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TRANSCRIPT
© 2017 Toshiba Corporation
Tunnel FET C-V modeling:- Impact of TFET C-V characteristics
on inverter circuit performance
Chika Tanaka, Tetsufumi Tanamoto, and Masato KoyamaCorporate R&D Center, Toshiba Corporation
MOS-AK Workshop, 2017, Leuven
© 2017 Toshiba Corporation 2
1. Backgroundi. Device and Circuit Characteristics of TFETii. Capacitance-Voltage characteristics of TFETiii. Impact of TFET CV characteristics on circuit performance
2. Modeling & Simulation methodi. Implementation of C-V threshold voltage (VthCV) on BSIM4 parameterii. Targeted Id-Vg and Cg-Vg characteristicsiii. VthCV optimization and simulated circuit
3. Simulation resultsi. Influence of VthCV modulation on inverter delayii. Vdd dependence on ∆tdelay with Mirror effect
4. Summary
Outline
© 2017 Toshiba Corporation 3
Device and Circuit Characteristics of TFET
Steep S.S.
TFETs Vdd=1.2VLow Ion
65nm CMOS Vdd=1.2V
Low Vdd operation
TFETs Vdd=0.5V 65nm CMOS Vdd=0.5V
Circuit Simulation (Ring Osc.)
Tunnel Field Effect Transistor (TFET) vs. Conventional CMOS
TFET Steep Sub-threshold Slope Low Ion dew to band-to-band tunneling
→Advantage of low-Vdd and low-power device
© 2017 Toshiba Corporation 4
Capacitance-Voltage characteristics of TFET
𝑉𝑉P =𝐶𝐶M
𝐶𝐶M + 𝐶𝐶L
S
Vd=0V、Vg=0V G D
Vd=1V、Vg=0V
Cgs: depletion cap.
S
G D
Cgd: response of minority carrier
IEEE TED, 56, 9 (2009) 2092.
Asymmetry of Cgs and Cgd by depletioncapacitance of source side tunnel junction
Vp increases as the increase of drain sidemirror capacitance
CM:mirror cap.(=Cgdp+Cgdn)For TFT, CM~2Cgg
For MOSFET, CM~Cgg
CL:load cap.(cap. for next stage)
Peak voltage for overshoot (VP)
Cgs: depletion cap.
Cgd: response of minority carrier and depletion cap.
© 2014 Toshiba Corporation 5
NMOS NLTFET NSJL
Cgd
Cgb
Cgg
Cgs
CgdCgb
Cgg
Cgs
CEFF is function of Cgg: CEFF ~ CM+CL(Cgg)…Circuit delay (tdelay) is influenced by both CM and CL
2D TCAD simulation results
Impact of TFET CV characteristics on circuit performance
Cgb
Cgs
Cgg
Cgd
When Vd is applied,(1) Vth
CV=f(Vd) …Cgg effectively decreases (2) Cgd>>Cgs …CM increasing
Modeled by voltage dependence on Vth for CV (VthCV)
𝒕𝒕delay ∝𝑪𝑪EFF � 𝑽𝑽dd
𝟐𝟐𝑰𝑰on
© 2014 Toshiba Corporation 6
1. Backgroundi. Device and Circuit Characteristics of TFETii. Capacitance-Voltage characteristics of TFETiii. Impact of TFET CV characteristics on circuit performance
2. Modeling & Simulation methodi. Implementation of C-V threshold voltage (VthCV) on BSIM4 parameterii. Targeted Id-Vg and Cg-Vg characteristicsiii. VthCV optimization and simulated circuit
3. Simulation resultsi. Influence of VthCV modulation on inverter delayii. Vdd dependence on ∆tdelay with Mirror effect
4. Summary
Outline
© 2017 Toshiba Corporation 7
D
Equivalent circuit for N-TFET
Investigate the influence of effective Cgg decrease on inverter circuit delay by CV threshold modulation
Vg [V]
Cgg
[a.u
.]
