transformational gan substrate technology - arpa-e · 2017-10-25 · • complete kvpe™ tool...
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Transformational GaN Substrate
Technology
Jacob Leach (PI) & Keith Evans (T2M)
Kyma Technologies, Inc.
March 28, 2017
Transformational GaN Substrate Technology
1
Project Objectives
Highest Quality Seed
Technology
Highest Speed
Replication TechnologyBoule Based
Low Cost High
Quality GaN
Substrate
Manufacturing
Technology
Demonstrate High
Performance Vertical
GaN FET Devices
Uniqueness: HVPE + Ammonothermal High growth rate, superior
dopant control, superior seed quality
Challenges: Reactor chemistry control over 100+ hrs, Strain in thick
boules, Inter-company agreements
Performance Metrics: Quality of GaN substrates produced (structural,
electrical, mechanical, etc.), Performance of devices built thereon
Transformational GaN Substrate Technology
2
Project Objectives
Highest Quality Seed
Technology
Highest Speed
Replication TechnologyBoule Based
Low Cost High
Quality GaN
Substrate
Manufacturing
Technology
Demonstrate High
Performance Vertical
GaN FET Devices
• Challenges with ammonothermal GaN seed
availability have driven a pivot in our project
• Additionally, while SWITCHES goals could be
reached on 2” to 100mm GaN, most major device
manufacturers and foundries are focused
primarily on 150mm or 200mm wafers
• 200mm engineered GaN substrates wafers
becoming available & have seed-boule potential
HVPE GaN on
ammonothermal
GaN seed
The Kyma SWITCHES Project Seed Pivot
3
MRL
Time
Ammonothermal GaN Seeds
• Seed DD ~104cm-2
• Grow boules by HVPE
• Make larger seeds
Engineered GaN Seeds
• Seed DD ~108cm-2
• Reduce DD thru
proprietary methods
• Grow boules by HVPE
Original Approach New Approach
The Engineered QST™ Seeds
4
The Engineered QST™ Seeds
5
Team and Concept
6
Thin engineered layer(s) with epi-ready surface
Very thick 200mm diameter
HVPE grown crystalline GaN boule
CTE-Matched Core
Low-Cost High-Quality GaN Substrates
Seed Supplier
Wafer Fabrication
& Boule Growth
HVPE GaN-on-QST™ “Thin” Growth at 150mm
7
“Template” Growth
CL Image of 30 micron
layer TDD = 9x107 cm-2
Best XRD FWHM
{002}/{102} = 144/156 arcsec
HVPE GaN-on-QST™ “Thick” Growth
8
• System assembly
completed March
2017
• Supports fast cycle
time templates &
boule growth
• Advanced substrate
heater design
• Initial growth studies
commencing
• Thick GaN on
200mm QST™ to be
carried out under
remainder of
SWITCHES program Fully Automated 25 x 200mm
Wafer Carousel Loadlock &
Transfer System
11’ x 8’ x 6’
Multi-Zone
Vertical
FurnaceComputer
Control
DashboardWafer
Carousel
200mm KVPE™ GaN Growth Tool
Polishing 150mm HVPE GaN on QST™
9
Center
Center Rq (nm) Rz (nm)
As-grown 6.3 38.1
Post-CMP 0.9 6.9
Edge Rq (nm) Rz (nm)
As-received 5.0 26.9
Post-CMP 3.8 22.3
117x156µ
Wyko
Characteristics of HVPE GaN Drift Layers
10
CV Profile
Good potential for C-free
low free carrier drift
regions!
Grown on QST™
SIMS Profile
Characteristics of HVPE GaN Drift Layers
11
Vertical leakage test using back-to-back Schottky contacts on
10µ n- HVPE vs. 10µ n- MOCVD on n-type GaN on QST
**IV collected using Keithley 6487 picoammeter
Future Plans / Goals
12
• Thicker boule growth on 200mm QST in new system
• >1cm possible in 200mm HVPE system
• Slicing + polishing of 200mm boules
• Control of miscut at 200mm
• Epi and device validation on 150mm freestanding GaN
• MOCVD and HVPE-derived epilayers
Tech to Market
• Commercial Objectives
• Manufacture & market HVPE tools & GaN substrates
• Fabless approach to tools planned
• Fabless approach to materials likely
• Markets
• Power electronics, RF, LED, & LD
• Technology value proposition
• Lower-cost and larger-area at good enough defect density
• Partners
• Quora Technology (seed supply & materials sales)
• World class wafer foundry (materials growth)
• World class OEM tool maker
• Important Commercial Events Ahead
• Complete KVPE™ tool marketing collateral & accelerate marketing efforts
• Key Supply Chain Challenges
• Partnership with Quora
• Questions to Fellow Attendees
• The real competition is not in this room
• Kyma is open to creative partnerships including JV, M&A, JDA, customer-supplier
13
Technology-to-
Market
Tech to Market
14
Technology-to-
Market
Launch
200mm
MaxFLAAT
GaN
Raise $5m-$10m
strategic equity investment
Launch
200mm
KVPE™
Tools
Launch
100mm
GaN
Launch
150mm
GaN
Q3’17 Q4’17 Q1’18 Q2’18
Add MOCVD tools
Add AlGaN templates
Add MOCVD epiwafer
Add Marketing guru
$750 $1000Volume
price
target
Conclusions
15
‣Market trend
– Large device makers & foundries focused on 150mm & 200mm wafers
‣ Pivot
– Exciting due to the disruptive potential of the technology plus the overall partnership with Quora plus
– Challenging due to major change in seed approach and the modifications in tool & process needed
‣ Technical progress
– Good progress in thin GaN growth & characterization
– Thick GaN growth coming next
‣ T2M
– KVPE™ tools & MaxFLAAT™ GaN template offering to set the stage
– 100mm & 150mm GaN substrate offering planned
– Seeking creative partnerships & major strategic investment