Using CoventorWareCoventorWare 2010www. covent or. com Version 2010 ii March 19, 2010 Coventor, Inc. Coventor, Inc.This manual and its accompanying materials are licensed to the user for the period set forth in the applicable license agreement, subject to termination of the license by Coventor, Inc. at any time. The manual at all times remains the property of Coventor, Inc., or third parties from whom Coventor, Inc. has obtained a licensing right. The information contained in this manual including but not limited to the ideas, concepts and know-how, is proprietary, confidential and trade secret to Coventor, Inc. or such third parties and the information contained therein shall be maintained as proprietary, confidential, and trade secret to Coventor, Inc. or to such third parties. 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Data presented in examples do not necessarily reflect actual test results and should not be used as design criteria.By acceptance of this manual, the user agrees to the above conditions and further agrees that this manual will not be exported (or re-exported from a country of installation), directly or indirectly, separately or as part of a system, without user or users employer, at its own cost, first obtaining all licenses from the United States Department of Commerce and any other appropriate agency of the United States Government as may be required by law. Coventor, Inc., 2010.All rights reserved. No part of this work may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic or mechanical, including photocopying and recording, or by any information storage or retrieval system without prior permission in writing from Coventor, Inc. Information in this document is subject to change without notice.CoventorWare includes software developed by the University of California, Berkeley and its contributors.CoventorWare is enhanced with Visualization Software from Tecplot, Inc. of Bellevue, Washington, USA.CoventorWare and the associated documentation incorporate portions of ABAQUS/CAE and its associated documentation under license from ABAQUS, Inc. ABAQUS is a registered trademark of ABAQUS, Inc.Coventor, CoventorWare, Bubble-DropSim, CoSolveEM, CoventorWare ANALYZER, CoventorWare ARCHITECT, Coventor-Ware DESIGNER, FlowMM, CoventorWare INTEGRATOR, MemElectro, MemCFD, DampingMM, MemFSI, MemHenry, MemMech, NetFlow, ReactSim, SwitchSim, and WHATS NEXT, AND NEXT, AND NEXT are registered trademarks of Coven-tor, Inc. Cary, NC.DXF is a trademark of Autodesk, Inc.Excel is a registered trademark of Microsoft CorporationFLEXnet is a registered trademark of Globetrotter Software, Inc.I-deas is a trademark of UGS. Permalloy is a registered trademark of B&D Industrial & Mining Services, Inc.SABER is a registered trademark of American Airlines, Inc., licensed to Synopsys, Inc.SaberDesigner, SaberGuide, CosmosScope, SaberSimulator, and SaberSketch are trademarks of Synopsys, Inc. Tecplot is a registered trademark of Tecplot, Inc.Cadence, Verilog and Verilog-XL are registered trademarks of Cadence Design Systems, Inc.Excel, and Windows XP are registered trademarks of Microsoft Corporation.X Window System is a trademark of Massachusetts Institute of Technology.MUMPs is a registered trademark of MEMSCAP, Inc.VdmTools is proprietary and copyrighted software of Visual Kinematics, Inc.All other trademarks or registered trademarks belong to their respective holders.Contact us at www.coventor.comDoc Ver 2010.000 Rev A Compatible with CoventorWare version 2010.000Table of Contents Version 2010Coventor, Inc. March 18, 2010 iiiM Table of ContentsSection 1: Using CoventorWare1.1: Major Components................................................................................. U1-2 1.1.1: Function Manager .................................................................................................... U1-2 1.1.2: Material Properties Database .................................................................................. U1-2 1.1.3: Process Editor.......................................................................................................... U1-3 1.1.4: ARCHITECT ............................................................................................................ U1-3 1.1.5: DESIGNER.............................................................................................................. U1-3 1.1.6: Meshing ................................................................................................................... U1-4 1.1.7: ANALYZER 3-D Field Solvers ................................................................................. U1-4 Parametric Study ..................................................................................................... U1-5 Visualizer ................................................................................................................. U1-5 Query Manager........................................................................................................ U1-5 1.1.8: Integrator.................................................................................................................. U1-51.2: Document Conventions ......................................................................... U1-6 1.2.1: Font Conventions..................................................................................................... U1-6 1.2.2: Icons ........................................................................................................................ U1-6 1.2.3: Page Numbering...................................................................................................... U1-7 1.2.4: On-Line Help............................................................................................................ U1-7 1.2.5: Other Conventions................................................................................................... U1-8 Tutorials................................................................................................................... U1-8 Screen Images ........................................................................................................ U1-8 1.2.6: Other Information Resources................................................................................... U1-81.3: CoventorWare Conventions .................................................................. U1-8 1.3.1: Coordinate System Conventions ............................................................................. U1-8 1.3.2: Units of Physical Quantities ..................................................................................... U1-9 1.3.3: Numerical Values Displayed in User Interface....................................................... U1-10 1.3.4: Units Displayed in User Interface........................................................................... U1-101.4: Licensing............................................................................................... U1-101.5: Function Manager Overview................................................................ U1-11 1.5.1: Materials ................................................................................................................ U1-11 1.5.2: Process.................................................................................................................. U1-12 1.5.3: Architect Tab.......................................................................................................... U1-14 1.5.4: Designer................................................................................................................. U1-15 Layout Editor ......................................................................................................... U1-15Table of Contents Version 2010 iv March 18, 2010 Coventor, Inc. Solid Modeling ....................................................................................................... U1-17 1.5.5: Analyzer ................................................................................................................. U1-18 1.5.6: Menu Functions...................................................................................................... U1-20 File......................................................................................................................... U1-20 Tools...................................................................................................................... U1-20 Help ....................................................................................................................... U1-21 Click to View Log ................................................................................................... U1-211.6: Dialog Overview....................................................................................U1-22 1.6.1: Project Browser...................................................................................................... U1-23 Project Functions................................................................................................... U1-23 Settings Functions ................................................................................................. U1-23 1.6.2: Database Browser.................................................................................................. U1-24 Browser Components ............................................................................................ U1-24 1.6.3: Run Analysis Dialog............................................................................................... U1-28 How to Run a Batch Simulation............................................................................. U1-29 1.6.4: Job Queue.............................................................................................................. U1-30 Job Queue Icons.................................................................................................... U1-31 Job Queue and the Database Browser.................................................................. U1-33 1.6.5: Delete Logs Window.............................................................................................. U1-331.7: Common Button Functions..................................................................U1-341.8: File Types and Organization................................................................U1-35 1.8.1: System Resource Files .......................................................................................... U1-35 Project Settings Files............................................................................................. U1-35 Database Files....................................................................................................... U1-35 MPD Files .............................................................................................................. U1-37 Process Files ......................................................................................................... U1-37 Layout Files ........................................................................................................... U1-37 1.8.2: Input Files............................................................................................................... U1-37 Database Files....................................................................................................... U1-37 Model Import .......................................................................................................... U1-37 1.8.3: Export Files ............................................................................................................ U1-38 1.8.4: Execution Files....................................................................................................... U1-38 Temporary Files..................................................................................................... U1-38 Log Files ................................................................................................................ U1-38 1.8.5: Tutorial Files........................................................................................................... U1-39 1.8.6: File Naming Restrictions ........................................................................................ U1-39 1.8.7: File Formats ........................................................................................................... U1-39 1.8.8: Directory Structure ................................................................................................. U1-40Table of Contents Version 2010Coventor, Inc. March 18, 2010 vM 1.8.9: Setting Up a Typical Project................................................................................... U1-411.9: Design Considerations ........................................................................ U1-42 1.9.1: Fabrication Description .......................................................................................... U1-42 1.9.2: Layout .................................................................................................................... U1-42 1.9.3: Meshing ................................................................................................................. U1-43 1.9.4: Computation Time Requirements .......................................................................... U1-43 1.9.5: Accuracy ................................................................................................................ U1-441.10: Enhancing Productivity ..................................................................... U1-44 1.10.1: Monitoring Execution ........................................................................................... U1-44 Testing the Setup .................................................................................................. U1-45 Reducing Total Computation Time........................................................................ U1-45 Allowing Sufficient Disk Space .............................................................................. U1-45 1.10.2: Managing Files and Directories ........................................................................... U1-46 1.10.3: Efficient Design Iterations .................................................................................... U1-46 Iterated Simulations from within the Solver Modules............................................. U1-461.11: Environment Variables....................................................................... U1-47 Setting Environment Variables on Windows.......................................................... U1-47 Setting Environment Variables on Linux................................................................ U1-481.12: Interfacing with Third-Party Software............................................... U1-48 Layout Files ........................................................................................................... U1-48 Solid Models and Meshes ..................................................................................... U1-48 ABAQUS ............................................................................................................. U1-48 Text Output ............................................................................................................ U1-48 Graphical Output ................................................................................................... U1-49 Saber ..................................................................................................................... U1-49Section 2: Material Properties Database2.1: Access to the MPD................................................................................. U2-2 2.1.1: Database Window Functions ................................................................................... U2-2 2.1.2: Initial Material Property Assignment ........................................................................ U2-3 2.1.3: Importing Material Properties................................................................................... U2-32.2: Property Types ....................................................................................... U2-4 2.2.1: Elastic Constants ..................................................................................................... U2-5 2.2.2: Density ..................................................................................................................... U2-8 2.2.3: Stress....................................................................................................................... U2-8Table of Contents Version 2010 vi March 18, 2010 Coventor, Inc. 2.2.4: TCE.......................................................................................................................... U2-9 TCE and MemMech................................................................................................. U2-9 TCE and Fluidics ................................................................................................... U2-10 2.2.5: Thermal Conductivity ............................................................................................. U2-10 2.2.6: Specific Heat .......................................................................................................... U2-10 2.2.7: Electrical Conductivity............................................................................................ U2-11 Temperature-Dependent Electrical Conductivity ................................................... U2-11 Dopant Concentration-Dependent Electrical Conductivity..................................... U2-11 2.2.8: Dielectric ................................................................................................................ U2-13 Piezoelectric Analysis............................................................................................ U2-13 CoventorWare Coupling Coefficient Conventions ................................................. U2-15 2.2.9: Viscosity................................................................................................................. U2-18 2.2.10: Piezoresistive Coefficients ................................................................................... U2-18 2.2.11: Computing Poly-T Values .................................................................................... U2-21 2.2.12: Computing Table-T Values .................................................................................. U2-21 2.2.13: Custom Properties File......................................................................................... U2-21 *conductivity........................................................................................................... U2-22 *damping................................................................................................................ U2-22 *dielectric ............................................................................................................... U2-22 *elastic ................................................................................................................... U2-23 *electrical conductivity ........................................................................................... U2-24 *expansion............................................................................................................. U2-24 *joule heat fraction................................................................................................. U2-25 *piezoelectric ......................................................................................................... U2-25 *piezoresistive........................................................................................................ U2-26 *specific heat ......................................................................................................... U2-26Section 3: The Process Editor3.1: Components............................................................................................U3-1 3.1.1: Process Library ........................................................................................................ U3-1 3.1.2: Process Description ................................................................................................. U3-2 3.1.3: Step Parameters ...................................................................................................... U3-33.2: Substrate Step.........................................................................................U3-33.3: Modeling Steps .......................................................................................U3-4 3.3.1: Deposit Parameters ................................................................................................. U3-5 Planar Fill and Stack................................................................................................ U3-5 Conformal Shell ....................................................................................................... U3-6Table of Contents Version 2010Coventor, Inc. March 18, 2010 viiM 3.3.2: Partition.................................................................................................................. U3-13 Example................................................................................................................. U3-13 3.3.3: Round Corners....................................................................................................... U3-15 3.3.4: Straight Cut Etch Parameters ................................................................................ U3-17 3.3.5: Statistical Properties .............................................................................................. U3-21 Normal ................................................................................................................... U3-21 Uniform.................................................................................................................. U3-22 Piecewise Linear ................................................................................................... U3-23 3.3.6: Delete Parameters................................................................................................. U3-253.4: User-Defined Step Definitions............................................................. U3-25 3.4.1: Etch Steps.............................................................................................................. U3-25 Anisotropic Wet Etch, Frontside, Backside............................................................ U3-26 Generic Wet Etch .................................................................................................. U3-28 Generic Dry Etch ................................................................................................... U3-28 Deep Reactive Ion Etch (DRIE) ............................................................................. U3-28 Release Dry Etch and Release Wet Etch.............................................................. U3-28 Stripping ................................................................................................................ U3-29 3.4.2: Deposition Steps.................................................................................................... U3-29 Thermal Oxidation ................................................................................................. U3-29 Generic PECVD..................................................................................................... U3-29 Sputtering .............................................................................................................. U3-29 Evaporation ........................................................................................................... U3-29 LPCVD................................................................................................................... U3-30 Spin Casting .......................................................................................................... U3-30 3.4.3: Process Sequences ............................................................................................... U3-30 Silicon-On-Insulator (SOI) ..................................................................................... U3-30 Ion Implantation Surface........................................................................................ U3-30 Electroplating......................................................................................................... U3-32 LIGA ...................................................................................................................... U3-33 Lift-Off .................................................................................................................... U3-34 Anodic Glass Wafer Bonding................................................................................. U3-34 Silicon Fusion Bonding.......................................................................................... U3-36 References ............................................................................................................ U3-373.5: Foundry Processes .............................................................................. U3-373.6: Menus .................................................................................................... U3-37 3.6.1: File ......................................................................................................................... U3-37 File Properties ....................................................................................................... U3-38 3.6.2: Edit ......................................................................................................................... U3-38Table of Contents Version 2010 viii March 18, 2010 Coventor, Inc. 3.6.3: View ....................................................................................................................... U3-39 3.6.4: Tools ...................................................................................................................... U3-40 Edit Process Steps Library .................................................................................... U3-40 Options .................................................................................................................. U3-40 Foundry Folder ...................................................................................................... U3-41 3.6.5: Window .................................................................................................................. U3-41 3.6.6: Help........................................................................................................................ U3-41 3.6.7: Right Click Menus .................................................................................................. U3-413.7: Deposit and Etch Basics......................................................................U3-42 3.7.1: Side Settings.......................................................................................................... U3-43 3.7.2: Conformal Deposit after a Release Step................................................................ U3-44 3.7.3: Basic MEMS Process ............................................................................................ U3-44 3.7.4: Structure of a Process File .................................................................................... U3-46 3.7.5: Building a Process Sequence ................................................................................ U3-463.8: Etch Conventions .................................................................................U3-50 3.8.1: Photoresist ............................................................................................................. U3-50 3.8.2: Offset...................................................................................................................... U3-52 3.8.3: Sidewall Angles...................................................................................................... U3-57Section 4: Foundry Design Kits4.1: DALSA Semiconductor: MEMS Post-Processing on CMOS...............U4-2 4.1.1: Basic Process Description ....................................................................................... U4-2 4.1.2: Implementation and Process Files........................................................................... U4-3 4.1.3: Contact Information.................................................................................................. U4-54.2: INTEGRAMplus QinetiQ Micromachining Processes.......................U4-5 4.2.1: DRIE-based SOI Micromachining Process (DPK) ................................................... U4-5 Basic Process Description....................................................................................... U4-5 Implementation and Process Files........................................................................... U4-6 4.2.2: Metal-Nitride Surface Micromachining Process (MPK) ............................................ U4-7 Basic Process Description....................................................................................... U4-7 Implementation and Process Files........................................................................... U4-8 4.2.3: Polysilicon Surface Micromachining Process (PPK) .............................................. U4-10 Basic Process Description..................................................................................... U4-10 Implementation and Process Files......................................................................... U4-10 4.2.4: Contact Information................................................................................................ U4-114.3: SensoNor MultiMEMS Process............................................................U4-12Table of Contents Version 2010Coventor, Inc. March 18, 2010 ixM 4.3.1: Basic Process Description ..................................................................................... U4-12 References ............................................................................................................ U4-13 4.3.2: Implementation and Process Files......................................................................... U4-13 4.3.3: Contact Information................................................................................................ U4-144.4: MEMSCAP MUMPs Processes.......................................................... U4-15 4.4.1: MEMSCAP PolyMUMPs ........................................................................................ U4-15 Basic Process Description..................................................................................... U4-15 Implementation and Process Files ........................................................................ U4-16 4.4.2: MEMSCAP SOIMUMPs......................................................................................... U4-17 Basic Process Description..................................................................................... U4-17 Implementation and Process Files ........................................................................ U4-18 4.4.3: MEMSCAP MetalMUMPs ...................................................................................... U4-19 Basic Process Description..................................................................................... U4-19 Implementation and Process Files ........................................................................ U4-20 4.4.4: Contact Information................................................................................................ U4-204.5: Tronics 60m SOI-HARM Process ...................................................... U4-21 4.5.1: Basic Process Description ..................................................................................... U4-21 4.5.2: Implementation and Process Files......................................................................... U4-22 4.5.3: Contact Information................................................................................................ U4-234.6: SINTEF MoveMEMS PZT...................................................................... U4-24 4.6.1: Implementation and Process Files......................................................................... U4-24 4.6.2: 3-D Modeling and Simulation................................................................................. U4-254.7: IMEPKU - Beijing University Polysilicon Process............................. U4-29 4.7.1: Basic Process Description ..................................................................................... U4-29 4.7.2: Implementation and Process Files......................................................................... U4-29 4.7.3: Contact Information................................................................................................ U4-30Section 5: GlossaryIndex ...................................................................................................... IX-1Table of Contents Version 2010 x March 18, 2010 Coventor, Inc. Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-1M Section 1: Using CoventorWareCoventorWare is an integrated suite of software tools for designing and simulating MicroElectroMechanical Systems (MEMS) and microfluidics devices. CoventorWare supports two distinct design flows, as shown in Figure U1-1, which may be used separately or in combination. The ARCHITECT module provides a unique system-level approach to MEMS design, whereas the DESIGNER and ANALYZER modules work together to provide a more conventional physical design flow. Both design flows require information about the fabrication process as a starting point, and this information is provided via a Process Editor and the Material Properties Database.Figure U1-1 Design FlowIn ARCHITECT, the user assembles a schematic of the MEMS device by selecting and connecting components from a library of parameterized, MEMS-specific behavioral models. The schematic resembles an electrical schematic, but the symbols in the schematic represent electromechanical components, such as rigid plates with adjacent electrodes, flexible beams, and electrostatic comb drives. Upon completing a schematic, the user can simulate various aspects of its physical behavior. The Scene3D sub-module makes it easy to visualize both the schematic design and animated simulation results in 3-D. The advantages of this system-level modeling approach include full parameterization of the design and very fast simulations compared to conventional finite-element analysis. The speed with which designs can be assembled, varied, and simulated enables rapid investigation of design alternatives, design optimization, and stud-ies of sensitivity to variations in the fabrication process. The DESIGNER and ANALYZER modules support a manufacturing-aware physical design flow. The user starts in DESIGNER by creating a 2-D layout in the Layout Editor. The Solid Modeler uses the layout, in conjunction with the layer stack information provided in the Process Editor, to automatically build a 3-D solid model. The user then works in a 3-D view in the Preprocessor to prepare the 3-D model for automatic mesh generation. After a mesh has been generated, the user can select from a comprehensive suite of field solvers that simulate the physical behavior of MEMS and microfluidics devices using either the finite-element method (FEM) or boundary-element method (BEM) or, in the case of coupled electromechanics, a combination of the two methods. Though not illustrated in Figure U1-1, physical design geometry can be imported from third-party tools in several industry-standard 2-D layout or 3-D solid Section 1: Using CoventorWare Version 2010 U1-2 March 19, 2010 Coventor, Inc. model formats. The MEMS-specific features of DESIGNER and ANALYZER provide many advantages over gen-eral-purpose FEM tools.The system-level design flow provided by ARCHITECT and the physical design flow provided by DESIGNER/ANALYZER are complementary. At any point in the design process, the ARCHITECT user can automatically gener-ate a 2-D layout or a 3-D model that can be used as a starting point for physical design or design verification in DESIGNER/ANALYZER. Correspondingly the INTEGRATOR module provides a bridge from detailed 3-D physi-cal simulations in ANALYZER to the ARCHITECT system-level modeling environment. INTEGRATOR can auto-matically generate reduced-order macromodels from detailed 3-D simulations This can be useful for creating custom models of MEMS subsystem components, such as intricate anchor or suspension geometries that cannot otherwise be modeled in ARCHITECT. The resulting custom models can be inserted in any schematic design in ARCHITECT and are fully compatible with the parameterized MEMS components. Finally, designs can be exported from either ARCHITECT or DESIGNER to third-party tools in the form of 2-D layouts and/or 3-D solid models in several avail-able industry-standard formats. In addition to the MEMS-specific component library in ARCHITECT, CoventorWare comes with other MEMS-spe-cific content that can jumpstart the design effort. It includes extensive tutorials for all common types of MEMS devices. There are also Foundry Access Kits consisting of a process file, material properties database, and layout tem-plate for more than ten independent MEMS foundries. And there are two libraries of standard MEMS packages from Kyocera and Hymite that make it easy to investigate the effects of packaging on MEMS device performance.CoventorWare's modules are individually licensed. Typical configurations are DESIGNER and ANALYZER, ARCHI-TECT and DESIGNER, or All modules. Your site may have licensed only a subset of the modules described in this manual. If you are unable to access one of the modules, check with your local system administrator to determine whether a license is available for that module.1.1: Major ComponentsA more detailed overview of each of CoventorWares major components is given below.1.1.1: Function ManagerOn starting CoventorWare, the Function Manager window is the first to appear. All CoventorWare functionality is accessed from the Function Manager. The upper portion of the Function Manager window has icons for accessing the Material Properties Database and the Process Editor. The lower portion of the Function Manager has navigation tabs for accessing the ARCHITECT, DESIGNER, and ANALYZER functions. The menu at the top of the window pro-vides options for file management, help, and several ancillary tools. For detailed information on the Function Man-ager, see page U1-11.1.1.2: Material Properties DatabaseThe first step in creating a design, whether you intend to perform system-level simulations with ARCHITECT or FEM simulations with ANALYZER, is to enter the material properties associated with your fabrication process in the Material Properties Database (MPD). Only the materials that are in the MPD are accessible in the Process Editor and available for simulations. For detailed information on the MPD, see the section beginning on page U2-1.For information on the latest CoventorWare features, please see the Release Notes, which are available in the Coventor\CoventorWare2010\docs and in the top directory of the installation CD.CoventorWare comes with a default MPD that is provided for example purposes only. All users are strongly advised to enter material property values for their specific fabrication process in the MPD because the accuracy of simulation results depends directly on the accuracy of the material properties.Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-3M 1.1.3: Process EditorThe second step in creating a design, whether you intend to perform system-level simulations with ARCHITECT or FEM simulations with ANALYZER, is to enter a description of the sequence of steps involved in the fabrication pro-cess in the Process Editor. You create the sequence by selecting prototype steps from a Process Library, displayed by default on the right-hand side of the Process Editor window. Each step has parameters that must be specified. For deposit steps, for example, you specify the material to be deposited and the deposit depth. As an alternative to speci-fying a custom process, you may select a complete process sequence for an independent foundry from among those listed in the Process Library. For detailed information on the Process Editor, see the section beginning on page U3-1.1.1.4: ARCHITECTARCHITECT provides a system-level design and simulation environment for MEMS devices. It is comprised of a schematic editor (Saber Sketch), a simulator (Saber Simulator), a plotting tool (Cosmos Scope), a 3-D visualizer (Scene3D), and several libraries of parameterized behavioral models (also known as components). Before starting a schematic, you must provide an MPD and process file created with the Process Editor. To create a schematic design in Saber Sketch, you select components from the PEM library and place these components in the schematic view. The design can be viewed in 3-D at any time using the companion Scene3D module. When the schematic is complete, you can run a variety of simulations of the design, including static, transient, and harmonic analyses. Simulation results can be viewed in the form of x-y plots using Cosmos Scope, or the motion of the device can be animated in Scene3D. The available component libraries include a library of parameterized electromechanical models (the EM library), and optional libraries of magnetic, optical, and fluidic models. There is also an optional set of templates for generic elec-trical, mechanical, and control-system components. Most MEMS designs can be completed using only components from these libraries, but you can also create custom components by using Integrator to extract reduced-order macro-models, but note these custom models cannot be viewed in Scene3D. All types of components are compatible and can be combined in any schematic.For users who want to continue their device design in DESIGNER/ANALYZER or another third-party tool, a 2-D layout or 3-D solid model can be exported from Scene3D or created using the New from Architect option available from the Function Managers Designer tab. See page U1-15 for more details. For detailed information on ARCHI-TECT, see the ARCHITECT Reference on page A1-1.1.1.5: DESIGNERDESIGNER provides a manufacturing-aware method for creating 3-D solid models of MEMS and microfluidics devices. It is comprised of a 2-D layout editor (the Layout Editor), a solid model generator (the Solid Modeler), and a 3-D solid model viewer and editor (the Preprocessor). As a starting point, you must provide a MPD and process file created with the Process Editor. In addition, you must supply a 2-D layout file that has layers that define all of the masks required by the process file. There are several options for providing the layout file. One option is to use the comprehensive editing capabilities in the Layout Editor to draw the shapes that define each mask. Another option is to draw the layout in a third-party layout tool and import the layout in the GDSII, DXF, or CIF file format. ARCHI-TECT users have the option to generate a layout from an ARCHITECT schematic by selecting the New from Archi-tect option on the Designer tab. When the MPD, process file, and layout file are complete, you click on a button in the Function