VOFFCV(Vd):on
0.0 0.4 0.8 1.2 0.0 0.4 0.8 1.2Vg [V]
Cgg
[a.u
.]Vd=0Vd=1
Vd=0
Vd=1
Implementation of VthCV(Vd) on BSIM4 parameterVOFFCV(Vd):off
BSIM4-based CV model:Implementation of Vd dependence on VthCV
”VOFFCV”→VOFFCV(Vd)=f(Vd)
© 2017 Toshiba Corporation 8
Targeted Id-Vg and Cg-Vg characteristicsGate
Source Drain
BoronAs
GateSource Drain
BoronAs
Lg=120nm, Tox=2nm, Ns=1E16 cm-3
Vd=0.5V Vd=0.7V Vd=1.0V
Vg [V]-0.5 0.0 0.5 1.0 1.5
Vg [V]-0.5 0.0 0.5 1.0 1.5
Vg [V]-0.5 0.0 0.5 1.0 1.5
Cap
acita
nce
[fF]
0.0
0.5
1.0
1.5
2.0
2.5
Cgg
Cgd
Cgs
Cgg
Cgd
Cgs Cgs
Cgd
Cgg
Cap
acita
nce
[fF]
0.0
0.5
1.0
1.5
2.0
2.5
Cap
acita
nce
[fF]
0.0
0.5
1.0
1.5
2.0
2.5
Vd=1.0VVd=0.7VVd=0.5V
Vg [V]-0.5 0.0 0.5 1.0 1.5
1E-6
1E-81E-10
1E-121E-141E-16
I d[A
/mm
]
Drain voltage (Vd) dependent on Vth for C-V
© 2017 Toshiba Corporation 9
VthCV optimization and simulated test circuit
VthCV optimization result
Simulated circuit configuration
VOFFCV=f(Vd, voffcv1, voffcv2) Split parameters “VOFFCV” to have Vd
dependence Extract to be optimized with each Vd
for “voffcv1” and “voffcv2”
2-stages inverter(output: Vout1)
CL=2・Cgg
CM=Cgdp+Cgdn
© 2017 Toshiba Corporation 10
1. Backgroundi. Device and Circuit Characteristics of TFETii. Capacitance-Voltage characteristics of TFETiii. Impact of TFET CV characteristics on circuit performance
2. Modeling & Simulation methodi. Implementation of C-V threshold voltage (VthCV) on BSIM4 parameterii. Targeted Id-Vg and Cg-Vg characteristicsiii. VthCV optimization and simulated circuit
3. Simulation resultsi. Influence of VthCV modulation on inverter delayii. Vdd dependence on ∆tdelay with Mirror effect
4. Summary
Outline
© 2017 Toshiba Corporation 11
𝒕𝒕delay ∝𝑪𝑪EFF � 𝑽𝑽dd
𝟐𝟐𝑰𝑰on
Influence of VthCV modulation on inverter delay
time [nsec.]0 20 40 60
V out
1[V
]
-0.5
0.0
VthCV with Vd dependenceVdd=1.0V
0.5
1.0
1.5
∆tdelay shows the effective gatecapacitance reduction.
Vdd [V]0.4 0.6 0.8 1.0 1.2
0.0
0.5
1.0
1.5
2.0
2.5
∆t d
elay
[nse
c.] Vdd∝Cgg
CEFF~CM + CL
Effect of CL reduction
If load capacitance (CL) becomes small, inverter delay reduced.
Inverter Delay (tdelay)
VthCV w/o Vd dependence∆tdelay
∆tdelay = | trise(with Vd depend.) – trise(w/o Vd depend.) |
© 2017 Toshiba Corporation 12
Vdd dependence on ∆tdelay with Mirror effect
CM = Cgdp + Cgdn
CEFF~ CM + CL
𝝉𝝉delay ∝𝑪𝑪EFF � 𝑽𝑽dd
𝟐𝟐𝑰𝑰on
0.3
∆tdelay increasesby Cgg reduction
0.5 0.7 0.9 1.1
Vdd [V]
1.0
0.6 0.8 1.0 1.2
0.8
0.6
0.40.4
Vdd [V]
0.01.0 Even when considering Miller effect, the effect
that the effective Cgg reduction is large.Increase in ∆tdelay becomes prominent as low Vdd.
2.03.04.05.06.0
Correctionby Mirror effect
Nor
mal
ized
∆t d
elay
Nor
mal
ized
∆t d
elay
∆tdelay decreases by Mirror effect
© 2017 Toshiba Corporation 13
Summary
AcknowledgementsThis work was supported by JST CREST Grant Number JPMJCR1332, Japan.We thank K. Adachi, A. Hokazono, M. Fujimatsu, and S. Kawanaka for discussions andsupports.
i. Implementation of the effective Cgg reduction on SPICE model was made by parameterizing the BSIM4 C-V parameter.Re-parameterizing of BSIM4 C-V parameter is reasonable approach to analyze the non-Si CMOS circuit performance.
ii. We investigated the influence of TFET C-V characteristics on inverter circuit delay by using the our proposed (optimized) model.Although the delay increases with the influence of overshoot due to the increase in CM, the effect of decreasing CL is prominent due to the reduction in effective gate capacitance, and then the inverter delay is smaller than the case where TFET C-V characteristics is not considered.