unique innovation for optimized equipment performance · pdf filerapid thermal process, plasma...

1550 Norman Ave.Santa Clara, CA 95054 USATel：+1-408-988-5188Fax: +1-408-904-7168E-mail: [email protected]: http://www.allwin21.comCopyright©2012-2016 Allwin21 Corp.

Rapid Thermal Process

Sputtering Deposition System.

Unique Innovation for Optimized Equipment Performance

Plasma Asher Descum

Branson/IPC 3000 Software Key Features

Branson/IPC 3000 Specifications*

Wafer Size: Sample to 200mm Capability. Multiple wafer size withouthardware change

Throughput: High Throughput. Up to 75 WPH. Process Dependent . Temperature: No heating function. N2 plasma can heat the substrate up

to 170 C. Gas Lines: Up to 5 gas lines with MFCs. Popular MFC Range: 2 SLM O2

and 1 SLM N2 . Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR Uniformity: 25%. Clear all photoresist without uniformity requirement Particulate: <0.05 /cm2 (0.03um or greater) Damage: Low damage with Faraday Cage if necessary. Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95%

uptime * Contact Allwin21 sales for other applications and specifications

Main Menu Screen

Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.comAll specification and information here are subject to change without notice and cannot be used for purchase and facility plan. (2 of 2) Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.

Company Introduction and Main Products

ALLLWIN21 CORP.

Introduction

Equipment Key Features

Allwin21 Corp. is the exclusive licensed manufacturer of AGAssociates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Atmospheric and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment ha e een used in production and D since the 0 s hey ha e pro en processes and research. Allwin21 Corp. can customize these systems with All in2 s compara le inte rated process control system ith PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts.Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE,Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.We understand that a timely responsive support and service are criticalelements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades

E-mail: [email protected] Website: www.allwin21.com

Allwin21 Overview

What sets us apart from the competition…

1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.2) Advanced Allwin21 Real Time PC Control Technology.3) Focus on Production-Proven process technology.4) Integrated 3-axis solid robotic wafer transfer technology.5) Experienced local engineer support.6) Products made in U.S.A

Allwin21 Products1) Rapid Thermal Process

• AccuThermo AW 410• AccuThermo AW 610• AccuThermo AW 810• AccuThermo AW 820• AccuThermo AW 810V• AccuThermo AW 820V

2) Sputter Deposition• Perkin-Elmer 44XX Series• AccuSputter AW 4450

3) Plasma Asher Descum• AW-105R• AW-1008• AW-B3000

4) Plasma Etch/RIE• AW-901eR• AW-903eR• AW-2001R

5) Upgraded Kit for:• Heatpulse 210• Heatpulse 410• Heatpulse 610• Matrix X0X• Tegal 90Xe• Gasonics Aura 1000/2000LL/3000/3010

• Gasonics AE 2001/2000LL• Gasonics L3510/L3500• Branson/IPC 3000/2000/4000

• Lam AutoEtch 490/590/690/790

6) Sheet Resistance Measurement• AWgage-150• AWgage-200

Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, atri 0 , atri 20 ,

atri 303, atri 403, atri 0 , atri 04, atri 02, atri 0 , atri 0

Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher

Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics Aura 000,

asonics Aura 2000, asonics Aura 3000, asonics 3 0, asonics Aura 30 0

Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, e al 0 e, e al 03e, e al 0 e , e al

Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics AE 200 , icro a e Etcher, icro a e Plasma Etcher,

icro a e Etch

apid hermal Process, apid hermal Processin , apid hermal Anneal, apid

hermal Annealin , apid hermal idation, apid hermal itride, A, P, , ,, Semiconductor

Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, A 2 0, A 3 0, A 4 0, A 0, A 0I, A Associates,

eatpulse 2 0, eatpulse 4 0, inipulse 3 0, eatpulse 0, eatpulse 0I, A

eatpulse 4 0, A eatpulse 0, A eatpulse 2 0, A inipulse 3 0, eatpulse 4 00, eatpulse 4 0 , eatpulse 0 , eatpulse 00,

Atmospheric apid hermal Process, acuum apid hermal Process, urnace,

en, hermal urnace, hermal Process, hermal Processin

• Lam Rainbow 4XXX Series


ALLLWIN21 CORP.

AccuThermo AW 410

Introduction The AccuThermo AW410 was derived from the AG Associates 610 production-proven design. Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system. The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

AccuThermo AW 410 Key Features

35 years’ production-proven real RTP/RTA/RTO/RTN system. Scattered IR light by special gold plated Al chamber surface. Allwin21 advanced Software package with real time control technologies and many useful functions. Consistent wafer-to-wafer process cycle repeatability. Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates Elimination of external contamination by Isolated Quartz Tube Up to six gas lines with MFCs and shut-off valves Energy efficient. Small Footprint. Made in U.S.A.

Gas Line(s) 1 2 to 4 5 to 6 Dimension(DXWXH) 17”x18”x11” 17”x26”x11” 17”x30”x11”

Chip manufacture Compound industry: GaAs,GaN,GaP,GaINP,InP,SiC, III-V,II-VI Optronics, Planar optical waveguides, Lasers Nanotechnology Biomedical Battery MEMS Solar LED


Introduction

Typical Applications (But not limited to)

Silicon-dielectric growth Implant annealing Glass reflow Silicides formation and

annealing

Contact alloying Nitridation of metals Oxygen-donor annihilation Other heat treatment

process

Typical Application Areas:

Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Heatpulse 4100, Heatpulse 4108, Heatpulse 8108, Heatpulse 8800, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing


ALLLWIN21 CORP.

AccuThermo AW 410 Software Key Features o Integrated process control systemo Real time graphics displayo Real time process data acquisition, display, and analysiso Programmed comprehensive calibration and diagnostic functionso Closed-loop temperature control with temperature sensing.o Precise time-temperature profiles tailored to suit specific process

requirements.o Faster, easier Programmable comprehensive calibration of all

subsystems, leading to enhanced process results.o A recipe editor to create and edit recipes to fully automate the

processing of wafers inside the AccuThermo RTPo Validation of the recipe so improper control sequences will be

revealed.o Storage of multiple recipes, process data and calibration files so that

process and calibration results can be maintained and compared overtime.

o Passwords provide security for the system, recipe editing, diagnostics,calibration and setup functions.

o Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.

o Troubleshooting feature which allows engineers and service personnelto activate individual subassemblies and functions. More I/O, AD/DA“exposure”.

o Use PowerSum technology to detect the process and increase Yield.o Watchdog function: If this board looses communication with the control

software, it will shut down all processes and halt the system untilcommunication is restored.

o GEM/SECS II function (Optional).

AccuThermo AW 410 Specifications

Wafer sizes: Small pieces, 2", 3", 4" wafer capability Recommended ramp up rate: Programmable, 10°C to 120°C per

second. Maximum Rate: 200°C (NOT RECOMMENDED) Recommended steady state duration: 0-300 seconds per step. Ramp down rate: Non-programmable, 10°C to 200°C per second. Recommended steady state temperature range: 150°C - 1150°C.

Maximum 1250°C (NOT RECOMMENDED) ERP Pyrometer 450-1250°C with ±1°C accuracy when calibrated against

an instrumented thermocouple wafer. Thermocouple 100-800±0.5°C with ±0.5°C accuracy & rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.

(Repetition specifications are based on a 100-wafer set.) Temperature uniformity: ±5°C across a 4" (100 mm) wafer at 1150°C.

(This is a one sigma deviation 100 angstrom oxide.) For a titaniumsilicide process, no more than 4% increase in non-uniformity during thefirst anneal at 650°C to 700°C.

Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2, Ar, He, Forming gas, NH3, N2O2 are used.

AccuThermo AW 410 Configuration

AccuThermo AW 410 Main Frame with wires. Power Type: Three Phase, worldwide power type(50/60 Hz) CE Mark if Necessary Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary software package. Mouse and standard keyboard . Aluminum oven chamber with water cooling passages and gold plating plates.. Door plate with one TC connection port. Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window. Oven control board and one main control board. Bottom and top heating with 17 (1.5KW ea) Radiation heating lamp module with 4 bank zones (Top Front&Rear, Bottom Front&Rear). Quartz Tray for 2 to 4 inch round wafer or customized. Gas line with one Gas MFC without shut-off valve T-Shaped Quartz with qualified K Type TC and one set holder for 100-800°C temperature measurement. Package of 5 pieces of thermocouple wires as spare TC USB with original Software backup.