Manager that causes the Solid Modeler to build a 3-D solid model. The resulting 3-D model is automatically loaded in the Preprocessor for viewing and, if desired, preparation for meshing and simulation in ANALYZER. The Preprocessor includes export and import functions than enable exchange of 3-D solid model files with third-party CAD tools, such as SolidWorks and UGS I-deas.Currently, microfluidics schematic designs cannot be viewed in Scene3D or extracted as a 2-D layout or 3-D model.Section 1: Using CoventorWare Version 2010 U1-4 March 19, 2010 Coventor, Inc. For more information on DESIGNER, see the DESIGNER Reference on page D1-1.1.1.6: MeshingCoventorWare's automatic mesh generations capabilities are incorporated in the Preprocessor, which serves as a bridge between DESIGNER and ANALYZER. Once a solid model is loaded in the Preprocessor, you select which layers are to be meshed. The Preprocessor automatically groups the layers into regions based on their adjacency. You then select the type of mesh to be generated on each region and can set local refinement options. The types of meshes include surface meshes with triangular or quadrilateral faces and volume meshes with tetrahedrons or hexahedrons (bricks). Several different methods are available for hexahedrons, including extrusion, Manhattan (for near orthogo-nal geometries) and mapping (for geometries that can be decomposed into 6-sided volumes). You can select any layer, part, face, edge or vertex and specify local refinement options. A Quality Query in the Preprocessor allows you to view a variety of mesh statistics to assess the quality of the mesh, and visualize "bad" elements (elements with characteristics that exceed user-settable thresh holds). Generating a valid, high-quality mesh is a pre-requisite for using any of the field solvers in ANALYZER.Meshes generated in third-party software can be imported to CoventorWare in I-deas Universal file (.unv) format, PATRAN mesh file format, ANSYS .ans, cdb, or .rst formats, or ASCII Stereolithography (.stl) file format. Meshes from older versions of CoventorWare that are in the .mbif format can also be imported. For more information on CoventorWares meshing capabilities, see the ANALYZER Reference beginning on page R2-1.1.1.7: ANALYZER 3-D Field SolversANALYZER provides a comprehensive suite of 3-D solvers, including solvers for electrostatics, mechanics, coupled electromechanics, thermomechanics, and microfluidics. With these solvers, you can perform analyses that incorpo-rate or compute the following types of physical behavior and effects: capacitance and electrostatic charge; deformations from applied pressures or forces; coupled electromechanical behavior, including pull-in and lift-off voltage; mechanical and coupled electromechanical behavior with full contact boundary conditions; piezoelectric effects; residual stress (from the fabrication process); modal analyses of the natural vibration frequencies of MEMS devices; harmonic analyses of MEMS devices; steady-state electrothermal (Joule heating), thermomechanical, and electrothermomechanical behavior; transient mechanical and thermomechanical behavior; thermal boundary conditions, such as film convection, radiation, and heat flux; Coupling of package deformation resulting from thermomechanical effects to mechanical behavior of a MEMS device. piezo-resistive sensing of mechanical deformation; inductance of electrically conductive components, such as package leads and wire bonds; gas damping effects on MEMS device behavior; fluidic solutions with static or transient compressible or incompressible flows; fluidic solutions with electrokinetic flows and diffusion in microchannels;Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-5M fluidic solutions involving species separation using phased voltage channel switching; fluidic solutions for multi-phase flows involving droplet ejection or bubble movement; and fluidic solutions for chemical reactions.Summaries of simulation results are available in tables and X-Y plots. Details of simulation results can also be viewed in 3-D using the Visualizer, with numerous visualization options. For more information on the MEMS ANALYZER solvers, see page R1-1. For more information on the Fluidics solv-ers, see page F1-1.Parametric StudyA parametric study is an option for all field solvers that enables users to vary one or more parameters over a range and obtain a solution for each value in the range. The Parametric Study option is available during the solver setup sequence for each solver. The parameters that can be varied during a parametric study include geometric dimensions, material properties, and boundary conditions such as pressure, temperature, and voltage. For more information, see page R9-1.VisualizerThe solver output for most MEMS models includes a significant amount of data for analysis and post-processing. The Visualizer tool supplements this capability by enabling users to map these results graphically onto the original model and visually analyze the solution. The Visualizer enables viewing of electrostatic fields, mechanical deformations, stresses, thermal variations, temperature gradients, pressures, current densities, and many other parameters. Selected parameters are color-mapped onto the 3-D model, allowing a complete surface analysis of the model after the solution is complete. An adjustable slice plane and selected probing of interior bricks allow the entire volume to be visualized.The Visualizer can show a timed sequence of incremental changes to a model from a parametric study and can simu-late and animate the modal vibrations from a modal analysis solution. It includes its own animation module for cap-turing and replaying a desired sequence. A print module captures the Visualizer screen to an output file in a variety of resolutions.The user can adjust virtually every aspect of the 3-D view, including lighting effects, perspective, shading, line widths, font sizes, and scale positions, to satisfy individual preferences. For more information on the Visualizer, see the section beginning on page R10-1.Query ManagerIn addition to the predefined summary tables and X-Y plots that are produced by each solver, the user can define custom queries that provide additional summary data on each analysis. The Query Manager is accessible from the Analysis Results window. Queries can be performed on device surfaces, volumes, regions specified by coordinates, or between surfaces. For fluidics solutions, queries may also be performed on a specified point, volume, or elliptical region.For more information on the Queries function, see the section beginning on page R9-14.1.1.8: IntegratorIntegrator consists of four solvers, available from the Analyzer tab of the Function Manager, that have the capability to extract reduced-order macromodels for use in system-level simulations in ARCHITECT. Extracted macromodels are saved in directories that can be accessed from Saber Sketch, allowing placement of their corresponding symbols in a manner nearly identical to that used for components from the parametric model libraries. Note that these custom macromodels are for a specific design. The solvers that comprise Integrator include SpringMM: extracts reduced-order models of linear double-ended and non-linear single-ended mechanical springs, electrostatic springs, and electromechanical springs; InertiaMM: extracts the centroids and moments of inertia of the movable parts of a device; Section 1: Using CoventorWare Version 2010 U1-6 March 19, 2010 Coventor, Inc. DampingMM: extracts of damping coefficients resulting from squeezed film, slide film, and Stokes flow effects. FlowMM: extracts the resistance and inertance of a two-port fluidic device of arbitrary geometry (e.g. a microchannel).For more information on the Integrator suite of tools, see the INTEGRATOR Reference on page N1-1.1.2: Document ConventionsConventions followed in the CoventorWare documentation are noted below.1.2.1: Font ConventionsThe table below outlines the font conventions used in CoventorWare manuals.1.2.2: IconsAdditional information or information of special note is denoted by an icon: Font FunctionBold Names of buttonsItalics File names, directory paths, icon names, field entries, and menu or drop-down selections (implies that there is more than one option) Courier Command lines (text entered at a terminal prompt)Underline Hyperlinks to related informationThe stop sign highlights critical information or instructions that you must follow in order to obtain proper results.The green arrow highlights information or instructions needed to understand the immediate topic.The lightbulb highlights supplemental information concerning the section topic or directs the user to other sections with related topics.Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-7M 1.2.3: Page NumberingEach volume in the CoventorWare manual set has a unique letter incorporated into its page number. This letter simpli-fies cross-references and index entries among the manuals. The table below outlines the lettering convention.1.2.4: On-Line HelpThis entire manual set, with hypertext links to cross-references, table of content entries, and index entries, is available in Adobe Acrobat PDF format, which may be viewed in Adobe Acrobat Reader 7.0 for your LINUX or Windows platform. The on-line manuals are distributed on the Installation CD and may be accessed from the Help menu in the Function Manager window, or they may be requested by contacting a Coventor Sales office. The Reader software is included on the CD or may be downloaded from the Adobe Web site at www.adobe.com. Select software set-up dialogs have help icons in the lower right corner. Clicking on one of these icons opens the doc-umentation to the location that has the relevant window information. For instance, if you are in the MemMech Sur-faceBCs window and would like to access information on the various options in this window, click on the help icon in this window to open the documentation at the location of the MemMech SurfaceBCs reference material.The software manual set is the best information tool available for providing guidelines on using the software. Detailed user requirements, extensive tutorial examples, a complete quick reference section, and other aids appear throughout the volumes to help you find the information you need quickly and to easily apply it to your application. Each of the manuals is available in PDF format and can be accessed while running the software by selecting Help > Contents from the Function Manager menu.The Master Help option, available from the Help menu, is designed to help you in several ways: If you have a certain task in mind, Master Help will direct you to the software module that will aid in that task. It gives an overview of each software module, with links to reference or tutorial