upgrading the star tpc fee (r & d phase)
DESCRIPTION
Upgrading the STAR TPC FEE (R & D Phase). Fred Bieser. R&D Program Goals. Develop solid technical approach for upgrading TPC (and FTPC) readout speed and data quality Basis for eventual upgrade implementation (in tandem with DAQ) to support >1kHz rate of event presentation to level 3. - PowerPoint PPT PresentationTRANSCRIPT
Upgrading the STAR TPC FEE(R & D Phase)
Fred Bieser
R&D Program Goals
Develop solid technical approach for upgrading TPC (and FTPC) readout speed and data quality
Basis for eventual upgrade implementation (in tandem with DAQ) to support >1kHz rate of event presentation to level 3
History
• EOS @ Bevatron (1990)– 15K channels; 100/sec SCA + ext. ADCs
• NA49 @ CERN SPS (1995)– 186K channels; 16/sec SCA/ADC
• STAR @ RHIC (1998)– 137K channels; 100/sec SCA/ADC + Gigabit links
The Future
• ALICE @ LHC (2007)– 570K channels, 200 central events/sec
• STAR (after upgrade)– 137K channels, 1000 central events/sec
Bottlenecks, shortcomings
• Analog store + digitization (SCA/ADC)
• Discontinuous sampling
• Off-chamber zero suppression
• Spatial ‘noise’
analog sampledigitize
sub. pedestalsuppress 0s
serializesend to DAQ
preampshaper
Desired Improvements
• Higher Event Rate to Level 3 (>1KHz)
• Continuous Waveform Sampling
• Digital filtering (better shaping)
• Zero suppression before Xmission to DAQ
digitizeadj. baseline
serializesend to DAQ
suppress 0spreampshaper
ALTRO Features
• 20MHz/10bit ADC per channel (4mW)
• 2 stages of adaptive baseline restoration
• Tunable pulse shaping (tail corrections)
• Continuous Pipelined Digital Processing/Formatting
• Output = 4x faster & 4x wider than inputs
R & D Plan
Year 1:
• Develop science-driven requirements
• Evaluate technical approaches
(e.g. ALTRO chip developed for ALICE TPC)
• Learn about care and feeding of ALTRO chip
• Define topology of FEE on a STAR TPC Sector
• Define interface to DAQ (both physical and philosophical)
R & D Plan
Year 2:• Design FEE card and Readout Controller
• Develop STAR-specific algorithms and parameters used within the ALTRO chip
• Construct several prototype FEE cards and interface to DAQ
• Perform detailed testing/evaluation of prototypes using spare TPC sector
Costs
• Major effort = contributed time (free) (myself + jay + other RNC members)
• 50% of one post-doc
• Part of a junior engineer in second year
• Travel (BNL,CERN)
• prototype PCBs
• Costs: year 1 $80K
year 2 $167K
Summary
• The goal of this R&D proposal is to prepare for upgrading the performance of the TPC electronics.
• We are doing preliminary work now and are ready to rapidly move ahead once we are approved.