Options: Multiple Process Gases (Up to 6) and MFCs with Extended Gas

Box and Gas Control Board Carrier or Susceptor for small sample, transparent substrate and

substrate with metal thin film on top. Patented ERP Pyrometer (400-1250°C) as non-contact high

temperature sensor. Chiller for ERP Pyrometer 2-inch, 4-inch TC Wafer, Single Point for Pyrometer calibration Omega Meter for Pyrometer and Thermocouple calibration Shut-off valve for Quartz Tube&Lamps cooling control Spare Parts

Allwin21 Corp. Address: 220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.

Tel.: +1-408-778-7788 Fax: +1-408-904-7168

Email: [email protected]

All specification and information here are

subject to change without notice and cannot

be used for purchase and facility plan.


ALLLWIN21 CORP.

AccuThermo AW 610

Introduction

The AccuThermo AW610 was derived from the AG Associates 610 production-proven design. Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system. The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.


35 years’ production-proven Real RTP/RTA/RTO/RTN system. Scattered IR light by special gold plated Al chamber surface. Allwin21 advanced Software package with real time control technologies and many useful functions. Consistent wafer-to-wafer process cycle repeatability. Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates Elimination of external contamination by Isolated Quartz Tube Up to six gas lines with MFCs and shut-off valves Energy efficient. Made in U.S.A. Small footprint

Gas Line(s) 1 2 to 4 5 to 6 Dimension(DXWXH) 17”x18”x11” 17”x26”x11” 17”x30”x11”



Introduction



annealing


process



ALLLWIN21 CORP. AccuThermo AW 610 Software Key Features

o Integrated process control systemo Real time graphics displayo Real time process data acquisition, display, and analysiso Programmed comprehensive calibration and diagnostic functionso Closed-loop temperature control with temperature sensing.o Precise time-temperature profiles tailored to suit specific process













Wafer sizes: Small pieces, 2", 3", 4", 5", 6" wafer capability Recommended ramp up rate: Programmable, 10°C to 120°C per



an instrumented thermocouple wafer. Thermocouple 100-800°C with ±0.5°C accuracy & rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.



Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2, Ar, He, forming gas,NH3, N2O2 are used.


AccuThermo AW 610 Main Frame with wires. Power Type: Three Phase, worldwide power (50/60 Hz) CE Mark if Necessary Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary software package. Mouse and standard keyboard. Aluminum oven chamber with water cooling passages and gold plating plates. Door plate with one TC connection port. Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window. Oven control board and one main control board. Bottom and top heating with 21 (1.2KW ea) Radiation heating lamp module with 4 bank zones (Top Front&Rear, Bottom Front&Rear). Quartz Tray for 4 to 6 inch round wafer or customized. Gas line with Gas MFC without shut-off valve. T-Shape Quartz with qualified K-Type TC and one set holder for 100-800°C temperature measurement. Package of 5 pieces of thermocouple wires as spare TC USB with original Software backup.

Options: Multiple Process Gases (Up to 6) and MFCs with Extended Gas

Box and Gas Control Board Carrier or Susceptor for small sample, transparent substrate and


temperature sensor. Chiller for ERP Pyrometer 2-inch, 4-inch, 6-inch TC Wafer, Single Point for Pyrometer

calibration Omega Meter for Pyrometer and Thermocouple calibration Shutt-off valve for Quartz Tube & Lamps cooling control Spare Parts


Tel.: +1-408-778-7788 Fax: +1-408-904-7168






ALLLWIN21 CORP.

AccuThermo AW 810

Introduction

The AccuThermo AW810 was derived from the AG Associates 610 production-proven design. Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system. The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.


35 years’ production-proven Real RTP/RTA/RTO/RTN system. Scattered IR light by special gold plated Al chamber surface. Allwin21 advanced Software package with real time control technologies and many useful functions. Consistent wafer-to-wafer process cycle repeatability. Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates Elimination of external contamination by Isolated Quartz Tube Up to four gas lines with MFCs and shut-off valves Energy efficiency Made in U.S.A. Small footprint 31(D) X 34(W) X 16(H)



Introduction



annealing


process



ALLLWIN21 CORP.

AccuThermo AW 810 Software Key Features o Integrated process control systemo Real time graphics displayo Real time process data acquisition, display, and analysiso Programmed comprehensive calibration and diagnostic functionso Closed-loop temperature control with temperature sensing.o Precise time-temperature profiles tailored to suit specific process








o Troubleshooting feature which allows engineers and service personnelto activate individual subassemblies and functions. More I/O, AD/DA“expose”.





Wafer sizes: Small pieces, 2", 3", 4", 5", 6", 8" wafer capability Recommended ramp up rate: Programmable, 10°C to 120°C per



an instrumented thermocouple wafer. Thermocouple 100-800°C with ±0.5°C accuracy & rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.

(Repetition specifications are based on a 100-wafer set.) Temperature uniformity: ±8°C across an 8" (200 mm) wafer at 1150°C.


Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2), Ar, He, forming gas,NH3, N2O2 are used.


AccuThermo AW 810 Main Frame with wires. Power Type: Three Phase, worldwide power (50/60 Hz) CE Mark if Necessary Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary software package. Mouse and standard keyboard. Aluminum oven chamber with water cooling passages and gold plating plates. Door plate with one TC connection port. Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window. Oven control board and one main control board. Bottom and top heating with 27 (1.2KW ea) Radiation heating lamp module with 4 bank zones (Top Front&Rear, Bottom Front&Rear). Quartz Tray for 5 to 8 inch round wafer or customized. Gas line with one Gas MFC with shut-off valve T-Shape Quartz with qualified K-Type TC and one set holder for 100-800°C temperature measurement. Package of 5 pieces of thermocouple wires as spare TC. USB with original Software backup.

Options: Multiple Process Gases (Up to 4) and MFCs with Gas Control

Board if necessary. Carrier or Susceptor for small sample, transparent substrate and


temperature sensor. Chiller for ERP Pyrometer 2-inch, 4-inch, 6-inch, 8-inch (Not recommended) TC Wafer,

Single Point for Pyrometer calibration Omega Meter for Pyrometer and Thermocouple calibration Shutt-off valve for Quartz Tube & Lamps cooling control Spare Parts


Tel.: +1-408-778-7788 Fax: +1-408-904-7168







ALLLWIN21 CORP.

AccuThermo AW 810V

Introduction

The AccuThermo AW810V is a desktop Vacuum RTP (Rapid Thermal Processing) system, which uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-900 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

AccuThermo AW 810V Key Features

Vacuum capability RTP/RTA/RTO/RTN system with Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime. Scattered IR light by special gold plated Al chamber surface. Allwin21 advanced Software package with real time control technologies and many useful functions. Consistent wafer-to-wafer process cycle repeatability. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates Up to 4 gas lines with 3 MFCs and shut-off valves Energy efficient. Made in U.S.A. Small footprint 31(D) X 34(W) X 16(H)

AccuThermo AW 810V

Top&Bottom Lamp Heating Chamber


Introduction



annealing


process




ALLLWIN21 CORP.

AccuThermo AW 810V Software Key Features o Integrated process control systemo Real time graphics displayo Real time process data acquisition, display, and analysiso Programmed comprehensive calibration and diagnostic functionso Closed-loop temperature control with temperature sensing.o Precise time-temperature profiles tailored to suit specific process











o GEM/SECS II function (Optional).oAccuThermo AW 810V Specifications Wafer sizes: Small pieces, 2", 3", 4", 5", 6", 8" wafer capability Vacuum Pressure: 50mTorr to 13 Torr or 13 Torr to 760 Torr Recommended ramp up rate: Programmable, 10°C to 120°C per


Maxim 1250°C (NOT RECOMMENDED) Special quick response K-Type TC temperature accuracy: ±1°C, when

calibrated against an instrumented thermocouple wafer. Thermocouple temperature accuracy: ±0.5°C with rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.



Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2), Ar, He, forming gas, NH3, N2O2 are used.