information on that module. It allows you to search the entire pdf documentation set for specific information.The Coventor support staff is also available for technical support. Having a working knowledge of your file organiza-Letter DesignationDocument TitleA CoventorWare ARCHITECT ReferenceMEMS and Microsystems System-Level DesignD CoventorWare DESIGNER ReferenceMEMS and Microsystems Physical DesignF CoventorWare ANALYZER Microfluidics ReferenceMicrofluidics AnalysisM CoventorWare Microfluidics Design and Analysis TutorialsMicrofluidics AnalysisN CoventorWare INTEGRATOR Macromodeling ReferenceMacromodel Extraction and System SimulationR CoventorWare ANALYZER ReferenceMEMS and Microsystems AnalysisT CoventorWare MEMS Design and Analysis Tutorials, Vol. 1 and 2MEMS and Microsystems AnalysisU Using CoventorWareSection 1: Using CoventorWare Version 2010 U1-8 March 19, 2010 Coventor, Inc. tion, log file contents, error messages, and other output from the software helps them get you through your questions and possible problems in the most efficient way.1.2.5: Other ConventionsTutorialsThe tutorials are designed to allow both advanced and new users to pace comfortably through the procedures. The Advanced User Procedure column in the tutorial steps includes concise, but complete steps on completing the tutorial sequences. All users should first attempt to complete the tutorials by reading only this column (and any accompany-ing graphics), if possible. The short explanations provide complete summaries and allow you to think more about the problem setup and results rather than on the mechanics of clicking buttons and setting fields. For users unfamiliar with concepts or with the software interface, the Detailed User Procedure column offers much more explanation on exactly how to accomplish the objectives of the Advanced User Procedure column. It also offers summary notes for many of the lettered steps (indicated with an arrow directly under the step), which explain why specific settings are used or why certain results are displayed.Screen ImagesFor consistency, images from the Windows operating system are used in all illustrations. The appearance of Coven-torWares user interface is virtually identical for the Linux and Windows XP platforms. There are only some superficial differences in attributes such as window borders and fonts, which are caused by the platform software.1.2.6: Other Information ResourcesYou can obtain additional information on CoventorWare and MEMS devices through these sources: Our web site at www.coventor.com, which contains up-to-date product and application information. Data sheets for each of the main CoventorWare modules. 1.3: CoventorWare ConventionsCreating a successful design depends in part on understanding CoventorWare conventions. The coordinate and design unit conventions are outlined in this section.1.3.1: Coordinate System ConventionsThe software uses a standard orientation for specifying X, Y, and Z coordinates for 3-D modeled objects. The surface of the ground plane is oriented in the X and Y direction. The Z axis is perpendicular to this surfacewhich is the Z=0 reference point. Objects above this surface take on a positive Z value. These conventions are summarized in Figure U1-2.Figure U1-2 Three-Dimensional Axis Orientation Conventions Z=0XYZSection 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-9M 1.3.2: Units of Physical QuantitiesCoventorWare often displays the values of input and output quantities without showing the units. However consistent units are used throughout the software. Table U1-1 lists all the numerical quantities that appear in CoventorWare, the commonly used symbol and SI (International Standard) units for each quantity, and the units used in CoventorWare.Table U1-1 CoventorWare UnitsQuantity SymbolARCHITECT units (kg/m/s/A/K)(S.I. units)DESIGNER and ANALYZER units (kg/m/s/pA/K)Acceleration a m / s2m / s2m / s2Angular acceleration1rad/s2degrees/sec2Angular input2 radians degreesAngular velocity rad/s degrees/secCapacitance C F A2 s4 / (kg m2) pF pA2 s4 / (kg m2)Charge Q C A s pC pA sConductivity (Electrical)3 S / m pS / m pA2 s3 / (kg m3)Conductivity (Thermal) k W / mK (kg m) / (K s3 )pW / m K (kg m) / (K s3 )Current (Electrical) A pA pADensity kg / m3kg / m3kg / m3Diffusivity m2/s m2/s m2/sFlow m3 / s m3 / s m3 / sForce F N (kg m) / s2N (kg m) / s2Frequency f Hz 1 / s Hz 1 / sHeat Flux q W / m2kg / s3pW / m2kg / s3Length l m m mMass m kg kg kgMoment of Inertia kg m2kg m2kg m2Piezoresistive Coefficients 11,12,44MPa-1Poissons Ratio Power P W (kg m2 ) / s3pW (kg m2 ) / s3Pressure p Pa kg / (m s2 ) MPa kg / (m s)2Specific Heat CpJ / kgK m2 / (K s2 ) pJ / kgK m2 / (K s2 )Stress ijPa kg/(m s2 )MPa kg /(m s2) Thermal Coefficient of ExpansionTCE 1 / K 1 / K 1 / KVelocity v m / s m / s m / sViscosity (Dynamic) Pa s MPa s kg / (m s)Section 1: Using CoventorWare Version 2010 U1-10 March 19, 2010 Coventor, Inc. 1Note that degrees are decimal degrees (degrees/minutes/seconds).2Note that in ARCHITECT, radians are used for rotations on wires and in Saber models, but for ARCHITECT para-metric models, angles are input as degrees.3 Note that it is often easier to find the electrical resistivity in meters*ohms for a material, rather than the electrical conductivity. The electrical conductivity can be computed as the reciprocal of the resistivity:To convert to ANALYZER units (pS/m), multiply the result by 106.1.3.3: Numerical Values Displayed in User InterfaceIn some locales, a comma is used as the decimal separators. In the CoventorWare interface, the period must be used as the decimal separators.1.3.4: Units Displayed in User InterfaceIn all software screens where units do appear, English rather than Greek characters are used to represent units. 1-2 lists these unit labels:Table U1-2 CoventorWare Unit Display1.4: LicensingThe specific modules licensed from Coventor determine whether or not you have access to the modules described in this document. If your license does not include one or more modules, those options will be grayed out. FLEXnet is used to manage CoventorWare licenses. Once the software is installed, user interaction with FLEXnet is minimal.If you have problems obtaining licenses when starting or running CoventorWare or some of its components, refer to the Troubleshooting section of the Installation Instructions.Voltage (Electrical) V W / A (kg m2 ) / (A s3 )V (kg m2 ) / (pA s3 )Youngs Modulus E Pa kg/(m s2 )MPa kg / (m s2 )Unit micro pico femto mega kilogram farad volts newton pascal watt kelvinLabel u p f M kg F V N Pa W KQuantity SymbolARCHITECT units (kg/m/s/A/K)(S.I. units)DESIGNER and ANALYZER units (kg/m/s/pA/K)1ohm meter ------------------------------Smeters----------------- =Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-11M 1.5: Function Manager OverviewAll CoventorWare components are controlled and started from the Function Manager, shown in Figure U1-3. The upper half of the window displays the active process and MPD files and offers access to the Process Editor and the MPD Editor. Because the process and MPD files serve as the basis for any design, they remain visible no matter which tab is active. Each tab on the Function Manager enables a specific software tool. The tab groups are logical divisions of tasks performed within the software: device simulation using a top-down methodology (the Architect tab), device creation and device modeling of a design extracted from top-down simulation or for FEM modeling (the Designer tab), and device verification and simulation using FEM modeling (the Analyzer tab). Depending on the bun-dled module configuration you have purchased from Coventor, you may not have access to all the modules described in this manual. This section gives a description of each tool and points you to more extensive documentation.Figure U1-3 Function Manager 1.5.1: MaterialsThe Materials field specifies a database file that stores all the material properties used by the solvers during the com-putation phase. This database file has a .mpd extension. A generic MPD file is included with the installation and is placed in each users Shared\mpd directory. A Material Properties Database (MPD) may be included with a tutorial directory, and foundry specific files may be provided by foundries as part of their design kits.When a new model is created, material properties are automatically assigned to the parts based on the material name, which was assigned in the Process Editor. Before creating a layout and a process file, check that the MPD has the desired materials and that these materials have the desired properties assigned to them. If you want to change any val-ues in the MPD file, consider copying the default MPD file and saving it under another name, then saving the changes to the new file, rather than overwriting the values in the original MPD.The MPD Editor icon to the right of the Materials field opens the Edit Materials window, as seen in Figure U1-4. This window provides access for viewing existing properties and changing or adding shared default material properties to the MPD. Starts the MaterialStarts the Process Editor Navigation tabsProperties Editor Section 1: Using CoventorWare Version 2010 U1-12 March 19, 2010 Coventor, Inc. Figure U1-4 MPD EditorBecause the Material Properties Database is shared by ARCHITECT, DESIGNER, and ANALYZER, its reference is included in this manual. For more detailed information on the Material Properties Database and the material proper-ties associated with it, see page U2-1.1.5.2: ProcessThis Process field specifies the file that contains the deposit and etch sequence needed to build a device. The process file is stored in a Devices subdirectory of the project_name directory. Clicking on the Process Editor icon from the Function Manager opens the Process Editor, shown in Figure U1-5. The Material Properties Editor can also be accessed from within the Preprocessor when a part is selected. The Edit > Properties menu opens the Properties dialog box, which has an icon link to the MPD Editor. When the MPD is accessed from the Function Manager, changes are written to the MPD file. If access is through the Preprocessor, changes will only apply to the model displayed.Material properties with more than one value are accessed from an Edit window.Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-13M Figure U1-5 Process Editor Window The Process Editor includes the Process Library, the Process Description, and the Step Parameters panes. The Process Library includes numerous process steps from which you can select user-defined process steps, generic modeling steps, and foundry-developed processes. The Process Description displays each step in its own row in a spreadsheet format. Each row lists settings or parameters that are used in creating the step. When a process step is selected, the Step Parameters window becomes active; from this window you can change step parameters. For substrate, deposit, and delete steps, you can select a material from the MPD, which stores properties of the mate-rials used in a fabrication process. Silicon, polysilicon, silicon nitride, and aluminum are typical examples of process materials. The properties associated with the materials include strength, density, conductivity, and thermal character-istics. The materials selected from the database in the process flow are used throughout the simulation process.For etch steps, you can select or create a mask name. These masks will become active masks in the 2-D Layout Edi-tor.CoventorWare is designed to be process-independent. This allows the software to accurately model many different types of MEMS processes, even if they are run on different fabrication lines. In fact, the software can accommodate a design that is transferred to a new or different process line by recharacterizing the mask set flow.Because the Process Editor is used by ARCHITECT, DESIGNER, and ANALYZER, its reference is included in this manual. For a more detailed information of the Process Editor function, see page U3-1.Section 1: Using CoventorWare Version 2010 U1-14 March 19, 2010 Coventor, Inc. 1.5.3: Architect TabThis tab allows access to the schematic editor and simulator used for system-level simulation. From the Schematic file field, you can select a schematic file to display in the schematic editor or can choose to create a new one. Clicking on the icon to the far right of the Schematic field launches the schematic editor. At this moment, process and MPD information relevant to ARCHITECT is read from the process and MPD files that appear in the Function Manager window above the Architect tab. This information is then saved with the selected schematic so that it is accessible by ARCHITECT. The Function Manager will maintain this link between the process/MPD information and the schematic as long as the schematic remains open in the schematic editor. The Function Manager will monitor for changes made to the process or MPD files and update the stored information for the open schematic. For example, if the current process or MPD file is edited and then saved, the information is automatically updated in the schematic. Or, if a different process or MPD file is chosen in the Function Manager, a dialog box will appear asking if you would also like to change the file used for the currently open schematic. This link continues to work even when multiple schematics that use the same process and MPD files are opened through this tab. However, if schematics with different process files are open at the same time, their process files must have identical lists of deposit layers. SchematicThis field displays the active schematic file. To change the active file, click on the arrow beside the Schematic file field to select another schematic in the project directory, or click on the Browse icon to the right of the field to select a file in any directory. The file selected must have an ai_sch extension. Start IconThis icon starts the schematic editor. There are four options for starting the Schematic Editor, accessed from the arrow to the right of the icon: New from Process: Starts the schematic editor and reads the process and MPD information described above. The schematic editor opens with the default reference frame and Coventor symbol placed on the canvas. New for Fluidics: The schematic editor opens and creates a new file that does not have the default reference frame. New Blank: Forces the schematic editor to start a new file even if there is a schematic file named in the Sche-matic field. The editor opens without the reference frame and Coventor symbol on the canvas.Browse to select fileStart schematic editorSynchronizeSection 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-15M Open: Opens the schematic specified in the Schematic file field and checks for updates to the process and MPD files. Data AssociationsThese read-only fields display the process and MPD files that were used in the creation of the schematic shown in the Schematic field. When the user opens a schematic created by another user or on another machine, this in-formation may not be available. If there are no data associations, they will be automatically created when the user first opens the schematic. SynchronizeThis icon is used to associate the process and MPD files displayed in the Function Manager with the selected sche-matic. This function can be used to update a schematic if the process or MPD file has been changed.For more information about the ARCHITECT suite, see the CoventorWare ARCHITECT Reference on page A1-1.1.5.4: DesignerClicking on this tab opens a window that allows access to the 2-D layout tool and the Preprocessor (for solid model-ing and meshing). The functions on this tab take you through all the steps of device creation: creation of a 2-D model in the Layout Editor, creation of a solid model, and creation of a mesh that can be used for FEM simulation.Layout EditorCoventorWare has its own 2-D drawing and editing tool, accessed from the Start Layout Editor icon to the right of the Layout file field. All layouts created in the Layout Editor proceed through a conversion process and are fully compat-ible with the rest of the software. LayoutThis field displays the file that will be opened in the Layout Editor. A previously created file may be selected for opening, or a new file may be named. All the cat files from the active project will be listed in the drop-down menu. The drop-down menu will also include any files in the \Design_Files\Shared\Layout_Template directory. To spec-Access to 2-DLayout EditorAccess to Preprocessorand Meshing options Solid model optionsSection 1: Using CoventorWare Version 2010 U1-16 March 19, 2010 Coventor, Inc. ify which file to open, click on the drop-down menu arrow to the right of the field to select a file that is in the project_directory\Devices directory, or click on the Browse icon to open a native layout file (*.cat), a GDS file, a CIF file, DXF file, or netlist (*.sin) file in another directory. The icon on the right starts the Layout Editor. Top CellA top cell may be selected when opening a project, and this cell will appear on the canvas when the Layout Edi-tor is started. Start Layout Editor IconWhen selecting files to be opened in the Layout Editor, you have these options from the icons drop-down menu: New from Process: When this option is selected, the masks specified in the process file are defined as the layers in the 2-D layout file (.cat). New from Architect: This option becomes available if a schematic is selected in the Architect tab. This option allows the Layout Editor to open a 2-D layout (in GDSII format) that was created from an ARCHI-TECT schematic. Note that to use this option, you must have opened the schematic in Scene3D or selected Architect > Export for Designer from within the ARCHITECT/SaberSketch window. New Blank Layout: This option allows you to create a layout without first defining a process. New from Template: This option allows you to import layer definitions from another cat file. Open Layout: When this option is selected, the Layout Editor opens to the file specified in the file field. Clicking on the Layout Editor icon opens the window seen in Figure U1-6:Figure U1-6 2-D Layout Editor Other options for generating a 2-D layout include: Imported layouts: Users can import designs from their own 2-D layout tools. Any editor capable of generat-ing an output file in CIF, DXF, or GDSII format qualifies. The software handles the appropriate file compati-bility considerations.Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-17M Extracted layouts: For users with ARCHITECT software, parametric library models can be extracted to a 2-D layout using Scene3D .arch3d files. With this method, users can use the top-down design approach to design and analyze the overall model, and then automatically create corresponding 2-D layout.For detailed information about using the Layout Editor, see CoventorWare DESIGNER Reference on page D1-1.Solid Modeling Model/MeshThis field displays the model that will be opened in the Preprocessor. A previously created model may be selected for opening, or a new model may be named for model creation. To specify which model to open, click on the drop-down menu arrow to the right of the field to select a model that is in the project database or click on the Browse icon to open or import another model. The Browse icon opens the Database Browser window, which is described on page U1-24. Start PreprocessorClick on this icon to start the Preprocessor or click on the arrow beside the Start Preprocessor icon to select one of these menu options from the drop-down menu: New: Choose this option to create a model from a specified process and 2-D layout file. A Input dialog win-dow will open and will prompt you to name the model to be created. This option is the same as the create new model option available from the Model/Mesh drop-down menu. New from Architect: This option becomes available if a schematic is selected in the Architect tab. This option allows the Preprocessor to open a 3-D model that was created from an Architect schematic. Note that to use this option, you must have opened the schematic in Scene3D or selected Architect > Export for Designer from within the Architect/SaberSketch window. Open: Choose this option to open the model specified in the file field. To use this option, the model must have been created in the Preprocessor. Rebuild: Choose this option to rebuild, and therefore overwrite the model specified in the file field. Options Apply Offset Values: Applies offset values from the process file when building the model. On selecting a regular layout file, this box is checked. On selecting a layout file that has been extracted from a schematic, the box is automatically unchecked. Create Inverse of Device (Negate): This function creates a 3-D model of the empty space around (and in between) the solid materials. See the tutorial section starting on page M5-17 for an example. Clip Device with Mask: This feature creates a 3-D cross-section of a model. The model is clipped with the mask layer selected from the drop-down menu to the right of the Clip Device option. Use this feature to build a portion of a design so only parts of interest appear in the 3-D model or if the design is symmetrical, build only a portion of the design. Split Layer: This option breaks up a layer into multiple parts. Use the first drop-down menu to select the layer to be split, and use the second drop-down menu to select the mask layer to split the first layer. Use this option to create a patch on a large region for load application. You can also use this option to create different meshes on a layer; this facilitates use of