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HUAWEI TECHNOLOGIES CO., LTD.

www.huawei.com

Huawei Confidential

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Huawei - Università di Parma

Sergio Bianchi Luca Menichetti

HUAWEI TECHNOLOGIES CO., LTD. Huawei Confidential

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Snapshot of Huawei

A leading provider of commercial public

telecom networks

Employee-owned private company

More than 100,000 employees; average age is

below 30

70% of R&D staff hold Master’s or Doctorate

degree

65% of the employees in overseas offices are

locally recruited

Revenues of USD 28 billion in 2010, expected to

grow more than 10% in 2011


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Corporate milestones

Deployed the world' s 1st commercial LTE network

in Europe

Topped WIPO‘s Patent Cooperation Treaty

applicant list

Established partnerships with all tier-one operators

in Europe

Selected as a preferred 21st century network

supplier by BT

Achieved 1st significant contract win in Europe

Established in Shenzhen, China

Won 1st overseas contract to build a fixed

network for Hutchison Whampoa

Established 1st overseas R&D centre in

Bangalore, India

1988

1997

1999

2004

2005

2007

2008

2009


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Sustainable growth

As of the end of December, 2010

Serving 1/3 of the world’s population

Serving 45 of the world's top 50

telecom operators with ~65% of our

sales from these operators

Global No. 2 telecom solution provider

Main contributor of industry standards

Revenue (CNY in billions)

Huawei Technologies releases an annual report with consolidated financial statements audited by KPMG

Revenue of 2006-2010 have been converted into USD from CNY based on the closing rate at the end of the

corresponding year

2006 2007 2008 2009

66.4

93.8

125.2

149.1

185 ($ 28 B)

($ 21.8 B)

($18.3 B)

($12.8 B)

($ 8.5 B)

2010

Continuously creating long-term value for customers

24%

2011 (Target)

199 ($ 31 B)


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Bell Canada

Comcast

Clearwire

Telus

Verizon

British Telecom

Deutsche Telekom

FT/Orange

KPN

OTE

Portugal Telecom

SFR

Swisscom

TDC

Telecom Italia

Telefonica

TeliaSonera

Telekom Austria

Vodafone

Belgacom

Bharti Airtle

BSNL

Hutchison Whampoa

KDDI

KT Corp

NTT

SingTel

SK Telecom

Softbank

Telenor

Telstra

MTN

America Movil

Oi/Telemar

Telmex

Etisalat

Saudi Telecom

Zain

MTS

Svyazinvest

Vimpelcom

China Mobile

China Telecom

China Unicom

TOP50 operator position Source: Totaltele, October 2009

Serving 45 of the world's top 50 operators


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Advantageous position in the All-IP convergence era

The only telecom supplier ranking in the top 3 for all these areas

Comprehensive strengths in the All-IP based FMC era

No. 3

No. 1 No. 2

IP

Fixed Mobile

All-IP based FMC

FMC: Fixed Mobile Convergence


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MEF Certificate

Huawei Microwave

MPLS Architecture

Ethernet Architecture

• Radio Features

• SDH/Ethernet Features

Microwave Architecture

Metro Ethernet

Architecture

Member of 123 standards organizations

Board member of OMA, IEEE, ATIS, WiMAX Forum; 148 leadership positions

More than 18,000 standards proposals submitted

Received 2009 Corporate Award in recognition of

Huawei's leadership in IEEE standards development

(All by Q4 2009)

Standards Patents

Open innovation; reaches cross-license

agreement with all major industry peers

42,543 patent applications, 13,236 of which

have been granted.

Leading position in terms of essential LTE

patents applications

Contributing to industry standards


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20 R&D centers worldwide

Munich

San Diego

Silicon Valley

Dallas

Ottawa Paris

Moscow

Headquarters Milan

Sweden

Shenzhen

Beijing

Shanghai Chengdu

Xi An Nanjing

Bangalore

Hangzhou Wuhan

Turkey New Jersey

Chicago

Fundamental

Algorithms

Next Generation Internet,

Chips, and Software

FMC, Fixed

Network

Microwave

Wireless &

Network

Wireless &

Device

San Diego,

USA

Dallas Texas,

USA

Moscow,

Russia

Bangalore,

India

Munich,

Germany

Stockholm/

Gothenburg,

Sweden

Paris,

France

Milan,

Italy

Ensuring products and technologies keep abreast with the industry trend

50% of employees engaged in R&D with more than 2 billion USD investments


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Innovation to a Greater EU Industry

5 R&D Centers & Numerous Joint Innovation centers

Stockholm, Gothenburg, Munich, Paris and Milan

Co-Founded with leading operators (Vodafone; FT;

DT) for leading technologies

University R&D cooperation

University of Dresden, TU Munich, TU Darmstadt,

University of Würzburg, RWTH Aachen, University

of Duisburg, Frauenhofer Fokus, Berlin, University

of Padova, University of Ferrara

EU Project

Framework Program 6 (“FP 6”); Framework

Program 7 (“FP 7”)

Support EU to realize the technology lead in the

world

Innovation Center Local Research Center


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More than 400 people, 75% locals

Offices established in 2004

Milano, Torino, Rome

R&D center and 3 innovation centers

Call center & spare part center

Huawei highlights in Italy

http://www.istockphoto.com/stock-photo-9751634-italy-map-with-flag.php


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Font to be used by customers and

partners :

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partners :

Puzzle Circle

• Focus on cutting-edge technologies and high-

level design, such as E-Band, algorithms,

Microwave Architecture

• Over 50 senior microwave experts

• Complete test lab, to support customer experience ,

demo and test.