AccuThermo AW 810V Configuration

AccuThermo AW 810V Main Frame with wires. Power Type: Three Phase, worldwide power (50/60 Hz) CE Mark Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary software package. Mouse and standard keyboard. Aluminum oven chamber with water cooling passages. Door plate with one TC connection port. Top and bottom quartz windows and heating module with 28 (1.2KW ea) Radiation lamps with 6 bank zones control. Oven control board and one main control board. Quartz Tray for 2 to 4 inch or 4 to 6 inch or 5 to 8 inch round wafer or customized. Two gas lines with one Gas MFC with shut-off valve. USB with original Software backup. Main Vacuum Valve

Options: Atmospheric process function. Vacuum pressure measurement and control function Mechanical vacuum pump* Dry vacuum pump* Multiple Process Gases and MFCs (Up to 4) with Gas Control Board

if necessary. Special quick response K-Type TC assembly for high temperature Carrier or Susceptor for small sample, transparent substrate and

substrate with metal thin film on top. Omega Meter Thermocouple calibration Shutt-off valve for Quartz Tube&Lamps cooling control Spare Parts


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Spare PartsAllwin21 Corp.Address: 220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.Tel.: +1-408-778-7788 Fax: +1-408-904-7168Email: [email protected] specification and information

* We recommend customer to provide vacuum pump for their Lab/Fabpump integration and local support in future.


ALLLWIN21 CORP.

AccuThermo AW 820

Introduction

The AccuThermo AW820 is production-proven stand alone atmospheric RTP (Rapid Thermal Processing) system, which uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-900 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.


Long steady time capability RTP/RTA/RTO/RTN system with big stand alone frame and fans in the frame. 35 years’ production-proven Real RTP/RTA/RTO/RTN system Scattered IR light by special gold plated Al chamber surface. Allwin21 advanced Software package with real time control technologies and many useful functions. Consistent wafer-to-wafer process cycle repeatability. Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates Elimination of external contamination by Isolated Quartz Tube Up to five gas lines with MFCs and shut-off valves Energy efficient. Made in U.S.A. Small footprint 38(D) X 39(W) X 70(H)



Introduction



annealing


process



ALLLWIN21 CORP.

AccuThermo AW 820 Software Key Features Integrated process control system Real time graphics display Real time process data acquisition, display, and analysis Programmed comprehensive calibration and diagnostic functions Closed-loop temperature control with temperature sensing. Precise time-temperature profiles tailored to suit specific process requirements. Faster, easier Programmable comprehensive calibration of all subsystems, leading to enhanced process results. A recipe editor to create and edit recipes to fully automate the processing of wafers inside the AccuThermo RTP Validation of the recipe so improper control sequences will be revealed. Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions. Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. Troubleshooting feature which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “expose”. Use PowerSum technology to detect the process and increase Yield. Watchdog function: If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored. GEM/SECS II function (Optional).


Wafer sizes: Small pieces, 2", 3", 4", 5", 6" , 8" wafer capability Recommended ramp up rate: Programmable, 10°C to 120°C per


Maximum 1250°C, 1500oC is optional. ERP Pyrometer 450-1250°C with ±1°C accuracy when calibrated against

an instrumented thermocouple wafer. 1500oC is optional. Thermocouple 100-800°C with ±0.5°C accuracy & rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.

(Repetition specifications are based on a 100-wafer set.) Temperature uniformity: ±8°C across an 8" (200 mm) wafer at 1150°C.


Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2), Ar, He, forming gas,NH3, N2O2 are used.


AccuThermo AW 820 Main Frame with wires. Power Type: Three Phase, worldwide power (50/60 Hz). CE Mark if Necessary. Pentium® class computer with a 15-inch touch screen monitor and Allwin21 Corp proprietary software package. Mouse and standard keyboard. Aluminum oven chamber with water cooling passages and gold plating plates. Door plate with one TC connection port. Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window. Oven control board and one main control board. Bottom and top heating with 27 (1.2KW ea) Radiation heating lamp module with 4 bank zones (Top Front&Rear, Bottom Front&Rear). Quartz Tray for 5 to 8 inch round wafer or customized. Gas line with one Gas MFC with shut-off valve. T-Shape Quartz with qualified K-Type TC and one set holder for 100-800°C temperature measurement. Package of 5 pieces of thermocouple wires as spare TC. USB with original Software backup.

Options: Multiple Process Gases (Up to 5) and MFCs with Gas Control

Board if necessary. Carrier or Susceptor for small sample, transparent substrate and


temperature sensor.1500oC is optional. Chiller for ERP Pyrometer 2-inch, 4-inch, 6-inch, 8-inch Not recommended) TC Wafer,

Single Point for Pyrometer calibration Omega Meter for Pyrometer and Thermocouple calibration Shutt-off valve for Quartz Tube&Lamps cooling control Spare Parts


Tel.: +1-408-778-7788 Fax: +1-408-904-7168







ALLLWIN21 CORP.

AccuThermo AW 820V

Introduction

The AccuThermo AW820V is a stand alone Vacuum RTP (Rapid Thermal Processing) system, which uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-900 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.


Vacuum capability RTP/RTA/RTO/RTN system with Top and bottom High-intensity visible radiation Tungsten halogen lamp heating forfast heating rates with good repeatability performance and long lamp lifetime.Scattered IR light by special gold plated Al chamber surface.Allwin21 advanced Software package with real time controltechnologies and many useful functions.Consistent wafer-to-wafer process cycle repeatability.Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling ratesUp to five gas lines with 4 MFCs and shut-off valvesEnergy efficient.Made in U.S.A.Small footprint38(D) X 39(W) X 70(H)

AccuThermo AW 820V

Top&Bottom Lamp Heating Chamber

Chip manufactureCompound industry: GaAs,GaN,GaP,GaINP,InP,SiC, III-V,II-VIOptronics, Planar optical waveguides, LasersNanotechnologyBiomedicalBatteryMEMSSolarLED

Introduction


Silicon-dielectric growthImplant annealingGlass reflowSilicides formation andannealing

Contact alloyingNitridation of metalsOxygen-donor annihilationOther heat treatmentprocess




ALLLWIN21 CORP.

AccuThermo AW 820V Software Key Featureso Integrated process control systemo Real time graphics displayo Real time process data acquisition, display, and analysiso Programmed comprehensive calibration and diagnostic functionso Closed-loop temperature control with temperature sensing.o Precise time-temperature profiles tailored to suit specific process











o GEM/SECS II function (Optional).oAccuThermo AW 820V Specifications Wafer sizes: Small pieces, 2", 3", 4", 5", 6", 8" wafer capability Vacuum Pressure: 50mTorr to 13 Torr or 13 Torr to 760 Torr Recommended ramp up rate: Programmable, 10°C to 120°C per


Maxim 1250°C ,1500oC is optional. Special quick response K-Type TC temperature accuracy: ±1°C, when

calibrated against an instrumented thermocouple wafer. Thermocouple temperature accuracy: ±0.5°C with rapid response. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.



Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30PSIG and pre-filtered to 1 micron. Typically, N2, O2), Ar, He, forming gas, NH3, N2O2 are used.

AccuThermo AW 820V Configuration

AccuThermo AW 820V Main Frame with wires.Power Type: Three Phase, worldwide power (50/60 Hz)CE Mark if NecessaryPentium® class computer with a 15-inch touch screen monitor and Allwin21 Corp proprietary software package.Mouse and standard keyboard. Aluminum oven chamber with water cooling passages.Door plate with one TC connection port.Top and bottom quartz windows and heating module with 27 (1.2KW ea) Radiation lamps with 4 bank zones (Top Front&Rear, Bottom Front&Rear).Oven control board and one main control board.Quartz Tray for 5 to 8 inch round wafer or customized.Two gas lines with one Gas MFC with shut-off valve. USB with original Software backup.Main Vacuum Valve

Options: Atmospheric process function. Vacuum pressure measurement and control function Turbo pump for up to 10-6 Torr (NOT RECOMMENDED) Mechanical vacuum pump* Dry vacuum pump* Multiple Process Gases and MFCs (Up to 4) with Gas Control Board

if necessary. Special quick response K-Type TC assembly for high temperature Carrier or Susceptor for small sample, transparent substrate and

substrate with metal thin film on top.

