growth

8

• System assembly

completed March

2017

• Supports fast cycle

time templates &

boule growth

• Advanced substrate

heater design

• Initial growth studies

commencing

• Thick GaN on

200mm QST™ to be

carried out under

remainder of

SWITCHES program Fully Automated 25 x 200mm

Wafer Carousel Loadlock &

Transfer System

11’ x 8’ x 6’

Multi-Zone

Vertical

FurnaceComputer

Control

DashboardWafer

Carousel

200mm KVPE™ GaN Growth Tool

Page 10: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Polishing 150mm HVPE GaN on QST™

9

Center

Center Rq (nm) Rz (nm)

As-grown 6.3 38.1

Post-CMP 0.9 6.9

Edge Rq (nm) Rz (nm)

As-received 5.0 26.9

Post-CMP 3.8 22.3

117x156µ

Wyko

Page 11: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Characteristics of HVPE GaN Drift Layers

10

CV Profile

Good potential for C-free

low free carrier drift

regions!

Grown on QST™

SIMS Profile

Page 12: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Characteristics of HVPE GaN Drift Layers

11

Vertical leakage test using back-to-back Schottky contacts on

10µ n- HVPE vs. 10µ n- MOCVD on n-type GaN on QST

**IV collected using Keithley 6487 picoammeter

Page 13: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Future Plans / Goals

12

• Thicker boule growth on 200mm QST in new system

• >1cm possible in 200mm HVPE system

• Slicing + polishing of 200mm boules

• Control of miscut at 200mm

• Epi and device validation on 150mm freestanding GaN

• MOCVD and HVPE-derived epilayers

Page 14: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Tech to Market

• Commercial Objectives

• Manufacture & market HVPE tools & GaN substrates

• Fabless approach to tools planned

• Fabless approach to materials likely

• Markets

• Power electronics, RF, LED, & LD

• Technology value proposition

• Lower-cost and larger-area at good enough defect density

• Partners

• Quora Technology (seed supply & materials sales)

• World class wafer foundry (materials growth)

• World class OEM tool maker

• Important Commercial Events Ahead

• Complete KVPE™ tool marketing collateral & accelerate marketing efforts

• Key Supply Chain Challenges

• Partnership with Quora

• Questions to Fellow Attendees

• The real competition is not in this room

• Kyma is open to creative partnerships including JV, M&A, JDA, customer-supplier

13

Technology-to-

Market

Page 15: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Tech to Market

14

Technology-to-

Market

Launch

200mm

MaxFLAAT

GaN

Raise $5m-$10m

strategic equity investment

Launch

200mm

KVPE™

Tools

Launch

100mm

GaN

Launch

150mm

GaN

Q3’17 Q4’17 Q1’18 Q2’18

Add MOCVD tools

Add AlGaN templates

Add MOCVD epiwafer

Add Marketing guru

$750 $1000Volume

price

target

Page 16: Transformational GaN Substrate Technology - ARPA-E · 2017-10-25 · • Complete KVPE™ tool marketing collateral & accelerate marketing efforts • Key Supply Chain Challenges

Conclusions

15

‣Market trend

– Large device makers & foundries focused on 150mm & 200mm wafers

‣ Pivot

– Exciting due to the disruptive potential of the technology plus the overall partnership with Quora plus

– Challenging due to major change in seed approach and the modifications in tool & process needed

‣ Technical progress

– Good progress in thin GaN growth & characterization

– Thick GaN growth coming next

‣ T2M

– KVPE™ tools & MaxFLAAT™ GaN template offering to set the stage

– 100mm & 150mm GaN substrate offering planned

– Seeking creative partnerships & major strategic investment