links and ties during meshing when different grades of mesh are being used on the same layer of the model.Section 1: Using CoventorWare Version 2010 U1-18 March 19, 2010 Coventor, Inc. 1.5.5: AnalyzerClicking on the Analyzer tab opens a window that allows access to the solvers. From this tab you can run a MEMS or microfluidics solver, view the results from a previous run, or view the model in the Preprocessor.. DomainThe type of domain selected determines the type of solvers that appear in the Solver (effects) drop-down menu. There are two domain options: MEMS: Enables the core electrostatic, mechanical, and electromechanical solvers, as well as special domain solvers for modeling piezoresistance, inductance and resistance, optics, and package thermomechanical inter-action. Solvers for creating reduced-order models for MEMS mixed-mode system-level simulation are also enabled. Microfluidics: Enables the general design of integrated chemical and biochemical analysis or synthesis sys-tems, and simulates chemical transport in electrophoretic, electroosmotic, and pressure driven systems. It also enables a fluidics macromodeling solver. Solver (effects): MEMSIf the MEMS domain option is selected, the list of options detailed below appears in the Solver drop-down menu. The number of solvers that appear in the drop-down menu is determined by the users license agreement. The list may include any of the following: MemElectro (electrostatic and electroquasistatic): Solver documentation begins on page R3-1. MemMech (mechanical, thermomechanical, and piezoelectric): Solver documentation begins on page R4-1. CoSolveEM (coupled electromechanical): Solver documentation begins on page R5-1. HarmonicEM (coupled electromechanical-frequency domain): Solver documentation begins on page R6-1. MemPZR (piezoresistance): Solver documentation begins on page R8-1. MemHenry (inductance and resistance): Solver documentation begins on page R7-1. SpringMM (electrostatic, mechanical, or electromechanical): Solver documentation begins on page N2-1. DampingMM (squeeze-film or free-space fluid damping): Solver documentation begins on page N4-1.Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-19M InertiaMM (proof-mass or plate inertia): Solver documentation begins on page N3-1. Solver (effects): MicrofluidicsIf the Microfluidics domain option is selected, the list of options detailed below appears in the Solver drop-down menu. The number of solvers that appear in the drop-down menu is determined by the users license agreement. The list may include any of the following: MemCFD (general flow, fluid mixing, thermal): Solver documentation begins on page F2-1. NetFlow (electrokinetic): Solver documentation begins on page F3-1. SwitchSim (electrokinetic with field switching): Solver documentation begins on page F4-1. ReactSim (multi-species chemical reaction): Solver documentation begins on page F5-1. Bubble-DropSim (multi-phase hydrodynamics): Solver documentation begins on page M7-1. MemFSI (fluid-structure interaction): Solver documentation begins on page F7-4. FlowMM (flow resistance and inertance): Solver documentation begins on page N5-1. Model/MeshThis field displays the model that will be simulated using the selected solver. To specify which model to simulate, click on the drop-down menu arrow to the right of the field to select a model that is in the project database, or click on the Browse icon to open or import another model. The Browse icon opens the Database Browser window, de-scribed on page U1-24. Start PreprocessorThis icon allows you to view a model before simulating. From within the Preprocessor you can view the mesh, rename patches, and rename conductors. Analysis FieldThis field allows you to select the set of analysis results to be used by the View Analysis Icon option described below. If you run a solver to create new results, the Save Analysis window opens before the simulation starts and prompts you to save the results under a new name. The choices in the Analysis Field drop-down menu are the user-assigned names of all previous analyses for this project and the create a new analysis option, which represents the next analysis to be run. View Analysis Icon This icon allows access to a solvers setup dialogs or to analysis results from a previous run. The actions of this icon can be accessed directly from its drop-down menu options: Solver Setup: Choosing this option launches the setup dialogs of the selected solver. If create a new analysis is selected in the Analysis Field, the values of the current project settings are used as default val-ues for the setup. If the solver is being launched for the first time in a project, the default options for the solver are loaded. Load Setup from Previous Analysis: If a previous analysis is selected in the Analysis Field, then the set-tings used from that analysis are loaded into the solvers Settings and boundary conditions dialogs. Thus by choosing a previous analysis, you can view the settings from a previous run, and optionally launch a new run after modifying those settings. Note that loading these previous settings overwrites the current project settings. View Results: This option allows you to view previous simulation results designated in the Analysis Field. If this option is selected, the Analysis window will open for access to the numerical, graphical, and 3-D results stored in the analysis directory designated in the Analysis field. The number of solvers that you can access is dependent on the specific licensed configuration of CoventorWare.Section 1: Using CoventorWare Version 2010 U1-20 March 19, 2010 Coventor, Inc. Clicking on the View Analysis icon will launch Solver Setup if create a new analysis is selected in the Analysis Field, otherwise it will launch the View Results functionality.1.5.6: Menu FunctionsThe menu options appear at the top of the Function Manager and are accessible from any selected tab.FileClicking on this menu option at the upper left portion of the window opens a drop-down menu with file maintenance and management tasks. Users can quit the software from this button menu. ProjectsOpens a dialog that allows you to select an existing project, create a new project, import a tutorial project, or im-port a Kyocera or Hymite package. For more information on this dialog, see page U1-23. The keyboard shortcut for opening this dialog is Alt + P. NewCreates a new settings file for the current project. The software first displays a confirmation window that asks, Do you want to save current settings? Then it clears all previous project settings and creates a new settings file with a default name ProjectSettings1.mps. The keyboard shortcut for creating a new settings file is Alt + N. To save this new project settings file with another name, use the File > Save As function. OpenOpens an existing settings file. The software opens a dialog window that displays all available settings associated with the current project.The keyboard shortcut for opening this dialog is Alt + O. SaveSaves the current settings file; includes tool settings, boundary conditions, and other window settings to the active settings file. The keyboard shortcut for saving a file is Alt + S. Save AsOpens a dialog for saving the current settings file name under a new name. ExitExits the software. The keyboard shortcut for exiting CoventorWare is Alt + X.Tools Fluidics Mesh GeneratorsOpens the Mesh Generators module. This module allows you to select a mesh shape and parameters, then generate a meshed model. For more information on this module, see the CoventorWare ANALYZER Microfluidics Refer-ence, beginning on page F9-1. View Log WindowOpens the log window, which displays software progress. Any errors that occur will be displayed in this window. VisualizerThis option opens the 3-D Visualizer. The keyboard shortcut for opening the Visualizer is Alt + 0. Job QueueThis option opens the Job Queue dialog, which allows the user to run simulations in the background, while con-tinuing to work in the Function Manager. For more information on this dialog, see page U1-30. User SettingsAccesses the user settings for work directory, shared directory, temp directory, and licenses location. Each indi-Section 1: Using CoventorWare Version 2010Coventor, Inc. March 19, 2010 U1-21M vidual user configures these settings the first time he runs the software. These settings can be changed from this menu option. The keyboard shortcut for opening the User Settings dialog is Alt + U. They can also be edited from the .coventorware2010.rc file located in C:\Documents and Settings\user_name on Windows and in the users home directory on LINUX. For more information selecting user settings; see page 2-16 of the installation instruc-tions.HelpThe Help menu provides access to the online documentation (in PDF format). The Help menu has these options: Master Help: Opens an online PDF designed to familiarize you with CoventorWare and to help you find the relevant documentation for a desired task. Using CoventorWare: Opens the online PDF for this document, which provides an overview of Coventor-Ware and detailed information on functions common to the entire software suite. Search: Accesses the Acrobat search engine; can be used to search the entire CoventorWare documentation set and documentation for third-party software bundled with CoventorWare. Contents: Opens an online PDF that lists all the manuals in the documentation set. Reference: Opens an online PDF that lists the available reference material for the solvers, with active links to their locations in the documentation. Tutorials: Has two submenus: MEMS Tutorials and Microfluidics Tutorials. Each submenu opens an online PDF that lists the available tutorials, with active links to their locations in the documentation. Installation Instructions: Opens an online PDF containing CoventorWare installation instructions for Win-dows and LINUX operating systems. About: Opens a window that lists the current version of the software. The keyboard shortcut for opening this window is Alt + A.Click to View LogClicking on the arrow at the bottom left corner of the Function Manager opens an attached window that shows result and diagnosis information for the Solid Modeler. This window is different from the CoventorWare log window that opens when CoventorWare is started, which shows all of the software activity. Use the main CoventorWare log win-dow to monitor the status of the design and/or simulation. A log file records all log window information and appears as the file CoventorWare.log in the users Design_Files\Logs directory. Additional documentation for Tecplot 360 Visualizer is available from its menubar Help menu from individual dialogs. Additional information for Saber is available in Coventor\CoventorWare2010 \architect\SaberDesignerInstall\doc\pdf_docs.Section 1: Using CoventorWare Version 2010