Shutt-off valve for Quartz Tube&Lamps cooling control Omega Meter Thermocouple calibration

Allwin21 Corp.Address: 220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.

Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Spare Partsll in21 Corpddress 220 Cochrane Circle, Morgan ill,C 9503 , U S

Tel 1-408- 8- 88 Fa 1-408-904- 168Email sales all in21 com

ll speci ication and in ormation

Spare Parts

1500oC is optional.

Sputter Deposition

ALLLWIN21 CORP.

AccuSputter AW 4450

Introduction

Allwin21 Corp. is a leading supplier of sputter deposition equipment for high technology applications for Semiconductor III-V, II-VI, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. The AccuSputter AW 4450 is designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin21's new real time AW-4450 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every AccuSputter AW 4450 sputtering system is supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service

AccuSputter AW 4450 Key Features

Production-proven sputter technology Optimum AW-4450 System Control DC 24V for Motors, Actuator, Relay, Solenoid Efficient 8" Delta cathodes, 2 to 6" option Full Pallet rotation control with “indexing” High Uniformity and Yield DC, RF Sputter, Pulse DC option Magnetron and Diode Sputter option RF Etch and Bias are optional Ultra Clean vacuum system Load lock operation UHV design Flexible for development or production use Full range of substrate sizes and shapes Various pumping and power options Co-sputtering option Reactive Sputtering option

AccuSputter 4450 Sputter Materials


Introduction

Al+W Cr/SiO2 SiC Ti+Au

InSnO SiO2 Ti/W Ti+Au+Ni

Al2O3 Mo SiO2+O2 Ni/Fe+Cu+SiO2

Ag MoSi2 Si+N2(Si3N4) Ti/W+Au

Au Mo2Si5 Si+N2+B4C Ti/W+Au+Ta

C Mo5Si3 Ta Ti/W+Al/Si

Cr Ni TaC Ti/W+Ni/Cr+Au

Cr/Co Ni/Cr Ta+Au Ti/W+Pt

Cr/Au Ni+Ni/Cr TaSi2 Al+Ti/W+Ag

Cr+Cu Ni/Fe Ta+SiO2 W+Al2O3

Cr/Si Pt Zr Zn

Cr/SiO TiO2 TiO2+Cr ZnO2

Sputter Deposition

ALLLWIN21 CORP.

AccuSputter AW 4450 Software Key Features

o Maintenance, Manual, Semi Automatic and Fully Automatic modes.o Automated calibration of all subsystems.o Troubleshooting to subassembly levels.o Programmed comprehensive calibration and diagnostic functions.o Recipe creation for full automatic wafer processing.o Automatic decline of improper recipes and process data inputs.o Multi-level password protection.o Storage of multiple recipes and system functions.o Real-Time process graphics, data acquisition display, and analysis.o Process Data and Recipe storage automatically to hard drive.o Easy TC vacuum gauge calibration.o Positioning Deposition (optional)o GEM/SECS II (optional)

Main Frame 28" dia. SST chamber top plate with ports and Cathodes Configuration I II Cathode Shape Circle Delta Cathode Size 8 inch Delta Cathode Quantity 1 to 4 1 to 3 Sputter Power Supply Configuration I II III DC Power 5 KW 10 KW RF Power 1KW 2 KW 3 KW Pulse DC Power 5 KW 10 KW Process Chamber • 8" diameter X 12" high stainless steel cylinder with 6"• CF flange viewport and load lock port• 28" diameter stainless steel base plate• 11/2" air-operated roughing isolation valve• Air-operated gas inlet valve• Air-operated vent valve• 11/2"blanked-off leak check port• Removable deposition shields• 23" diameter, 3-position water-cooled annular substrate

table with variable-speed motorized table drive• Full circle shutter and vane shutter• Chain drive pallet carrier transport• Heavy duty electric hoistLoad lock • 30" x 28" x 8" stainless steel load lock chamber with

aluminum cover• Chain drive pallet carrier transport• 2" air-operated roughing isolation valve• Air-operated vent valve• 23" diameter molybdenum annular substrate pallet• Elevator for pallet up and down function.Vacuum Systems for process Chamber • 2 stage Cryo pump with 1000 l/s pumping speed for air,

including chevron, water-cooled compressor and lines,automatic regeneration controller and plumbing kit. 71/2"O.D. (6" ASA) aluminum air-operated gate valveAir-operated venetian blind throttling valve.

• 36.7 cfm mechanical pump or dry pump for process chamber andload lock (Optional)

1 gas line with MFC ① Ar, 200 SCCM; ② CustomizedNew Controller: Allwin21 Corp.'s AW-4450 System PC Control New Power Distribution Box: AC380V /208V/ 3Phase

AccuSputter AW 4450 Basic Configuration

GEM/SECS II function (Software) More gas lines with MFC

① N2; ② O2; ③ Customized Lamp tower alarm with buzzer. Mechanical pump or dry pump for process chamber and load lock. Independent mechanical pump or dry pump for process chamber. Chiller for Cooling plates and table. Turbo pump for load lock. Load lock Lamp Heating function, Up to 200°C Chamber Lamp Heating function, Up to 300°C (Use one cathode port

in SST chamber top plate). Plasma etch function (before sputter) Bias function Co-sputter function Reactive sputter function Transformer for AC 380V to 208V for DC Power Supply (if necessary).

Options

Production-Proven Chamber/Load lock/Vacuum


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition

Plasma Asher Descum

ALLLWIN21 CORP.

Introduction


AW-105R

The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.

AW-105R Key Features

Production-proven plasma Asher/Descum system. Integrated solid robotic wafer handling, Single wafer process. Up to 3%-5% Uniformity. Best for III-V Materials. Frontside and backside isotropic removal. Consistent wafer-to-wafer process cycle repeatability. Element heating for up to 250oC. 50mm-150mm wafer capability. Up to 6.25” substrate. Up to 4 wafer size capability without hardware change. Fixed cassette station and wafer aligner/cooling station. Can handle 50um thickness wafer. PC controller with Advanced Allwin21 Software. Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional). Up to 3 gas lines with MFC. Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option). Pressure control with Throttle Valve. 15-inch Touch screen monitor GUI. EMO, Interlocks, and Watchdog function. GEM/SECS II (optional). Small Footprint: 27”W x 40”D x 59”H (280LBs) Made in U.S.A.

AW-105R Applications

GaAs, InP, GaN, SiC wafer Strip (Mainly) GaAs, InP, GaN, SiC wafer Descum (Mainly) Thin Film Head Resist Cleaning Opto-Electronic Devices Cleaning MEMS Photoresist Stripping High dose implant (As+, B+, P+) Rework Post-polysilicon Post-metal Post-oxideControlled Resist Removal Post-develop descum Uniformity capability (<5% 1σ)

Production-proven Reactor

Integrated Robust Solid Robot

Introduction

Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10

Branson/IPC 3000 Specifications*

AW-105R Software Key Features

o Real time graphics display, process data acquisition, and analysis.o Closed-loop process parameters control.o Precise parameters profiles tailored to suit specific process

requirements.o Programmable comprehensive calibration of all subsystems from within

the software. This allows faster, easier calibration, leading to enhancedprocess results.

o Recipe creation to ensure process repeatability. It features a recipeeditor to create and edit recipes to fully automate the processing ofwafers inside the process chamber.

o Validation of the recipe so improper control sequences will be revealed.o Storage of multiple recipes, process data, and calibration files so that

process & calibration results can be maintained or compared over time.o Passwords provide security for the system, recipe editing, diagnostics,

calibration, and setup functions.o Simple and easy to use menu screen which allow a process cycle to be

easily defined and executed.o Troubleshooting features which allows engineers and service personnel

to activate individual subassemblies and functions. More I/O and AD/DA“exposure”.

o DB-25F parallel (printer) port. The computer interfaces to the Allwin21system with only one cable: the control interface cable.

o The control board inside the machine that translates the computercommands to control the machine has a watchdog timer. If this boardloses communication with the control software, it will shut down allprocesses and halt the system until communication is restored.

o GEM/SECS II function (Optional).o Advanced Allwin21 End of Process (EOP) function (Optional)

AW-105R Specifications*

Wafer Size: Up to 6.25 inch. Temperature: 60-250ºC (±2ºC) Gas Lines: Up to three gas lines with MFCs.