ITALY: Milan research Center

CHINA: Chengdu, Xi’an, Shenzhen R&D Center Italy: Milan China: Xi’an

China: Chendu

China: Shenzhen

Milan cutting-edge tech.

Chengdu Product Develop

Xi'an RF Research

Shenzhen Platform & NMS

• Focus on product and chips Research

• 600 Microwave R&D engineers

• Focus on RF Research ,the same

research platform with Huawei

wireless product

• Over 200 RF R&D engineers。

• Focus on software and NMS

• Over 300 software engineers

R&D for Microwave, Four Research Centers in Globe


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PoC5

Point to point Radio Link – Where used

‘Backhauling’ section

LTE Deployment weight: 10 15%

Optical Ring

(MW ring)

‘Feeder’ section

LTE Deployment weight: 30 / 35%

‘Tail sites’ section

PoC1

PoC2 PoC3

Traditional network topology

‘Tail sites’ : 40 45% ‘Feeder’ : 40 45% ‘Backhauling’ : 10 15% Current deployment weights

PoC4

PoC4 PoC3

Capacity

WiMAX

2G

3G

4G

(LTE)


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PoC5

LTE expanded

topology

Ring type

Star type

PoC5

Network Topology Evolution - Urban

‘Backhauling’ section


Optical Ring

(MW ring)

‘Feeder’ section

LTE Deployment weight: 30 / 35%

‘Tail sites’ section ‘Micro cellular’ section


PoC1

PoC2 PoC3

Traditional network topology

‘Tail sites’ : 40 45% ‘Feeder’ : 40 45% ‘Backhauling’ : 10 15% Current deployment weights

PoC4

PoC4 PoC3

Capacity


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partners :

Professionals

Marketing Technical

Sales

Customer

System Test Account

R & D

R & D R & D Project

Management

Post Sales

Technical

Service

CUSTOMER

SATISFACTION


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Interdisciplinary

Equipments

Professional

Skills Competitive

Advantages

Strong Correlation between different disciplines

in the Equipment Design: Digital, Modem,

Microwave

New Ethernet Services and Network Protocols

Evolution to Full IP Networks

All the actors in the

Microwave field shall

have transversal skills:

Marketing

Designers

Technical sales

System test

Post Sales Assistance

Improvements for

competitive advantages:

Product performances

Network Features &

protocols integration

TCO:

Cost

Commonalities

Spare Parts

Lead Time

Easy Installation &

Management

Interdisciplinary


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Puzzle Circle

Milan Microwave Competence Center – R&D

MMIC - Microwave Monolithic Integrated Circuit in GaAs

Millimeter wave up to 90 GHz (e-band)


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Puzzle Circle Main activities

Microwave link system

architecture

Microwave technology

advanced research

Modem design

MMIC design


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Equipment Types

Full Indoor Equipments Split Equipments

IDU

ODUs

Full ODU Equip.


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Equipment Design – Interfaces

2G – E1

E1

IMA/ATM over E1

FE/GE

FE/GE

E1 / STM-1

STANDARD INTERFACES

PROPRIETARY INTERFACE

3G – ATM

LTE – Ethernet


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MODEM

Dominated by DSP algorithms: • FPGA ( Xilinx , Altera , Lattice ) • Verilog/VHDL • DSP (C, C++) • ASIC • Integrated D/A – A/D

Algorithms: • Adaptive equalizers • Synchronization • Carrier recovery • Phase noise suppression (PSAM) • Digital Pre-Distortion • IQ compensation • Soft decoders • ...


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DSP Block Example


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What is it an MMIC ?

An MMIC is a circuit where both active and passive components are integrated

into the same material (Galliun Arsenide, Gallium Nitrade, Silicon Germanium,

Indium Phosphate, ...) .


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2 5 10 freq [GHz] 30

low

m

ed

ium

h

igh

v

ery

hig

h

Pe

rfo

rma

nce

/ou

tpu

t p

ow

er

SiGe BiCMOS

RF-CMOS 65/45/32 nm

LDMOS GaN

GSM,3G

DECT

BT

802.11b/g

802.11a/n

PA

Sat Ka Sat return Sat LNB

WiMAX

GaAs PA’s

UWB

Car Radar

PtP

X-band Radar

Base station

SiGe to replace

GaAs

Wafer & mask cost RF-CMOS

limits suitability for ASICs

Technologies Trend

GaN to

replace GaAs


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MEMS - What

MEMS: Micro-Electro-

Mechanical Systems

Process: like IC, could be Si or

SiGe


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MEMS technology

Targets:

•Performance improvement

•Integration and cost reduction

Challenges:

•Feasibility

•Reliability

•Process

http://www.kth.se/ees/omskolan/organisation/avdelningar/mst/research/projects/files/switch.jpg


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Human Resources reference:

[email protected]

mailto:[email protected]


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Thank you www.huawei.com

Copyright©2011 Huawei Technologies Co., Ltd. All Rights Reserved.

The information contained in this document is for reference purpose only, and is subject to change or withdrawal according to specific customer requirements and conditions.

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