Typical MFC configuration: 5 SLM O2 and 500 SCCM N2. Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at

100 ºC, Descum Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum Particulate: <0.05 /cm2 (0.3um or greater) Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total

shift on 98% of points tested no shift >5% Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime

*Contact Allwin21 sales for other applications and specifications

AW-105R Configuration

Main Frame with Circuit Breakers, Solenoid Valves Pentium Class PC with AW Software Keyboard, Mouse, USB SW backup, and Cables Chuck /w Heat, Pump Ring ,Lift Pins ① 2-4 inch; ② 2-6 inch; ③ 4-6 inch; ④ 6.125 inch; ⑤ 6.25 inchCenter Aligner and Cassette Station ① Two Dimensions ② Four DimensionsAnodized Reactor with Door Chamber Base plate with water sensor Base Plate and Reactor Ceramic Ring Base Plate and Chuck Ceramic Ring Upper and Lower Electrodes Quartz showerhead & Diffusion Disk Main Control and Distribution PCBs 3-axis Integrated Robust Solid Robot RF Matching Network with PCBs 13.56MHz RF Generator ① 300W ② 600WMFC /w In-line Filter and Solenoid Isolation Valve ① One MFC; ② Two MFCs; ③ Three MFCsAC/DC Box with Temperature Controller MKS Baratron with Isolation Valve Lamp Tower Alarm w/ Buzzer Throttle Valve Main Vacuum Valve Front EMO, Interlocks 15-inch Touch Screen GUI

Options: End-of-Process (EOP) GEM/SECS II (Software) Vacuum Pump Chiller for Chamber Base Plate

AW-105R Facilities Requirements Plumbed Process Gases: O2 N2

Cooling water: 1GPM house circulating supply @ <23 ± 2°C Facility Exhaust: 100 CFM @ 1” static pressure Vacuum supply for Robot: 11.8”Hg(-5.8psi) / 0.1CFM airflow Power: 190-240VAC, single phase, 30A, 50/60Hz (NEMA L-6-30P plug supplied)

Main Menu Screen





Tel.: +1-408-778-7788 Fax: +1-408-904-7168


Plasma Asher Descum

ALLLWIN21 CORP.

Plasma Asher

ALLLWIN21 CORP.

AW-1008

Introduction

The AW-1008 single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication. The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.

AW-1008 Key Features

Production-proven plasma stripper/Asher system technology. 5-15% Uniformity. (Process & Hardware dependent. Optional.) Fast strip/ash rate. (Process & Hardware dependent. Optional.) Increased throughput with 3-Axis Integrated Robust Solid Robot. Frontside and backside isotropic removal. 3x 1kW IR Lamp for uniform heating up to 500C. 75mm-150mm wafer capability. Endpoint detection w/Allwin21 SLOPE technology (Optional) 2 wafer sizes capability without hardware change if necessary. Two Fixed cassette stations. Or, one Fixed & one centering station. Can handle 50um thickness wafer PC controller with Advanced Allwin21 Software Package Up to 4 gas lines with MFC’s 2.45GHz 1000W Microwave Pressure control with Throttle Valve Touch screen monitor EMO, Interlocks, and Watchdog function GEM/SECS II interface, Optional Small Footprint : 35”W x 40”D x 55”H (250LBs) Made in U.S.A.

AW-1008 Applications

Downstream ashing for NO device damage Frontside and backside isotropic removal Bulk resist removal Single wafer process High-dose implanted resist Non-oxidizing metal processing Descum

Production-proven Reactor Integrated Robust Solid Robot


Introduction Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010

Plasma Asher

ALLLWIN21 CORP.

AW-1008 Software Key Features

Real time graphics display, process data acquisition, and analysis. Closed-loop process parameters control. Precise parameters profiles tailored to suit specific process requirements. Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. Validation of the recipe so improper control sequences will be revealed. Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”. DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored. GEM/SECS II function (Optional). Advanced Allwin21 EOP function (Optional)

AW-1008 Specifications*

Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size withouthardware charge.

Temperature: 150-350 ºC (±2 ºC) capability Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 510

SLM O2 and 1 SLM N2. Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative

photoresist Uniformity: 15%, Process Dependent Particulate: <0.05 /cm2 (0.3um or greater) Damage: CV: <0.I V CV-shift for 250A gate oxide Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95%

uptime*Contact Allwin21 sales for other applications and specifications

AW-1008 Configuration

Main Frame with Breakers, Relays and Wires Pentium Class PC with AW Software Keyboard, Mouse, USB with SW backup and Cables Quartz Tray ① 3-4 inch; ② 4-6 inch; ③ 5 inch; ④ 6 inch; ⑤ OthersFixed Cassette Station ① Two Cassette Stations; ② One Cassette StationLamp Heat Module and Quartz Window (3 of 1000W IR lamp) 6 inch Quartz showerhead and 5 inch Diffusion Disk Chamber Top Plate and Body with TC for Close Loop Temperature Control (CLTC) Main Control, Distributor PCB and DC H1-7X10.5 Integrated Solid Robot Waveguide and Quartz Plasma Tube Blower for Magnetron and Waveguide Capacitor, Two Transformers, HV Diode 1000W Air cooling magnetron 1-4 Gas Lines w/ Pneumatic Valve, and MFC ① One MFC; ② Two MFCs; ③ Three MFCs; ④ Four MFCsAC Box and Lamp Control PCB for Close Loop Temperature Control (CLTC) Main Vacuum Valves. Two, one for Fast and one for slow pump down MKS Baratron Throttle Valve Front EMO, Interlocks 15-inch Touch Screen GUI

Options: EOP Module with PCB GEM/SECS II function (Software) Lamp Tower Alarm function 1.25kW “Absolute” MW Magnetron with water-cooled Waveguide

with AGL Power Generator. Vacuum Pump

Main Menu Screen


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Plasma Asher Descum

ALLLWIN21 CORP.

AW-B3000

Introduction

The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership.

AW-B3000 Key Features

Production-proven plasma Stripper/Asher/Descum technology. Up to 25% Uniformity. Much lower if used with a Faraday Cage. Consistent wafer-to-wafer uniformity. TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate. End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness. Samples, 6” square, and up to 8” round wafers capable. Many wafer sizes capability without hardware change. Can handle different thickness wafer with different carriers. New controller with PC with Advanced AW Software Up to 5 isolated gas lines with MFC’s 13.56 MHz RF Generator. (Air-cooled Optional) Pressure Control Throttle Valve for better process repeatability. (Optional) MKS Baratron (Optional) Touch screen GUI EMO, Interlocks and Watchdog function GEM/SECS II (Optional) Made in U.S.A.

AW-B3000 Applications

Low cost production-proven plasma Asher / Descum Front and backside isotropic photoresist removal. Barrel/Batch Manual Load Process Descum



Introduction

Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher

Plasma Asher Descum

ALLLWIN21 CORP.

AW-B3000 Software Key Features

Real time graphics display (GUI), process data acquisition, display, and analysis. Closed-loop process parameters control. Precise parameters profiles tailored to suit specific process requirements. Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. Validation of the recipe so improper control sequences will be revealed. Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”. DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored. GEM/SEC II function (Optional). Advanced Allwin21 EOP function (Optional)

AW-B3000 Specifications* Wafer Size: Sample to 200mm Capability. Multiple wafer size without

hardware change High Throughput: Up to 75 WPH. Process Dependent. Temperature: Only TC Option can be used for N2 plasma to heat the

substrates up to 170°C. Gas Lines: Up to 5 isolated gas lines with MFCs. Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR. Slower if

Faraday Cage is used Uniformity: Up to 25%. Much lower with Faraday Cage. Particulate: <0.05 /cm2 (0.3um or greater) Damage: Low damage with Faraday Cage. Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime

* Contact Allwin21 sales for other applications and specifications

AW-B3000 Configuration

Main Body with wires Control Box Pentium Class PC with AW Software Keyboard, Mouse, USB with SW backup and Cables Main Control PCB and DC Transformer, Circuit Breaker,Contactor 1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC Purge has manual regulator in controller box to control speed. Quartz Chamber: Dia 12” x Depth 23”; RF Match Network Integrated in the Main Body of tool. Chamber Door with quartz plate in the Main Body. Gas and vacuum lines Connections in the Main Body 13.56MHz RF Generator (Air-Cooled is Optional) ① 300W; ② 600W; ③ 1000W; ④ 1200WLamp tower alarm with buzzer Main Vacuum Valve MKS Baratron Throttle Valve Front EMO, Interlocks 15-inch Touch Screen GUI

Options: End-of-Process (EOP) function. Throttle Valve for pressure control. Air-cooled RF Generator. GEM/SECS II function (Software) Thermocouple for Chamber Temperature Vacuum Pump

Main Menu Screen


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Plasma Etcher/RIE

ALLLWIN21 CORP.

AW-901eR & AW-903eR

Introduction

The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology.

Equipment Key Features

Production-proven plasma etching system. Up to 3%-5% Uniformity. Frontside and backside isotropic and anisotropic etch. Process Temperature: 6-65°C . 75mm-150mm wafer capability. Integrated solid robotic wafer handling. Single wafer process. Fixed cassette station and wafer aligner/cooling station. Can handle 50um thickness wafer. PC controller with Advanced Allwin21 Software. Endpoint detection with Allwin21 SLOPE technology. (Optional) Up to 4 gas lines with MFC’s. MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W. Pressure control with UPC. Throttle valve is optional. Touch screen GUI. EMO, Interlocks, and Watchdog function. GEM/SECS II (Optional) Small Footprint Made in U.S.A.

AW-901eR, AW-903eR Applications

Polysilicon Etch Nitride Etch Silicon Nitride Etch Silicides Etch Silicon Dioxide Etch Polyimide Etch Polyimide ILD Etch LDD Spacer Etch BCB Etch



Introduction

Zero Layer Etch Backside Etch Pad Etch Passivation Etch Oxide/Contact/Via Etch (Down to 0.8um) Titanium/Tantalum Alloy Resist/SOG Planarization Descum

Integrated Robust Solid Robot

Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915

Plasma Etcher/RIE

ALLLWIN21 CORP.

Software Key Features

Real time graphics display, process data acquisition, and analysis. Closed-loop process parameters control. Precise parameters profiles tailored to suit specific process requirements. Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. Validation of the recipe so improper control sequences will be revealed. Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time. Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions. Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”. DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored. GEM/SECS II function (Optional). Advanced Allwin21 Endpoint Detection function (Optional)

AW-901eR, AW-903eR Specifications*

Up to 6 inch Capability Throughput: 30-60 WPH, Process Dependent Temperature: 6-65ºC (±2 ºC) capability Gas Lines: 4 gas lines with MFCs. Etcher Rate: AW-901eR: 0-8000A/minute; AW-903eR:

0-4000A/minute, Process Dependent Uniformity: Up to ±3%, Process Dependent Particulate: <0.05 /cm2 (0.3um or greater) Selectivity: 901eR: 2-20:1 ; AW-903eR: 2-20:1, Process

Dependent MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95%

uptime * Contact Allwin21 sales for other applications and specifications

AW-901eR, AW-903eR Configuration

Main Frame, Standard Pentium Class PC with AW Software Keyboard, Mouse, USB with SW backup, and Cables Chuck ① 3”; ② 4”; ③ 5”; ④ 6”Wafer Aligner/Cooling Station 3-Axis Integrated Solid Robot ① H-Zero (Standard); ② H1-7X10.5 (TTW)Fixed Cassette Station Chuck Assembly ① 901eR Non-anodized; ② 903eR Anodized /W Flat③ 903eR Anodized /wo Flat ④ 903eR Non-anodized /W FlatReactor Assembly ① 901eR Non-anodized; ② 903eR Anodized③ 903eR Non-anodized; ④ 903eR High Performance⑤ Direct Cooling; ⑥ Non-Direct CoolingPins ① Quartz; ② Ceramic; ③ SSTCentering Ring ① Aluminum; ② Quartz; ③ CeramicMain Control Board Gas Box /w 4 inline Gas Lines, MFC, filters, and Pneumatic valves RF Matching Network with PCB 13.56 MHz RF Generator (Air or Water Cooled) ① MKS Elite:300HD; ② MKS Elite:600HD③ MKS Elite:1000HD; ④ ENI ACG 3; ⑤ ENI ACG 10AC/DC Box ATM Sensor UPC Pressure Control ① 225 SCCM,901eR; ② 2000 SCCM, 903eRMKS Baratron with Pneumatic Isolation Valve Main Vacuum Valves Front EMO, Interlocks 15-inch Touch Screen GUI

Options: EOP Module with PCB GEM/SECS II function (Software) Lamp tower alarm with buzzer Throttle Valve Pressure Control Vacuum Pump Chiller for chuck and chamber Through The Wall


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Through The Wall

Plasma Etcher

ALLLWIN21 CORP.

AW-2001R

Introduction

The AW-2001R single-wafer Etcher is an automated tool designed as a flexible downstream Microwave system for high-volume wafer fabrication. AW-2001R is in direct response to manufacturer’s concerns for wafer damage, uniformity, uptime, reliability and production-proven technology.

AW-2001R Key Features

Production-proven plasma etching system. No damage downstream plasma etcher(≤0.1 Volt CV-shift ) “Extended” Alumina Plasma Tube for better uniformity. Frontside isotropic etch and backside etch if pins-up 75mm-150mm wafer capability. Varied wafer sizes capability without hardware change if necessary. Integrated 3-axis robotic wafer handling for increased throughput

and less wafer breakage. Optional alignment/cooling station to prevent wafer breakage Water-Cooled 1000W Magnetron/Waveguide with an AGL 2.45GHz

Microwave Power Generator for better process repeatability. Can handle 50um thickness wafer PC controller with Advanced Allwin21 Software Package with touch

screen monitor GUI Can handle 50um thickness wafer 4 isolated gas lines with MFC’s Pressure control for process repeatability EMO, Interlocks and Watchdog function GEM/SECS II interface, Optional Light Tower, Optional Small Footprint Made in U.S.A.

AW-2001R Applications

Contact Slope Etch Via Etch BPSG Etch LTO Etch TEOS Etch Thermal Oxide Etch LPCVD Nitride Etch PECVD Nitride Etch Trench Rounding Descum RIE Damage Removal Sodium Removal Planarization Backside Etch (Poly, Nitride, or Oxide) Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å) Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly


Introduction

2.45GHz Microwave Plasma Etch for low plasma damage

Plasma Etcher

ALLLWIN21 CORP.

AW-2001R Software Key Features

Real time graphics display (GUI), process data acquisition, display, and analysis. Closed-loop process parameters control. Precise parameters profiles tailored to suit specific process requirements. Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. Validation of the recipe so improper control sequences will be revealed. Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”. DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored. GEM/SEC II function (Optional).

AW-2001R Specifications*

Wafer Size: 2, 3, 4, 5, 6 inch Capability. Chuck Temperature: 60-110ºC (±2 ºC) Gases: NF3 CF4 HE O2 Uniformity:

100mm : ± 3% (5% 3 sigma) * 150mm : ± 5% (8% 3 sigma) * *max.- min. /2 x average

Reproducibility (w-t-w): 10% 3 sigma Particulate: 0.05p/cm2 > 0.3µm NO DAMAGE: ≤0.1 Volt CV-shift* Contact Allwin21 sales for other applications and specifications

AW-2001R Configuration

Main Frame with Breakers, Relays and Wires Pentium Class PC with AW Software Keyboard, Mouse, USS with SW backup and Cables Fixed Cassette Stations:

1) 1 Two Cassette Stations, or2) One Cassette Station / One Centering/Alignment Station

Door Assembly Metal Shower head "Extended' Alumina Plasma Tube for better Uniformity. Orifice, Gas Cap Chamber Body and Top Plate Main Control , Distributor PCB and DC H1 -7X10.5 Integrated 3-Axls Solid Robot Water-Cooled Magnetron and Waveguide Water-Cooled 1000W Magnetron/Waveguide with an AGL

2.45GHz Microwave Power Generator 4 Isolated Gas Lines with Pneumatic Valves and MFC AC Box Main & Slow Vacuum Valves MKS Baratron Throttle Valve Front EMO, Interlocks 15-rnch Touch Screen GUI

Options: GEM/SECS II function (Software) Light Tower Vacuum Pump

Main Menu Screen


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch

Metal Film Metrology

ALLLWIN21 CORP.

AWgage-150

Introduction

AWgage-150 measures sheet resistance in ohms per square or milliohms per square. If specific resistivity is known, the thickness of the deposited film layer can be computed from the sheet resistance. The choice of measurement data is easily get in the software. AWgage-150 can accommodate 150mm (6") wafers as well as the standard 2", 3",4", 5" wafers without any hardware change.

AWgage-150 Key Features

30 years proven Eddy Sheet Resistance Measurement technology. Non-contact Sheet Resistance Measurement. 1mΩ/square to 19,990Ω/square sheet resistance measurement range. 100Å to 270kÅ Metal Film Thickness range. Touch Screen Monitor GUI and PC w/ Advanced Allwin21 software. Wafer carriage travel programmed with internal encoder step motor , without encoder disk. Consistent wafer-to-wafer process cycle repeatability. Small footprint and energy efficient. Made in U.S.A.

AWgage-150 Specifications

• Perform odd number of site tests: 1 to 9 points• Highly Conductive or Metal Sheet Resistance

1 to 1,999 mΩ/square 1 to 1,999 Ω/square 10 to 19,990 Ω/square

• Highly Conductive or Metal Film ThicknessMinimum: 100 Ångström Maximum: Proportional to resistivity. Maximum for a resistivity of 2.7 µΩ-cm is 270 k Å (27 µm)

• Sheet Resistance RepeatabilityTotal repeatability is the standard deviation (σ) percent of mean value(X),1 count.

Range s/X (±%)

1 to 100 mΩ/sq; Ω/sq 1 100 to 500 ΩW/sq; Ω/sq 2 500 to 1000 mΩ/sq; Ω/sq 4 1000 to 1,999 mΩ/sq; Ω/sq 6 1,999 to 5,000 Ω/sq Consult Factory 5000 to 10,000 Ω/sq Consult Factory 10,000 to 15,000 Ω/sq Consult Factory


Introduction

AWgage-150 Configuration

Main Frame Wafer Carriage (2”-6”) Measurement Head RF Tank Circuit board Pentium® class computer board Main control board Motor control board. Two USB Ports

Two Extra DB9 Ports 15–inch touch screen GUI Allwin21 Corp proprietary

software package. Mouse & keyboard . USB Flash Drive with AW

Software backup. CE Certification (Optional)

Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor

Sheet Resistance Measurement

ALLLWIN21 CORP.

AWgage-150 Software Key Features

The AWgage-150 system is controlled by menu commands from the control software. This software allows a great deal of flexibility and control of the Allwin21 system. The AWgage-150 control software features the following: • Automated calibration of all subsystems from within the control

software. This allows faster and easier calibration, leading to enhancedprocess results. The AWgage-150 allows calibration of the ohm andmilliohm measurements within the software for maximum performanceand accuracy. This provides a much easier and faster method tocalibrate the instrument than by adjusting pots on the back of thetraditional Sheet Resistance Measurement Instrument.

• The SOFTWARE can compensate for where the flat is on the carriageto locate the test points.

• It features a recipe editor to create and edit recipes to fully automatethe processing of wafers on the Allwin21 system.

• Validation of the recipe so improper points will be revealed.• Storage of multiple recipes, process data and calibration files so that


• Passwords provide security for the system, recipe editing, diagnostics,calibration and setup functions.

• Simple and easy to use menu screens which allow an automatic cycleto be easily defined and executed.

• Troubleshooting features which allow engineers and service personnelto activate individual subassemblies and functions.

AWgage-150 Facilities Requirements • Instrument needs to be on a hard/solid surface.• The room temperature should be close to 23° C for the greatest

measurement accuracy.• Avoid environments with high concentrations of particulates, especially

abrasives such as glass and silicon dust.• Power : 50/60Hz, Single Phase, 110/220VAC, 2 Amps• Weight and Dimensions: 44 LBs ; 11 inch (W) X 18 inch (D) X 22 inch (H)

AWgage-150 Measurement Processes

• Turn on the power to the AWgage-150. Allow 30 minutes forwarming up.

• Select an existing recipe or create a new recipe.• When The carriage is in the loading position, place the wafer on

the carriage between the four locator blocks. The wafer will becentered over the circular platform that rotates the wafer.

• Manual Mode: Press the MAN/AUTO button, so the LED is off.Momentarily press the START/STANDBY button. The carriagewill move the wafer under the measurement head to the first pointin the measurement sequence. For multi-pointmeasurements--press START/STANDBY once for each point inthe measurement sequence. The wafer will be advanced to thenext point. When the measurement sequence is complete thecarriage will move to the right until the wafer is out from under themeasurement head in the loading/unloading position. The wafercan be removed from the carriage after it has reached thisposition.

• Automatic Mode: Press the MAN/AUTO button on theAWgage-150 control panel until the LED comes on. Press theSTART/STANDBY button. The entire measurement sequencewill be performed without further operator intervention. When thesequence is complete, the wafer will be moved to the unloadingposition.

• PC Screen Mode: Press the “Start Test” button at the ProcessScreens (for Engineer or Production) to test the wafer that is onthe wafer carriage, using the selected recipe. The entiremeasurement sequence will be performed without furtheroperator intervention. When the sequence is complete, the waferwill be moved to the unloading position.

• All data measurements are recorded in the computer for laterretrieval, inspection and, if desired, a print-out of the measuredpoints can be printed on an external printer.

Recipe Editor Start Test Testing Data


Tel.: +1-408-778-7788 Fax: +1-408-904-7168






ALLLWIN21 CORP.

AWgage-200

Introduction

AWgage-200 measures sheet resistance in ohms per square or milliohms per square. If specific resistivity is known, the thickness of the deposited film layer can be computed from the sheet resistance. The choice of measurement data is easily get in the software. AWgage-200 can accommodate 200mm (8") wafers as well as the standard 6" wafers without any hardware change.

AWgage-200 Key Features

30 years proven Eddy Sheet Resistance Measurement technology. Non-contact Sheet Resistance Measurement. 1mΩ/square to 19,990Ω/square sheet resistance measurement range. 100Å to 270kÅ Metal Film Thickness range. Touch Screen Monitor GUI and PC w/ Advanced Allwin21 software. Wafer carriage travel programmed with internal encoder step motor , without encoder disk. Consistent wafer-to-wafer process cycle repeatability. Small footprint and energy efficient. Made in U.S.A.

AWgage-200 Specifications

• Perform odd number of site tests: 1 to 9 points• Highly Conductive or Metal Sheet Resistance

1 to 1,999 mΩ/square 1 to 1,999 Ω/square 10 to 19,990 Ω/square

• Highly Conductive or Metal Film ThicknessMinimum: 100 Ångström Maximum: Proportional to resistivity. Maximum for a resistivity of 2.7 µΩ-cm is 270 k Å (27 µm)

• Sheet Resistance RepeatabilityTotal repeatability is the standard deviation (σ) percent of mean value(X),1 count.

Range s/X (±%)

1 to 100 mΩ/sq; Ω/sq 1 100 to 500 mΩ/sq; Ω/sq 2 500 to 1000 mΩ/sq; Ω/sq 4 1000 to 1,999 mΩ/sq; Ω/sq 6 1,999 to 5,000 Ω/sq Consult Factory 5000 to 10,000 Ω/sq Consult Factory 10,000 to 15,000 Ω/sq Consult Factory


Introduction

AWgage-200 Configuration

Main Frame Wafer Carriage (2”-6”) Measurement Head RF Tank Circuit board Pentium® class computer board Main control board Motor control board. Two USB Ports

Two Extra DB9 Ports 15–inch touch screen GUI Allwin21 Corp proprietary

software package. Mouse & keyboard . USB Flash Drive with AW

Software backup. CE Certification (Optional)

Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor


ALLLWIN21 CORP.

AWgage-200 Software Key Features

The AWgage-200 system is controlled by menu commands from the control software. This software allows a great deal of flexibility and control of the Allwin21 system. The AWgage-200 control software features the following: • Automated calibration of all subsystems from within the control

software. This allows faster and easier calibration, leading to enhancedprocess results. The AWgage-200 allows calibration of the ohm andmilliohm measurements within the software for maximum performanceand accuracy. This provides a much easier and faster method tocalibrate the instrument than by adjusting pots on the back of thetraditional Sheet Resistance Measurement Instrument.

• The SOFTWARE can compensate for where the flat is on the carriageto locate the test points.

• It features a recipe editor to create and edit recipes to fully automatethe processing of wafers on the Allwin21 system.

• Validation of the recipe so improper points will be revealed.• Storage of multiple recipes, process data and calibration files so that


• Passwords provide security for the system, recipe editing, diagnostics,calibration and setup functions.

• Simple and easy to use menu screens which allow an automatic cycleto be easily defined and executed.

• Troubleshooting features which allow engineers and service personnelto activate individual subassemblies and functions.

AWgage-200 Facilities Requirements • Instrument needs to be on a hard/solid surface.• The room temperature should be close to 23° C for the greatest

measurement accuracy.• Avoid environments with high concentrations of particulates, especially

abrasives such as glass and silicon dust.• Power : 50/60Hz, Single Phase, 110/220VAC, 2 Amps• Weight and Dimensions: 44 LBs ; 11 inch (W) X 18 inch (D) X 22 inch (H)

AWgage-200 Measurement Processes

• Turn on the power to the AWgage-200. Allow 30 minutes forwarming up.

• Select an existing recipe or create a new recipe.• When The carriage is in the loading position, place the wafer on

the carriage between the four locator blocks. The wafer will becentered over the circular platform that rotates the wafer.

• Manual Mode: Press the MAN/AUTO button, so the LED is off.Momentarily press the START/STANDBY button. The carriagewill move the wafer under the measurement head to the first pointin the measurement sequence. For multi-pointmeasurements--press START/STANDBY once for each point inthe measurement sequence. The wafer will be advanced to thenext point. When the measurement sequence is complete thecarriage will move to the right until the wafer is out from under themeasurement head in the loading/unloading position. The wafercan be removed from the carriage after it has reached thisposition.

• Automatic Mode: Press the MAN/AUTO button on theAWgage-200 control panel until the LED comes on. Press theSTART/STANDBY button. The entire measurement sequencewill be performed without further operator intervention. When thesequence is complete, the wafer will be moved to the unloadingposition.

• PC Screen Mode: Press the “Start Test” button at the ProcessScreens (for Engineer or Production) to test the wafer that is onthe wafer carriage, using the selected recipe. The entiremeasurement sequence will be performed without furtheroperator intervention. When the sequence is complete, the waferwill be moved to the unloading position.

• All data measurements are recorded in the computer for laterretrieval, inspection and, if desired, a print-out of the measuredpoints can be printed on an external printer.

Recipe Editor Start Test Testing Data


Tel.: +1-408-778-7788 Fax: +1-408-904-7168





o Real time graphics display, process data acquisition, and analysis.o Advanced Temperature Control for RTP and other “lamp-based” wafer

heating systems.o Precise parameters profiles tailored to suit specific process

requirements.o Consistent wafer-to-wafer process cycle repeatability.o Programmable comprehensive calibration of all subsystems from

within the software. This allows faster, easier calibration, leading toenhanced process results.

o Recipe creation. It features a recipe editor to create and edit recipes tofully automate the processing of wafers inside the process chamber.

o Validation of the recipe so improper control sequences will berevealed.

o Storage of multiple recipes, process data and calibration files so thatprocess and calibration results can be maintained and compared overtime.

Upgrade Kits

ALLLWIN21 CORP.

Upgrade Kits

Introduction

The Upgrade Kits include an advanced Allwin21 AW System Control with touch screen Graphic User Interface (GUI) and a new PC with Allwin21 real-time control Software. Most upgrade kits include new main control board, new wafer heating functions with Allwin21’s Advanced RTP technology, fixed cassette station instead of the original elevator, and robust 3-Axis integrated robotic wafer handling (instead of the original). The kits are easy to incorporate (plug-and-play) into the original systems. Onsite installation available for most of kits as well (so all facilities connections can stay in place). Each upgrade kit will enhance the entire systems’ operation and allow for far better Process Repeatability, Stability, and Uniformity.

Software Key Features


Introduction

o Passwords provide security for the system, recipe editing,diagnostics, calibration and setup functions

o Simple and easy to use menu screen which allow a processcycle to be easily defined and executed.

o Troubleshooting features which allows engineers and servicepersonnel to activate individual subassemblies and functions.More I/O, AD/DA “exposure”.

o The control board inside the machine that translates thecomputer commands to control the machine has a watchdogtimer. If this board looses communication with the controlsoftware, it will shut down all processes and halt the system untilcommunication is restored.

o Closed-loop process parameters control.o GEM/SECS II function (Optional).o Advanced Allwin21 EOP function (Optional)

Upgrade Kits

ALLLWIN21 CORP.

Why Upgrade Used Process Equipment

1) Low cost solution of obsolete components and parts.2) Increase stability of the original system.3) Add network function (GEM/SECS II) for Fab/Lab integration4) PC control for data storage.5) Friendly GUI operation.6) More precise control.7) Better performance (Repeatability, Uniformity, Stability)8) Easier maintenance, calibration and troubleshooting.

Main Upgrade Kits

Equipment Model Image Upgrade Kits

New PC Controller with AW Software Integrated Solid Robotic Wafer trnasfer

Heatpulse 210 Yes N/A

Heatpulse 410

Heatpulse 610

Perkin-Elmer 4XXX Yes N/A

Perkin-Elmer 24XX

Matrix 10X Yes

Matrix 20X

Matrix 30X

Matrix 40X

Tegal 901e Yes

Tegal 903e

Gasonics Aura 1000 Yes

Gasonics AE 2001

Gasonics Aura 3010 3000/2000LL/AE 2000LL

Yes

Gasonics L3510 /L3500

Lam AutoEtch X90 Yes N/A

Branson/IPC 3000 20004000

Yes N/A


Tel.: +1-408-778-7788 Fax: +1-408-904-7168


All specification and information here are subject to change

without notice and cannot be used for purchase and facility plan.

The used equipment trade mark belongs to OEM.

Only for Gasonics 3010/3000 / L3510 / 3500

At Allwin21 Facility only

At Allwin21 Facility only

Lam Rainbow 44XX

Sputter Deposition System

Lowest Cost Upgrade Solution

No More Obsolete Controller Parts

Increase Uptime

Decrease Maintenance

Main Characteristics

Upgrade Your Perkin-Elmer 2400,44XX Series Sputter Deposition Systems

Perkin-Elmer 44XX Series Sputter Systems : PE 2400 PE 4400 PE 4410 PE 4415 PE 4430 PE 4450 PE 4480

The AW-4450 Sputter System Upgrade Kit includes an advanced control system with touch screen operator interface and Allwin21 computer software. The kit is easy

to incorporate (plug-and-play) into the original PE sputter system. No need to move the to be upgraded system from its present location. All utility connections stay in

place. The new control system will enhance the entire system operation. It makes the upgraded sputter system much more reliable, since many of the old controllers

are eliminated.

Fast On-site Upgrading

Customized survey and upgrading plan

Same input/output connectors

Same definition of each connector

Plug-and-Play

Replaced Obsolete Controls If Necessary

Auto Pump Down Controller

Load Lock Controller

Digital Clock Timer

AW-4450 System Control

Maintenance, Manual, Semi Automatic and Full Automatic operation modes

Automated calibration of all subsystems

Trouble shooting to sub-assembly levels

Programmed comprehensive calibration and diagnostic functions

Recipe creation for full automatic wafer processing

Automatic decline of improper recipes and process data

Multi level password protections

Storage of multiple recipes and system functions

Real-Time process data acquisition,display ,analysis

Real-Time graphics user display (GUI)

Process Data and Recipe storage on a hard drive

Easy TC vacuum gauge calibration

Positioning Deposition(optional)

GEM/SEC II functions (optional)

Table Raise / Lower Control

Throttle Valve Control System

Pressure Control System

Sputter Head Controls (optional)

Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037

.

220 Cochrane CircleMorgan Hill, CA 95037 USA Tel： +1-408-778-7788Fax: +1-408-904-7168E-mail: [email protected] Website: http://www.allwin21.comCopyright©2017-2021 Allwin21 Corp.


Sputtering Deposition System.

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